相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS
本公开要求于2023年08月16日提交中国国家知识产权局的申请号为202311036178.7、名称为“测量人体组织内压力和温度的微型传感器及其封装工艺”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。The present disclosure claims the priority of Chinese patent application number 202311036178.7 filed with the State Intellectual Property Office of China on August 16, 2023, entitled “Microsensor for measuring pressure and temperature in human tissue and its packaging process”, the entire contents of which are incorporated by reference in the present disclosure.
本公开涉及传感器以及医疗设备技术领域，特别是涉及一种测量人体组织内压力和温度的微型传感器及其封装工艺。The present disclosure relates to the technical field of sensors and medical equipment, and in particular to a micro sensor for measuring pressure and temperature in human tissue and a packaging process thereof.
现在临床使用的传感器件，多数在人体外使用。比如，使用压力传感器件或者温度传感器件在体表或者在距离体表比较浅的部位，测量血压或者温度。随着医疗技术的进步和要求，需要对于人体组织或腔道内的压力或者温度进行测量时，往往需要对传感器件进行微小化封装。譬如对颅内压、冠状动脉内压力、肺动脉压力、肾动脉压力等人体内压力的测量，以及对颅内温、膀胱内温、直肠内温等体内温度的测量。这些部位相对狭窄，所需的压力和温度传感器必须做到微型化才能够到达所述部位进行测量。Most of the sensors currently used in clinical practice are used outside the human body. For example, pressure sensors or temperature sensors are used to measure blood pressure or temperature on the body surface or at a location relatively shallow from the body surface. With the advancement and requirements of medical technology, when it is necessary to measure the pressure or temperature in human tissues or cavities, it is often necessary to miniaturize the sensor packaging. For example, the measurement of intracranial pressure, intracoronary pressure, pulmonary artery pressure, renal artery pressure and other human body pressures, as well as the measurement of intracranial temperature, bladder temperature, rectal temperature and other body temperatures. These areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the said areas for measurement.
然而，现有用于人体内的微型传感器件封装难度大，良品率低。传感器件封装之后，往往体积比较大，限制了用于人体内组织或血管内的使用。However, the existing micro-sensor devices used in the human body are difficult to package and have a low yield rate. After the sensor devices are packaged, they are often large in size, which limits their use in tissues or blood vessels in the human body.
发明内容Summary of the invention
基于此，本公开的目的在于，提供一种测量人体组织内压力和温度的微型传感器及其封装工艺，其具有传感器件制作方便、良品率高、封装体积小的优点。Based on this, the purpose of the present disclosure is to provide a micro sensor for measuring pressure and temperature in human tissue and its packaging process, which has the advantages of easy sensor device manufacturing, high yield rate and small packaging volume.
根据本公开实施例的第一方面，提供一种测量人体组织内压力和温度的微型传感器，微型传感器用于连接信号检测电路，信号检测电路包括压力信号采样电路以及温度信号采样电路；微型传感器包括载板、固定在载板上的压力传感器以及温度传感器；According to a first aspect of an embodiment of the present disclosure, there is provided a micro sensor for measuring pressure and temperature in human tissue, the micro sensor being used to connect to a signal detection circuit, the signal detection circuit comprising a pressure signal sampling circuit and a temperature signal sampling circuit; the micro sensor comprising a carrier board, a pressure sensor fixed on the carrier board, and a temperature sensor;
压力传感器包括由单晶硅压敏薄膜和多晶硅压敏薄膜混合组成，多晶硅压敏感薄膜被沉积在体硅加工后的单晶硅层下表面，单晶硅层与多晶硅压力敏感薄膜之间夹着一层氧化硅层；然后通过干法自停止刻蚀单晶硅层形成单晶硅应力集中结构，最后去除氧化硅层暴露出多晶硅力敏感薄膜，从而制备厚度薄于5μm下的多晶硅力敏感薄膜。The pressure sensor includes a mixture of a single-crystal silicon pressure-sensitive film and a polycrystalline silicon pressure-sensitive film. The polycrystalline silicon pressure-sensitive film is deposited on the lower surface of the single-crystal silicon layer after bulk silicon processing, and a silicon oxide layer is sandwiched between the single-crystal silicon layer and the polycrystalline silicon pressure-sensitive film; then, the single-crystal silicon layer is etched by dry self-stop etching to form a single-crystal silicon stress concentration structure, and finally the silicon oxide layer is removed to expose the polycrystalline silicon force-sensitive film, thereby preparing a polycrystalline silicon force-sensitive film with a thickness thinner than 5μm.
