本申请涉及显示技术领域，特别涉及一种发光组件及其制备方法、显示基板。The present application relates to the field of display technology, and in particular to a light-emitting component and a preparation method thereof, and a display substrate.
显示基板包括驱动背板以及和驱动背板连接的多个发光组件，其中，驱动背板可以为发光组件提供驱动信号，以使得发光组件发光，进而实现显示。The display substrate includes a driving backplane and a plurality of light-emitting components connected to the driving backplane, wherein the driving backplane can provide driving signals for the light-emitting components to make the light-emitting components emit light, thereby realizing display.
发明内容Summary of the Invention
本申请提供了一种发光组件及其制备方法、显示基板，所述技术方案如下：This application provides a light-emitting component and a method for preparing the same, and a display substrate. The technical solutions are as follows:
一方面，提供了一种发光组件，所述发光组件包括：In one aspect, a light emitting assembly is provided, comprising:
封装部、发光单元以及位于所述封装部和所述发光单元之间的驱动单元，所述发光单元的和所述驱动单元电连接；An encapsulation portion, a light-emitting unit, and a driving unit located between the encapsulation portion and the light-emitting unit, wherein the light-emitting unit is electrically connected to the driving unit;
所述驱动单元包括朝向所述发光单元一侧的第一表面，背离所述发光单元一侧的第二表面，以及位于所述第一表面和所述第二表面之间的目标侧面；The driving unit includes a first surface facing the light emitting unit, a second surface facing away from the light emitting unit, and a target side surface located between the first surface and the second surface;
所述发光单元包括朝向所述驱动单元的第三表面，所述封装部包括第一子封装部，所述第三表面包括与所述驱动单元电连接的第一接触区以及与所述第一子封装部连接的第二接触区，所述第二接触区环绕所述第一接触区设置；The light emitting unit includes a third surface facing the driving unit, the encapsulation portion includes a first sub-encapsulation portion, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-encapsulation portion, and the second contact area is arranged around the first contact area;
其中，所述第一子封装部与所述第二表面和所述目标侧面至少之一接触设置，以使所述发光单元和所述驱动单元相互电连接的位置位于密闭空间内。The first sub-packaging portion is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light emitting unit and the driving unit are electrically connected to each other is located in a confined space.
可选的，所述发光组件还包括粘合层，所述粘合层位于所述第一子封装部与所述第三表面之间；Optionally, the light emitting component further includes an adhesive layer, and the adhesive layer is located between the first sub-encapsulation portion and the third surface;
所述第一子封装部与所述第三表面通过所述粘合层连接。The first sub-encapsulation portion is connected to the third surface through the adhesive layer.
可选的，所述封装部的目标路径的长度和所述驱动单元的厚度的比值大于或等于7；Optionally, a ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7;
所述封装部的目标路径的长度和所述粘合层的厚度的比值大于或等于10；A ratio of a length of a target path of the encapsulation portion to a thickness of the adhesive layer is greater than or equal to 10;
其中，所述驱动单元包括多个电极，所述多个电极包括靠近所述驱动单元的边缘的目标电极；所述目标电极远离所述驱动单元的中心的边缘沿所述发光单元厚度方向在所述封装部上的投影包括第一端，与所述第一端对应的与所述目标电极远离所述驱动单元的中心的边缘相邻的所述封装部的边缘为第二端，所述目标路径为所述封装部中位于所述第一端和所述第二端之间的部分的最小路径。The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.
可选的，所述封装部的目标路径的长度大于或等于35微米，所述驱动单元的厚度大于或等于5微米，所述粘合层的厚度大于或等于0.5微米。Optionally, the length of the target path of the packaging portion is greater than or equal to 35 micrometers, the thickness of the driving unit is greater than or equal to 5 micrometers, and the thickness of the adhesive layer is greater than or equal to 0.5 micrometers.
可选的，所述发光组件还包括位于所述第一子封装部和所述第三表面之间的垫层结构；Optionally, the light emitting component further includes a pad structure located between the first sub-encapsulation portion and the third surface;
所述第一子封装部与所述第三表面通过所述垫层结构连接。The first sub-encapsulation portion is connected to the third surface through the pad layer structure.
可选的，所述发光组件还包括位于所述垫层结构和所述第一子封装部之间的粘合层，所述垫层结构与所述第三表面直接接触设置，所述第一子封装部通过所述粘合层与所述垫层结构连接。Optionally, the light-emitting component further includes an adhesive layer located between the pad structure and the first sub-package part, the pad structure is arranged in direct contact with the third surface, and the first sub-package part is connected to the pad structure through the adhesive layer.
可选的，所述垫层结构与所述粘合层接触的表面与所述第三表面的最大距离小于所述第二表面与所述第三表面之间的最大距离。Optionally, the maximum distance between the surface of the cushion structure in contact with the adhesive layer and the third surface is smaller than the maximum distance between the second surface and the third surface.
可选的，所述封装部的目标路径的长度和所述驱动单元的厚度的比值大于或等于7；Optionally, a ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7;
所述封装部的目标路径的长度和所述粘合层以及所述垫层结构的厚度之和的比值大于或等于10；The ratio of the length of the target path of the encapsulation portion to the sum of the thicknesses of the adhesive layer and the cushion structure is greater than or equal to 10;
其中，所述驱动单元包括多个电极，所述多个电极包括靠近所述驱动单元的边缘的目标电极；所述目标电极远离所述驱动单元的中心的边缘沿所述发光单元厚度方向在所述封装部上的投影包括第一端，与所述第一端对应的与所述目标电极远离所述驱动单元的中心的边缘相邻的所述封装部的边缘为第二端，所述目标路径为所述封装部中位于所述第一端和所述第二端之间的部分的最小路径。The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.
可选的，所述封装部的目标路径的长度大于或等于35微米，所述驱动单元的厚度大于或等于5微米，所述粘合层和所述垫层结构的厚度之和小于或等于5微米。Optionally, the length of the target path of the packaging portion is greater than or equal to 35 microns, the thickness of the driving unit is greater than or equal to 5 microns, and the sum of the thicknesses of the adhesive layer and the cushion structure is less than or equal to 5 microns.
可选的，所述驱动单元的第二表面包括表面边缘和表面中心，且所述表面边缘环绕所述表面中心设置；Optionally, the second surface of the driving unit includes a surface edge and a surface center, and the surface The edge is disposed around the center of the surface;
其中，所述表面边缘和所述第三表面之间的距离，小于所述表面中心和所述第三表面之间的距离。The distance between the edge of the surface and the third surface is smaller than the distance between the center of the surface and the third surface.
可选的，所述驱动单元的第二表面和所述封装部靠近所述驱动单元的表面共形。Optionally, the second surface of the driving unit is conformal to a surface of the packaging portion close to the driving unit.
可选的，所述封装部还包括覆盖所述第二表面的第二子封装部；Optionally, the packaging portion further includes a second sub-packaging portion covering the second surface;
所述第一子封装部和所述第二子封装部为一体结构，所述驱动单元位于所述封装部和所述发光单元围成的所述密闭空间的内部。The first sub-packaging portion and the second sub-packaging portion are an integrated structure, and the driving unit is located inside the enclosed space surrounded by the packaging portion and the light-emitting unit.
可选的，所述封装部的材料为柔性材料。Optionally, the packaging portion is made of a flexible material.
可选的，所述第二子封装部包括通孔，所述发光组件包括位于所述通孔内的导电结构，所述导电结构和所述驱动单元电连接，且用于和显示基板包括的驱动背板的导电垫电连接。Optionally, the second sub-package includes a through hole, the light-emitting component includes a conductive structure located in the through hole, the conductive structure is electrically connected to the driving unit, and is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate.
可选的，所述导电结构包括电连接的第一导电子结构和第二导电子结构；Optionally, the conductive structure includes a first conductive substructure and a second conductive substructure that are electrically connected;
所述第一导电子结构相对于所述第二导电子结构更远离所述发光单元设置，所述第二导电子结构在参考平面上的正投影位于所述第一导电子结构在所述参考平面上的正投影内，所述参考平面平行于所述发光单元远离所述驱动单元的第四表面；The first conductive substructure is arranged farther away from the light-emitting unit than the second conductive substructure, an orthographic projection of the second conductive substructure on a reference plane is located within an orthographic projection of the first conductive substructure on the reference plane, and the reference plane is parallel to a fourth surface of the light-emitting unit away from the driving unit;
其中，所述第一导电子结构用于和显示基板包括的驱动背板的导电垫电连接，所述第二导电子结构和所述驱动单元电连接。The first conductive substructure is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate, and the second conductive substructure is electrically connected to the driving unit.
可选的，所述发光单元包括：第一电极，第二电极以及分别与所述第一电极和所述第二电极电连接的发光层；Optionally, the light-emitting unit includes: a first electrode, a second electrode, and a light-emitting layer electrically connected to the first electrode and the second electrode respectively;
所述驱动单元包括第三电极，第四电极和驱动电路，所述第三电极和所述第四电极均位于所述驱动电路靠近所述发光单元的一侧，所述第三电极和所述第四电极分别与所述驱动电路电连接，所述第三电极和所述第一电极电连接，所述第四电极与所述第二电极电连接。The driving unit includes a third electrode, a fourth electrode and a driving circuit, wherein the third electrode and the fourth electrode are both located on a side of the driving circuit close to the light-emitting unit, the third electrode and the fourth electrode are electrically connected to the driving circuit respectively, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode.
可选的，所述目标侧面为所述驱动电路的侧面。Optionally, the target side is a side of the driving circuit.
可选的，所述第二子封装部包括通孔，所述发光组件包括位于所述通孔内的导电结构；所述驱动电路包括多个薄膜晶体管和至少一个存储电容，每个所述薄膜晶体管包括栅极，源极和漏极；Optionally, the second sub-package includes a through hole, and the light-emitting component includes a conductive structure located in the through hole; the driving circuit includes a plurality of thin film transistors and at least one storage capacitor, and each of the thin film transistors includes a gate, a source, and a drain;
所述导电结构和所述多个薄膜晶体管中一个薄膜晶体管的源极连接，用于为所述驱动电路提供来自显示基板中驱动背板传输的数据驱动信号。The conductive structure is connected to the source of a thin film transistor among the plurality of thin film transistors, and is used to The driving circuit is provided with a data driving signal transmitted from a driving backplane in the display substrate.
可选的，所述驱动电路包括依次层叠的缓冲绝缘层，有源层，第一栅极绝缘层，第一栅极层，第二栅极绝缘层，第二栅极层，层间介定层，源漏极层以及平坦层；所述第三电极和所述第四电极位于所述平坦层远离所述缓冲绝缘层的一侧；Optionally, the driving circuit includes a buffer insulating layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source and drain layer, and a planar layer stacked in sequence; the third electrode and the fourth electrode are located on a side of the planar layer away from the buffer insulating layer;
所述有源层包括与所述多个薄膜晶体管对应的多个有源图案，每个所述有源图案包括源极区，漏极区以及沟道区；The active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, and each of the active patterns includes a source region, a drain region, and a channel region;
所述薄膜晶体管的所述源极和所述漏极位于所述源漏极层，所述薄膜晶体管的源极和所述源极区连接，所述薄膜晶体管的漏极和所述漏极区连接；The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source region, and the drain electrode of the thin film transistor is connected to the drain region;
所述第一栅极层包括与所述多个薄膜晶体管对应的多个栅极图案，所述沟道区为所述有源图案和所述栅极图案的正投影重叠的区域。The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is a region where the active pattern and the orthographic projection of the gate pattern overlap.
