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News, technologies, and trends in the electronics industry
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DesignLines

AI & Big Data Designline

Find the latest big data and AI news in the electronics industry. Coverage includes artificial Intelligence (AI), machine learning, quantum computing and more.

NAND Reimagined in High-Bandwidth Flash to Complement HBM

AI & Big Data Designline

NAND Reimagined in High-Bandwidth Flash to Complement HBM

High-bandwidth flash stacks NAND layers to bolster memory capacity for inference workloads.

ByMajeed Ahmad Feb 16, 2026

AI Drives AV Momentum at CES 2026

AI Drives AV Momentum at CES 2026

ByEgil Juliussen 02.13.2026

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar’s Deep Tech Ambitions Come Into Focus

BySally Ward-Foxton 02.13.2026

Qatar’s AI Ambitions Span the Tech Stack

BySally Ward-Foxton 02.12.2026

ISE 2026: Sol Rashidi Warns of ‘POC Purgatory’

ByPablo Valerio 02.12.2026

RISC-V Pivots from Academia to Industrial Heavyweight

ByPablo Valerio 02.11.2026

Partner Content

Engineering SDVs at China Speed Without Losing Control

Engineering SDVs at China Speed Without Losing Control

ByRafael Taubinger, Product Marketing Manager, IAR02.16.2026

Beyond the Dashboard: How Cars Are Learning to Sense Like Humans

Beyond the Dashboard: How Cars Are Learning to Sense Like Humans

ByInfineon Technologies AG02.12.2026

PERSPECTIVES

AI Drives AV Momentum at CES 2026

Egil’s Eye

AI Drives AV Momentum at CES 2026

AI-powered autonomous vehicles stole the spotlight at CES 2026.

By Egil Juliussen 02.13.2026

Qatar’s Deep Tech Ambitions Come Into Focus

News

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar accelerates deep-tech domination with major AI, quantum, and semiconductor investments.

By Sally Ward-Foxton 02.13.2026

ISE 2026: Sol Rashidi Warns of ‘POC Purgatory’

Supply Chain & Distribution

ISE 2026: Sol Rashidi Warns of ‘POC Purgatory’

At ISE 2026, Sol Rashidi provides an AI reality check, explaining how agents are risking infrastructure security.

By Pablo Valerio 02.12.2026

RISC-V Pivots from Academia to Industrial Heavyweight

Supply Chain & Distribution

RISC-V Pivots from Academia to Industrial Heavyweight

RISC-V Andrea Gallo discusses how the open-standard is pivoting from academia to HPC, AI, and automotive with ISO standardization.

By Pablo Valerio 02.11.2026

News & Analysis

GPU with HBF_High Bandwidth flash memory

News

NAND Reimagined in High-Bandwidth Flash to Complement HBM

High-bandwidth flash stacks NAND layers to bolster memory capacity for inference workloads.

By Majeed Ahmad 02.16.20260

Egil’s Eye

AI Drives AV Momentum at CES 2026

AI-powered autonomous vehicles stole the spotlight at CES 2026.

By Egil Juliussen 02.13.20260

News

Qatar’s Deep Tech Ambitions Come Into Focus

Qatar accelerates deep-tech domination with major AI, quantum, and semiconductor investments.

By Sally Ward-Foxton 02.13.20260

News

Qatar’s AI Ambitions Span the Tech Stack

Qatar is actively investing in multiple levels of the AI tech stack.

By Sally Ward-Foxton 02.12.20260

ISE Sol Rashidi

Supply Chain & Distribution

ISE 2026: Sol Rashidi Warns of ‘POC Purgatory’

At ISE 2026, Sol Rashidi provides an AI reality check, explaining how agents are risking infrastructure security.

By Pablo Valerio 02.12.20260

RISC-V Gallo

Supply Chain & Distribution

RISC-V Pivots from Academia to Industrial Heavyweight

RISC-V Andrea Gallo discusses how the open-standard is pivoting from academia to HPC, AI, and automotive with ISO standardization.

By Pablo Valerio 02.11.20260

Lam Research CTO Vahid Vahedi and CEA-Leti CEO Sébastien Dauvé signed a joint agreement on January 30. (Source: CEA-Leti/Lam Research | @Utopikphoto)

News

Lam Research, CEA-Leti Open Fast Lane for Specialty Technologies

Lam Research and CEA-Leti team up to speed specialty semiconductor innovation.

By Pat Brans 02.11.20260

News

The Sovereign Quantum Race Starts Before Quantum Advantage

Governments should be investing in sovereign quantum systems before the technology matures.

By Sally Ward-Foxton 02.10.20260

News

Cadence Unveils ChipStack AI Agent for Agentic Chip Design and Verification

Cadence launches ChipStack AI Super Agent, touting 10× faster chip design.

By Stefani Munoz 02.10.20260

News

TSMC 3-nm Upgrade in Japan to Catch up With Demand

TSMC supercharges its Japan fab with 3-nm tech to meet soaring AI chip demand.

By Alan Patterson 02.09.20260

Memory

News

NOR Flash Next in AI-Driven Memory Crunch

NOR’s high reliability and low latency make it highly suitable for safe boot and initialization in AI servers.

By Majeed Ahmad 02.09.20260

Sponsored content

Galaxy Wins “FPGA Professional Spot Service Provider” Award

Against the backdrop of a continued global chip shortage, Galaxy Semicon Group Limited has stockpiled a large number of high-quality Xilinx Kintex™ UltraScale+, Virtex™ UltraScale+, Zynq UltraScale+ RFSoC, Versal, and other high-quality chips.

By Galaxy Semicon Group Limited 02.09.20260

News

Imec to Open R&D Center in Qatar

Imec chose Qatar due to the country’s focus on talent development, which aligns with imec’s goals

By Sally Ward-Foxton 02.09.20260

News

SiTime Bolsters Timing Portfolio With Renesas-Acquired Clocks

SiTime snaps up Renesas’ clock assets for $3.2B, doubling sales and targeting AI data centers.

By Majeed Ahmad 02.06.20260

Google Power

Supply Chain & Distribution

Google Bets Big on Power Generation to Fuel AI

Google intends to control energy generation, fueling AI growth and reshaping the tech-power industry.

By Pablo Valerio 02.06.20260

News

IBM, Synopsys Move Toward 1.4-nm Node With Heat-Modeling Tech

IBM and Synopsys set their sights toward 1.4-nm chips with ultra-fast heat modeling.

By Alan Patterson 02.04.20260

Podcast

Podcast Episode

Podcasts 46:58

Reimagining CPU, DSP, and AI With a Reconfigurable Dataflow Architecture

By Sally Ward-Foxton 02.13.2026

Efficient Computer's Electron E1 chip reimagines CPUs, DSPs, and AI with a reconfigurable dataflow fabric.

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