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Special Section on Recent Advances in Integrated Photonic Devices

10Gb/s BOSA Employing Low-Cost TO CAN Package and Impedance Matching Circuits in Transmitter

Kota ASAKA, Atsushi KANDA, Akira OHKI, Takeshi KUROSAKI, Ryoko YOSHIMURA, Hiroaki SANJOH, Toshio ITO, Makoto NAKAMURA, Mikio YONEYAMA

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Kota ASAKA
NTT Photonics Laboratories, NTT Corporation
Atsushi KANDA
NTT Photonics Laboratories, NTT Corporation
Akira OHKI
NTT Photonics Laboratories, NTT Corporation
Takeshi KUROSAKI
NTT Photonics Laboratories, NTT Corporation
Ryoko YOSHIMURA
NTT Photonics Laboratories, NTT Corporation
Hiroaki SANJOH
NTT Photonics Laboratories, NTT Corporation
Toshio ITO
NTT Photonics Laboratories, NTT Corporation
Makoto NAKAMURA
NTT Photonics Laboratories, NTT Corporation
Mikio YONEYAMA
NTT Photonics Laboratories, NTT Corporation

Corresponding author

Keywords:low-cost,BOSA,impedance matching circuits,directly modulated laser diode (DML)

JOURNALRESTRICTED ACCESS

2013 Volume E96.CIssue 7Pages 989-995

DOIhttps://doi.org/10.1587/transele.E96.C.989

Details

Published: July 01, 2013Manuscript Received: October 31, 2012Released on J-STAGE: July 01, 2013Accepted: -Advance online publication: -Manuscript Revised: February 16, 2013

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Article overview

Abstract

By using impedance (Z) matching circuits in a low-cost transistor outline (TO) CAN package for a 10Gb/s transmitter, we achieve a cost-effective and small bidirectional optical subassembly (BOSA) with excellent optical transmission waveforms and a > 40% mask margin over a wide temperature range (-10 to 85°C). We describe a design for Z matching circuits and simulation results, and discuss the advantage of the cost-effective compensation technique.

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