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Special Reports

By: Gregory Haley

Contamination is a systems-level limiter at advanced nodes, and there's no simple solution to fix it.

The Race Begins For Much Bigger Abstractions In Data Centers

By: Ed Sperling

Massive compute capabilities enable a whole new way of manipulating and using data, and a potential bonanza for AI data...

Chiplet Fundamentals For Engineers: eBook

By: Bryon Moyer

A 65-page in-depth research report on the next phase of device scaling.

Laser Arrays May Simplify Co-Packaged Optics

Monolithic tunable lasers can adapt statically and dynamically.

February 19th, 2026 ByBryon Moyer

Why Indium Oxide Chips Are Getting So Much Attention

Much work still needs to be done to make these materials reliable enough for commercial...

February 19th, 2026 ByKatherine Derbyshire

Can A Computer Science Student Be Taught To Design Hardware?

To fill the talent gap, CS majors could be taught to design hardware, and the EE curric...

February 17th, 2026 ByLiz Allan

Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges

Reliability is now a system-level concern that includes everything from materials and p...

February 12th, 2026 ByAnn Mutschler

UCIe’s Major Technical Components Are Now In Place

Version 3.0 of the interconnect standard doubles bandwidth and supports new use cases a...

February 12th, 2026 ByBryon Moyer

Minimum Energy Per Query

How much of the energy consumed in an AI chip is spent doing something useful? This que...

February 12th, 2026 ByBrian Bailey

Catching Critical Defects In TSVs And Stacked Chips

Variation is a bigger problem in advanced packages with multiple chiplets; AI can help.

February 10th, 2026 ByLaura Peters

Resistance In Advanced Packages Is Now A System-Level Problem

Multi-die assemblies require the measurement of subtle changes at the precise point whe...

February 10th, 2026 ByGregory Haley

Chiplets Add More Inspection And Test Steps

What's required to improve the yield of multi-die assemblies.

February 10th, 2026 ByAnne Meixner

Securing Hardware For The Quantum Era

Quantum computers may become a security threat as early as next year, and that threat w...

February 5th, 2026 ByAnn Mutschler

Consumer, Med Tech Mushrooms As Quantum Closes In

Bio-inspired medical devices can gather more data than ever before, and HPC/quantum wil...

February 5th, 2026 ByLiz Allan

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems

Existing technology is being upcycled and deployed in new ways as companies seek to mea...

February 5th, 2026 ByLiz Allan

Why Move To 2nm?

Leading-edge chipmakers are starting to look at process node scaling very differently.

February 4th, 2026 ByEd Sperling

Does Your RISC-V Core Meet The Standard?

Verifying an extensible processor is more than a one-step process, especially when soft...

January 29th, 2026 ByBrian Bailey

Multi-Die Assemblies Require More Detailed Test Plan Earlier

Understanding connectivity issues and interactions are only part of the problem; ECOs c...

January 29th, 2026 ByAnn Mutschler

Balancing Training, Quantization, And Hardware Integration In NPUs

Evolving challenges and strategies in AI/ML model deployment and hardware optimization ...

January 26th, 2026 ByAnn Mutschler

Every Atom Now Counts In Advanced Chip Manufacturing

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scali...

January 22nd, 2026 ByGregory Haley

An Explosion In Interconnect Complexity

The chip industry has gone from two routing platforms to five. That's a lot.

January 22nd, 2026 ByBryon Moyer

Oxides Bring Low Leakage Transistors To Leading-Edge Memories

New approaches and research surge in the face of DRAM shortages and SRAM scaling limita...

January 22nd, 2026 ByKatherine Derbyshire

Addressing Critical Tradeoffs In NPU Design

Flexibility, future-proofing, and performance considerations for neural processing units.

January 21st, 2026 ByAnn Mutschler

Latest News

Blog Review: Feb. 18

Agentic disruption; data center PUE; scaling AI; RTOS; dropping toast.

February 18th, 2026 ByJesse Allen

Chip Industry Week In Review

Tighter controls on IC equipment; HBM4; design/verification AI super agent; new tool for AI adoption at scale; $200M funding for optical TPU; Imagination's new CE...

February 13th, 2026 ByThe SE Staff

Automotive Week In Review

AI chip for SDVs; hypercar; automotive edge chip; Waymo's new GenAI model; neuromorphic detects motion 4X faster; sodium-ion battery; Ferrari-all electric; carmak...

February 13th, 2026 ByThe SE Staff

more news »

Opinion

One-on-One With proteanTecs CEO Shai Cohen

Inside the whirlwind changes across the chip industry.

February 17th, 2026 ByEd Sperling

Silicon Photonics In The Data Center: What A CMOS Exec Needs To Know

Photonics will replace copper for all interconnects in ~5 year...

February 9th, 2026 ByGeoff Tate

more opinions »

Research

Research Bits: Feb. 17

Analog layout foundation model; carbon nanotube sandpaper; low...

ByJesse Allen

Chip Industry Technical Paper Roundup: Feb. 16

AFMTJs for IMC; test generation w/high functional switching ac...

ByLinda Christensen

Chip Industry Technical Paper Roundup: Feb. 9

Scalable quantum photonics; scheduling multicore architectures...

ByLinda Christensen

more research »

Startup Corner

Startup Funding: Q4 2025

More and bigger funding rounds for AI chips and AI for making ...

ByJesse Allen

Startup Tips To Get From Seed Funding To Series A, B, C

Everyone has a bright idea about how to save power or boost pe...

ByLiz Allan

more startups »

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