所述单晶硅压敏薄膜和多晶硅压敏薄膜在芯片内部共同连接成超微型惠斯顿电桥，构成一个完整的超微型压力传感器芯片模块，具体包括R1\R2\R3\R4等，由硅压敏薄膜组成的压力传感器芯片分别有全桥和半桥不同的结构：由两个硅压敏薄膜电阻组成的惠斯顿半桥压力传感器芯片，分别为R1、R2，而R3、R4则为通过导线与R1、R2连接的传感器芯片外部的惠斯顿半桥的一部分，R3、R4为固定值电阻。在另一个方案中，由四个硅压敏薄膜电阻组成的惠斯顿全桥压力传感器芯片，分别为R1、R2、R3、R4，全部是位于芯片内部的硅压敏薄膜电阻。温度传感器包括热敏电阻；热敏电阻的第一端与R1、R2的连接端共同连接并接地；热敏电阻的第二端经由温度信号采样电路与电源连接。The monocrystalline silicon piezoresistance film and the polycrystalline silicon piezoresistance film are connected together inside the chip to form an ultra-micro Wheatstone bridge, forming a complete ultra-micro pressure sensor chip module, specifically including R1\R2\R3\R4, etc. The pressure sensor chip composed of silicon piezoresistance film has different structures of full bridge and half bridge: the Wheatstone half-bridge pressure sensor chip composed of two silicon piezoresistance film resistors, namely R1 and R2, while R3 and R4 are sensor cores connected to R1 and R2 through wires. Part of the Wheatstone half-bridge outside the chip, R3 and R4 are fixed value resistors. In another scheme, the Wheatstone full-bridge pressure sensor chip consists of four silicon piezoresistors, namely R1, R2, R3, and R4, all of which are silicon piezoresistors located inside the chip. The temperature sensor includes a thermistor; the first end of the thermistor is connected to the connection ends of R1 and R2 and grounded; the second end of the thermistor is connected to the power supply via the temperature signal sampling circuit.
根据本公开实施例的第二方面，提供一种测量人体内压力和温度的微型传感器件的制造工艺，包括如下步骤：According to a second aspect of an embodiment of the present disclosure, a manufacturing process of a microsensor device for measuring pressure and temperature in a human body is provided, comprising the following steps:
在载板上通过电镀工艺镀上金属焊盘a、b、c以及金属异型焊盘d、e；其中，焊盘a、b、c与焊盘d、e通过导线与各自对应的传感器芯片上的焊盘连接；Metal pads a, b, c and metal special-shaped pads d and e are plated on the carrier by electroplating process; wherein the pads a, b, c and the pads d and e are connected to the pads on the corresponding sensor chips by wires;
采用固晶工艺将压力传感器固定在载板上，采用超声波焊接工艺将压力传感器的焊盘与载板焊盘a、b、c通过导线焊接；将温度传感器固定在载板上，以使温度传感器的电极与焊盘d、e连接。The pressure sensor is fixed on the carrier board by using a die bonding process, and the pads of the pressure sensor are welded to pads a, b, and c of the carrier board by using an ultrasonic welding process through wires; the temperature sensor is fixed on the carrier board so that the electrodes of the temperature sensor are connected to pads d and e.
本公开实施例通过在载板上布局压力传感器以及温度传感器，压力信号采样电路根据压力传感器上压敏电阻的电阻值的大小变化，来检测压力信号，实现对压力的测量。温度信号采样电路根据温度传感器上热敏电阻的电阻值的大小变化，来检测温度信号。压力传感器与温度传感器共用接地线，实现了在载板上将压力传感器以及温度传感器进行微组装，提高了微型传感器件的良品率以及减小了传感器件的封装体积。The disclosed embodiment arranges a pressure sensor and a temperature sensor on a carrier board, and the pressure signal sampling circuit detects the pressure signal according to the change in the resistance value of the varistor on the pressure sensor, thereby realizing the measurement of pressure. The temperature signal sampling circuit detects the temperature signal according to the change in the resistance value of the thermistor on the temperature sensor. The pressure sensor and the temperature sensor share a ground wire, which realizes the micro-assembly of the pressure sensor and the temperature sensor on the carrier board, improves the yield rate of the micro-sensor device and reduces the packaging volume of the sensor device.
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.
为了更好地理解和实施，下面结合附图详细说明本公开。For better understanding and implementation, the present disclosure is described in detail below with reference to the accompanying drawings.
图1为本公开一个实施例提供的测量人体组织内压力和温度的微型传感器的示意图；FIG1 is a schematic diagram of a micro sensor for measuring pressure and temperature in human tissue provided by an embodiment of the present disclosure;
图2为本公开一个实施例提供的测量人体组织内压力和温度的微型传感器的具体电路结构示意图；FIG2 is a schematic diagram of a specific circuit structure of a micro sensor for measuring pressure and temperature in human tissue provided by an embodiment of the present disclosure;
图3为本公开另一个实施例提供的测量人体组织内压力和温度的微型传感器的示意图；FIG3 is a schematic diagram of a micro sensor for measuring pressure and temperature in human tissue provided by another embodiment of the present disclosure;
图4为本公开另一个实施例提供的测量人体组织内压力和温度的微型传感器的具体电路结构示意图；FIG4 is a schematic diagram of a specific circuit structure of a micro sensor for measuring pressure and temperature in human tissue provided by another embodiment of the present disclosure;
图5为本公开一个实施例提供的测量人体组织内压力和温度的微型传感器的封装工艺的流程示意图。FIG5 is a schematic flow chart of a packaging process for a micro sensor for measuring pressure and temperature in human tissue provided by an embodiment of the present disclosure.
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施例方式作进一步地详细描述。In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.
