Mishchik et al., 2016
| Publication | Publication Date | Title |
|---|---|---|
| Mishchik et al. | Dash line glass-and sapphire-cutting with high power USP laser | |
| KR102230762B1 (en) | Method of and device for the laser-based machining of sheet-like substrates using a laser beam focal line | |
| KR101358672B1 (en) | Transparent material cutting method using ultrafast pulse laser and dicing apparatus for thereof | |
| Vanagas et al. | Glass cutting by femtosecond pulsed irradiation | |
| Kumkar et al. | Comparison of different processes for separation of glass and crystals using ultrashort pulsed lasers | |
| Lopez et al. | Glass cutting using ultrashort pulsed Bessel beams | |
| Liu et al. | Modulation of crack formation inside single-crystal sapphire using ultrafast laser Bessel beams | |
| Hendricks et al. | Time-resolved study of femtosecond laser induced micro-modifications inside transparent brittle materials | |
| Capuano et al. | Morphology of single picosecond pulse subsurface laser-induced modifications of sapphire and subsequent selective etching | |
| Javaux et al. | Effects of burst mode on transparent materials processing | |
| Indrisiunas et al. | Direct laser beam interference patterning technique for fast high aspect ratio surface structuring | |
| Dudutis et al. | Modification of glass using an axicon-generated non-symmetrical Bessel-Gaussian beam | |
| Mincuzzi et al. | New fast galvo scanner head for high throughput micromachining | |
| Gaudfrin et al. | Fused silica ablation by double femtosecond laser pulses with variable delays | |
| Xiong et al. | Highly Efficient Cutting of Quartz Glass with Low Roughness and Minor Chipping Using Bessel Laser Beams | |
| Zhang et al. | High quality stealth dicing of sapphire with a picosecond Bessel beam by controlling the polarization direction | |
| Dudutis et al. | Generation of asymmetrical Bessel-like laser beams for glass dicing | |
| Lopez et al. | Trepanning drilling of stainless steel using a high-power Ytterbium-doped fiber ultrafast laser: influence of pulse duration on hole geometry and processing quality | |
| Sun et al. | Towards crack-free ablation cutting of thin glass sheets with picosecond pulsed lasers | |
| Tamura et al. | Double pulse explosion drilling of transparent materials | |
| Zhang et al. | Laser processing transparent materials with nanosecond, picosecond and femtosecond pulses for industrial applications | |
| Collins et al. | Thin glass processing with various laser sources | |
| von Witzendorff et al. | Laser ablation of borosilicate glass with high power shaped UV nanosecond laser pulses | |
| Hattori et al. | High-speed observation of damage generation during ultrashort pulse laser drilling of wide-bandgap materials | |
| Tamura | Double pulse effect of pico-second laser ablation on transparent materials |