 | |
| Release date | 2016 (2016) |
|---|---|
| Designed by | Intel |
| Manufactured by | Lotes |
| Type | LGA-ZIF |
| Chip form factors | Flip-chip |
| Contacts | 3647 |
| FSB protocol | |
| Processor dimensions | 76.0mm × 56.5mm 4,294mm2 |
| Processors | |
| Predecessor | LGA 2011 |
| Variant | LGA 2066 (HEDTs and workstations) |
| Successor | LGA 4189 |
| Memory support | DDR4 |
This article is part of theCPU socket series | |
LGA 3647 is anIntelmicroprocessor compatiblesocket used byXeon Phi x200 ("Knights Landing"),[1]Xeon Phi 72x5 ("Knights Mill"),Skylake-SP,Cascade Lake-SP, andCascade Lake-W microprocessors.[2]
The socket supports a 6-channel memory controller, non-volatile3D XPoint memory DIMMs,Intel Ultra Path Interconnect (UPI), as a replacement forQuick Path Interconnect (QPI), and 100GOmni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler's pressure and its screws to secure it in place.
There are two sub-versions of this socket with differences also in the ILM (Independent Loading Mechanism, pitch of center screws changed slightly and a more visible one being that the guiding pins are in other corners). The processor socket and the matching notches on the processor are at different location, preventing insertion of an incompatible processor and preventing use of the wrong heatsink in a system. The more common P0 variant has two sub-options for heatsink mounting – designated as square ILM and narrow ILM, choice of which depends on the server andmainboard design (likely based on space constraints).
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