应当明确，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。It should be clear that the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. The embodiments in the present disclosure and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.
在本公开实施例使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本公开实施例。在本公开实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。The terms used in the disclosed embodiments are only for the purpose of describing specific embodiments and are not intended to limit the disclosed embodiments. The singular forms of "a", "said" and "the" used in the disclosed embodiments and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and/or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。在本公开的描述中，需要理解的是，术语“第一”、“第二”、“第三”等仅用于区别类似的对象，而不必用于描述特定的顺序或先后次序，也不能理解为指示或暗示相对重要性。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims. In the description of the present disclosure, it should be understood that the terms "first", "second", "third", etc. are only used to distinguish similar objects, and do not have to be used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.
此外，在本公开的描述中，除非另有说明，“多个”是指两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。字符“/”一般表示前后关联对象是一种“或”的关系。In addition, in the description of the present disclosure, unless otherwise specified, "plurality" means two or more. "And/or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character "/" generally indicates that the associated objects before and after are in an "or" relationship.
下面将结合图1至图5，对本公开实施例提供的测量人体内压力和温度的微型传感器及其封装工艺进行详细介绍。The micro sensor for measuring pressure and temperature in the human body and its packaging process provided by the embodiment of the present disclosure will be introduced in detail below with reference to FIGS. 1 to 5 .
实施例1Example 1
第一个实施例中，请参阅图1和图2，本公开实施例提供一种测量人体内压力和温度的微型传感器件，微型传感器件通过连接信号检测电路，信号检测电路包括压力信号采样电路以及温度信号采样电路；微型传感器件包括载板10、布局在载板10上的压力传感器11、压力感应面12以及温度传感器13；In the first embodiment, please refer to FIG. 1 and FIG. 2 , the embodiment of the present disclosure provides a micro sensor device for measuring pressure and temperature in a human body, the micro sensor device is connected to a signal detection circuit, the signal detection circuit includes a pressure signal sampling circuit and a temperature signal sampling circuit; the micro sensor device includes a carrier board 10, a pressure sensor 11 arranged on the carrier board 10, a pressure sensing surface 12 and a temperature sensor 13;
载板上分别镀有焊盘a、b、c、d、e，其中焊盘d为7字形或q字型异型焊盘，焊盘e为T字形或P字形异型焊盘。他们分别简称为载板焊盘a、b、c、d、e。压力传感器上有焊盘Q1、Q2、Q3。其中载板焊盘a、b、c分别与传感器焊盘Q1、Q2、Q3通过超声波焊接工艺实现导线焊接。载板焊盘d、e分别为温度传感器电极的连接焊盘。The substrate is plated with pads a, b, c, d, and e, respectively, where pad d is a 7-shaped or q-shaped special-shaped pad, and pad e is a T-shaped or P-shaped special-shaped pad. They are referred to as substrate pads a, b, c, d, and e, respectively. There are pads Q1, Q2, and Q3 on the pressure sensor. The substrate pads a, b, and c are respectively connected to the sensor pads Q1, Q2, and Q3 by ultrasonic welding. The substrate pads d and e are the connection pads of the temperature sensor electrodes.
其中，焊盘a、b、c分别与导线m1、m2、m3通过焊接工艺连接，焊盘d、e分别通过焊接工艺与导线m4、m5连接。The pads a, b, and c are connected to the wires m1, m2, and m3 respectively through a welding process, and the pads d and e are connected to the wires m4 and m5 respectively through a welding process.
压力传感器11的压力感应面12包括第一压敏硅薄膜电阻R1以及第二压敏硅薄膜电阻R2；温度传感器13包括热敏电阻R5；第一压敏电阻R1和第二压敏电阻R2的第一端，连接于传感器焊盘Q1,焊盘Q1通过导线与焊盘a并通过导线m1与热敏电阻R5的载板焊盘d连接并通过导线m4接地GND；第一压敏电阻R1的第二端通过焊盘Q2与压力信号采样电路的第一端连接，第二压敏电阻R2的第二端通过焊盘Q3与压力信号采样电路的第二端连接；热敏电阻R5的另一端经由温度信号采样电路与电源VCC2连接。其中，接地GND与电源VCC2可以视为激励电源的负极与激励电源的正极。The pressure sensing surface 12 of the pressure sensor 11 includes a first piezoresistive silicon thin film resistor R1 and a second piezoresistive silicon thin film resistor R2; the temperature sensor 13 includes a thermistor R5; the first ends of the first piezoresistor R1 and the second piezoresistor R2 are connected to the sensor pad Q1, the pad Q1 is connected to the pad a through a wire and to the carrier pad d of the thermistor R5 through a wire m1 The first varistor R1 is connected to the first end of the pressure signal sampling circuit through the pad Q2, and the second end of the second varistor R2 is connected to the second end of the pressure signal sampling circuit through the pad Q3; the other end of the thermistor R5 is connected to the power supply VCC2 via the temperature signal sampling circuit. The ground GND and the power supply VCC2 can be regarded as the negative pole of the excitation power supply and the positive pole of the excitation power supply.
