| General information | |
|---|---|
| Designed by | IBM,[1]Freescale[2] |
| Common manufacturer | |
| Performance | |
| Max.CPUclock rate | 66 MHz[3] to 462 MHz |
| Architecture and classification | |
| Application | Radiation hardened |
| Technology node | RH45 (45 nm SOI) |
| Microarchitecture | PowerPC e5500[4] |
| Instruction set | Power ISA v.2.06 |
| Physical specifications | |
| Cores |
|
| History | |
| Predecessor | RAD750 |
| Successor | [5] |
| POWER,PowerPC, andPower ISA architectures |
|---|
| NXP (formerly Freescale and Motorola) |
| IBM |
|
| IBM/Nintendo |
| Other |
| Related links |
| Cancelled in gray,historic in italic |
TheRAD5500 is aradiation-hardened 64-bit processor core design created byBAE Systems Electronics, Intelligence & Support based on thePowerPC e5500 designed byIBM andFreescale Semiconductor.[1][2][6] Successor of theRAD750, the RAD5500 processor platform is for use in highradiation environments experienced on boardsatellites andspacecraft.
The RAD5500 core supportsVPX high speed connectors,DDR2/DDR3 memory, serialize/deserialize (SerDes), andSpaceWireIO.[7]
The RAD5500 core is based on those of the Freescale Semiconductore5500-basedQorIQsystem-on-chip. The RAD5510, RAD5515, RAD5545, RADSPEED-HB (host bridge), and RAD510 are fivesystem on a chip processors implemented with RAD5500 cores produced with 45 nmSOI technology from the IBMTrusted Foundry.[1][4]
The RAD5510[8] and RAD5515[9] processors employ a single RAD5500 core and are intended for medium processing capability in environments that require low power consumption (11.5 and 13.7 watts respectively). This processor provides up to 1.4 giga operations per second (GOPS) and 0.9 GFLOPS of performance. The RAD5515 is distinguished from the RAD5510 by the addition of RapidIO.[7]
The RAD5545 processor employs four RAD5500 cores, achieving performance characteristics of up to 5.6 giga-operations per second (GOPS) and over 3.7 GFLOPS.[10] Power consumption is 20 watts with all peripherals operating.
Based on the RAD5545, the RADSPEED-HB is intended for host processing and data management support for one to four RADSPEED DSPs. The RADSPEED-HB replaces a secondary DDR2/DDR3 memory interface connection found on the RAD5545 with connections for RADSPEED DSPs instead. (Note that RADSPEED DSPs are entirely different processors that are specialized fordigital signal processing and are not to be confused with the RADSPEED-HB, which serves as a host bridge.)
The RAD510 is marketed as a higher-performance and lower-power modern alternative to the RAD750 chips, for customers who do not need the performance of a RAD5545-based computer.[11][12] Unlike the RAD5545, it appears to be a single-core SoC.[3]
The RAD5545 SpaceVPXsingle-board computer is for use in the harsh environmental conditions of outer space; designed for operating in temperatures between −55 °C and 125 °C and radiation-hardened for a total ionizing dose of 100 krad (for the silicon chips). It is a 6U-220 format module, compliant to the ANSI/VITA 78.00 SpaceVPX standard, and includes either a RAD5515 or RAD5545 processor.[13] The RAD5545 SpaceVPX single-board computer is produced BAE Systems's facility in Manassas, Virginia, which is a U.S. Department of Defense Category 1A Microelectronics Trusted Source.[14]
RAD510 RAD5500 processor core operating frequency ranges from 66MHz to 462MHz, supporting both low power and high performance applications for enhanced versatility.
In the US, our radiation-hardened RAD510™ System on Chip (SoC) for space-based computing is entering fabrication. The RAD510 SoC will be the core of a single board computer with twice the performance capability, providing more advanced processing while demanding less power from its spacecraft than the industry standard RAD750® microprocessor.
For missions that do not require the same processing of the RAD5545 SBC, BAE Systems is developing the RAD510™ SBC. The RAD510 SBC will use software compatible with both the RAD750 and RAD5545 SBCs allowing developers to reduce software development cost.