Key Takeaways New approaches are being devised and tested to address the talent shortage. Leveraging AI in design tools will help engineers become more efficient, and potentially could reduce the time it takes to train engineering students. EDA companies are looking at whether it's possible to train computer science and software engineers to become hardware engineers.A vari...» read more
GeopoliticsU.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential.The U.S....» read more
Key Takeaways Extracting heat from a chip faster is a short-term fix to a bigger problem. The longer-term challenge is how to reduce the amount of energy used per query. Data movement, guardbanding, and software inefficiency are key targets for the future.Heat is a serious problem within AI chips, and it is limiting how much processing can be done. The solution is either to...» read more
The race to build smarter and faster AI chips continues to surge. This is especially true in autonomous vehicles that interpret the world in milliseconds, edge accelerators that push trillions of operations per second, hyperscale data-center processors that drive massive workloads, and next-generation consumer devices that demand ever-higher intelligence. As modern system-on-chip (SoC) architec...» read more
Key Takeaways Architectural conformance and implementation verification are necessary but different for RISC-V designs, yet few verification engineers have experience on the conformance side. While RISC-V enables flexibility, there is a potential for ecosystem fragmentation. It is mathematically impossible to test every instruction combination, so engineers are moving beyond just "bl...» read more
Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil...» read more
Verification of modern System on Chip (SoC) designs involve many components. Hardware Description Languages (VHDL, System Verilog), Unified Power Format (UPF), Software Languages (C#/C++), Interconnect standards (IP-XACT, AMBA), and specialty purpose-built layers such as the Universal Verification Methodology (UVM) and System Verilog Assertions (SVA). This deck explores using Arteris SoC Integr...» read more
GeopoliticsTaiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S. The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap...» read more
The number of processes running simultaneously inside of chips is growing, fueled by massive increases in data from AI and sensors everywhere. The challenge now, particularly in multi-die assemblies, is how to prioritize where signals go, how quickly they move, and when they're supposed to arrive at shared memories. Andy Nightingale, vice president of product management and marketing at Arteris...» read more
Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D.Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic...» read more
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture.
Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as insurance for evolving protocols.
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