焊盘a、b、c、d、e通过导线与对应外接的的传感器采样电路连接，从而实现温度和压力的测量。其中，传感器中压敏电阻R1、R2通过焊盘b、c与外接电阻R3、R4构成完整的惠斯顿电桥，焊盘a与压力传感器焊盘Q1通过导线m1连接载板焊盘d互通并接地，即压力传感器与温度传感器共用地线。焊盘e通过导线为NTC温度传感器供电。Pads a, b, c, d, and e are connected to the corresponding external sensor sampling circuits through wires to achieve temperature and pressure measurement. Among them, the varistors R1 and R2 in the sensor form a complete Wheatstone bridge through pads b and c and external resistors R3 and R4. Pad a and pressure sensor pad Q1 are connected to pad d on the carrier board through wire m1 and grounded, that is, the pressure sensor and temperature sensor share a common ground wire. Pad e supplies power to the NTC temperature sensor through a wire.
其中，载板10的长度不超过6mm，可以是2-6mm，载板10的最大宽度不超过1.5mm，可以是0.2-1.5mm，载板10的厚度不超过0.5mm，可以是0.1mm-0.5mm之间，以满足将载板10以及载板10上的压力传感器、温度传感器封装在细小狭窄的空间的要求。载板10可以是柔性电路板、硬电路板或者陶瓷板。The length of the carrier 10 does not exceed 6 mm, but may be 2-6 mm, the maximum width of the carrier 10 does not exceed 1.5 mm, but may be 0.2-1.5 mm, and the thickness of the carrier 10 does not exceed 0.5 mm, but may be between 0.1 mm and 0.5 mm, so as to meet the requirement of packaging the carrier 10 and the pressure sensor and temperature sensor on the carrier 10 in a small and narrow space. The carrier 10 may be a flexible circuit board, a hard circuit board or a ceramic board.
其中，传感器中第一压敏硅薄膜电阻R1以及第二压敏硅薄膜电阻R2组成一个惠斯通半桥，R1、R2两个可变压敏硅片薄膜电阻通过导线与外接的定值电阻R3、R4连接成可测量压力的的惠斯顿电桥。第一压敏电阻R1以及第二压敏电阻R2在人体内压力作用下，电阻值发生变化，从而使得第一压敏电阻R1的第二端即焊盘Q2或焊盘b的电压值发生变化，第二压敏电阻R2的第二端即焊盘Q3或焊盘c的电压值发生变化。通过焊盘b引出一根导电线m2，通过焊盘c引出一根导电线m3，在这两根导电线m1和m2之间连接第一电压计V1。压力信号采样电路通过电压值V1，可以测量人体内组织或腔道内压力的大小。Among them, the first varistor silicon thin film resistor R1 and the second varistor silicon thin film resistor R2 in the sensor form a Wheatstone half-bridge, and the two variable varistor silicon thin film resistors R1 and R2 are connected to the external fixed resistors R3 and R4 through wires to form a Wheatstone bridge that can measure pressure. Under the pressure in the human body, the resistance values of the first varistor R1 and the second varistor R2 change, so that the voltage value of the second end of the first varistor R1, that is, the pad Q2 or the pad b, changes, and the voltage value of the second end of the second varistor R2, that is, the pad Q3 or the pad c, changes. A conductive wire m2 is led out through the pad b, and a conductive wire m3 is led out through the pad c, and a first voltmeter V1 is connected between the two conductive wires m1 and m2. The pressure signal sampling circuit can measure the pressure in the tissue or cavity of the human body through the voltage value V1.
热敏电阻R5在不同的温度下，电阻值的大小不同。具体地，当温度升高时，热敏电阻R5的电阻值变小，当温度降低时，热敏电阻R5的电阻值变大。热敏电阻感应人体内温度变化，热敏电阻R5的电阻值变化，导致热敏电阻R5的焊盘d、e间的电压值会发生变化。温度信号采样电路通过采集热敏电阻R5的焊盘的d、e间的电压值即导线m4与m5间的电压值V3，可以测量温度的大小。其中，热敏电阻R5可以是柱状电极的NTC热敏电阻，也可以是上下电极的片状NTC热敏电阻。The thermistor R5 has different resistance values at different temperatures. Specifically, when the temperature rises, the resistance value of thermistor R5 decreases, and when the temperature decreases, the resistance value of thermistor R5 increases. The thermistor senses the temperature change in the human body, and the resistance value of thermistor R5 changes, causing the voltage value between the pads d and e of thermistor R5 to change. The temperature signal sampling circuit can measure the temperature by collecting the voltage value between the pads d and e of the thermistor R5, that is, the voltage value V3 between the wires m4 and m5. Among them, the thermistor R5 can be an NTC thermistor with columnar electrodes, or it can be a sheet NTC thermistor with upper and lower electrodes.
其中，电源VCC1与电源VCC2可以是同一个激励电源的正极，也可以是不同激励电源的正极。The power source VCC1 and the power source VCC2 may be the positive pole of the same excitation power source, or may be the positive poles of different excitation power sources.
