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SM320F28335-EP
C2000™ Enhanced Product 32-bit MCU with 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC
SM320F28335-EP
Product details
- High-Performance Static CMOS Technology
- Up to 150 MHz (6.67-ns Cycle Time)
- 1.9-V/1.8-V Core, 3.3-V I/O Design
- High-Performance 32-Bit CPU
- IEEE-754 Single-Precision Floating-Point Unit (FPU)
- 16 x 16 and 32 x 32 MAC Operations
- 16 x 16 Dual MAC
- Harvard Bus Architecture
- Fast Interrupt Response and Processing
- Unified Memory Programming Model
- Code-Efficient (in C/C++ and Assembly)
- Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
- 16-bit or 32-bit External Interface (XINTF)
- Over 2M x 16 Address Reach
- On-Chip Memory
- 256K x 16 Flash, 34K x 16 SARAM
- 1K x 16 OTP ROM
- Boot ROM (8K x 16)
- With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
- Standard Math Tables
- Clock and System Control
- Dynamic PLL Ratio Changes Supported
- On-Chip Oscillator
- Watchdog Timer Module
- GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
- Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
- 128-Bit Security Key/Lock
- Protects Flash/OTP/RAM Blocks
- Prevents Firmware Reverse Engineering
- Enhanced Control Peripherals
- Up to 18 PWM Outputs
- Up to 6 HRPWM Outputs With 150 ps MEP Resolution
- Up to 6 Event Capture Inputs
- Up to 2 Quadrature Encoder Interfaces
- Up to 8 32-bit/Nine 16-bit Timers
- Three 32-Bit CPU Timers
- Serial Port Peripherals
- Up to 2 CAN Modules
- Up to 3 SCI (UART) Modules
- Up to 2 McBSP Modules (Configurable as SPI)
- One SPI Module
- One Inter-Integrated-Circuit (I2C) Bus
- 12-Bit ADC, 16 Channels
- 80-ns Conversion Rate
- 2 x 8 Channel Input Multiplexer
- Two Sample-and-Hold
- Single/Simultaneous Conversions
- Internal or External Reference
- Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
- JTAG Boundary Scan Support(1)
- Advanced Emulation Features
- Analysis and Breakpoint Functions
- Real-Time Debug via Hardware
- Development Support Includes
- ANSI C/C++ Compiler/Assembler/Linker
- Code Composer Studio IDE
- DSP/BIOS
- Digital Motor Control and Digital Power Software Libraries
- Low-Power Modes and Power Savings
- IDLE, STANDBY, HALT Modes Supported
- Disable Individual Peripheral Clocks
- Package Options
- Quad Flatpack With Power-Pad (PTP)
- Thin Quad Flatpack (PGF, Preview Only)
- MicroStar BGA (GHH)
- Plastic BGA (GJZ)
- Temperature Options:
- A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)
- S: –40°C to 125°C (GJZ, Preview Only)
- Q: –40°C to 125°C (GJZ, Preview Only)
- M: –55°C to 125°C (PTP, GJZ)
- APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(2)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
(2) Additional temperature ranges are available - contact factory
- High-Performance Static CMOS Technology
- Up to 150 MHz (6.67-ns Cycle Time)
- 1.9-V/1.8-V Core, 3.3-V I/O Design
- High-Performance 32-Bit CPU
- IEEE-754 Single-Precision Floating-Point Unit (FPU)
- 16 x 16 and 32 x 32 MAC Operations
- 16 x 16 Dual MAC
- Harvard Bus Architecture
- Fast Interrupt Response and Processing
- Unified Memory Programming Model
- Code-Efficient (in C/C++ and Assembly)
- Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
- 16-bit or 32-bit External Interface (XINTF)
- Over 2M x 16 Address Reach
- On-Chip Memory
- 256K x 16 Flash, 34K x 16 SARAM
- 1K x 16 OTP ROM
- Boot ROM (8K x 16)
- With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
- Standard Math Tables
- Clock and System Control
- Dynamic PLL Ratio Changes Supported
- On-Chip Oscillator
- Watchdog Timer Module
- GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
- Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
- 128-Bit Security Key/Lock
- Protects Flash/OTP/RAM Blocks
- Prevents Firmware Reverse Engineering
- Enhanced Control Peripherals
- Up to 18 PWM Outputs
- Up to 6 HRPWM Outputs With 150 ps MEP Resolution
- Up to 6 Event Capture Inputs
- Up to 2 Quadrature Encoder Interfaces
- Up to 8 32-bit/Nine 16-bit Timers
- Three 32-Bit CPU Timers
- Serial Port Peripherals
- Up to 2 CAN Modules
- Up to 3 SCI (UART) Modules
- Up to 2 McBSP Modules (Configurable as SPI)
- One SPI Module
- One Inter-Integrated-Circuit (I2C) Bus
- 12-Bit ADC, 16 Channels
- 80-ns Conversion Rate
- 2 x 8 Channel Input Multiplexer
- Two Sample-and-Hold
- Single/Simultaneous Conversions
- Internal or External Reference
- Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
- JTAG Boundary Scan Support(1)
- Advanced Emulation Features
- Analysis and Breakpoint Functions
- Real-Time Debug via Hardware
- Development Support Includes
- ANSI C/C++ Compiler/Assembler/Linker
- Code Composer Studio IDE
- DSP/BIOS
- Digital Motor Control and Digital Power Software Libraries
- Low-Power Modes and Power Savings
- IDLE, STANDBY, HALT Modes Supported
- Disable Individual Peripheral Clocks
- Package Options
- Quad Flatpack With Power-Pad (PTP)
- Thin Quad Flatpack (PGF, Preview Only)
- MicroStar BGA (GHH)
- Plastic BGA (GJZ)
- Temperature Options:
- A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)
- S: –40°C to 125°C (GJZ, Preview Only)
- Q: –40°C to 125°C (GJZ, Preview Only)
- M: –55°C to 125°C (PTP, GJZ)
- APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(2)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
(2) Additional temperature ranges are available - contact factory
The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
Throughout this document, the device is abbreviated as F28335. provides a summary of features.
The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.
Throughout this document, the device is abbreviated as F28335. provides a summary of features.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
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Supported products & hardware
Products
C2000 real-time microcontrollers
Arm-based processors
Industrial mmWave radar sensors
Automotive mmWave radar sensors
MSP430 microcontrollers
Wi-Fi products
Arm Cortex-M4 MCUs
Arm Cortex-M0+ MCUs
Arm Cortex-R MCUs
Low-power 2.4-GHz products
Automotive wireless connectivity products
Sub-1 GHz wireless MCUs
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C2000-3P-SEARCH — C2000 Third-party search tool
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HLQFP (PTP) | 176 | Ultra Librarian |
PBGA (GJZ) | 176 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
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Support & training
TI E2E™ forums with technical support from TI engineers
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