Chiplet architectures are quickly becoming the dominant approach for building scalable, heterogeneous SoCs. By disaggregating a monolithic die into multiple interoperable chiplets, silicon designers gain flexibility in process node choices, reuse of proven functions, and faster time-to-market. At the same time, disaggregation breaks one of the most fundamental assumptions in traditional SoC sec...» read more
By Dana Neustadter and Vincent van der LeestOver the next decade, artificial intelligence will dominate computing, driving profound changes in both hardware and software architectures. This transformation will reshape data center design and interconnect technologies, creating new opportunities for innovation. As AI workloads scale, the need for high-speed, low-latency communication between ...» read more
As semiconductor designs advance into cutting-edge nodes, the complexity of integrated IP blocks from diverse sources is expanding the attack surface. Traditional software-only security measures are increasingly inadequate, as attackers exploit vulnerabilities beneath the software layer.To counter these risks, designers of AI accelerators, automotive domain controllers, aerospace systems, a...» read more
FIPS 140‑3 is a U.S. federal standard. Validations are issued under the Cryptographic Module Validation Program (CMVP), jointly managed by the National Institute of Standards (NIST) and the Canadian Center for Cyber Security (CCCS). These validations are accepted by both U.S. and Canadian federal agencies. The standard imposes strict requirements on security boundaries, operational environmen...» read more
Fault injection is usually discussed in the context of security, where adversaries deliberately induce faults to bypass protections or extract sensitive information. In safety engineering, by contrast, faults are often treated as rare, random events driven by natural or environmental factors. The recent Airbus A320 recall is a good example of how a primarily safety incident can still benefit fr...» read more
By Dana Neustadter and Vincent van der LeestIn the realm of high-performance computing (HPC) and data centers, Ethernet is one of the interfaces of choice due to its scalability, reliability, and broad industry support. Ethernet's ability to efficiently handle large volumes of data makes it ideal for HPC environments that require high-speed data transmission and seamless integration with ex...» read more
Devices in a broad range of edge AI applications are increasingly at risk of hacking or tampering, with the stakes varying greatly depending on how much the device can impact and interact with human life. Design methods and protection techniques must now be included up front in the design cycle for optimal protection of consumers and companies as the quantum threat looms.In today’s factor...» read more
Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president a...» read more
Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat.Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins...» read more
In automotive, security, and pervasive computing, the stakes of failure have never been higher. Functional safety, security compliance, long product lifecycles, and system resilience are no longer differentiators — they are baseline requirements. Yet many semiconductor and system companies are still relying on an outdated engagement model built around static datasheets, fragmented tools, and ...» read more
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture.
Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as insurance for evolving protocols.
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