The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d...» read more
Discover how modern chip designs are revolutionizing the lithographic process, driving the need for innovative solutions to meet the industry's demand for shorter design cycles. This whitepaper explores the significant role of GPUs in accelerating computational lithography, offering unprecedented speed-ups for EDA tools in chip development. Learn about the collaborative efforts of Synopsys, NVI...» read more
Key Takeaways UCIe 3.0 doubles bandwidth and enhances manageability, addressing new use cases and following an annual update cycle since 2023. The growing demand for chiplet-based architectures in AI data centers is driven by the limitations of monolithic chips, making inter-chiplet communication and connectivity crucial. While UCIe was initially seen as feature-heavy, many of its ma...» read more
Intel hired ex-Qualcomm GPU guru Eric Demers for the company's high-performance GPU push, setting the stage for a three-way battle with Nvidia and AMD. The key targets for Intel and AMD will be better power efficiency and a programming model that rivals CUDA, but don't expect Nvidia to stand still.Acquisitions Texas Instruments plans to acquire Silicon Labs for ~$7.5B cash to enhance i...» read more
Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections. Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q...» read more
TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes.Memory The U.S. threatened 100% tariffs on South Korean memory compan...» read more
AI workloads need to position more memory that uses less power in ever-closer proximity to computational logic. That overriding imperative is driving new memory designs and new materials exploration across a wide range of applications, including cache memory, working memory, as well as a new category, non-volatile memory used for direct computation.The largest of these, by volume, is workin...» read more
GeopoliticsTaiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S. The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap...» read more
SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase.Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ...» read more
Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D.Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic...» read more
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture.
Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as insurance for evolving protocols.
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