Righi et al., 2002
| Publication | Publication Date | Title |
|---|---|---|
| Deutsch et al. | On-chip wiring design challenges for gigahertz operation | |
| Pinello et al. | Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation | |
| US8867226B2 (en) | Monolithic microwave integrated circuits (MMICs) having conductor-backed coplanar waveguides and method of designing such MMICs | |
| US5566083A (en) | Method for analyzing voltage fluctuations in multilayered electronic packaging structures | |
| US7149666B2 (en) | Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures | |
| CN101697177A (en) | Method for modeling field-path cooperative model for predicting field line coupled system response | |
| Nazarian et al. | A physics-based causal bond-wire model for RF applications | |
| Johansen et al. | EM simulation accuracy enhancement for broadband modeling of on-wafer passive components | |
| Le et al. | PEEC method and hierarchical approach towards 3D multichip power module (MCPM) layout optimization | |
| Jackson | A circuit topology for microwave modeling of plastic surface mount packages | |
| Li et al. | FD-TD analysis of electromagnetic radiation from modules-on-backplane configurations | |
| Righi et al. | Time-domain characterization of packaging effects via segmentation technique | |
| Kopcsay et al. | A comprehensive 2-D inductance modeling approach for VLSI interconnects: Frequency-dependent extraction and compact circuit model synthesis | |
| Wiatr et al. | Coplanar-waveguide-to-microstrip transition model | |
| Chiprout | Interconnect and substrate modeling and analysis: An overview | |
| Kolstad et al. | A new circuit augmentation method for modeling of interconnects and passive components | |
| Orhanovic et al. | Full wave analysis of planar interconnect structures using FDTD-SPICE | |
| Tsai et al. | Multiple arbitrary shape via-hole and air-bridge transitions in multilayered structures | |
| Cao et al. | A PEEC with a new capacitance model for circuit simulation of interconnects and packaging structures | |
| Araneo et al. | Differential signalling in PCBs: Modeling and validation of dielectric losses and effects of discontinuities | |
| De Zutter et al. | Recent trends in the integration of circuit optimization and full-wave electromagnetic analysis | |
| Thompson et al. | Challenges and methodologies in EM simulation with circuit models | |
| Righi et al. | TLM modelling of packaged integrated circuits | |
| Bergervoet et al. | The common-mode skeleton model for assessment of electromagnetic compatibility at the system level | |
| Mukhtar et al. | Variation-aware X-topology architecture with local ground references for broadband characterization of passives |