可选的，所述发光组件包括多个发光单元以及与所述多个发光单元对应的所述驱动单元；Optionally, the light emitting assembly includes a plurality of light emitting units and the driving units corresponding to the plurality of light emitting units;
所述多个发光单元包括第一颜色发光单元，第二颜色发光单元以及第三颜色发光单元，所述第一颜色，所述第二颜色和所述第三颜色互不相同。The plurality of light emitting units include a first color light emitting unit, a second color light emitting unit, and a third color light emitting unit, and the first color, the second color, and the third color are different from each other.
可选的，所述发光单元包括沿远离所述封装部的方向依次层叠的彩膜层，色转层以及发光层；所述发光层的发光颜色为蓝色；Optionally, the light-emitting unit includes a color filter layer, a color conversion layer, and a light-emitting layer stacked in sequence in a direction away from the packaging portion; the light-emitting color of the light-emitting layer is blue;
其中，所述发光层包括层叠设置的第一掺杂层、多量子阱层以及第二掺杂层，其中，所述第一掺杂层和所述第一电极电连接，所述第二掺杂层和所述第二电极电连接，所述发光层包括第一发光部、第二发光部和第三发光部。The light-emitting layer includes a first doped layer, a multi-quantum well layer and a second doped layer that are stacked, wherein the first doped layer is electrically connected to the first electrode, the second doped layer is electrically connected to the second electrode, and the light-emitting layer includes a first light-emitting portion, a second light-emitting portion and a third light-emitting portion.
另一方面，提供了一种发光组件的制备方法，所述方法包括：In another aspect, a method for preparing a light-emitting component is provided, the method comprising:
获取临时基板，以及位于所述临时基板上的初始封装部和位于所述初始封装部远离所述临时基板的一侧的驱动单元，所述临时基板为刚性基板，所述驱动单元在所述初始封装部上的正投影位于所述初始封装部内；Obtaining a temporary substrate, an initial packaging portion located on the temporary substrate, and a driving unit located on a side of the initial packaging portion away from the temporary substrate, wherein the temporary substrate is a rigid substrate, and an orthographic projection of the driving unit on the initial packaging portion is located within the initial packaging portion;
获取基底以及位于所述基底上的发光单元；Obtaining a substrate and a light-emitting unit located on the substrate;
通过键合工艺将所述发光单元和所述驱动单元键合连接，以得到目标结构，所述目标结构包括依次设置的所述临时衬底，所述初始封装部，驱动单元，发光单元以及基底，所述驱动单元包括朝向所述发光单元一侧的第一表面，背离所述发光单元一侧的第二表面，以及位于所述第一表面和所述第二表面之间的目标侧面，所述发光单元包括朝向所述驱动单元的第三表面；Bonding the light-emitting unit and the driving unit to each other through a bonding process to obtain a target structure, wherein the target structure includes the temporary substrate, the initial packaging portion, the driving unit, the light-emitting unit, and the base arranged in sequence, the driving unit including a first surface facing the light-emitting unit, a second surface facing away from the light-emitting unit, and a target side surface located between the first surface and the second surface, and the light-emitting unit including a third surface facing the driving unit;
在所述初始封装部的重力方向朝向所述发光单元的情况下，将所述临时基板从所述初始封装部的一侧剥离，以使得所述初始封装部在自身重力的作用下向靠近所述发光单元的一侧形变得到封装部；When the gravity direction of the initial packaging part is toward the light-emitting unit, the temporary substrate is peeled off from one side of the initial packaging part, so that the initial packaging part is deformed toward the side closer to the light-emitting unit under the action of its own gravity to form the packaging part;
其中，所述封装部包括第一子封装部，所述第三表面包括与所述驱动单元电连接的第一接触区以及与所述第一子封装部连接的第二接触区，所述第二接触区环绕所述第一接触区设置，所述第一子封装部与所述第二表面和所述目标侧面至少之一接触设置，以使所述发光单元和所述驱动单元相互电连接的位置位于密闭空间内。In which, the packaging part includes a first sub-packaging part, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-packaging part, the second contact area is arranged around the first contact area, and the first sub-packaging part is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light-emitting unit and the driving unit are electrically connected to each other is located in a confined space.
可选的，所述在所述初始封装部的重力方向朝向所述发光单元的情况下，将所述临时基板从所述初始封装部的一侧剥离，包括：Optionally, when the gravity direction of the initial packaging portion is toward the light-emitting unit, peeling the temporary substrate from one side of the initial packaging portion includes:
在所述初始封装部的重力方向朝向所述发光单元的情况下，在所述临时基板远离所述初始封装部的一侧设置激光设备；When the gravity direction of the initial packaging part is toward the light-emitting unit, a laser device is arranged on a side of the temporary substrate away from the initial packaging part;
驱动所述目标结构移动使得所述激光设备的激光光条扫过所述目标结构，所述目标结构被所述激光光条扫过后，所述临时基板能够从所述初始封装部的一侧剥离。The target structure is driven to move so that the laser light bar of the laser device sweeps across the target structure. After the target structure is swept across by the laser light bar, the temporary substrate can be peeled off from one side of the initial packaging portion.
又一方面，提供了一种显示基板，所述显示基板包括驱动背板，以及位于所述驱动背板的一侧且阵列排布的多个如上述方面所述的发光组件；In another aspect, a display substrate is provided, comprising a driving backplane, and a plurality of light-emitting components as described in the above aspects arranged in an array and located on one side of the driving backplane;
所述发光组件包括的驱动单元位于所述驱动背板和所述发光组件包括的发光单元之间，且所述驱动背板和所述驱动单元电连接；The driving unit included in the light-emitting assembly is located between the driving backplane and the light-emitting unit included in the light-emitting assembly, and the driving backplane and the driving unit are electrically connected;
其中，所述驱动背板用于为所述驱动单元提供驱动信号，以使所述驱动单元驱动所述发光单元发光。The driving backplane is used to provide a driving signal to the driving unit so that the driving unit drives the light-emitting unit to emit light.
可选的，所述驱动背板包括：背板衬底，以及位于所述背板衬底的一侧的焊盘，所述焊盘包括多个导电垫；Optionally, the driving backplane includes: a backplane substrate, and a pad located on one side of the backplane substrate, wherein the pad includes a plurality of conductive pads;
所述导电垫用于和所述发光组件包括的导电结构的第一导电子结构电连接。The conductive pad is used to be electrically connected to the first conductive substructure of the conductive structure included in the light-emitting component.
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, without creative work, Other drawings can also be obtained based on these drawings.
图1是本申请实施例提供的一种发光组件的结构示意图；FIG1 is a schematic structural diagram of a light-emitting component provided in an embodiment of the present application;
图2是本申请实施例提供的另一种发光组件的结构示意图；FIG2 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图3是本申请实施例提供的一种发光组件的俯视图；FIG3 is a top view of a light-emitting component provided in an embodiment of the present application;
图4是本申请实施例提供的又一种发光组件的结构示意图；FIG4 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图5是本申请实施例提供的再一种发光组件的结构示意图；FIG5 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图6是本申请实施例提供的再一种发光组件的结构示意图；FIG6 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图7是本申请实施例提供的再一种发光组件的结构示意图；FIG7 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图8是本申请实施例提供的一种发光单元的结构示意图；FIG8 is a schematic structural diagram of a light-emitting unit provided in an embodiment of the present application;
图9是本申请实施例提供的另一种发光单元的结构示意图；FIG9 is a schematic structural diagram of another light-emitting unit provided in an embodiment of the present application;
图10是本申请实施例提供的再一种发光组件的结构示意图；FIG10 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;
图11是本申请实施例提供的一种发光组件的制备方法的流程图；FIG11 is a flow chart of a method for preparing a light-emitting component provided in an embodiment of the present application;
图12是本申请实施例提供的一种获取临时衬底，初始封装部和多个驱动单元的示意图；FIG12 is a schematic diagram of obtaining a temporary substrate, an initial packaging portion, and a plurality of driving units according to an embodiment of the present application;
图13是本申请实施例提供的一种获取基底和多个发光单元的示意图；FIG13 is a schematic diagram of an acquisition substrate and a plurality of light-emitting units provided in an embodiment of the present application;
图14是本申请实施例提供的一种驱动单元和发光单元键合连接的示意图；FIG14 is a schematic diagram of a bonding connection between a driving unit and a light-emitting unit provided in an embodiment of the present application;
图15是本申请实施例提供的一种激光剥离的示意图；FIG15 is a schematic diagram of a laser lift-off process provided in an embodiment of the present application;
图16是本申请实施例提供的一种将临时衬底去除后的示意图；FIG16 is a schematic diagram of a temporary substrate after removal provided by an embodiment of the present application;
图17是本申请实施例提供的一种切割示意图；FIG17 is a cutting schematic diagram provided in an embodiment of the present application;
图18是本申请实施例提供的一种显示基板的结构示意图；FIG18 is a schematic structural diagram of a display substrate provided in an embodiment of the present application;
图19是本申请实施例提供的一种显示基板的截面示意图。FIG19 is a schematic cross-sectional view of a display substrate provided in an embodiment of the present application.
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.
微发光二极管(micro light emitting diode，Micro LED)显示基板通常包括驱动背板，集成设置在驱动背板上的驱动单元，以及和驱动单元键合连接的发光芯片。在制备该Micro LED显示基板时，为了实现彩色显示，需要采用将不同颜色的发光芯片转移并键合至集成有驱动单元的驱动背板上，且相同颜色的发光芯片同一次转移，不同颜色的发光芯片分次转移。也即是，转移次数即为发光芯片的颜色数量。可选的，发光芯片包括三种颜色的发光芯片，如包括红色(red，R)发光芯片，绿色(green，G)发光芯片以及蓝色(blue)发光芯片，进而需要进行三次转移。该方案制备Micro LED显示基板时的转移次数较多，工艺较复杂。A micro light emitting diode (Micro LED) display substrate generally includes a driving backplane, a driving unit integrated on the driving backplane, and a light emitting chip bonded to the driving unit. When preparing the Micro LED display substrate, in order to achieve color display, it is necessary to transfer and bond light emitting chips of different colors to the driving backplane integrated with the driving unit, and light emitting chips of the same color are transferred at the same time, while light emitting chips of different colors are transferred in batches. In other words, the number of transfers is The number of colors of the light-emitting chip. Optionally, the light-emitting chip includes three colors of light-emitting chips, such as a red (R) light-emitting chip, a green (G) light-emitting chip, and a blue (blue) light-emitting chip, requiring three transfers. This solution requires more transfers when preparing the Micro LED display substrate, and the process is more complex.
