This is an overview ofchipsets sold under theAMD brand, manufactured before May 2004 by the company itself, before the adoption ofopen platform approach as well as chipsets manufactured byATI Technologies after October 2006 as the completion of the ATI acquisition.
Model | Code name | Released | CPU support | Fab (nm) | FSB/HT (MHz) | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|
AMD-640 chipset | AMD-640 | 1997 | K6, | ? | 66 (FSB) | AMD-645 | AMD licensedVIA Technologies'Apollo VP2/97 |
AMD-750 chipset | AMD-751 | 1999 | Athlon,Duron | 100 (FSB) | AMD-756, VIA-VT82C686A | AGP 2×, SDRAM Irongate chipset family; early steppings had issues with AGP 2×; drivers often limited support to AGP 1×; later fixed with "super bypass" memory access adjustment.[1] | |
AMD-760 chipset | AMD-761 | Nov 2000 | Athlon, Athlon XP, Duron | 133 (FSB) | AMD-766, VIA-T82C686B | AGP 4×, DDR SDRAM | |
AMD-760MP chipset | AMD-762 | May 2001 | Athlon MP | AMD-766 | AGP 4× | ||
AMD-760MPX chipset | AMD-768 | AGP 4×,Hardware RNG Most initial boards shipped without USB headers due to a fault with the integrated USB controller. Manufacturers included PCI USB cards to cover this shortcoming. A later refresh of the chipset had the USB problem remedied.[2] | |||||
AMD-8000 series chipset | AMD-8111 | Apr 2004 | Opteron | 800 (HT 1.x) | AMD-8131 AMD-8132 | Hardware RNG |
A-Link Express and A-Link Express II are essentiallyPCIe 1.1 x4 lanes.
SeeComparison of ATI Chipsets for the comparison of chipsets sold under theATI brand for AMD processors, before AMD's acquisition of ATI.
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|
AMD480X chipset (originally CrossFire Xpress 1600) | RD480 | Oct 2006 | Athlon 64, Sempron | 110 | 1000 (HT 2.0) | No | x8 + x8 | SB600, ULi-M1575 | ? |
AMD570X/550X chipset (originally CrossFire Xpress 3100) | RD570 | Jun 2007 | Phenom,[3] Athlon 64, Sempron | ? | No | x16 + x8 | SB600 | ||
AMD580X chipset (originally CrossFire Xpress 3200) | RD580 | Oct 2006 | x16 + x16 | ||||||
AMD690V chipset | RS690C | Feb 2007 | Athlon 64, Sempron | 80 | 1000 (HT 2.0) | Radeon X1200 (350MHz) | No | SB600 | DirectX 9.0,AVIVO,HDMI/HDCP, noLVDS |
AMD690G chipset | RS690 | Phenom, Athlon 64, Sempron | Radeon X1250 (400MHz) | DirectX 9.0, AVIVO, HDMI/HDCP | |||||
AMDM690V chipset | RS690MC | Turion 64 X2, Athlon 64 X2 mobile | 800 (HT 2.0) | Radeon X1200 (350 MHz) | No | DirectX 9.0, AVIVO, DVI, HDMI/HDCP, noLVDS, Powerplay 7.0 | |||
AMDM690 chipset | RS690M | Radeon X1250 (350 MHz) | DirectX 9.0, AVIVO, DVI/HDCP, no HDMI, Powerplay 7.0 | ||||||
AMDM690E chipset | RS690T | Athlon Neo, Mobile Sempron | Radeon X1250 (350Mhz) | No | DirectX 9.0, AVIVO, 2×HDMI/HDCP, Powerplay 7.0 | ||||
AMDM690T chipset | Turion 64 X2, Athlon 64 X2 mobile | Radeon X1270 (400Mhz) | DirectX 9.0, AVIVO,HDMI/HDCP, Powerplay 7.0 | ||||||
AMD740 chipset | RX740 | 2008 | Athlon 64, Phenom, Sempron | 55 | 1000 (HT 2.0) | No | No | SB600, SB700, SB750 | Single PCIe 1.1 x16 |
AMD740G chipset | RS740 | Radeon 2100 | DirectX 9.0, AVIVO,HDMI/HDCP, OR single PCIe 1.1 x16 | ||||||
AMD760G chipset | RS780L | 2009 | 2600 (HT 3.0) | Radeon 3000 | Hybrid | SB710 | DirectX 10, AVIVO HD,HDMI/HDCP, OR single PCIe 2.0 x16 | ||
