TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
A14 Technology
A14 technology is TSMC’s next cutting-edge logic process that achieves full-node power, performance and area through dimensional scaling. A14 is designed to drive AI transformation forward by delivering...
A16 Technology
TSMC A16™ technology integrates leading nanosheet transistors with innovative Super Power Rail (SPR) solutions, bringing greatly improved logic density and performance. SPR improves logic density and...
2nm Technology
TSMC’s 2nm (N2) technology has started volume production in 4Q25 as planned. N2 technology features first-generation nanosheet transistor technology, with full-node strides in performance and power consumption...
3nm Technology
In 2022, TSMC became the first foundry to move 3nm FinFET (N3) technology into high-volume production. N3 technology is the industry’s most advanced process technology, offering the best...
5nm Technology
In 2020, TSMC became the first foundry to move 5nm FinFET (N5) technology into volume production and enabled customers’ innovations in smartphone and high-performance computing (HPC) applications...
In 2020, TSMC became the first foundry to move 5nm FinFET (N5) technology into volume production and enabled customers’ innovations in smartphone and high-performance computing (HPC) applications. TSMC’s N5 technology is the Company’s second technology to use EUV lithography and achieved the same success as its predecessor, the N7+ process.
TSMC continues to expand its 5nm technology family to meet a multitude of customer demands. These include N5P, N4P, and N4C, which offer better power, performance, density, and more cost-effective advantages; N4X, a process tailored for HPC applications; and N5A for automotive applications.
The N5, N5P, N4P, N4C processes are in volume production and showing excellent yields.
TSMC’s Fab 18 is the main 5nm production facility7nm Technology
In 2018, TSMC became the first foundry to start 7nm FinFET (N7) volume production. The N7 technology is one of TSMC’s fastest technologies to reach volume production and provides optimized manufacturing...
16/12nm Technology
In 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) technology risk production and later in 2014, the first foundry to deliver a fully functional 16nm FinFET customer...
20nm Technology
TSMC became the world’s first semiconductor company that began 20nm volume production, using its innovative double patterning...
22nm Technology
The 22nm Ultra-Low Power (22ULP) process technology is derived from TSMC's industry-leading 28nm technology. It delivers enhanced performance and cost efficiency, making it suitable for...
28nm Technology
In 2011, TSMC became the first foundry that provided 28nm General Purpose process technology. Following this, TSMC continued to...
40nm Technology
TSMC led the foundry segment to start the volume production of a variety of products for multiple customers...
65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year...
90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography technology...
0.13µm Technology
TSMC launched the semiconductor industry's first 0.13µm low-k, copper system-on-a-chip (SoC) process technology...
0.18µm Technology
TSMC’s 0.18μm logic technology marked a significant milestone in semiconductor manufacturing and today provides a reliable and proven solution for a wide range of applications. This mature process node...
3µm Technology
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company...