并且，为了降低Micro LED显示基板的制造成本，驱动背板的尺寸不会设计的太大(因为设计的太大，如果转移后其中一些发光芯片发光失效，则整个产品报废，成本较高)。由此该方案若需实现大尺寸显示，只能通过拼接来实现，显示效果较差。Furthermore, to reduce the manufacturing cost of the Micro LED display substrate, the driver backplane is designed to be minimally sized. (This is because if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, resulting in higher costs.) Therefore, if this solution requires large-scale displays, it can only be achieved through splicing, resulting in poor display quality.
对于红绿蓝三色微型显示芯片(RGB Micro LED)与驱动单元键合以形成新的自带驱动电路的有源矩阵发光二极管(Active-matrix light-emitting diode，AM-LED)芯片。该AM-LED芯片包括红绿蓝三种颜色的发光芯片以及驱动发光芯片的驱动单元。进而，需要制备多大尺寸的显示基板，就采用对应数量的AM-LED芯片与驱动背板一次性转移键合，实现玻璃基的彩色发光二极管(light-emitting diode，LED)显示基板的制备。同时，该方案可以只需进行一次转移工艺，工艺较简单。并且，无需拼接就能够实现大尺寸显示，能够提升驱动背板的玻璃利用率，从而实现成本降低。The red, green and blue micro-display chip (RGB Micro LED) is bonded to a driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit. The AM-LED chip includes red, green and blue light-emitting chips and a driving unit that drives the light-emitting chips. Furthermore, depending on the size of the display substrate that needs to be prepared, a corresponding number of AM-LED chips are used to transfer and bond with the driving backplane at one time to realize the preparation of a glass-based color light-emitting diode (LED) display substrate. At the same time, this solution only requires a single transfer process, which is a relatively simple process. In addition, large-size displays can be achieved without splicing, which can improve the glass utilization rate of the driving backplane, thereby reducing costs.
并且，该AM-LED芯片通过检测技术，可实现电学/光学双检测，筛选出光学性能和驱动性能都符合要求的芯片。如此，相比将驱动电路集成在驱动背板上进而形成显示基板的方案，更有利于显示基板上的芯片良率提升，也便于对不良的芯片维修更换。Furthermore, this AM-LED chip utilizes dual electrical and optical testing technology to select chips that meet both optical and driving performance requirements. This improves chip yield on the display substrate compared to solutions that integrate the driver circuitry onto the driver backplane to form the display substrate, and also facilitates the repair and replacement of defective chips.
但是，由于驱动单元和发光单元连接的位置暴露在外，因此容易受到外界环境的影响，可靠性较差。However, since the connection position between the driving unit and the light-emitting unit is exposed, it is easily affected by the external environment and has poor reliability.
图1是本申请实施例提供的一种发光组件的结构示意图。参考图1，发光组件10包括：封装部101，发光单元102以及位于封装部101和发光单元102之间的驱动单元103。其中，发光单元102和驱动单元103电连接，驱动单元103为发光单元102提供驱动信号，用于驱动发光单元102发光。Figure 1 is a schematic diagram of the structure of a light-emitting assembly provided in an embodiment of the present application. Referring to Figure 1 , light-emitting assembly 10 includes: an encapsulation portion 101, a light-emitting unit 102, and a driving unit 103 located between encapsulation portion 101 and light-emitting unit 102. Light-emitting unit 102 and driving unit 103 are electrically connected, and driving unit 103 provides a driving signal to light-emitting unit 102, thereby driving light-emitting unit 102 to emit light.
参考图1，驱动单元103包括朝向发光单元102一侧的第一表面103a，背离发光单元102一侧的第二表面103b，以及位于第一表面103a和第二表面103b之间的目标侧面103c。可选的，目标侧面103c可以为环形侧面，即目标侧面103c为封闭的侧面。示例的，驱动单元103的形状为正方形，则目标侧面103c可以包括正方形的四个侧边。1 , the driving unit 103 includes a first surface 103a facing the light emitting unit 102, a second surface 103b facing away from the light emitting unit 102, and a target side surface 103c located between the first surface 103a and the second surface 103b. Optionally, the target side surface 103c may be an annular side surface, i.e., the target side surface 103c may be an annular side surface. For example, if the driving unit 103 is in the shape of a square, the target side surface 103c may include four sides of the square.
发光单元102包括朝向驱动单元103的第三表面102a，封装部101包括第一子封装部1011。第三表面102a包括与驱动单元103电连接的第一接触区102a1以及与第一子封装部1011连接的第二接触区102a2。其中，第二接触区102a2环绕第一接触区102a1设置。The light-emitting unit 102 includes a third surface 102a facing the driving unit 103. The package portion 101 includes a first sub-package portion 1011. The third surface 102a includes a first contact region 102a1 electrically connected to the driving unit 103 and a second contact region 102a2 connected to the first sub-package portion 1011. The second contact region 102a2 is arranged around the first contact region 102a1.
另外，第一子封装部1011还与第二表面103b和目标侧面103c至少之一接触设置。也即是，第一子封装部1011可以与第二表面103b接触设置，或者，第一子封装部1011可以与目标侧面103c接触设置，又或者，第一子封装部1011可以与第二表面103b和目标侧面103c均接触设置。In addition, the first sub-package portion 1011 is further disposed in contact with at least one of the second surface 103b and the target side surface 103c. That is, the first sub-package portion 1011 may be disposed in contact with the second surface 103b, or the first sub-package portion 1011 may be disposed in contact with the target side surface 103c, or the first sub-package portion 1011 may be disposed in contact with both the second surface 103b and the target side surface 103c.
由此可以使得封装部101和发光单元102相互连接构成密闭空间，并使得发光单元102和驱动单元103相互电连接的位置位于密闭空间内。进一步的，可以避免发光单元102和驱动单元103相互电连接的位置受到外界环境的影响，提高发光组件的可靠性。As a result, the packaging portion 101 and the light-emitting unit 102 are connected to form a sealed space, and the location where the light-emitting unit 102 and the driving unit 103 are electrically connected is located within the sealed space. Furthermore, the location where the light-emitting unit 102 and the driving unit 103 are electrically connected is protected from being affected by the external environment, thereby improving the reliability of the light-emitting assembly.
综上所述，本申请实施例提供了一种发光组件，该发光组件包括封装部，发光单元以及驱动单元。其中，发光单元的第三表面的第一接触区和驱动单元连接，发光单元的第三表面中的第二接触区和封装部的第一子封装部连接，且第二接触区环绕第一接触区设置。通过上述设置方式可以使得第一子封装部可以和发光单元构成密闭空间，由此可以使得发光单元和驱动单元相互电连接的位置位于密封空间内，保证对电连接的位置的密封效果，避免外界环境对电连接的位置产生影响，提高发光组件的可靠性。In summary, an embodiment of the present application provides a light-emitting component, which includes a packaging portion, a light-emitting unit, and a driving unit. The first contact area on the third surface of the light-emitting unit is connected to the driving unit, the second contact area on the third surface of the light-emitting unit is connected to the first sub-packaging portion of the packaging portion, and the second contact area is arranged around the first contact area. The above-mentioned arrangement allows the first sub-packaging portion to form a sealed space with the light-emitting unit, thereby allowing the position where the light-emitting unit and the driving unit are electrically connected to each other to be located within the sealed space, thereby ensuring the sealing effect of the electrical connection position, preventing the external environment from affecting the electrical connection position, and improving the reliability of the light-emitting component.
在本申请实施例中，第一子封装部1011可以和第二接触区102a2直接连接，也可以和第二接触区102a2间接连接。例如，参考图2，发光组件10还包括粘合层104，粘合层104位于第一子封装部1011与第三表面102a之间，第一子封装部1011与第三表面102a通过粘合层104连接。In the embodiment of the present application, the first sub-package portion 1011 can be directly connected to the second contact area 102a2, or can be indirectly connected to the second contact area 102a2. For example, referring to FIG2 , the light-emitting component 10 further includes an adhesive layer 104, which is located between the first sub-package portion 1011 and the third surface 102a. The first sub-package portion 1011 and the third surface 102a are connected via the adhesive layer 104.
此种情况下，第二接触区102a2为粘合层104在第三表面102a的正投影区域。由于在第一子封装部1011和第三表面102a之间设置的粘合层104，因此可以保证第一子封装部1011和第三表面102a的第二接触区102a2的连接效果。In this case, the second contact area 102a2 is the orthographic projection area of the adhesive layer 104 on the third surface 102a. Due to the adhesive layer 104 provided between the first sub-package 1011 and the third surface 102a, the connection effect between the first sub-package 1011 and the second contact area 102a2 of the third surface 102a can be guaranteed.
可选的，封装部101的目标路径的长度h1和驱动单元103的厚度h2的比值大于或等于7。另外，封装部101的目标路径的长度h1和粘合层104的厚度h3的比值大于或等于10。如此，可以保证封装部101中的第一子封装部1011能够和粘合层104粘接，进而围成密闭空间。Optionally, the ratio of the length h1 of the target path of the packaging part 101 to the thickness h2 of the driving unit 103 is greater than or equal to 7. In addition, the length h1 of the target path of the packaging part 101 and the thickness h2 of the adhesive layer 104 are The ratio h3 is greater than or equal to 10. In this way, it can be ensured that the first sub-encapsulation portion 1011 in the encapsulation portion 101 can be bonded to the adhesive layer 104 to form a closed space.
参考图3，驱动单元103包括多个电极Q，多个电极Q包括靠近驱动单元102的边缘的目标电极Qm。目标电极Qm远离驱动单元103的中心的边缘沿发光单元102厚度方向(参考图3，z向)在封装部101上的投影包括第一端(可以称为起点端，图3中记为t1)，与第一端对应的目标电极Qm远离驱动单元103的中心的边缘相邻的封装部101的边缘为第二端(可以称为终点端，图3中记为t2)。目标路径可以为封装部101中位于第一端和第二端之间的部分的最小路径。Referring to Figure 3 , the driving unit 103 includes multiple electrodes Q, including a target electrode Qm located near an edge of the driving unit 102. The projection of the edge of the target electrode Qm away from the center of the driving unit 103 onto the packaging portion 101 along the thickness direction of the light-emitting unit 102 (see Figure 3 , the z-direction) includes a first end (which may be referred to as a starting end, denoted as t1 in Figure 3 ). The edge of the packaging portion 101 adjacent to the edge of the target electrode Qm away from the center of the driving unit 103 corresponding to the first end is a second end (which may be referred to as an ending end, denoted as t2 in Figure 3 ). The target path may be the minimum path of the portion of the packaging portion 101 located between the first end and the second end.
其中，目标电极Qm远离驱动单元103的中心的边缘沿发光单元102厚度方向在封装部101上的投影包括第一端，可以理解为：目标电极Qm远离驱动单元103的中心的边缘沿着发光单元102的厚度方向平移至封装部101上，其平移到封装部101上的位置为第一端。Among them, the projection of the edge of the target electrode Qm away from the center of the driving unit 103 on the packaging part 101 along the thickness direction of the light-emitting unit 102 includes a first end, which can be understood as: the edge of the target electrode Qm away from the center of the driving unit 103 is translated to the packaging part 101 along the thickness direction of the light-emitting unit 102, and the position where it is translated to the packaging part 101 is the first end.