AMD770 chipset | RX780 | 2008 | 65 | No | No | SB600, SB700, SB710, SB750 | Single PCIe 2.0 x16 | ||
AMD780V chipset | RS780C | 55 | Radeon 3100 | No | SB700, SB710, SB750 | DirectX 10, AVIVO HD,HDMI/HDCP, DisplayPort/DPCP, OR single PCIe 2.0 x16 | |||
AMD780G chipset | RS780I | Radeon HD 3200 | Hybrid | DirectX 10, UVD+,HDMI/HDCP,DisplayPort/DPCP, Side-port memory, OR single PCIe 2.0 x16 | |||||
AMDM780V chipset | RS780MC | Mobile Turion, Mobile Athlon, Athlon Neo | Radeon 3100 | PowerXpress AXIOM/MXM module(s) | SB600, SB700, SB710 | DirectX 10, UVD+, HDMI/HDCP,DisplayPort,DVI,VGA, OR single PCIe 2.0 x16 | |||
AMDM780G chipset | RS780M | Radeon HD 3200 | |||||||
AMD785G chipset | RS880 | 2009 | Athlon 64, Phenom, Sempron | Radeon HD 4200 | Hybrid, x16 + x4 | SB710, SB750, SB810, SB850 | DirectX 10.1, UVD2, Side-port memory, HDMI/HDCP,DisplayPort/DPCP, OR two PCIe 2.0 x16 TDP: 11 W (500 MHz), 3 W in PowerPlay | ||
785E | RS785E | ? | 2200 (HT 3.0) | Radeon HD 4200 | Hybrid | SB810, SB850, SB820M | |||
AMD790GX chipset | RS780D | 2008 | Athlon 64, Phenom, Sempron | 2600 (HT 3.0) | Radeon HD 3300 | Hybrid, x8 + x8[4] | SB750 | DirectX 10, UVD+, Side-port memory, HDMI/HDCP,DisplayPort/DPCP, OR two PCIe 2.0 x16 | |
AMD790X chipset | RD780 | 65 | No | x8 + x8 | SB600, SB700, SB750, SB850 | Two PCIe 2.0 x16 | |||
AMD790FX chipset | RD790 | Nov 2007 | No | CrossFire X (dual x16 or quad x8) | SB600, SB750, SB850 | Up to four PCIe 2.0 x16 Support forAMD Quad FX platform (FASN8), Dual socket enthusiast platform withNUMA, optional single socket variant, 720-pin 1.1VFC-BGA | |||
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
A-Link Express III is essentiallyPCIe 2.0 x4 lanes.
Model | Code name | Released | CPU support | Fab (nm) | HT (MHz) | AMD-V (Hardware Virtualization) | IGP | CrossFire | SLI[5] | TDP (W) | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD870 chipset | RX880 | 2010 | Phenom II, Athlon 64, Sempron | 65 | 2600 (HT 3.0) | ? | No | Hybrid, x16 + x4 | No | ? | SB850 | Single PCIe 2.0 x16 |
AMD880G chipset | RS880P | Q4 2010 | Phenom II, Athlon II, Sempron | 55 | ? | Radeon HD 4250 | Hybrid | No | SB710, SB750, SB810, SB850, SB920, SB950 | DirectX 10.1, UVD2, HDMI/HDCP,DisplayPort/DPCP, OR single PCIe 2.0 x16 AM3+ socket support | ||
AMD880M chipset | RS880M | Q2 2010 | Mobile Turion II, Mobile Athlon II, Mobile Sempron | ? | Radeon HD 4200 | PowerXpress AXIOM/MXM module(s) | No | SB820 | DirectX 10.1, UVD2, HDMI/HDCP,DisplayPort,DVI,VGA, sideport memory, OR single PCI-E 2.0 x16 Mobile Chipset,Tigris platform | |||
AMD880M chipset | Athlon II Neo, Turion II Neo | Radeon HD 4225 | No | DirectX 10.1, UVD2, HDMI/HDCP,DisplayPort,DVI,VGA, OR Single PCI-E 2.0 x16 Mobile Chipset,Nile platform | ||||||||
AMD880M chipset | Mobile Phenom II, Mobile Turion II, Mobile Athlon II, Mobile Sempron V-Series | Radeon HD 4250 Radeon HD 4270 | No | DirectX 10.1, UVD2, HDMI/HDCP,DisplayPort,DVI,VGA, OR single PCI-E 2.0 x16 Mobile Chipset,Danube platform | ||||||||
AMD890GX chipset | RS880D | Phenom II, Athlon II, Sempron | ? | Radeon HD 4290 | Hybrid, x8 + x8 | No | 22 | SB710, SB750, SB810, SB850 | DirectX 10.1, UVD2, HDMI/HDCP,DisplayPort/DPCP, Side-port memory, OR two PCIe 2.0 x16 | |||
