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Figure 10 – uploaded byPedro Vitoriano

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Figure 9: Solder joint height variation. Figure 10: Solder joint reconstruction of the inspection area for a specific y coordinate. 3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES

Figure 9Solder joint height variation. Figure 10: Solder joint reconstruction of the inspection area for a specific y coordinate. 3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES

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tion and denser packing of boards!"!. In these conditions, the failure detection has become critical for any SMT manufacturing process. AOI systems for PCBs have become a proven so- lution, replacing the traditional human-based inspection method”.
tion and denser packing of boards!"!. In these conditions, the failure detection has become critical for any SMT manufacturing process. AOI systems for PCBs have become a proven so- lution, replacing the traditional human-based inspection method”.
Figure 1: Block diagram of the proposed approach. IPC-A-610 rules specify that the solder joint should reach at least 25% of the component electrode height, however 2D AOI systems aren’t capable of measuring the height of the solder joint. The measurement of such characteristics will require a 3D measurement system"!. The proposed approach presents a 2D AOI system using the 3D-SJR method, for improving solder joint classification (Figure 1).
Figure 1: Block diagram of the proposed approach. IPC-A-610 rules specify that the solder joint should reach at least 25% of the component electrode height, however 2D AOI systems aren’t capable of measuring the height of the solder joint. The measurement of such characteristics will require a 3D measurement system"!. The proposed approach presents a 2D AOI system using the 3D-SJR method, for improving solder joint classification (Figure 1).
Figure 3: Light rings!'7!.
Figure 3: Light rings!'7!.
Figure 2: Initial image.
Figure 2: Initial image.
Figure 4: Solder joint area. 3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES The 3D reconstruction of the solder joint surface can be determined by:
Figure 4: Solder joint area. 3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES The 3D reconstruction of the solder joint surface can be determined by:
Table |: Light Ring Parameters. As in the case of the ambient light reflec- tion, the specular light reflection has three plans corresponding to the red, green and blue components (14). The value used in the observation angle po- sition was 90°, and the illumination angles used in the structured light system are given in Table I. These parameters are determined initially and remain constant during the procedure of solder inspection. we - es —
Table |: Light Ring Parameters. As in the case of the ambient light reflec- tion, the specular light reflection has three plans corresponding to the red, green and blue components (14). The value used in the observation angle po- sition was 90°, and the illumination angles used in the structured light system are given in Table I. These parameters are determined initially and remain constant during the procedure of solder inspection. we - es —
Figure 5: Inspection area without the ambient light reflection.
Figure 5: Inspection area without the ambient light reflection.
3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES Since the intensity of light reflection, Is, de- pends only on the surface angle, @s, now it will be possible to determine the surface angle by applying the inverse function of Phong (7).
3D SOLDER JOINT RECONSTRUCTION ON SMD BASED ON 2D IMAGES Since the intensity of light reflection, Is, de- pends only on the surface angle, @s, now it will be possible to determine the surface angle by applying the inverse function of Phong (7).
Figure 8: Surface angles along the solder joint. Figure 7: The observed RGB color variation along the solder joint profile. 3D Solder Joint Reconstruction The reconstruction of the solder joint sur- face shape, z(x,y), is possible by integrating the solder joint surface angle, @s(x,y), along the sol- der profile from the beginning of the solder pad to the component electrode (19).
Figure 8: Surface angles along the solder joint. Figure 7: The observed RGB color variation along the solder joint profile. 3D Solder Joint Reconstruction The reconstruction of the solder joint sur- face shape, z(x,y), is possible by integrating the solder joint surface angle, @s(x,y), along the sol- der profile from the beginning of the solder pad to the component electrode (19).
The IPC-A-610 standard specifies the limits for the solder joint of SMD components. Ac- cording to this standard, the solder height (SJH) should be higher than 25% of the component
The IPC-A-610 standard specifies the limits for the solder joint of SMD components. Ac- cording to this standard, the solder height (SJH) should be higher than 25% of the component
Figure 11: Solder joint height”.
Figure 11: Solder joint height”.
Figure 12: Solder joint length"?!
Figure 12: Solder joint length"?!
Figure 13: Solder joint profile.
Figure 13: Solder joint profile.
Figure 14: 3D-SJR applied over the ceramic capacitor. Figure 15: Good solder joint sample.
Figure 14: 3D-SJR applied over the ceramic capacitor. Figure 15: Good solder joint sample.
Figure 18: Solder surface level curve (bad sample). Figure 16: Solder surface contour lines. Figure 17: Bad solder joint sample. The obtained results of the solder joint (SJ) classifier for the two samples show that on the bad sample only 37% of the electrodes have solder joints higher than 25% of the electrode height. In this case, 3D-SJR allows the verifica- tion that the solder height in the component electrode is not according to IPC A-610 stan- dard specifications.
Figure 18: Solder surface level curve (bad sample). Figure 16: Solder surface contour lines. Figure 17: Bad solder joint sample. The obtained results of the solder joint (SJ) classifier for the two samples show that on the bad sample only 37% of the electrodes have solder joints higher than 25% of the electrode height. In this case, 3D-SJR allows the verifica- tion that the solder height in the component electrode is not according to IPC A-610 stan- dard specifications.
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