与第一端对应的目标电极Qm远离驱动单元103的中心的边缘相邻的封装部101的边缘为第二端，可以理解为：第一端对应有一个第二端，第二端为目标电极Qm远离驱动单元103的中心的边缘相邻的封装部101的边缘。The edge of the packaging part 101 adjacent to the edge of the target electrode Qm corresponding to the first end away from the center of the driving unit 103 is the second end. It can be understood that: the first end corresponds to a second end, and the second end is the edge of the packaging part 101 adjacent to the edge of the target electrode Qm away from the center of the driving unit 103.
如图3所示，多个电极Q包括多个目标电极Qm，每个目标电极Qm远离驱动单元103的中心的边缘沿发光单元102厚度方向在封装部101上的投影都可以为第一端。并且，与第一端对应的目标电极Qm远离驱动单元103的中心的边缘相邻的封装部101的边缘为第二端。例如图3中的t1为第一端，t2为与t1对应的第二端，t1′为第一端，t2′为与t1′对应的第二端。As shown in Figure 3 , the multiple electrodes Q include multiple target electrodes Qm. The projection of the edge of each target electrode Qm away from the center of the driver unit 103 onto the package portion 101 along the thickness direction of the light-emitting unit 102 can be considered a first end. Furthermore, the edge of the package portion 101 adjacent to the edge of the target electrode Qm away from the center of the driver unit 103 corresponding to the first end is considered a second end. For example, in Figure 3 , t1 is the first end, t2 is the second end corresponding to t1, t1′ is the first end, and t2′ is the second end corresponding to t1′.
如此，参考图3，可以使得封装部101的各个边缘均具有目标路径的长度，进而使得封装部101的各个边缘均能够和粘合层104粘接，进而保证围成的密闭空间的密闭效果。具体地，位于封装部101各个边缘处目标路径的长度可以相同，也可以不同。3 , each edge of the packaging portion 101 can have a target path length, thereby enabling each edge of the packaging portion 101 to adhere to the adhesive layer 104, thereby ensuring the sealing effect of the enclosed space. Specifically, the lengths of the target paths at each edge of the packaging portion 101 can be the same or different.
示例的，封装部101的目标路径的长度h1可以大于或等于35μm(微米)，驱动单元103的厚度h2大于或等于5μm，粘合层104的厚度h3大于或等于0.5μm，例如为3.5μm。For example, the target path length h1 of the packaging portion 101 may be greater than or equal to 35 μm, the thickness h2 of the driving unit 103 may be greater than or equal to 5 μm, and the thickness h3 of the adhesive layer 104 may be greater than or equal to 0.5 μm, for example, 3.5 μm.
需要说明的是，上述图2可以为图3沿AA’方向的截面图。图3中的h*可以用于表示第一端为t1，第二端为t2的情况下，目标路径在第三表面102a上的正投影的长度，h*′可以用于表示第一端为t1′，第二端为t2′的情况下，目标路径在第三表面102a上的正投影的长度。It should be noted that FIG2 may be a cross-sectional view of FIG3 along the AA' direction. h* in FIG3 may be used to indicate that the target path is on the third surface 102a when the first end is t1 and the second end is t2. The length of the orthographic projection of the target path, h*′ can be used to represent the length of the orthographic projection of the target path on the third surface 102a when the first end is t1′ and the second end is t2′.
可选的，驱动单元103和发光单元102可以是通过键合连接的，而通常情况下，驱动单元103和发光单元102的键合精度在±5μm的范围内，因此需要使得粘合层104的长度大于或等于10μm，才能使得第一子封装部1011和粘合层104连接。Optionally, the driving unit 103 and the light-emitting unit 102 can be connected by bonding. Normally, the bonding accuracy of the driving unit 103 and the light-emitting unit 102 is within the range of ±5μm. Therefore, the length of the adhesive layer 104 needs to be greater than or equal to 10μm so that the first sub-package 1011 and the adhesive layer 104 can be connected.
其中，粘合层104的长度可以为粘合层104沿目标方向的长度，目标方向为发光组件的中心和发光组件的边缘之间的连线方向。The length of the adhesive layer 104 may be the length of the adhesive layer 104 along a target direction, where the target direction is the direction of a line connecting the center of the light-emitting component and the edge of the light-emitting component.
参考图4，发光组件10还包括垫层结构105。其中，垫层结构105可以位于第一子封装部1011和第三表面102a之间，第一子封装部1011与第三表面102a通过垫层结构105连接。通过设置垫层结构105，可以降低封装部101的变形程度，提高结构的可靠型。4 , the light-emitting assembly 10 further includes a cushion structure 105. The cushion structure 105 can be located between the first sub-package 1011 and the third surface 102a, with the first sub-package 1011 and the third surface 102a connected via the cushion structure 105. The cushion structure 105 can reduce deformation of the package 101 and improve structural reliability.
参考图4，发光组件10还包括粘合层104，粘合层104可以位于垫层结构105和第一子封装部1011之间，且垫层结构105与第三表面102a直接接触设置，第一子封装部1011通过粘合层104与垫层结构105连接。由此可以保证第一子封装部1011和垫层结构105的连接效果。此种情况下，密闭空间是由封装部101，垫层结构105以及发光单元102相互连接构成的。4 , the light-emitting assembly 10 further includes an adhesive layer 104, which can be located between the cushion structure 105 and the first sub-package 1011. The cushion structure 105 is disposed in direct contact with the third surface 102a, and the first sub-package 1011 is connected to the cushion structure 105 via the adhesive layer 104. This ensures a secure connection between the first sub-package 1011 and the cushion structure 105. In this case, the enclosed space is formed by the interconnection of the package 101, the cushion structure 105, and the light-emitting unit 102.
可选的，垫层结构105与粘合层104接触的表面与第三表面102a的最大距离h4小于第二表面103b与第三表面102a之间的最大距离h5。也即是，发光组件10中，设置有垫层结构105的部分的高度低于未设置垫层结构105的部分的高度。Optionally, the maximum distance h4 between the surface of the pad structure 105 in contact with the adhesive layer 104 and the third surface 102a is less than the maximum distance h5 between the second surface 103b and the third surface 102a. In other words, in the light-emitting component 10, the height of the portion provided with the pad structure 105 is lower than the height of the portion not provided with the pad structure 105.
另外，粘合层104也可以位于垫层结构105和第三表面102a之间，垫层结构105和第一子封装部1011直接接触设置。第三表面102a通过粘合层104与垫层结构105连接。也即是，垫层结构105和粘合层104的位置可以交换，本申请实施例对此不做限定。Alternatively, the adhesive layer 104 may be located between the cushion structure 105 and the third surface 102a, with the cushion structure 105 and the first sub-package portion 1011 being in direct contact with each other. The third surface 102a is connected to the cushion structure 105 via the adhesive layer 104. In other words, the positions of the cushion structure 105 and the adhesive layer 104 may be interchanged, and this is not limited in the present embodiment.
可选的，封装部101的目标路径的长度h1和驱动单元103的厚度h2的比值大于或等于7。另外，封装部101的目标路径的长度h1和粘合层104以及垫层结构105的厚度之和h6的比值大于或等于10。如此，可以保证封装部101中的第一子封装部1011能够通过垫层结构105和粘合层104与第三表面102a连接，进而围成密闭空间。其中，封装部101的目标路径的相关说明可以参见上述实施例，本申请实施例在此不再赘述。Optionally, the ratio of the length h1 of the target path of the packaging part 101 to the thickness h2 of the driving unit 103 is greater than or equal to 7. In addition, the ratio of the length h1 of the target path of the packaging part 101 to the sum of the thickness h6 of the adhesive layer 104 and the cushion structure 105 is greater than or equal to 10. In this way, it can be ensured that the first sub-packaging part 1011 in the packaging part 101 can be connected to the third surface 102a through the cushion structure 105 and the adhesive layer 104, thereby forming a closed space. Among them, the relevant description of the target path of the packaging part 101 can be referred to the above embodiment. The embodiments of the present application will not be described in detail here.
示例的，封装部101的目标路径的长度h1可以大于或等于35μm，驱动单元103的厚度h2大于或等于5μm，粘合层104和垫层结构105的厚度之和h6小于或等于5μm，例如为3.5μm。For example, the length h1 of the target path of the packaging part 101 can be greater than or equal to 35μm, the thickness h2 of the driving unit 103 is greater than or equal to 5μm, and the sum of the thicknesses h6 of the adhesive layer 104 and the pad structure 105 is less than or equal to 5μm, for example 3.5μm.
图5是本申请实施例提供的有一种发光组件的结构示意图。参考图5，驱动单元103的第二表面103b包括表面边缘103b1和表面中心103b2，其中表面边缘103b1环绕表面中心103b2设置。表面边缘103b1和第三表面102a之间的距离，小于表面中心103b2和第三表面102a之间的距离。Figure 5 is a schematic diagram of the structure of a light-emitting assembly provided in an embodiment of the present application. Referring to Figure 5 , the second surface 103b of the driving unit 103 includes a surface edge 103b1 and a surface center 103b2, wherein the surface edge 103b1 is arranged around the surface center 103b2. The distance between the surface edge 103b1 and the third surface 102a is smaller than the distance between the surface center 103b2 and the third surface 102a.
其中，表面边缘103b1可以是指第二表面103b中位于驱动单元103和发光单元102电连接的位置所构成的区域之外的表面，表面中心103b2可以是指第二表面103b中位于驱动单元103和发光单元102电连接的位置所构成的区域之内的表面。Among them, the surface edge 103b1 may refer to the surface outside the area formed by the position where the driving unit 103 and the light-emitting unit 102 are electrically connected in the second surface 103b, and the surface center 103b2 may refer to the surface within the area formed by the position where the driving unit 103 and the light-emitting unit 102 are electrically connected in the second surface 103b.
可选的，驱动单元103中位于边缘位置的膜层会受到重力作用的影响而向第三表面102a靠近，而驱动单元103和发光单元102的电连接的位置属于刚性节点，因此位于中心位置的膜层向第三表面102a靠近的作用力较小。由此，可能会使得表面边缘103b1和第三表面102a之间的距离，小于表面中心103b2和第三表面102a之间的距离。Alternatively, the film layers at the edge of the driving unit 103 may be influenced by gravity and move closer to the third surface 102a. However, the electrical connection between the driving unit 103 and the light-emitting unit 102 is a rigid node, so the force exerted on the film layers at the center toward the third surface 102a is relatively small. Consequently, the distance between the surface edge 103b1 and the third surface 102a may be smaller than the distance between the surface center 103b2 and the third surface 102a.