AMD890FX chipset | RD890 | Bulldozer,[6] Phenom II, Athlon II, Sempron | 65 | Yes[7] | No | x16 + x16 or x8 quad | No | 18 | SB710, SB750, SB810, SB850 | Four PCIe 2.0 x16 | ||
AMD970 chipset | RX980 | Q2 2011 | Bulldozer,Piledriver Phenom II, Athlon II, Sempron, FX | 65 | 2400 (HT 3.0) | Yes[8] | No | x16 + x4 | No | 13.6 | SB710, SB750, SB810, SB850, SB920, SB950 | Single PCIe 2.0 x16,IOMMU AM3+ socket support |
AMD990X chipset | RD980 | 2600 (HT 3.0) | x8 + x8 | x8 + x8 | 14 | Two PCIe 2.0 x16,IOMMU AM3+ socket support | ||||||
AMD990FX chipset | RD990 | x16 + x16 or x8 quad | x16 + x16 or x16 + x8 + x8 or x8 quad | 19.6 | Four PCIe 2.0 x16,IOMMU AM3+ socket support | |||||||
Model | Code name | Released | CPU support | Fab (nm) | HT (MHz) | AMD-V (Hardware Virtualization) | IGP | CrossFire | SLI | TDP (W) | Southbridge | Features / Notes |
Model | Codename | Released | Fab (nm) | USB 2.0 + 1.1 | Audio | Parallel ATA1 | Features / Notes |
---|---|---|---|---|---|---|---|
AMD 640 chipset | AMD-645 | 1997 | 2 × ATA/33 | ||||
AMD 750 chipset | AMD-756 | 1999 | 0 + 4 | 2 × ATA/66 | |||
AMD 760 chipset | AMD-766 | 2001 | 2 × ATA/100 | ||||
AMD 760MPX chipset | AMD-768 | AC'97 | |||||
Geode GX1 | Geode CS5530 | AC'97 | 2 × ATA/33 | National Semiconductor release | |||
Geode GXm Geode GXLV | Geode CS5530A | ||||||
Geode GX | Geode CS5535 | 0 + 4 | 2 × ATA/66 | ||||
Geode LX | Geode CS5536 | 4 + 0 | 2 × ATA/100 | ||||
AMD-8111 nForce Professional ULi-1563 | AMD-8131 | 2004 | 4 + 2 | AC'97 | 2 × ATA/133 | PCI-X | |
AMD-8132 | PCI-X 2.0 | ||||||
AMD-8151 | AMD-8151 | AGP 8X |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
Model | Codename | Released | Fab (nm) | SATA | USB 2.0 + 1.1 | Parallel ATA1 | RAID | NIC | Package | TDP (W) | Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|
AMD 480/570/580/690 CrossFire Chipset | SB600 | 2006 | 130 | 4 × 3 Gbit/s AHCI 1.1SATA Revision 2.0 | 10 + 0 | 1 × ATA/133 | 0,1,10 | No | 548-pin FC-BGA | 4.0 | |
AMD 700 chipset series | SB700 | Q1 2008 | 6 × 3 Gbit/s AHCI 1.1SATA Revision 2.0 | 12 + 2 | 1 × ATA/133 | No | 4.5 | DASH 1.0 | |||
SB700S | DASH 1.0 Server southbridge | ||||||||||
SB710 | Q4 2008 | DASH 1.0 | |||||||||
SB750 | 0,1,5,10 | ||||||||||
AMD 800 chipset series | SB810 | Q1 2010 | 65 | 6 × 3 Gbit/s AHCI 1.2SATA Revision 2.0 | 14 + 2 | No | 0,1,10 | 10/100/1000 | 605-pin FC-BGA | 6.0 | |
SB850 | 6 × 6 Gbit/s AHCI 1.2SATA Revision 3.0 | 0,1,5,10 | |||||||||
SB820M | 0,1 | 3.4 - 5.3 | mobile/embedded | ||||||||
AMD 900 chipset series | SB920 | May 30, 2011 | 6 × 6 Gbit/s AHCI 1.2SATA Revision 3.0 | No | 0,1,10 | 10/100/1000 | 6.0 | ||||
SB950 | 0,1,5,10 | ||||||||||
Model | Codename | Released | Fab (nm) | SATA | USB 2.0 + 1.1 | Parallel ATA1 | RAID | NIC | Package | TDP (W) | Features / Notes |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
For AMD APU models from 2011 until 2016. AMD marketed their chipsets as Fusion Controller Hubs (FCH), implementing it across their product range in 2017 alongside the release of the Zen architecture. Before then, only APUs used FCHs, while their other CPUs still used a northbridge and southbridge. The Fusion Controller Hubs are similar in function to Intel'sPlatform Controller Hub.
