As chip performance and integration continue to advance, thermal dissipation control has become increasingly critical not only at the wafer fabrication level but also in the packaging industry. For artificial intelligence (AI) and high performance computing (HPC) applications, the industry is gradually shifting toward 2.5D integration. In response to the growing demand, High-Density Fan-Out (HD...» read more
One of the unavoidable aspects of chip manufacturing is that some dies on a wafer perform differently than others, even though they were made together on the same wafer. This blog dives into that mystery and provides a way to predict and fix these issues.Imagine baking cookies. If your oven has hot and cold spots, some cookies will be perfect; others burnt. That’s what happens in chip man...» read more
By Anders Blom and Igor Markov“Force fields” have long captured our imagination — the invisible shields of science-fiction lore that protect starships and superheroes from harm. But in the world of scientific discovery, force fields play a much different role: They are mathematical models that let us peer into the atomic heart of matter itself.Now, thanks to breakthroughs in artif...» read more
Key Takeaways Moving lasers into the same package as silicon helps improve performance. More colors enable more data to be moved, but too many colors in a small space can cause issues. New options are being turned into products, which could help commercialize CPO.The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs) and electronic ICs (EICs) ...» read more
By Jan-Bart Smits and David HarapEvery time a transistor switches, it generates heat. Pack enough transistors together and you hit a wall: the chip melts before it computes. This thermal ceiling is why Splunk notes that "as physical and economic limitations are reached, the pace predicted by Moore's Law is slowing."Light solves this problem. Photons carry information without generating ...» read more
The semiconductor industry continues to serve as the foundation of U.S. technological innovation and economic growth, and it has entered its most decisive phase yet. As geopolitical competition intensifies and policy frameworks evolve, 2026 will push the United States to sustain its leadership in semiconductor design, manufacturing, and innovation amid growing alliances and accelerating competi...» read more
Key Takeaways Their low leakage is of interest for memory applications, particularly capacitor-less gain cell designs; They can be deposited over large areas using low-temperature processes, a very desirable characteristic for BEOL integration, and The variety of compositions available gives designers many options to achieve the specific properties they need. Indium tin oxide (ITO), ...» read more
Key Takeaways Contamination is becoming much more difficult to identify at the most advanced nodes, forcing fabs to rethink how control is achieved. Issues may show up as electrical or statistical anomalies, not particles, and not at time zero. Reliable classification is needed to identify critical contamination and reduce time and effort spent on nuisance failures.For much...» read more
Discover how modern chip designs are revolutionizing the lithographic process, driving the need for innovative solutions to meet the industry's demand for shorter design cycles. This whitepaper explores the significant role of GPUs in accelerating computational lithography, offering unprecedented speed-ups for EDA tools in chip development. Learn about the collaborative efforts of Synopsys, NVI...» read more
Key Takeaways: Scaling digital logic still provides significant benefits, especially lower power. Multi-die assemblies will be the predominant approach, and most of the circuitry will not be 2nm or below. While these systems are inherently more flexible, the number and complexity of tradeoffs required for optimizing PPA/C are increasing.The rollout of 2nm process nodes and ...» read more
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture.
Growing use cases include life science AI, reducing memory and I/O bottlenecks, data prepping, wireless networking, and as insurance for evolving protocols.
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