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Why Thin Film Measurements Matter

ByLaura Peters - 08 Apr, 2025 - Comments: 0

Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward first-silicon, the importance of precise film measurement is only growing in significance as fabs seek to maintain the performance and reliability of leading-edge devices.Whether it’s the read and writ...» read more

Measuring Multi-Layer Ultra-Thin Critical Films

ByJiangtao Hu - 11 Mar, 2025 - Comments: 0

Artificial intelligence is one of the driving forces in today’s semiconductor industry, with more traditional market drivers like high performance compute and smart phones continuing to play important roles. This situation is unlikely change in the years ahead as chip makers continue their quest to create the most advanced nodes. With 3nm nodes in production and 2nm nodes on the horizon, the ...» read more

Using Test And Metrology Data For Dynamic Process Control

ByGregory Haley - 14 Jan, 2025 - Comments: 0

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device characterization, and complex yield optimization strategies.These combinations are essential to improving performance and functionality, but they create some thorny issues for which there are no easy fixes. ...» read more

Advanced Packaging Drives Test And Metrology Innovations

ByGregory Haley - 12 Nov, 2024 - Comments: 1

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes.In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon...» read more

Metrology Advances Step Up To Sub-2nm Device Node Needs

ByLaura Peters - 15 Oct, 2024 - Comments: 0

Metrology and inspection are dealing with a slew of issues tied to 3D measurements, buried defects, and higher sensitivity as device features continue to shrink to 2nm and below.This is made even more challenging due to increasing pressure to ramp new processes more quickly. Metrology tool suppliers must exceed current needs by a process node or two to ensure solutions are ready to meet tig...» read more

Non-Destructive Measurement of Bottom Width in Deep Trench Isolation Structures using IRCD Metrology

ByOnto Innovation - 10 Sep, 2024 - Comments: 0

As scaling in semiconductor devices continues, the aspect ratios of deep trench isolation (DTI) structures have increased. DTI structures are used in power devices, power management ICs and image sensors as a method to isolate active devices by reducing crosstalk, parasitic capacitance, latch-up and allowing for an increase breakdown voltage of active devices. Measurement of these structures in...» read more

ECTC 2024 Session Readout: Advancement of Metrology

ByTechnical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International.Abstract:"Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this...» read more

Research Bits: Aug. 13

ByJesse Allen - 13 Aug, 2024 - Comments: 0

3D X-ray of chip interiorsResearchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution.To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ...» read more

Metrology And Inspection For The Chiplet Era

ByGregory Haley - 06 Aug, 2024 - Comments: 0

New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets.These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a...» read more

Research Bits: Aug. 5

ByJesse Allen - 05 Aug, 2024 - Comments: 0

Measuring temperature with neutronsResearchers from Osaka University, National Institutes for Quantum Science and Technology, Hokkaido University, Japan Atomic Energy Agency, and Tokamak Energy developed a way to rapidly measure the temperature of electronic components inside a device using neutrons.The technique, called ‘neutron resonance absorption’ (NRA), examines neutrons being ab...» read more

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