AMD's FCH has been discontinued since the release of the Carrizo series of CPUs as it has been integrated into the same die as the rest of the CPU.[9] However, since the release of the Zen architecture, there's still a component called a chipset which only handles relatively low speed I/O such as USB and SATA ports and connects to the CPU with a PCIe connection. In these systems all PCIe connections are routed directly to the CPU.[10] The UMI interface previously used by AMD for communicating with the FCH is replaced with a PCIe connection. Technically the processor can operate without a chipset; it only continues to be present for interfacing with low speed I/O. AMD server CPUs adopt a self containedsystem on chip design instead which doesn't require a chipset.[11][12][13][14]
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 | RAID | NIC | 33 MHz PCI | SD[S 1] | VGA DAC | TDP (W) | Features / notes | Part number |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Mobile | ||||||||||||
A55T | Hudson-M2T[N 1] | ×2 Gen 1 | 1× 3 Gbit/s AHCI 1.1 | 0 + 8 + 0 | No | No | No | SDIO | No | |||
A50M | Hudson-M1[N 1] | ×4 Gen 1[M 1] | 6× 6 Gbit/s AHCI 1.2 | 0 + 14 + 2 | No | 5.9[15] | ~920 mW idle | 100-CG2198[15] | ||||
A60M | Hudson-M2[N 1] | ×4 Gen 1 +DP | 0,1 | 10/100/1000 | Yes | Yes | 4.7 | |||||
A68M | Hudson-M3L[N 1] | 2× 6 Gbit/s AHCI 1.2 | 2 + 8 + 0 | No | ~750 mW idle | 218-0792006 | ||||||
A70M | Hudson-M3[N 1] | 6× 6 Gbit/s AHCI 1.2 | 4 + 10 + 2 | Yes | First native USB 3.0 controller[16] | 100-CG2389[15] | ||||||
A76M | Bolton-M3[N 1] | 218-0844012 | ||||||||||
Desktop | ||||||||||||
A45 | Hudson-D1[N 2] | ×4 Gen. 2[M 2] | 6× 3 Gbit/s AHCI 1.1 | 0 + 14 + 2 | No | No | Up to 4 slots | No | No | 218-0792008 | ||
A55 | Hudson-D2[N 2] | ×4 Gen 2 +DP | 0,1,10 | 10/100/1000 | Up to 3 slots | Yes | Yes | 7.6 | ||||
A58 | Bolton-D2[N 2] | ×4 Gen 2 | 6× 3 Gbit/s AHCI 1.3 | 218-0844023 | ||||||||
A68H | Bolton-D2H[N 2] | 4× 6 Gbit/s AHCI 1.3 | 2 + 10 + 2 | xHCI 1.0 | 218-0844029-00 | |||||||
A75 | Hudson-D3[N 2] | ×4 Gen 2 +DP | 6× 6 Gbit/s AHCI 1.2 | 4 + 10 + 2 | 10/100/1000 | 7.8[15] | First native USB 3.0 controller[16] | 100-CG2386[15] | ||||
A78 | Bolton-D3[N 2] | 6× 6 Gbit/s AHCI 1.3 | 7.8 | xHCI 1.0 | 218-0844014 | |||||||
A85X | Hudson-D4[N 2] | 8× 6 Gbit/s AHCI 1.2 | 0,1,5,10 | 10/100/1000 | USB 3.0 (xHCI 0.96) | 218-0755117 | ||||||
A88X | Bolton-D4[N 2] | ×4 Gen 2 | 8× 6 Gbit/s AHCI 1.3 | USB 3.0 (xHCI 1.0) | 218-0844016 | |||||||
Embedded | ||||||||||||
A55E | Hudson-E1[N 3] | ×4 Gen 2 | 6× 6 Gbit/s AHCI 1.2 | 0 + 14 + 2 | 0,1,5,10 | 10/100/1000 | Up to 4 slots | No | No | 5.9[15] | 100-CG2293[15] | |
A77E[17] | Bolton-E4[N 3] | 1-, 2-, or 4-lane 2 or 5 GB/s | 6× 6 Gbit/s AHCI 1.3 | 4 + 10 + 2 | Up to 3 slots | Yes | Yes | 4-lane PCIe 2.0 | 218-0844020-00 | |||
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 | RAID | NIC | 33 MHz PCI | SD[S 1] | VGA DAC | TDP (W) | Features / notes | Part number |
Secure Digital:
Codename:
UMI:
There are currently 3 generations of AM4-based chipsets on the market. Models beginning with the numeral "3" are representatives of the first generation, those with "4" the second generation, etc.