可选的，驱动单元103的第二表面103b和封装部101靠近驱动单元103的表面共形。例如，驱动单元103的第二表面103b和封装部101靠近驱动单元103的表面接触，驱动单元103的第二表面103b中的表面边缘103b1和封装部101靠近驱动单元103的表面接触的部分均可以向第二表面103b靠近。也即是，驱动单元103的边缘部分可以随着封装部101的弯曲而弯曲。Optionally, the second surface 103b of the driving unit 103 is conformal to the surface of the packaging portion 101 proximal to the driving unit 103. For example, the second surface 103b of the driving unit 103 is in contact with the surface of the packaging portion 101 proximal to the driving unit 103, and the surface edge 103b1 of the second surface 103b of the driving unit 103 and the portion of the packaging portion 101 in contact with the surface proximal to the driving unit 103 can both move closer to the second surface 103b. In other words, the edge of the driving unit 103 can bend as the packaging portion 101 bends.
进一步的，在驱动单元103的第二表面103b的表面边缘103b1向第二表面103b靠近后，可能会使得驱动单元103的第一表面103a的一部分和第二接触区102a2连接。此种情况下，封装部101的第一子封装部1011也和第二接触区102a2连接，即同样可以使得发光单元102和驱动单元103相互电连接的位置位于密闭空间内。Furthermore, after the surface edge 103b1 of the second surface 103b of the driving unit 103 approaches the second surface 103b, a portion of the first surface 103a of the driving unit 103 may be connected to the second contact area 102a2. In this case, the first sub-encapsulation portion 1011 of the encapsulation portion 101 is also connected to the second contact area 102a2, that is, the location where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can also be located within a confined space.
参考图1至图5，封装部101还包括覆盖第二表面103b的第二子封装部1012。第一子封装部1011和第二子封装部1012为一体结构，驱动单元103位于封装部101和发光单元102围成的密闭空间的内部。也即是，除了驱动单元103和发光单元102相互电连接的位置位于密闭空间之外，整个驱动单元103也位于密闭空间内。由此可以避免驱动单元103的目标侧面103c暴露在外，保证驱动单元103的可靠性。1 to 5, the package part 101 further includes a second sub-package part 1012 covering the second surface 103b. The first sub-package part 1011 and the second sub-package part 1012 are an integrated structure, and the driving unit 103 is located inside the enclosed space surrounded by the package part 101 and the light emitting unit 102. That is, in addition to the driving unit The location where the drive unit 103 and the light emitting unit 102 are electrically connected is outside the enclosed space, and the entire drive unit 103 is also located in the enclosed space, thereby preventing the target side surface 103c of the drive unit 103 from being exposed to the outside, thereby ensuring the reliability of the drive unit 103.
可选的，密闭空间可以为封装部101和发光单元102相互连接形成，即封装部101和发光单元102相互连接围成密闭空间。或者，密闭空间可以为封装部101，发光单元102，以及与除驱动单元103之外的其他结构共同组合连接形成，即封装部101，发光单元102以及与除驱动单元103之外的其他结构共同组合连接围成密闭空间。Alternatively, the enclosed space may be formed by the interconnection of the packaging portion 101 and the light-emitting unit 102, i.e., the packaging portion 101 and the light-emitting unit 102 are connected to form a closed space. Alternatively, the enclosed space may be formed by the combination and connection of the packaging portion 101, the light-emitting unit 102, and other structures other than the driving unit 103, i.e., the combination and connection of the packaging portion 101, the light-emitting unit 102, and other structures other than the driving unit 103, to form a closed space.
可选的，封装部101的材料可以为柔性材料，例如封装部101的材料可以为聚酰亚胺(PI)。Optionally, the material of the packaging part 101 may be a flexible material, for example, the material of the packaging part 101 may be polyimide (PI).
需要说明的是，如果驱动单元103的目标侧面103c暴露在外，则一方面可能会导致驱动单元103包括的驱动电路(下文介绍)中的金属膜层被水氧腐蚀，进而可能导致膜层的电阻增大或者导致膜层短路。另一方面可能会导致驱动单元103包括的驱动电路中的有源层和水氧接触而发生漂移失效。It should be noted that if the target side 103c of the driver unit 103 is exposed, on the one hand, the metal film layer in the driver circuit (described below) included in the driver unit 103 may be corroded by water and oxygen, which may increase the resistance of the film layer or cause the film layer to short-circuit. On the other hand, it may cause the active layer in the driver circuit included in the driver unit 103 to come into contact with water and oxygen, resulting in drift failure.
图6是本申请实施例提供的再一种发光组件的结构示意图。参考图6，第二子封装部1012包括通孔，发光组件10包括位于通孔内的导电结构106。该导电结构106可以和驱动单元103电连接，且用于和显示基板包括的驱动背板的导电垫电连接。也即是，驱动背板的导电垫可以通过导电结构106为驱动单元103提供驱动信号(例如数据驱动信号)，从而使得驱动单元103能够驱动发光单元102发光。FIG6 is a schematic diagram of the structure of another light-emitting component provided in an embodiment of the present application. Referring to FIG6 , the second sub-package portion 1012 includes a through hole, and the light-emitting component 10 includes a conductive structure 106 located within the through hole. The conductive structure 106 can be electrically connected to the driving unit 103 and is used to electrically connect to the conductive pad of the driving backplane included in the display substrate. In other words, the conductive pad of the driving backplane can provide a driving signal (e.g., a data driving signal) to the driving unit 103 through the conductive structure 106, so that the driving unit 103 can drive the light-emitting unit 102 to emit light.
参考图6，导电结构106包括电连接的第一导电子结构1061和第二导电子结构1062。第一导电子结构1061相对于第二导电子结构1062更远离发光单元102设置。第二导电子结构1062在参考平面上的正投影位于第一导电子结构1061在参考平面上的正投影内，即第二导电子结构1062在参考平面上的正投影的面积小于第一导电子结构1061在参考平面上的正投影的面积。其中，参考平面平行于发光单元102远离驱动单元103的第四表面102b。6 , the conductive structure 106 includes an electrically connected first conductive substructure 1061 and a second conductive substructure 1062. The first conductive substructure 1061 is located farther away from the light-emitting unit 102 than the second conductive substructure 1062. The orthographic projection of the second conductive substructure 1062 on a reference plane is located within the orthographic projection of the first conductive substructure 1061 on the reference plane. That is, the area of the orthographic projection of the second conductive substructure 1062 on the reference plane is smaller than the area of the orthographic projection of the first conductive substructure 1061 on the reference plane. The reference plane is parallel to the fourth surface 102 b of the light-emitting unit 102, which is away from the driving unit 103.
可选的，第一导电子结构1061用于和显示基板包括的驱动背板的导电垫电连接，第二导电子结构1062和驱动单元103电连接。也即是，驱动背板的导电垫可以依次通过第一导电子结构1061和第二导电子结构1062为驱动单元103提供驱动信号(例如数据驱动信号)，从而使得驱动单元103能够驱动发光单元102发光。Optionally, the first conductive substructure 1061 is used to electrically connect to the conductive pad of the driving backplane included in the display substrate, and the second conductive substructure 1062 is electrically connected to the driving unit 103. That is, the conductive pad of the driving backplane can sequentially provide a driving signal (such as a data driving signal) to the driving unit 103 through the first conductive substructure 1061 and the second conductive substructure 1062, so that the driving unit 103 can drive the light-emitting unit. Yuan 102 glows.
在本申请实施例中，导电结构106中的第一导电子结构1061以及第二导电子结构1062可以均位于通孔内。导电结构106的制备方法可以包括：采用图案化处理工艺在临时衬底上形成第一导电子结构1061；在第一导电子结构1061远离临时衬底的一侧形成封装薄膜；在封装薄膜上形成通孔，且通孔用于露出第一导电子架构1061的至少部分，且通孔在临时衬底上的正投影位于第一导电子结构1061在临时衬底上的正投影内；在通孔内形成第二导电子结构1062。其中，图案化处理工艺包括：光刻胶涂覆，曝光，显影，刻蚀以及去除光刻胶。In an embodiment of the present application, the first conductive substructure 1061 and the second conductive substructure 1062 in the conductive structure 106 can both be located within a through-hole. A method for fabricating the conductive structure 106 can include: forming the first conductive substructure 1061 on a temporary substrate using a patterning process; forming an encapsulation film on a side of the first conductive substructure 1061 away from the temporary substrate; forming a through-hole in the encapsulation film, wherein the through-hole is configured to expose at least a portion of the first conductive substructure 1061, and the orthographic projection of the through-hole on the temporary substrate is located within the orthographic projection of the first conductive substructure 1061 on the temporary substrate; and forming the second conductive substructure 1062 within the through-hole. The patterning process includes: photoresist coating, exposure, development, etching, and photoresist removal.
如此，参考图6，第一导电子结构1061远离第二导电子结构1062的表面可以和封装部101远离驱动单元103的表面平齐。As such, referring to FIG. 6 , the surface of the first conductive substructure 1061 away from the second conductive substructure 1062 may be flush with the surface of the packaging portion 101 away from the driving unit 103 .
需要说明是的，导电结构106中的第一导电子结构1061可以位于通孔之外，第二导电子结构1062位于通孔内。也即是，第一导电子结构1061位于封装部101远离驱动单元103的一侧，且第一导电子结构1061远离封装部101的表面凸出于封装部101远离驱动单元103的表面。此种情况下，导电结构106的制备方法包括：在临时衬底的一侧形成封装薄膜；在封装薄膜上形成通孔；在通孔内形成第二导电子结构1062。之后，再依次形成驱动单元的各个膜层，将驱动单元和发光单元进行键合连接，以及去除临时基板。最后采用电镀或化学镀的方法在第二导电子结构1062远离驱动单元103的一侧形成第一导电子结构1061。It should be noted that the first conductive substructure 1061 in the conductive structure 106 can be located outside the through-hole, and the second conductive substructure 1062 is located inside the through-hole. That is, the first conductive substructure 1061 is located on the side of the packaging portion 101 away from the driving unit 103, and the surface of the first conductive substructure 1061 away from the packaging portion 101 protrudes from the surface of the packaging portion 101 away from the driving unit 103. In this case, the preparation method of the conductive structure 106 includes: forming a packaging film on one side of a temporary substrate; forming a through-hole in the packaging film; and forming the second conductive substructure 1062 in the through-hole. Thereafter, the various film layers of the driving unit are formed in sequence, the driving unit and the light-emitting unit are bonded and connected, and the temporary substrate is removed. Finally, the first conductive substructure 1061 is formed on the side of the second conductive substructure 1062 away from the driving unit 103 by electroplating or chemical plating.
如此，参考图7，第一导电子结构1061靠近第二导电子结构1062的表面可以和封装部101远离驱动单元103的表面平齐。As such, referring to FIG. 7 , the surface of the first conductive substructure 1061 close to the second conductive substructure 1062 may be flush with the surface of the packaging portion 101 away from the driving unit 103 .
