By Anders Blom and Igor Markov“Force fields” have long captured our imagination — the invisible shields of science-fiction lore that protect starships and superheroes from harm. But in the world of scientific discovery, force fields play a much different role: They are mathematical models that let us peer into the atomic heart of matter itself.Now, thanks to breakthroughs in artif...» read more
Key Takeaways Moving lasers into the same package as silicon helps improve performance. More colors enable more data to be moved, but too many colors in a small space can cause issues. New options are being turned into products, which could help commercialize CPO.The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs) and electronic ICs (EICs) ...» read more
Key Takeaways Contamination is becoming much more difficult to identify at the most advanced nodes, forcing fabs to rethink how control is achieved. Issues may show up as electrical or statistical anomalies, not particles, and not at time zero. Reliable classification is needed to identify critical contamination and reduce time and effort spent on nuisance failures.For much...» read more
Discover how modern chip designs are revolutionizing the lithographic process, driving the need for innovative solutions to meet the industry's demand for shorter design cycles. This whitepaper explores the significant role of GPUs in accelerating computational lithography, offering unprecedented speed-ups for EDA tools in chip development. Learn about the collaborative efforts of Synopsys, NVI...» read more
Synopsys' Raja Tabet anticipates deployment of an agentic AI workforce within the next 12 to 24 months that can take on different engineering personas, such as a digital implementation agent, a verification agent, or an analog agent, to run experiments in parallel, generate and triage tests, and propose fixes.Cadence's Reela Samuel dives into power usage effectiveness in data centers and wh...» read more
Key Takeaways New approaches are being devised and tested to address the talent shortage. Leveraging AI in design tools will help engineers become more efficient, and potentially could reduce the time it takes to train engineering students. EDA companies are looking at whether it's possible to train computer science and software engineers to become hardware engineers.A vari...» read more
Key Takeaways Data center build-out is enabling much larger and more complex abstractions. Competition is building for digital/virtual twins across multiple industry segments, including automotive, aerospace, and chip manufacturing. AI, and particularly AI agents, will play a significant role in sorting through data to find potential trouble spots.The frenzy of new data cen...» read more
GeopoliticsU.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential.The U.S....» read more
Key Takeaways• Chiplets and 3D-IC architectures add new thermal-mechanical stresses that can affect the reliability of entire systems.• As chiplets are assembled into packages, defectivity targets become more stringent for each component in a system.• Traditional silos are breaking down, forcing design teams to address issues such as materials choices that previously were handled by...» read more
Key Takeaways UCIe 3.0 doubles bandwidth and enhances manageability, addressing new use cases and following an annual update cycle since 2023. The growing demand for chiplet-based architectures in AI data centers is driven by the limitations of monolithic chips, making inter-chiplet communication and connectivity crucial. While UCIe was initially seen as feature-heavy, many of its ma...» read more
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture.
Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as insurance for evolving protocols.
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