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Home >Manufacturing, Packaging & Materials > Laser Arrays May Simplify Co-Packaged Optics

Bryon Moyer

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Bryon Moyer is a technology editor at Semiconductor Engineering.

Author's Latest Posts

Laser Arrays May Simplify Co-Packaged Optics

ByBryon Moyer - 19 Feb, 2026 - Comments: 0

Key Takeaways Moving lasers into the same package as silicon helps improve performance. More colors enable more data to be moved, but too many colors in a small space can cause issues. New options are being turned into products, which could help commercialize CPO.The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs) and electronic ICs (EICs) ...» read more

UCIe’s Major Technical Components Are Now In Place

ByBryon Moyer - 12 Feb, 2026 - Comments: 0

Key Takeaways UCIe 3.0 doubles bandwidth and enhances manageability, addressing new use cases and following an annual update cycle since 2023. The growing demand for chiplet-based architectures in AI data centers is driven by the limitations of monolithic chips, making inter-chiplet communication and connectivity crucial. While UCIe was initially seen as feature-heavy, many of its ma...» read more

Chiplet Fundamentals For Engineers: eBook

ByBryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out  to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits.But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so...» read more

An Explosion In Interconnect Complexity

ByBryon Moyer - 22 Jan, 2026 - Comments: 0

For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also brings greater complexity and ratchets up the number of design decisions needed to complete a project.This transition has been evo...» read more

Liquid Cooling Gains Traction In Data Centers

ByBryon Moyer - 15 Jan, 2026 - Comments: 1

All electronics generate heat, and that heat must be removed to ensure those electronics don’t overheat. Moving air has been the predominant approach for decades, with liquid cooling limited to particularly intense computing workloads, largely in the supercomputing domain.With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buil...» read more

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

ByBryon Moyer - 13 Jan, 2026 - Comments: 0

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s merely a postponement, not a cancellation.HBM has been in high demand for AI in data centers — especially for training. Data movement dominates energy consumption, and high-bandwidth memories...» read more

What’s Next for 2.5D Packaging?

ByBryon Moyer - 18 Dec, 2025 - Comments: 0

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they're built and assembled.Interposers are becoming thicker and more complex, while bridges are being used to reduce the assembled cost. Both efforts are facing new challenges.Interposers are effectively platforms on which mu...» read more

Chiplets Vs. Soft IP: Different In Almost Every Way

ByBryon Moyer - 11 Dec, 2025 - Comments: 2

Chiplets serve a similar function as the soft IP widely used in chips today, but the similarities end there. While both can speed time to market and enable design teams to focus limited resources where they can best be applied, the implementation, manufacturing, test, and long-term business requirements wrought by a chiplet marketplace would be very different.Soft IP (also known as RTL IP) ...» read more

New Panel Production Efforts Target Interposer Costs

ByBryon Moyer - 20 Nov, 2025 - Comments: 0

The rising cost of increasingly large interposers is spurring renewed interest in panel-level manufacturing, which for years has hobbled along due to the massive and collective effort required by the chip industry to change formats.Several companies are developing their own processes, although there is currently no commercial production. And a new consortium called Joint3, spearheaded by Ja...» read more

Multiple AI Scale-Up Options Emerge

ByBryon Moyer - 13 Nov, 2025 - Comments: 0

Artificial intelligence (AI) workloads are very different from those traditionally run inside of data centers, and while the current infrastructure can accommodate those needs, there is a constant demand for higher performance and better power efficiency.It can take months to train a large language model, even with a huge number of processing elements. Typically this involves commandeering ...» read more

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