本申请实施例对导电结构106的具体结构不做限定，只需使得导电结构106能够与驱动背板的导电垫以及驱动单元103均连接，以将驱动背板提供的驱动信号传输至驱动单元103即可。The embodiment of the present application does not limit the specific structure of the conductive structure 106 . It is only necessary that the conductive structure 106 can be connected to the conductive pad of the driving backplane and the driving unit 103 to transmit the driving signal provided by the driving backplane to the driving unit 103 .
可选的，发光组件10包括多个发光单元102以及与多个发光单元102对应的驱动单元103。由此，可以使得多个发光单元102中的每个发光单元102和驱动单元103相互电连接的位置被限制在密闭空间内，进而对每个发光单元102和驱动单元103的电连接的位置进行保护，避免外界的环境的干扰。Optionally, the light-emitting assembly 10 includes a plurality of light-emitting units 102 and a driving unit 103 corresponding to the plurality of light-emitting units 102. Thus, the location where each of the plurality of light-emitting units 102 and the driving unit 103 are electrically connected to each other can be confined within a confined space, thereby protecting the location where each light-emitting unit 102 and the driving unit 103 are electrically connected to each other and preventing interference from the external environment.
可选的，多个发光单元102包括第一颜色发光单元，第二颜色发光单元以及第三颜色发光单元。其中，第一颜色，第二颜色和第三颜色互不相同。示例的，第一颜色为红色(red，R)，第二颜色为绿色(green，G)，第三颜色为蓝色(blue，B)。Optionally, the plurality of light emitting units 102 include a first color light emitting unit, a second color light emitting unit, and a third color light emitting unit. The first color, the second color, and the third color are different from each other. Example The first color is red (red, R), the second color is green (green, G), and the third color is blue (blue, B).
在本申请实施例中，参考图1至图7，发光单元102包括：第一电极1021，第二电极1022以及分别与第一电极1021和第二电极1022电连接的发光层1023。其中，发光层1023的发光颜色为蓝色。另外，参考图8，发光单元102还包括彩膜层1024和色转层1025。其中，彩膜层1024，色转层1025以及发光层1023沿远离封装部101的方向依次层叠。In the embodiment of the present application, referring to Figures 1 to 7 , the light-emitting unit 102 includes a first electrode 1021, a second electrode 1022, and a light-emitting layer 1023 electrically connected to the first electrode 1021 and the second electrode 1022, respectively. The light-emitting layer 1023 emits blue light. Furthermore, referring to Figure 8 , the light-emitting unit 102 also includes a color filter layer 1024 and a color conversion layer 1025. The color filter layer 1024, the color conversion layer 1025, and the light-emitting layer 1023 are stacked sequentially in a direction away from the encapsulation portion 101.
并且，发光层1023包括第一发光部，第二发光部和第三发光部。也即是，第一发光部，第二发光部和第三发光部的发光颜色均为蓝色。图8中只示意了一个发光部。Furthermore, the light-emitting layer 1023 includes a first light-emitting portion, a second light-emitting portion, and a third light-emitting portion. That is, the first light-emitting portion, the second light-emitting portion, and the third light-emitting portion all emit blue light. FIG8 illustrates only one light-emitting portion.
色转层1025包括第一色转部，第二色转部和透明部，图8中只示意了一个色转部10251。第一色转部与第一发光部的正投影存在交叠，该第一色转部用于将第一发光部发出的光线转化为第一色转部对应的颜色(例如转化为红色)。第二色转部与第二发光部的正投影存在交叠，该第二色转部用于将第二发光部发出的光线转化为第二色转部对应的颜色(例如转化为绿色)。第三色转部与透明部的正投影存在交叠，该透明部用于透过第三发光部发出的光线。The color conversion layer 1025 includes a first color conversion portion, a second color conversion portion, and a transparent portion. Figure 8 shows only one color conversion portion 10251. The first color conversion portion overlaps with the orthographic projection of the first light-emitting portion and is used to convert the light emitted by the first light-emitting portion into the color corresponding to the first color conversion portion (for example, red). The second color conversion portion overlaps with the orthographic projection of the second light-emitting portion and is used to convert the light emitted by the second light-emitting portion into the color corresponding to the second color conversion portion (for example, green). The third color conversion portion overlaps with the orthographic projection of the transparent portion and is used to transmit light emitted by the third light-emitting portion.
可选的，色转层1025还包括位于第一色转部，第二色转部和透明部中任意相邻两个结构之间具有间隔部10252，该间隔部用于区分和间隔不同的色转部10251以及透明部。Optionally, the color conversion layer 1025 further includes a spacer 10252 located between any two adjacent structures among the first color conversion portion, the second color conversion portion and the transparent portion, and the spacer is used to distinguish and separate different color conversion portions 10251 and the transparent portion.
彩膜层1024包括第一色阻块，第二色阻块，第三色阻块和黑矩阵10242，图8只示意了一个色阻块10241。黑矩阵10242位于相邻的色阻块10241之间。第一色阻块与第一色转部的正投影存在重叠，第一色阻块用于透过第一色转部转化后对应颜色的光线，并阻隔其他颜色的光线。第二色阻块与第二色转部的正投影存在重叠，第二色阻块用于透过第二色转部转化后对应颜色的光线，并阻隔其他颜色的光线。第三色阻块与透明部的正投影存子啊重叠，第三色阻块用于透过透明部透过的对应颜色的光线，并阻隔其他颜色的光线。The color filter layer 1024 includes a first color block, a second color block, a third color block, and a black matrix 10242. Figure 8 only illustrates one color block 10241. The black matrix 10242 is located between adjacent color blocks 10241. The first color block overlaps with the orthographic projection of the first color conversion portion. The first color block is used to transmit light of the corresponding color after conversion by the first color conversion portion and block light of other colors. The second color block overlaps with the orthographic projection of the second color conversion portion. The second color block is used to transmit light of the corresponding color after conversion by the second color conversion portion and block light of other colors. The third color block overlaps with the orthographic projection of the transparent portion. The third color block is used to transmit light of the corresponding color transmitted by the transparent portion and block light of other colors.
示例的，第一色阻块为红色色阻块，第二色阻块为绿色色阻块，第三色阻块为蓝色色阻块。For example, the first color block is a red color block, the second color block is a green color block, and the third color block is a blue color block.
可选的，参考图9，发光层1023包括层叠设置的第一掺杂层10231，多量子阱层10232以及第二掺杂层10233。其中，第一掺杂层10231和第一电极1021电连接，第二掺杂层10233和第二电极1022电连接。Optionally, referring to FIG9 , the light emitting layer 1023 includes a first doping layer 10231, a multi-quantum well layer 10232, and a second doping layer 10233. The first doping layer 10231 and the first electrode 1021 The second doping layer 10233 is electrically connected to the second electrode 1022 .
可选的，第一掺杂层10231可以为N型掺杂层，第二掺杂层10233可以为P型掺杂层。相应的，第一电极1021可以称为N型电极，第二电极1022可以称为P型电极。可选的，第一掺杂层10231的材料可以为N型氮化镓(GaN)，第一掺杂层10231记为N-GaN。第二掺杂层10233的材料可以为P型氮化镓(GaN)，第二掺杂层10233记为P-GaN。Optionally, the first doped layer 10231 may be an N-type doped layer, and the second doped layer 10233 may be a P-type doped layer. Accordingly, the first electrode 1021 may be referred to as an N-type electrode, and the second electrode 1022 may be referred to as a P-type electrode. Optionally, the material of the first doped layer 10231 may be N-type gallium nitride (GaN), and the first doped layer 10231 is denoted as N-GaN. The material of the second doped layer 10233 may be P-type gallium nitride (GaN), and the second doped layer 10233 is denoted as P-GaN.
参考图9，第二掺杂层10233和多量子阱层10232用于露出第一掺杂层10231的目标部分。发光层1023还包括垫高电极10234，导电层10235以及绝缘层10236。其中，垫高电极10234和第一掺杂层10231的目标部分连接，导电层10235位于第二掺杂层10233远离第一掺杂层10231的一侧，绝缘层10236位于垫高电极10234和导电层10235远离第一掺杂层10231的一侧。绝缘层10236具有第一过孔(N型过孔)和第二过孔(P型过孔)。第一过孔用于露出垫高电极10234，垫高电极10234和第一电极1021连接，第二过孔用于露出导电层10235，导电层10235和第二电极1022连接。可选的，导电层10235的材料可以为氧化铟锡(ITO)，绝缘层10236可以为钝化层(PVX)。Referring to Figure 9, the second doped layer 10233 and the multi-quantum well layer 10232 are used to expose the target portion of the first doped layer 10231. The light-emitting layer 1023 also includes a raised electrode 10234, a conductive layer 10235, and an insulating layer 10236. The raised electrode 10234 is connected to the target portion of the first doped layer 10231. The conductive layer 10235 is located on the side of the second doped layer 10233 away from the first doped layer 10231. The insulating layer 10236 is located on the side of the raised electrode 10234 and the conductive layer 10235 away from the first doped layer 10231. The insulating layer 10236 has a first via (N-type via) and a second via (P-type via). The first via is used to expose the raised electrode 10234, which is connected to the first electrode 1021. The second via is used to expose the conductive layer 10235, which is connected to the second electrode 1022. Optionally, the material of the conductive layer 10235 may be indium tin oxide (ITO), and the insulating layer 10236 may be a passivation layer (PVX).
在本申请实施例中，参考图1至图7，驱动单元103包括：第三电极1031，第四电极1032以及驱动电路1033。第三电极1031和第四电极1032均可以为图4中驱动单元103包括的多个电极中的一个电极。第三电极1031和第四电极1032均位于驱动单元103朝向发光单元102的一侧，即第三电极1031和第四电极1032相对于驱动电路1033而言更靠近发光单元102。第三电极1031和第四电极1032分别与驱动电路1033电连接，第三电极1031和第一电极1021电连接，第四电极1032与第二电极1022电连接。In the embodiment of the present application, referring to Figures 1 to 7, the driving unit 103 includes: a third electrode 1031, a fourth electrode 1032, and a driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 can each be one of the multiple electrodes included in the driving unit 103 in Figure 4. The third electrode 1031 and the fourth electrode 1032 are both located on the side of the driving unit 103 facing the light-emitting unit 102, that is, the third electrode 1031 and the fourth electrode 1032 are closer to the light-emitting unit 102 than the driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 are respectively electrically connected to the driving circuit 1033, the third electrode 1031 is electrically connected to the first electrode 1021, and the fourth electrode 1032 is electrically connected to the second electrode 1022.
可选的，目标侧面103c可以为驱动电路1033的侧面。也即是，第一子封装部1011可以和第二表面103b以及驱动电路1033的侧边至少之一接触设置，进而使得第一子封装部1011和发光单元102构成密闭空间。Optionally, the target side surface 103c may be a side surface of the driving circuit 1033. That is, the first sub-package portion 1011 may be in contact with at least one of the second surface 103b and the side surface of the driving circuit 1033, thereby forming a sealed space with the first sub-package portion 1011 and the light emitting unit 102.
