QP Technologies provides prototype and volume IC packaging and IC assembly services, as well as wafer preparation. Packaging offerings include over-molded QFN/DFN packages and pre-molded air cavity QFN packages. In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, chip-on-board (COB) and chip-on-flex assemblies.
Originally called SPT, the company was founded in 1994. In 2000, device handling company Gel-Pak acquired SPT, which was renamed Quik-Pak. The companiesreorganized in 2004 under the name Delphon Industries. In April 2015, the Quik-Pak division wasacquired by Promex Industries, which focuses on microelectronic design, packaging, and assembly for medical and biotech devices. In 2021, Quik-Pak wasre-named QP Technologies.
November 2019:Acquired wafer preparation firm QBBS.
September 2008:Acquired Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units.