本公开实施例图2中，虚线框1中的压力传感器以及温度传感器同在载板10上，而定值电阻R3、R4、R6以及第一电压计V1和第三电压计V3均不在载板10上。其中，温度传感器中的热敏电阻为柱状或片状电极的NTC热敏电阻。In FIG. 2 of the embodiment of the present disclosure, the pressure sensor and the temperature sensor in the dotted frame 1 are both on the carrier 10, while the fixed resistors R3, R4, R6 and the first voltmeter V1 and the third voltmeter V3 are not on the carrier 10. The thermistor in the temperature sensor is an NTC thermistor with a columnar or sheet electrode.
实施例2Example 2
在第二个实施例中，请参阅图3和图4，本公开实施例提供一种测量人体内压力和温度的微型传感器件，微型传感器件通过连接信号检测电路，信号检测电路包括压力信号采样电路以及温度信号采样电路；微型传感器件包括载板10、布局在载板10上的压力传感器11、压力感应面12以及温度传感器13；In the second embodiment, please refer to FIG. 3 and FIG. 4 , the embodiment of the present disclosure provides a method for measuring pressure and temperature in a human body. The micro sensor device is connected to a signal detection circuit, the signal detection circuit includes a pressure signal sampling circuit and a temperature signal sampling circuit; the micro sensor device includes a carrier 10, a pressure sensor 11 arranged on the carrier 10, a pressure sensing surface 12 and a temperature sensor 13;
载板上分别镀有焊盘a、b、c、d、e，其中焊盘d为7字形或q字型异型焊盘，焊盘e为T字形或P字形异型焊盘。他们分别简称为载板焊盘a、b、c、d、e。压力传感器上有焊盘Q4、Q5、Q6、Q7。其中载板焊盘a、b、c分别与传感器焊盘Q4、Q5、Q6通过超声波焊接工艺实现导线焊接。载板焊盘d、e分别为温度传感器电极的连接焊盘。The carrier is plated with pads a, b, c, d, and e, respectively, where pad d is a 7-shaped or q-shaped special-shaped pad, and pad e is a T-shaped or P-shaped special-shaped pad. They are referred to as carrier pads a, b, c, d, and e, respectively. There are pads Q4, Q5, Q6, and Q7 on the pressure sensor. The carrier pads a, b, and c are respectively connected to the sensor pads Q4, Q5, and Q6 by ultrasonic welding. The carrier pads d and e are the connection pads of the temperature sensor electrodes.
在本公开实施例中，压力传感器11的压力感应面12上还包括第三压敏硅薄膜电阻R3以及第四压敏硅薄膜电阻R4；硅薄膜压敏电阻R1、R2、R3以及R4共同组成惠斯通全桥。其中，第一压敏电阻R1与第三压敏电阻R3串联，第二压敏电阻R2与第四压敏电阻R4串联。这四个压敏电阻均可以感应人体内压力大小，在压力作用下，其电阻值均可发生变化，测量的灵敏度也比惠斯顿半桥结构更高。In the disclosed embodiment, the pressure sensing surface 12 of the pressure sensor 11 also includes a third piezoresistive silicon thin film resistor R3 and a fourth piezoresistive silicon thin film resistor R4; the silicon thin film piezoresistors R1, R2, R3 and R4 together form a Wheatstone full bridge. Among them, the first piezoresistors R1 and the third piezoresistors R3 are connected in series, and the second piezoresistors R2 and the fourth piezoresistors R4 are connected in series. These four piezoresistors can all sense the pressure in the human body, and their resistance values can all change under the action of pressure, and the measurement sensitivity is also higher than that of the Wheatstone half-bridge structure.
在此实施例中，压力信号采样电路包括第二电压计V2；第二电压计V2的一端与第一压敏电阻R1的第二端即焊盘Q4连接，第二电压计V2的另一端与第二压敏电阻R2的第二端即焊盘Q6连接。In this embodiment, the pressure signal sampling circuit includes a second voltmeter V2; one end of the second voltmeter V2 is connected to the second end of the first varistor R1, namely the pad Q4, and the other end of the second voltmeter V2 is connected to the second end of the second varistor R2, namely the pad Q6.
在本公开实施例中，电源VCC1提供电压，通过第二电压计V2测量第一压敏电阻R1的第二端即焊盘Q4与第二压敏电阻R2的第二端即焊盘Q6之间的电压差，根据电压差，可以获得压力传感器感应的压力大小。In the disclosed embodiment, the power supply VCC1 provides voltage, and the voltage difference between the second end of the first varistor R1, i.e., the pad Q4, and the second end of the second varistor R2, i.e., the pad Q6, is measured by the second voltmeter V2. The pressure sensed by the pressure sensor can be obtained based on the voltage difference.
在本公开实施例中，虚线框2中的压力传感器11以及温度传感器13同在载板10上，而定值电阻R6、第二电压计V2和第三电压计V3均不在载板10上。其中，温度传感器13中的热敏电阻为柱状或片状NTC热敏电阻。In the disclosed embodiment, the pressure sensor 11 and the temperature sensor 13 in the dotted frame 2 are both on the carrier 10, while the fixed resistor R6, the second voltmeter V2 and the third voltmeter V3 are not on the carrier 10. The thermistor in the temperature sensor 13 is a columnar or sheet NTC thermistor.
