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IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
Pilot demonstration of refractive index sensing using polymer optical fiber crushed with slotted screwdriver
Yosuke MizunoHeeyoung LeeShumpei ShimadaYukihiro MatsumotoYosuke TanakaHitoshi NakamuraKentaro Nakamura
Author information
  • Yosuke Mizuno

    Institute of Innovative Research, Tokyo Institute of Technology

  • Heeyoung Lee

    Institute of Innovative Research, Tokyo Institute of Technology

  • Shumpei Shimada

    Institute of Innovative Research, Tokyo Institute of Technology

  • Yukihiro Matsumoto

    Department of Architecture and Civil Engineering, Toyohashi University of Technology

  • Yosuke Tanaka

    Institute of Engineering, Tokyo University of Agriculture and Technology

  • Hitoshi Nakamura

    Department of Civil and Environmental Engineering, Tokyo Metropolitan University

  • Kentaro Nakamura

    Institute of Innovative Research, Tokyo Institute of Technology

Corresponding author

ORCID
Keywords:optical fiber sensors,refractive index sensing,polymer optical fibers
JOURNALFREE ACCESS

2017 Volume 14Issue 21Pages 20170962

DOIhttps://doi.org/10.1587/elex.14.20170962
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  • Published: 2017Received: September 19, 2017Released on J-STAGE: November 10, 2017Accepted: October 03, 2017Advance online publication: October 20, 2017Revised: -
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Abstract

We demonstrate power-based refractive index (RI) sensing using a polymer optical fiber (POF) crushed with a slotted screwdriver. This structure can be easily fabricated by simply pressing the end of a slotted screwdriver against part of the POF. Neither external heat sources, chemicals, nor ultrasonic transducers, which have been conventionally used, are necessary. The transmitted power has a linear RI dependence in the RI range from ∼1.32 to ∼1.43 (coefficient: 173 dB/RIU (RI unit)). The temperature dependence of the transmitted power is experimentally shown to be negligible, which indicates the potential of this structure as a temperature-independent RI sensor.

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© 2017 by The Institute of Electronics, Information and Communication Engineers
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