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DesignLines

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Chip Assembler ASE Sees Advanced Packaging Sales Doubling

SoC Designline

Chip Assembler ASE Sees Advanced Packaging Sales Doubling

ASE expects advanced packaging sales to double on AI chip demand.

ByAlan Patterson Feb 16, 2026

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar’s Deep Tech Ambitions Come Into Focus

BySally Ward-Foxton 02.13.2026

RISC-V Pivots from Academia to Industrial Heavyweight

RISC-V Pivots from Academia to Industrial Heavyweight

ByPablo Valerio 02.11.2026

Cadence Unveils ChipStack AI Agent for Agentic Chip Design and Verification

ByStefani Munoz 02.10.2026

Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing

ByRick Clucas, SVP, Innovation & Technology, V-Nova02.10.2026

TSMC 3-nm Upgrade in Japan to Catch up With Demand

ByAlan Patterson 02.09.2026

Partner Content

Engineering SDVs at China Speed Without Losing Control

Engineering SDVs at China Speed Without Losing Control

ByRafael Taubinger, Product Marketing Manager, IAR02.16.2026

Beyond the Dashboard: How Cars Are Learning to Sense Like Humans

Beyond the Dashboard: How Cars Are Learning to Sense Like Humans

ByInfineon Technologies AG02.12.2026

PERSPECTIVES

Qatar’s Deep Tech Ambitions Come Into Focus

News

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar accelerates deep-tech domination with major AI, quantum, and semiconductor investments.

By Sally Ward-Foxton 02.13.2026

RISC-V Pivots from Academia to Industrial Heavyweight

Supply Chain & Distribution

RISC-V Pivots from Academia to Industrial Heavyweight

RISC-V Andrea Gallo discusses how the open-standard is pivoting from academia to HPC, AI, and automotive with ISO standardization.

By Pablo Valerio 02.11.2026

Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing

Opinion

Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing

Discover how ARC’s legacy is driving next-gen AI processing.

By Rick Clucas, SVP, Innovation & Technology, V-Nova 02.10.2026

India Budget 2026-2027: Semiconductors, Manufacturing, and Tax Reforms

Supply Chain & Distribution

India Budget 2026-2027: Semiconductors, Manufacturing, and Tax Reforms

India's 2026-2027 budget reshapes semiconductor and electronics policy.

By Yashasvini Razdan 02.02.2026

News & Analysis

News

Chip Assembler ASE Sees Advanced Packaging Sales Doubling

ASE expects advanced packaging sales to double on AI chip demand.

By Alan Patterson 02.16.20260

News

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar accelerates deep-tech domination with major AI, quantum, and semiconductor investments.

By Sally Ward-Foxton 02.13.20260

RISC-V Gallo

Supply Chain & Distribution

RISC-V Pivots from Academia to Industrial Heavyweight

RISC-V Andrea Gallo discusses how the open-standard is pivoting from academia to HPC, AI, and automotive with ISO standardization.

By Pablo Valerio 02.11.20260

News

Cadence Unveils ChipStack AI Agent for Agentic Chip Design and Verification

Cadence launches ChipStack AI Super Agent, touting 10× faster chip design.

By Stefani Munoz 02.10.20260

Opinion

Passing the Torch: Reflections on ARC’s Journey and the Future of Specialized Processing

Discover how ARC’s legacy is driving next-gen AI processing.

By Rick Clucas, SVP, Innovation & Technology, V-Nova 02.10.20260

News

TSMC 3-nm Upgrade in Japan to Catch up With Demand

TSMC supercharges its Japan fab with 3-nm tech to meet soaring AI chip demand.

By Alan Patterson 02.09.20260

News

Fabless Startup Aheesa Tapes Out First Indian RISC-V Network SoC

Aheesa launches India's first homegrown RISC-V network SoC, VIHAAN-I, powering fiber internet access.

By Yashasvini Razdan 02.05.20260

News

IBM, Synopsys Move Toward 1.4-nm Node With Heat-Modeling Tech

IBM and Synopsys set their sights toward 1.4-nm chips with ultra-fast heat modeling.

By Alan Patterson 02.04.20260

With TI’s expanded fab footprints, the quest for more efficient and faster process technology design cycles is also a strategic part of this acquisition. (Source: Texas Instruments)

News

What TI’s Acquisition of Silicon Labs Stands For?

TI is raising its stakes in IoT designs, recently energized by the arrival of viable edge AI solutions.

By Majeed Ahmad 02.04.20260

Supply Chain & Distribution

India Budget 2026-2027: Semiconductors, Manufacturing, and Tax Reforms

India's 2026-2027 budget reshapes semiconductor and electronics policy.

By Yashasvini Razdan 02.02.20261

HiPEAC IA Speed

Technical Deep Dive

HiPEAC 2026: Bridging AI Speed and Silicon Reality

The path to sustainable AI lies in building systems where the intelligence of the architecture matches the intelligence of the algorithm.

By Pablo Valerio 02.02.20260

Sponsored content

Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers

Lightmatter®, the leader in photonic interconnect solutions for AI, and Global Unichip Corp. (GUC), the Advanced ASIC leader and a key enabler for hyperscaler AI infrastructure, today announced a strategic partnership to bring commercial Passage™ 3D Co-Packaged Optics (CPO) solutions to market.

By Global Unichip Corp. (GUC 01.28.20260

molecular contamination

Supply Chain & Distribution

Molecular Contamination: The Hardware Reality of High-NA EUV

Keeping next-gen High-NA EUV chipmaking machines clean is a massive hardware and materials science challenge.

By Emily Newton 01.28.20261

HiPEAC 2026 - Michaela Blott - AMD - on stage_Image source_Nitin Dahad

News

HiPEAC 2026: Don’t Get Lazy With AI Optimization

AI research must ditch laziness and embrace optimization at all levels.

By Nitin Dahad 01.27.20260

CPU processor on computer motherboard.

News

MosChip Completes 28-nm SoC for India’s Space Center

MosChip powers India's space tech leap with new 28-nm SoC for ISRO.

By Yashasvini Razdan 01.27.20260

News

Hybrid Bonding Comes of Age Slowly and Collectively

Hybrid bonding moves beyond niche, tackling real-world hurdles for mass adoption.

By Pat Brans 01.26.20260

Podcast

Podcast Episode

Podcasts 46:58

Reimagining CPU, DSP, and AI With a Reconfigurable Dataflow Architecture

By Sally Ward-Foxton 02.13.2026

Efficient Computer's Electron E1 chip reimagines CPUs, DSPs, and AI with a reconfigurable dataflow fabric.

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