具体地，载板10通过电镀工艺镀有焊盘a、b、c、d、e，通过焊盘a引出一根外引导电线m1，通过焊盘b引出一根外引导电线m2与外部电源VCC1连接，通过焊盘c引出一根外引导电线m3，在这两根外引导电线m1和m3之间连接第二电压计V2。Specifically, the carrier 10 is plated with pads a, b, c, d, and e through an electroplating process. An external guide wire m1 is led out through pad a, an external guide wire m2 is led out through pad b and connected to an external power supply VCC1, an external guide wire m3 is led out through pad c, and a second voltmeter V2 is connected between the two external guide wires m1 and m3.
在第二个实施例中，温度信号采样电路包括定值电阻R6以及第三电压计V3；热敏电阻R5的第二端即焊盘e与定值电阻R6通过导线m5连接，定值电阻R6的另一端与电源VCC2连接，第三电压计V3两端分别连接导线m4与m5。In the second embodiment, the temperature signal sampling circuit includes a fixed resistor R6 and a third voltmeter V3; the second end of the thermistor R5, namely the pad e, is connected to the fixed resistor R6 through a wire m5, the other end of the fixed resistor R6 is connected to the power supply VCC2, and the two ends of the third voltmeter V3 are respectively connected to wires m4 and m5.
具体地，载板10上镀有焊盘d和e，通过焊盘d引出一根导线m4接地GND，通过焊盘e引出一根导线m5经定值电阻R6与外部电源VCC2连接。其中，电源VCC2与电源VCC1可以是同一个激励电源的正极，也可以是不同激励电源的正极。Specifically, pads d and e are plated on the carrier 10, a wire m4 is led out through pad d to ground GND, and a wire m5 is led out through pad e to connect to the external power supply VCC2 via a fixed resistor R6. The power supply VCC2 and the power supply VCC1 can be the positive pole of the same excitation power supply or the positive poles of different excitation power supplies.
在本公开实施例中，热敏电阻R5在温度的作用下，电阻值发生变化，导致流经热敏电阻R5与定值电阻R6的电流发生变化。通过第三电压计V3测量热敏电阻R5两端即导线m4与m5之间的电压值，可以获得温度传感器感应的温度变化。In the embodiment of the present disclosure, the resistance value of thermistor R5 changes under the influence of temperature, resulting in a change in the current flowing through thermistor R5 and fixed resistor R6. The third voltmeter V3 is used to measure the current at both ends of the thermistor R5, i.e., the wire The voltage value between m4 and m5 can obtain the temperature change sensed by the temperature sensor.
具体封装工艺流程：Specific packaging process flow:
请参阅图5，其为本公开一个实施例提供的测量人体内压力和温度的微型传感器的封装工艺的流程示意图。本公开实施例提供的测量人体内压力温度的微型传感器件的封装工艺，包括步骤S1～S5，具体如下：Please refer to FIG5, which is a schematic diagram of a process flow of a micro sensor for measuring pressure and temperature in the human body provided by an embodiment of the present disclosure. The process flow of a micro sensor for measuring pressure and temperature in the human body provided by an embodiment of the present disclosure includes steps S1 to S5, which are as follows:
S1：在载板上镀上若干个焊盘；其中，若干个传感器焊盘与若干个载板焊盘之间按照预设连接关系通过导电线连接；所有在载板电镀的若干个焊盘，可镀铜、镀金、镀锡或者镀银以实现对导电线与焊盘的焊接牢固度。S1: a plurality of pads are plated on a carrier; wherein a plurality of sensor pads are connected to a plurality of carrier pads through conductive wires according to a preset connection relationship; all the pads plated on the carrier can be plated with copper, gold, tin or silver to achieve a strong welding connection between the conductive wires and the pads.
载板焊盘布局的方案以与两个传感器上的焊盘最近及最方便焊接的方式为原则。方便传感器焊盘与若干个载板焊盘按照预设的连接关系通过导电线连接。The layout of the substrate pads is based on the principle of being closest to the pads on the two sensors and being most convenient for welding, so that the sensor pads are conveniently connected to several substrate pads through conductive wires according to a preset connection relationship.
载板焊盘a、b、c可以用于连接压力传感器的焊盘、焊盘d、e用于连接温度传感器的电极。The pads a, b, and c of the carrier board can be used to connect the pads of the pressure sensor, and the pads d and e are used to connect the electrodes of the temperature sensor.
S2：采用固晶工艺将压力传感器固定在载板上，采用超声波焊接工艺将压力传感器焊盘与相应的载板焊盘通过导线焊接；S2: The pressure sensor is fixed on the carrier board by using a die bonding process, and the pressure sensor pad is welded to the corresponding carrier board pad by using an ultrasonic welding process through a wire;
S3:将温度传感器固定在载板上，以使温度传感器的电极与相应的载板焊盘连接。包括S301、S302，具体步骤如下：S3: Fix the temperature sensor on the carrier board so that the electrodes of the temperature sensor are connected to the corresponding pads of the carrier board. This includes S301 and S302, and the specific steps are as follows:
S301：若热敏电阻为两端柱状电极的NTC热敏电阻，采用smt贴片工艺将温度传感器固定在载板上，以使热敏电阻的两端电极分别与两端电极相应的两个载板焊盘连接。具体地，热敏电阻的一端电极与焊盘d连接，热敏电阻的另一端电极与焊盘e连接。S301: If the thermistor is an NTC thermistor with columnar electrodes at both ends, the temperature sensor is fixed on the carrier board by using the SMT patch process, so that the electrodes at both ends of the thermistor are respectively connected to the two carrier board pads corresponding to the electrodes at both ends. Specifically, one end electrode of the thermistor is connected to pad d, and the other end electrode of the thermistor is connected to pad e.