在本申请实施例中，驱动电路1033可以包括多个薄膜晶体管和至少一个存储电容。可选的，驱动电路1033可以包括七个薄膜晶体管和一个存储电容，即驱动电路1033为7T1C的驱动电路。或者，驱动电路1033可以包括其他数量的薄膜晶体管和其他数量的存储电容。本申请实施例对驱动电路1033所包括的薄膜晶体管的数量，以及包括的存储电容的数量不做限定。In the embodiment of the present application, the driving circuit 1033 may include a plurality of thin film transistors and at least one storage capacitor. Optionally, the driving circuit 1033 may include seven thin film transistors and one storage capacitor, that is, the driving circuit 1033 is a 7T1C driving circuit. Alternatively, the driving circuit 1033 may include other numbers of thin film transistors and other numbers of storage capacitors. The embodiment of the present application does not limit the number of thin film transistors included in the driving circuit 1033 and the number of storage capacitors included.
其中，每个薄膜晶体管包括栅极，源极和漏极。驱动电路1033包括的多个薄膜晶体管中互相连接，以实现驱动发光单元102发光的作用。Each thin film transistor includes a gate, a source, and a drain. The driving circuit 1033 includes multiple thin film transistors that are interconnected to achieve the function of driving the light emitting unit 102 to emit light.
可选的，多个薄膜晶体管至少包括数据写入晶体管，该数据写入晶体管的源极用于和显示基板中驱动背板的数据线连接。该数据线可以将数据驱动信号通过数据写入晶体管传输至驱动电路1033中。Optionally, the plurality of thin film transistors include at least a data writing transistor, the source of which is connected to a data line of a driving backplane in the display substrate. The data line can transmit a data driving signal to the driving circuit 1033 through the data writing transistor.
在本申请实施例中，发光组件10包括的导电结构106和驱动电路1033中的数据写入晶体管的源极连接，该数据写入晶体管通过其他薄膜晶体管与驱动单元103的第三电极1031连接，进而使得显示基板中驱动背板包括的数据线对应的导电垫依次通过导电结构106，驱动电路1033，以及第三电极1031向发光单元102的第一电极1021传输数据驱动信号。In an embodiment of the present application, the conductive structure 106 included in the light-emitting component 10 is connected to the source of the data writing transistor in the driving circuit 1033, and the data writing transistor is connected to the third electrode 1031 of the driving unit 103 through other thin film transistors, so that the conductive pad corresponding to the data line included in the driving backplane in the display substrate transmits the data driving signal to the first electrode 1021 of the light-emitting unit 102 through the conductive structure 106, the driving circuit 1033, and the third electrode 1031 in sequence.
需要说明的是，为了使得驱动单元103能够驱动发光单元102发光，除了为发光单的第一电极1021提供的数据驱动信号之外，还需为发光单元102的第二电极1022提供电源信号(如VSS信号)。可选的，驱动背板为多个发光组件提供的电源信号可以为相同信号，因此可以通过位于显示基板的周边区域的导电结构106为多个发光组件中发光单元102的第二电极1022提供电源信号。It should be noted that in order for the driving unit 103 to drive the light-emitting unit 102 to emit light, in addition to providing the data driving signal to the first electrode 1021 of the light-emitting unit, it is also necessary to provide a power signal (such as a VSS signal) to the second electrode 1022 of the light-emitting unit 102. Optionally, the power signal provided by the driving backplane to multiple light-emitting components can be the same signal, so the power signal can be provided to the second electrodes 1022 of the light-emitting units 102 in the multiple light-emitting components via the conductive structure 106 located in the peripheral area of the display substrate.
参考5，驱动电路1033包括依次层叠的缓冲绝缘层m1，有源层m2，第一栅极绝缘层m3，第一栅极层m4，第二栅极绝缘层m5，第二栅极层m6，层间介电层m7，源漏极层m8以及平坦层m9。驱动单元103包括的第三电极1031和第四电极1032位于平坦层m9远离缓冲绝缘层m1的一侧。Referring to Figure 5, the driver circuit 1033 includes a buffer insulating layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer m6, an interlayer dielectric layer m7, a source/drain layer m8, and a planar layer m9, which are stacked in sequence. The third electrode 1031 and the fourth electrode 1032 included in the driver unit 103 are located on a side of the planar layer m9 away from the buffer insulating layer m1.
有源层m2包括与多个薄膜晶体管对应的多个有源图案，每个有源图案包括源极区，漏极区以及沟道区。薄膜晶体管的源极和漏极位于源漏极层，且薄膜晶体管的源极和源极区连接，漏极和漏极区连接。The active layer m2 includes multiple active patterns corresponding to multiple thin film transistors, each of which includes a source region, a drain region, and a channel region. The source and drain of the thin film transistor are located in the source-drain layer, and the source of the thin film transistor is connected to the source region, and the drain is connected to the drain region.
第一栅极层m4包括与多个薄膜晶体管对应的多个栅极图案。沟道区为有源图案和栅极图案的正投影重叠的区域。The first gate layer m4 includes a plurality of gate patterns corresponding to the plurality of thin film transistors. The channel region is an area where the orthographic projections of the active pattern and the gate pattern overlap.
参考图10，发光组件10还包括基底107，基底107可以位于发光单元102远离驱动单元103的一侧，该基底107可以用于支撑发光单元102。当然，发光组件10也可以不包括基底107，基底107可以为发光组件10制备过程中用于支撑发光组件10的基底，而后期可以将基底107去除。10 , the light-emitting assembly 10 further includes a substrate 107. The substrate 107 may be located on a side of the light-emitting unit 102 away from the driving unit 103, and the substrate 107 may be used to support the light-emitting unit 102. Of course, the light-emitting assembly 10 may also not include the substrate 107. The substrate 107 may be used to support the light-emitting assembly 10 during its preparation, and the substrate 107 may be removed later.
综上所述，本申请实施例提供了一种发光组件，该发光组件包括封装部，发光单元以及驱动单元。其中，发光单元的第三表面的第一接触区和驱动单元连接，发光单元的第三表面中的第二接触区和封装部的第一子封装部连接，且第二接触区环绕第一接触区设置。通过上述设置方式可以使得第一子封装部可以和发光单元构成密闭空间，由此可以使得发光单元和驱动单元相互电连接的位置位于密封空间内，保证对电连接的位置的密封效果，避免外界环境对电连接的位置产生影响，提高发光组件的可靠性。In summary, the embodiment of the present application provides a light emitting component, which includes a packaging portion, a light emitting unit and a driving unit. The first sub-encapsulation portion of the packaging portion is connected to the second contact area on the third surface of the light-emitting unit, and the second contact area is arranged around the first contact area. This arrangement allows the first sub-encapsulation portion and the light-emitting unit to form a sealed space. As a result, the location where the light-emitting unit and the driving unit are electrically connected to each other can be located within the sealed space, ensuring a good sealing effect at the electrical connection location, preventing the external environment from affecting the electrical connection location, and improving the reliability of the light-emitting assembly.
图11是本申请实施例提供的一种发光组件的制备方法的流程图。参考图11，该方法包括：FIG11 is a flow chart of a method for preparing a light-emitting component according to an embodiment of the present application. Referring to FIG11 , the method includes:
步骤S101、获取临时基板，以及位于临时基板上的初始封装部和位于初始封装部远离临时基板的一侧的驱动单元。Step S101 : obtaining a temporary substrate, an initial packaging portion located on the temporary substrate, and a driving unit located on a side of the initial packaging portion away from the temporary substrate.
在本申请实施例中，初始封装部101a可以位于临时基板上，驱动单元103位于初始封装部101a远离临时基板的一侧。其中，临时基板可以为刚性基板，因此可以为初始封装部101a以及驱动单元103提供支撑，避免初始封装部101a和驱动单元103形变。另外，驱动单元103在初始封装部101a上的正投影位于初始封装部101a内。例如，初始封装部101a可以具有超出驱动单元103的部分。In an embodiment of the present application, the initial packaging portion 101a can be located on a temporary substrate, and the drive unit 103 is located on a side of the initial packaging portion 101a away from the temporary substrate. The temporary substrate can be a rigid substrate, thereby providing support for the initial packaging portion 101a and the drive unit 103 to prevent deformation of the initial packaging portion 101a and the drive unit 103. Furthermore, the orthographic projection of the drive unit 103 on the initial packaging portion 101a is located within the initial packaging portion 101a. For example, the initial packaging portion 101a can have a portion that extends beyond the drive unit 103.
可选的，驱动单元103包括：第三电极1031，第四电极1032以及驱动电路1033。第三电极1031和第四电极1032均位于驱动单元103远离初始封装部101a的一侧，即第三电极1031和第四电极1032相对于驱动电路1033而言更远离初始封装部101a。Optionally, the driving unit 103 includes a third electrode 1031, a fourth electrode 1032, and a driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 are both located on a side of the driving unit 103 away from the initial packaging portion 101a, that is, the third electrode 1031 and the fourth electrode 1032 are farther away from the initial packaging portion 101a than the driving circuit 1033.
步骤S102、获取基底以及位于基底上的发光单元。Step S102: obtaining a substrate and a light-emitting unit located on the substrate.
在本申请实施例中，参考图13，发光单元102可以包括第一电极1021，第二电极1022以及分别与第一电极1021和第二电极1022电连接的发光层1023。其中，第一电极1021和第二电极1022位于发光层1023远离基底的一侧。In the embodiment of the present application, referring to FIG13 , the light-emitting unit 102 may include a first electrode 1021, a second electrode 1022, and a light-emitting layer 1023 electrically connected to the first electrode 1021 and the second electrode 1022. The first electrode 1021 and the second electrode 1022 are located on a side of the light-emitting layer 1023 away from the substrate.
步骤S103、通过键合工艺将发光单元和驱动单元键合连接，以得到目标结构。Step S103 : bonding the light emitting unit and the driving unit together through a bonding process to obtain a target structure.
在本申请实施例中，参考图14，将发光单元102和驱动单元103键合连接之后，可以使得发光单元102的第一电极1021和驱动单元103的第三电极1031电连接，并使得发光单元102的第二电极1022和驱动单元103的第四电极1032电连接。In an embodiment of the present application, referring to Figure 14, after the light-emitting unit 102 and the driving unit 103 are bonded and connected, the first electrode 1021 of the light-emitting unit 102 and the third electrode 1031 of the driving unit 103 can be electrically connected, and the second electrode 1022 of the light-emitting unit 102 and the fourth electrode 1032 of the driving unit 103 can be electrically connected.
其中，参考图14，目标结构包括依次设置的临时衬底，初始封装部101a，驱动单元103，发光单元102以及基底。驱动单元103包括朝向发光单元102一侧的第一表面103a，背离发光单元102一侧的第二表面103b，以及位于第一表面103a和第二表面103b之间的目标侧面103c。发光单元102包括朝向驱动单元103的第三表面102a。14 , the target structure includes a temporary substrate, an initial packaging portion 101 a, The driving unit 103, the light-emitting unit 102, and the substrate. The driving unit 103 includes a first surface 103a facing the light-emitting unit 102, a second surface 103b facing away from the light-emitting unit 102, and a target side surface 103c located between the first surface 103a and the second surface 103b. The light-emitting unit 102 includes a third surface 102a facing the driving unit 103.