In addition to their traditional chipsets, AMD offers chipsets with "processor-direct access", exclusively through OEM partners.[18] Enthusiast publicationigor'sLAB obtained leaked documents about an AMD "Knoll Activator" that enables "activating... processor I/O and processor features in the absence of an alternative AMD chipset." It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips.[19]
Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences.[20][21]
Model | Release date | PCIe support[a] | Multi-GPU | USB support[b] | Storage features | Processor overclocking | TDP | CPU support | Architecture | Part number | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | SATA ports | RAID | AMD StoreMI | Excavator | Zen | Zen+ | Zen 2 | Zen 3 | ||||||||
A300 | Feb 2017 | None | Untested | None | None | Yes[22] | No[23] | No | ~120 μW[c] | No | Yes[24][25] | Knoll Express[26] | 100-CG2978 218-0892000 KNOLL1 | ||||
X300 | Yes | Yes[27] | unknown | ||||||||||||||
Pro 500 | Jan 2020[28] | Unknown | No | Partial[d] | 218-0891003 unreleased | ||||||||||||
A320 | Feb 2017[29][30] | PCIe 2.0 ×4 | No | No | 1, 2, 6 | 4 | 0, 1, 10 | No | Limited[e] | ~5.8 W[31] | Yes | Yes | Yes | Varies[f] | Promontory | 218-0891004 | |
B350 | PCIe 2.0 ×6 | Yes | 2, 2, 6 | Yes | 218-0891005 | ||||||||||||
X370 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | 218-0891006 | ||||||||||||
B450 | Mar 2018[32] | PCIe 2.0 ×6 | No | 2, 2, 6 | 4 | Yes | Yes, withPBO | Varies[g] | Yes | Varies[g][33] | 218-0891011 | ||||||
X470 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | 218-0891008 | ||||||||||||
A520 | Aug 2020[34] | PCIe 3.0 ×6 | No | 1, 2, 6 | 4 | No | Varies | 218-0891015 | |||||||||
B550[h] | Jun 2020[35][36] | PCIe 3.0 ×10 | Yes | Varies | 2, 2, 6 | 6 | Yes, withPBO | ~7W | 218-0891014 - b550, 218-0891009 - B550A | ||||||||
X570 | Jul 2019[37][38] | PCIe 4.0 ×16 | Yes | 8, 0, 4 | 12 | ~15 W[39][40][i] | No | Yes | Yes | Bixby | 100-CG3091 |
The 300 series, 400 series, and the B550 chipsets are designed in collaboration withASMedia and the family is codenamed Promontory.[41] The X570 is designed by AMD with IP licensed from ASMedia and other companies and is codenamed Bixby.[42]Network interface controller,Wi-Fi, andBluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55nm lithography.[43] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process.[44]
Supports both 1st and 2nd generation AMD Ryzen Threadripper processors.[45]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA +SATA Express | USB 3.1 Gen 2 + 3.1 Gen 1 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | |
---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | |||||||||
X399[46][45] | ×4 | PCIe 2.0 ×8 | Yes | Yes | 4 + 2 | 2 + 14 + 6 | 0,1,10 | Yes | 5 W[47] | Unknown |
Supports 3rd generation AMD Ryzen Threadripper (3960X to 3990X) processors.[48]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX40[48] | ×8 | PCIe 4.0 ×8 | Yes | Yes | 4 (+ up to 2 × 4 extra) | 8 + 4 | 0,1,10 | Yes | 15 W[47] | 14 nm | HW-wise identical to X570[citation needed] |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins. Twelve TRX40 motherboards were released at launch in November 2019. The TRX40 chipset does not support theHD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on TRX40 motherboards to integrate audio codecs.[47]
Supports 3rd (3900WX) and 4th generation (5900WX) AMD Ryzen Threadripper Pro processors.[49]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
WRX80 | ×8 | PCIe 4.0 ×16 | Yes | Yes | 4 | 8 + 4 | 0,1,10 | Yes | 15 W | 14 nm | HW-wise identical to EPYC/Threadripper IO die[citation needed] |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins.[47] Three WRX80 motherboards were released at launch in March 2021. The WRX80 chipset does not support theHD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on WRX80 motherboards to integrate audio codecs.