请参阅图1，载板上镀有焊盘a、b、c，焊盘d、e，压力传感器上有焊盘Q1、Q2、Q3。通过超声波焊接工艺分别将焊盘a与压力传感器的焊盘Q1通过导线连接，将焊盘b与压力传感器的焊盘Q2连接，将焊盘c与压力传感器的焊盘Q3连接，焊盘a通过导线m1与焊盘d连接。Please refer to Figure 1. The carrier board is plated with pads a, b, c, d, e, and the pressure sensor is provided with pads Q1, Q2, and Q3. Pad a is connected to pad Q1 of the pressure sensor through a wire, pad b is connected to pad Q2 of the pressure sensor, pad c is connected to pad Q3 of the pressure sensor, and pad a is connected to pad d through a wire m1 by ultrasonic welding.
S302：若热敏电阻为上下电极的片状NTC热敏电阻，采用银浆粘结工艺将温度传感器的下端电极固定在载板上，以使热敏电阻的下端电极与之相连接的焊盘d连接，采用超声波焊接工艺将热敏电阻的上端电极与焊盘e通过导线连接。S302: If the thermistor is a sheet-type NTC thermistor with upper and lower electrodes, a silver paste bonding process is used to fix the lower electrode of the temperature sensor on the carrier board so that the lower electrode of the thermistor is connected to the pad d connected thereto, and an ultrasonic welding process is used to connect the upper electrode of the thermistor to the pad e through a wire.
请参阅图3，载板上分别镀有焊盘a、b、c、d、e，压力传感器上有焊盘Q4、Q5、Q6、Q7。通过导线超声波焊接工艺分别将焊盘a与压力传感器的焊盘Q4连接，焊盘b与压力传感器的焊盘Q5连接，焊盘c与压力传感器的焊盘Q6连接，焊盘d与压力传感器的焊盘Q7连接。Please refer to Figure 3. The carrier board is plated with pads a, b, c, d, and e, and the pressure sensor is provided with pads Q4, Q5, Q6, and Q7. Pad a is connected to pad Q4 of the pressure sensor, pad b is connected to pad Q5 of the pressure sensor, pad c is connected to pad Q6 of the pressure sensor, and pad d is connected to pad Q7 of the pressure sensor by means of wire ultrasonic welding.
S4:通过压力传感器和温度传感器焊盘和导线之间的焊接，实现两者共用地线。S4: By welding the pads and wires of the pressure sensor and temperature sensor, a common ground wire is achieved for both.
将导电线m4作为接地线，因此，压力传感器和温度传感器实现共地线。采用共地线连接，可以使微组装更加容易，压力传感器和温度传感器的电气连接，可以减少一根外引导电线的焊接，使得狭小的载板上更利于布局焊盘。Conductive wire m4 is used as the ground wire, so the pressure sensor and temperature sensor share the same ground wire. The electrical connection of the pressure sensor and the temperature sensor can reduce the welding of an external guide wire, making it easier to layout the pads on the narrow carrier board.
S5:通过在载板焊盘焊接合适的外接导线m1、m2、m3、m4、m5，所有导线通过粘合工艺实现绝缘并线，并通过所有导线与传感器接口电路的焊接，从而实现传感器信号与主机系统的通讯。S5: By welding appropriate external wires m1, m2, m3, m4, and m5 on the substrate pads, all the wires are insulated and connected together through a bonding process, and all the wires are welded to the sensor interface circuit to achieve communication between the sensor signal and the host system.
医用微型传感器使用时需要通过医护人员操作将其短期或长期植入人体内进行测量。具体地，将微型传感器件封装在医疗器械部件内，可以封装在细小的套管内，或者镶嵌在细小的导丝或者导管壁上，以能达到套管、导丝或导管壁能达到的人体内器官或腔道的测量部位。通过微型传感器件上的压力传感器感应器官部位的压力变化，通过微型传感器件上的温度传感器感应器官部位的温度变化，有效的监测该器官或腔道部位的压力和温度，可以反应该器官部位的病情进展，譬如血管或者组织内的水肿、感染、梗塞情况。When used, medical microsensors need to be implanted in the human body for short or long term for measurement by medical staff. Specifically, the microsensor device is encapsulated in a medical device component, which can be encapsulated in a small cannula, or embedded in a small guidewire or catheter wall, so as to reach the measurement site of the organ or cavity in the human body that can be reached by the cannula, guidewire or catheter wall. The pressure sensor on the microsensor device senses the pressure change of the organ part, and the temperature sensor on the microsensor device senses the temperature change of the organ part, effectively monitoring the pressure and temperature of the organ or cavity part, which can reflect the progression of the disease in the organ part, such as edema, infection, and infarction in the blood vessels or tissues.