步骤S104、在初始封装部的重力方向朝向发光单元的情况下，将临时基板从初始封装部的一侧剥离，以使得初始封装部在自身重力的作用下向靠近发光单元的一侧形变得到封装部。Step S104 : When the gravity direction of the initial packaging part is toward the light emitting unit, peel the temporary substrate from one side of the initial packaging part so that the initial packaging part is deformed toward the side close to the light emitting unit under the action of its own gravity.
在本申请实施例中，在将驱动单元103和发光单元102键合连接之后，可以将临时基板，初始封装部101a，驱动单元103，发光单元102以及基底沿从上至下的顺序设置。之后，参考图15，在临时基板远离初始封装部101a的一侧设置激光设备。驱动目标结构移动使得激光设备的激光光条依次扫过目标结构沿移动方向的每个区域。其中，在目标结构被激光光条扫过后，临时基板就能够从初始封装部101a的一侧剥离。也即是，临时基板采用激光剥离(Laser lift-off，LLO)从初始封装部101a的一侧去除。In an embodiment of the present application, after the driving unit 103 and the light-emitting unit 102 are bonded and connected, the temporary substrate, the initial packaging part 101a, the driving unit 103, the light-emitting unit 102 and the base can be arranged in order from top to bottom. Thereafter, referring to FIG15 , a laser device is set on the side of the temporary substrate away from the initial packaging part 101a. The target structure is driven to move so that the laser light bar of the laser device sequentially scans each area of the target structure along the moving direction. Among them, after the target structure is scanned by the laser light bar, the temporary substrate can be peeled off from one side of the initial packaging part 101a. That is, the temporary substrate is removed from one side of the initial packaging part 101a by laser lift-off (LLO).
在将临时基板从初始封装部101a的一侧剥离之后，初始封装部101a就会失去临时基板的支撑作用，进而在自身重力的作用下向靠近发光单元102的一侧形变。After the temporary substrate is peeled off from one side of the initial packaging part 101 a , the initial packaging part 101 a loses the support of the temporary substrate and is deformed toward the side close to the light emitting unit 102 under the action of its own gravity.
同时，由于初始封装部101a和发光单元102之间设置有驱动单元103，而驱动单元103和发光单元102相互电连接的位置通常为刚性节点，因此驱动单元103中位于刚性节点所构成的区域之内的部分还是会对初始封装部101a提供支撑。由此，初始封装部101a中位于刚性节点所构成的区域之外的部分可以在自身重力的作用下向靠近发光单元102的一侧形变。At the same time, because the driver unit 103 is disposed between the initial packaging portion 101a and the light-emitting unit 102, and the location where the driver unit 103 and the light-emitting unit 102 are electrically connected is generally a rigid node, the portion of the driver unit 103 within the area formed by the rigid node still provides support for the initial packaging portion 101a. As a result, the portion of the initial packaging portion 101a outside the area formed by the rigid node can deform toward the side closer to the light-emitting unit 102 under the action of its own gravity.
在本申请实施例中，封装部101包括第一子封装部1011，第三表面102a包括与驱动单元103电连接的第一接触区102a1以及与第一子封装部1011连接的第二接触区102a2。第二接触区102a2环绕第一接触区102a1设置，第一子封装部1011与第二表面103b和目标侧面103c至少之一接触设置。由此可以使得封装部101和发光单元102构成密闭空间，并使得发光单元102和驱动单元103相互电连接的位置位于密闭空间内。进一步的，可以避免发光单元102和驱动单元103相互电连接的位置受到外界环境的影响，提高发光组件10的可靠性。In the embodiment of the present application, the packaging portion 101 includes a first sub-packaging portion 1011, and the third surface 102a includes a first contact area 102a1 electrically connected to the driving unit 103 and a second contact area 102a2 connected to the first sub-packaging portion 1011. The second contact area 102a2 is arranged around the first contact area 102a1, and the first sub-packaging portion 1011 is arranged in contact with at least one of the second surface 103b and the target side surface 103c. In this way, the packaging portion 101 and the light-emitting unit 102 can form a closed space, and the position where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can be located within the closed space. Furthermore, the position where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can be prevented from being affected by the external environment, thereby improving the reliability of the light-emitting component 10.
如图12至16所示，可以采用一次工艺制备得到多个发光组件10，进而便于实现发光组件10的批量化生产。之后，参考图17，可以采用切割工艺对多个发光组件10进行切割，从而得到多个发光组件10。其中，图12至图17均以两个发光组件10为例。As shown in Figures 12 to 16, multiple light-emitting components 10 can be prepared using a single process. 17 , a cutting process can be used to cut the plurality of light emitting components 10, thereby obtaining a plurality of light emitting components 10. In particular, FIG12 to FIG17 all take two light emitting components 10 as an example.
综上所述，本申请实施例提供了一种发光组件的制备方法，该方法制备得到的发光组件包括封装部，发光单元以及驱动单元。其中，发光单元的第三表面的第一接触区和驱动单元连接，发光单元的第三表面中的第二接触区和封装部的第一子封装部连接，且第二接触区环绕第一接触区设置。通过上述设置方式可以使得第一子封装部可以和发光单元构成密闭空间，由此可以使得发光单元和驱动单元相互电连接的位置位于密封空间内，保证对电连接的位置的密封效果，避免外界环境对电连接的位置产生影响，提高发光组件的可靠性。In summary, an embodiment of the present application provides a method for preparing a light-emitting component, wherein the light-emitting component prepared by the method includes a packaging part, a light-emitting unit, and a driving unit. The first contact area on the third surface of the light-emitting unit is connected to the driving unit, the second contact area on the third surface of the light-emitting unit is connected to the first sub-packaging part of the packaging part, and the second contact area is arranged around the first contact area. The above-mentioned arrangement method can make the first sub-packaging part and the light-emitting unit form a closed space, thereby making the position where the light-emitting unit and the driving unit are electrically connected to each other located in the sealed space, ensuring the sealing effect of the electrical connection position, avoiding the influence of the external environment on the electrical connection position, and improving the reliability of the light-emitting component.
图18是本申请实施例提供的一种显示基板的结构示意图。参考图18，该显示基板00包括驱动背板20以及多个发光组件10。示例的，多个发光组件10位于显示基板00的显示区域00a，且多个发光组件10阵列排布。FIG18 is a schematic diagram of the structure of a display substrate provided in an embodiment of the present application. Referring to FIG18 , the display substrate 00 includes a driver backplane 20 and a plurality of light-emitting components 10. For example, the plurality of light-emitting components 10 are located in a display area 00a of the display substrate 00 and are arranged in an array.
其中，发光组件10包括的驱动单元103位于驱动背板20和发光组件10包括的发光单元102之间，且驱动背板20和驱动单元103电连接。驱动背板20用于为驱动单元103提供驱动信号，以使驱动单元103驱动发光单元102发光。The driving unit 103 included in the light-emitting assembly 10 is located between the driving backplane 20 and the light-emitting unit 102 included in the light-emitting assembly 10, and the driving backplane 20 and the driving unit 103 are electrically connected. The driving backplane 20 is used to provide a driving signal to the driving unit 103 so that the driving unit 103 drives the light-emitting unit 102 to emit light.
参考图19，驱动背板20包括：背板衬底201，以及位于背板衬底201的一侧的焊盘(图中未示出)，焊盘包括多个导电垫202。其中，导电垫202用于和发光组件10包括的导电结构106的第一导电子结构1061电连接。19 , the driving backplane 20 includes a backplane substrate 201 and a pad (not shown) located on one side of the backplane substrate 201. The pad includes a plurality of conductive pads 202. The conductive pads 202 are used to electrically connect to the first conductive substructure 1061 of the conductive structure 106 included in the light-emitting component 10.
由于显示基板可以与前面实施例描述的发光组件具有基本相同的技术效果，因此，出于简洁的目的，此处不再重复描述显示基板的技术效果。Since the display substrate can have substantially the same technical effects as the light-emitting assembly described in the previous embodiment, the technical effects of the display substrate will not be repeatedly described here for the purpose of brevity.
本申请的实施方式部分使用的术语仅用于对本申请的实施例进行解释，而非旨在限定本申请。除非另作定义，本申请的实施方式使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。The terms used in the embodiments of this application are only used to explain the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the common meaning understood by people with ordinary skills in the field to which this application belongs.
本申请的实施方式部分使用的术语仅用于对本申请的实施例进行解释，而非旨在限定本申请。除非另作定义，本申请的实施方式使用的技术术语或者科学术语应当为本申请所属领域内具有一般技能的人士所理解的通常意义。本申请专利申请说明书以及权利要求书中使用的“第一”、“第二”、“第三”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。The terms used in the embodiments of this application are only used to explain the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The terms "first", "second", "third" and "third" used in the patent application specification and claims of this application are not intended to limit this application. and similar words do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprises" include the elements or objects listed after "include" or "comprises" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
以上所述仅为本申请的可选实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2024/074756WO2025160758A1 (en) | 2024-01-30 | 2024-01-30 | Light-emitting assembly and preparation method therefor, and display substrate |
| CN202480000152.3ACN120731679A (en) | 2024-01-30 | 2024-01-30 | Light-emitting component and preparation method thereof, and display substrate |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2024/074756WO2025160758A1 (en) | 2024-01-30 | 2024-01-30 | Light-emitting assembly and preparation method therefor, and display substrate |
| Publication Number | Publication Date |
|---|---|
| WO2025160758A1true WO2025160758A1 (en) | 2025-08-07 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2024/074756PendingWO2025160758A1 (en) | 2024-01-30 | 2024-01-30 | Light-emitting assembly and preparation method therefor, and display substrate |
| Country | Link |
|---|---|
| CN (1) | CN120731679A (en) |
| WO (1) | WO2025160758A1 (en) |
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| CN108886050A (en)* | 2017-01-24 | 2018-11-23 | 歌尔股份有限公司 | Micro LED device, display device, and micro LED manufacturing method |
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| CN112018143A (en)* | 2019-05-28 | 2020-12-01 | 云谷（固安）科技有限公司 | Micro light-emitting diode display substrate, display panel, manufacturing method thereof, and display device |
| CN116314238A (en)* | 2023-01-13 | 2023-06-23 | 上海交通大学 | Integrated structure based on OTFT circuit driving Micro-LED display |
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| CN108886050A (en)* | 2017-01-24 | 2018-11-23 | 歌尔股份有限公司 | Micro LED device, display device, and micro LED manufacturing method |
| CN112018143A (en)* | 2019-05-28 | 2020-12-01 | 云谷（固安）科技有限公司 | Micro light-emitting diode display substrate, display panel, manufacturing method thereof, and display device |
| CN116314238A (en)* | 2023-01-13 | 2023-06-23 | 上海交通大学 | Integrated structure based on OTFT circuit driving Micro-LED display |
| CN116434705A (en)* | 2023-06-12 | 2023-07-14 | 惠科股份有限公司 | Driving circuit, display panel and display device |
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| CN120731679A (en) | 2025-09-30 |
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