AMD uses a single Promontory 21 chipset for all configurations that include a chipset. A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670, X670E and X870E chipsets.[50]
Branding | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
A620 | B650 | B650E | X670 | X670E | B840 | B850 | X870 | X870E | ||||
Platform features | PCIe 5.0 support[a] | x16 slot | No | No | Yes | No | Yes | No | Optional | Yes | Yes | |
M.2 slot + 4×GPP | No | M.2 Optional | Yes | Yes | Yes | No | Yes | Yes | Yes | |||
x16 slot configurations | 1×16 | 1×16 or 2×8 | 1×16 | 1×16 or 2×8 | ||||||||
Multi-GPU | CrossFire | No | Yes | Yes | Yes | Yes | No | Yes | Yes | |||
SLI | No | No | No | No | No | No | No | No | No | |||
USB4 Gen 3×2(40 Gb/s)[b] | Optional | Optional | Optional | Optional | Optional | Optional | Optional | Yes | Yes | |||
Wi-Fi version[b][c] | 6 | 7 | ||||||||||
Processor overclocking | No | Yes | Yes | Yes | Yes | No | Yes | Yes | Yes | |||
Chipset specifications | PCIe lanes[d] | Gen 4 | None | ×8 | ×12 | x10 | x12 | ×8 | ×12 | |||
Gen 3 | Up to ×8 | Up to ×4 | Up to ×8 | Up to x4 | Up to ×4 | Up to ×8 | ||||||
USB support | USB 2.0 | 6 | 12 | 6 | 12 | |||||||
USB 3.2 Gen 1x1 (5 Gb/s) | 2 | None | None | |||||||||
USB 3.2 Gen 2x1 (10 Gb/s) | 2 | 4 | 8 | 2 | 6 | 4 | 8 | |||||
USB 3.2 Gen 2x2 (20 Gb/s) | None | 1[e] | 2[f] | None | 1[e] | 2[f] | ||||||
Storage features | SATA III ports | Up to 4 | Up to 8 | Up to 4 | Up to 8 | |||||||
RAID | 0, 1, 10 | |||||||||||
ChipsetTDP | ~4.5 W | ~7 W | ~14 W[g] | ~7 W | ~14 W[g] | |||||||
Architecture | Promontory 21 ×1 | Promontory 21 ×2 | Promontory 21 ×1 | Promontory 21 ×2 | ||||||||
Chipset links | To CPU | PCIe 4.0 ×4 | ||||||||||
Interchipset | — | PCIe 4.0 ×4 | — | PCIe 4.0 ×4 | ||||||||
CPU support | Zen 4 | Yes | ||||||||||
Zen 5 | Yes | |||||||||||
Release date | Mar 31, 2023 | Oct 10, 2022 | Sep 27, 2022 | Jan 6, 2025 | Sep 2024 | |||||||
Reference(s) | [51][52][53] | [51][54][55] | [51][56][57][58] |
ThesTR5 socket has two chipset options available, TRX50 and WRX90:
HD audio support is provided by the CPU, rather than by the chipset.[60]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.2 Gen 2x2 + 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX50[61] | PCIe 4.0 ×8 | 4 | 1 + 4 + 4 | Yes | |||||||
WRX90[60][61] | ×4 |
{{cite web}}
: CS1 maint: multiple names: authors list (link)the X570 platform is targeting a release of Computex 2019, which takes place between May 28th and June 1st.
slide
One of the caveats to a more powerful chipset is that it draws around 11 W of power.
The source also mentions the TDP of the AMD X570 chipset to be at least 15 Watts, a 3-fold increase over the X470 with its 5W TDP.
Q6: It has been noted that AMD has been working with ASMedia on the chipset side of the platform, using a 55nm PCIe 3.0x4 based chipset.