本公开实施例通过将载板作为压力传感器、温度传感器和外接导线之间的转接载体，可以为半导体封装使用的超声波焊接设备和固晶设备提供物理上的固定作用，同时也起到转接导线之间提供了一个可加工的对象，从而为同时在同一载板上微组装压力传感器以及温度传感器提供了可组装的平台。固定有压力传感器以及温度传感器的载板，再进一步封装在套管部件内，提供了可固定的平台，增加了加工的可靠性。如果不使用载板，微小的压力传感器以及温度传感器，并不适合直接焊接导电线，直接焊接，导致良品率低。同时，独立的压力传感器和独立的温度传感器，组装在一起难度大，良品率低，不易组装在细小狭窄的空间。The disclosed embodiment uses the carrier as a transfer carrier between the pressure sensor, the temperature sensor and the external wires, which can provide a physical fixation effect for the ultrasonic welding equipment and the die bonding equipment used in the semiconductor packaging, and also provides a processable object between the transfer wires, thereby providing an assembleable platform for micro-assembling the pressure sensor and the temperature sensor on the same carrier. The carrier with the pressure sensor and the temperature sensor fixed is further encapsulated in the sleeve component, which provides a fixable platform and increases the reliability of the processing. If the carrier is not used, the tiny pressure sensor and the temperature sensor are not suitable for direct welding of the conductive wires, and direct welding results in a low yield rate. At the same time, it is difficult to assemble the independent pressure sensor and the independent temperature sensor together, the yield rate is low, and it is not easy to assemble in a small and narrow space.
本公开实施例中微型传感器件制造过程中所涉及的超声波焊接工艺、SMT贴片工艺、银浆粘结工艺以及电阻焊工艺，具有用料节省、污染少的特点，适合医用超微传感器器件的后续加工。The ultrasonic welding process, SMT patch process, silver paste bonding process and resistance welding process involved in the manufacturing process of the micro sensor device in the embodiment of the present disclosure have the characteristics of saving materials and less pollution, and are suitable for the subsequent processing of medical ultra-micro sensor devices.
以上所述，仅是本公开的较佳实施例而已，并非对本公开作任何形式上的限制，故凡是未脱离本公开技术方案内容，依据本公开的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本公开技术方案的保护范围内。The above description is only a preferred embodiment of the present disclosure and does not constitute any form of limitation to the present disclosure. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure shall still fall within the protection scope of the technical solution of the present disclosure.
本公开涉及一种测量人体组织内压力和温度的微型传感器及其封装工艺，通过在载板上布局压力传感器以及温度传感器，压力信号采样模块根据压力传感器上单晶硅和多晶硅压敏薄膜电阻的电阻值的大小变化，来检测压力信号，实现对压力的测量，温度信号采样模块根据温度传感器上热敏电阻的电阻值的大小变化，来检测温度信号。压力传感器与温度传感器共用接地线，实现了在载板上将压力传感器以及温度传感器进行微组装，提高了微型传感器件的便利度以及减少了封装体积。The present disclosure relates to a micro sensor for measuring pressure and temperature in human tissue and its packaging process. By arranging a pressure sensor and a temperature sensor on a carrier board, a pressure signal sampling module detects a pressure signal according to the change in the resistance value of a single-crystal silicon and polycrystalline silicon piezoresistive thin film resistor on the pressure sensor, thereby realizing the measurement of pressure. A temperature signal sampling module detects a temperature signal according to the change in the resistance value of a thermistor on the temperature sensor. The pressure sensor and the temperature sensor share a ground wire, thereby realizing micro-assembly of the pressure sensor and the temperature sensor on the carrier board, improving the convenience of the micro sensor device and reducing the packaging volume.
此外，可以理解的是，本公开的测量人体组织内压力和温度的微型传感器及其封装工艺是可以重现的，并且可以用在多种工业应用中。例如，本公开的测量人体组织内压力和温度的微型传感器及其封装工艺可以用于传感器以及医疗设备技术领域。In addition, it is understood that the disclosed microsensor for measuring pressure and temperature in human tissue and its packaging process are reproducible and can be used in a variety of industrial applications. For example, the disclosed microsensor for measuring pressure and temperature in human tissue and its packaging process can be used in the field of sensor and medical device technology.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311036178.7ACN116919352A (en) | 2023-08-16 | 2023-08-16 | Micro-sensors that measure pressure and temperature within human tissue and their packaging processes |
| CN202311036178.7 | 2023-08-16 |
| Publication Number | Publication Date |
|---|---|
| WO2025035600A1true WO2025035600A1 (en) | 2025-02-20 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2023/127988PendingWO2025035600A1 (en) | 2023-08-16 | 2023-10-30 | Micro-sensor for measuring pressure and temperature in human tissue and packaging process therefor |
| Country | Link |
|---|---|
| CN (1) | CN116919352A (en) |
| WO (1) | WO2025035600A1 (en) |
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