本申请要求于2022年11月23日提交中国专利局、申请号为202211478366.0、申请名称为“电子设备以及电子设备的产线组装方法、系统及介质”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application filed with the China Patent Office on November 23, 2022, with application number 202211478366.0 and application name “Electronic device and production line assembly method, system and medium for electronic device”, all contents of which are incorporated by reference in this application.
本申请涉及通信技术领域，特别涉及一种电子设备以及电子设备的产线组装方法、系统及介质。The present application relates to the field of communication technology, and in particular to an electronic device and a production line assembly method, system and medium for the electronic device.
当前折叠手机的天线主要分布在主屏上，部分频段分布在副屏上。然而，随着WIFI及蜂窝4*4多进多出(multiple input multiple output，MIMO)的普及，天线的频段越来越多，主屏能承载天线的空间越来越少，为了提升性能，越来越多的天线分布在副屏上。然而，如图1所示，射频前端一般分布在主屏上，副屏上的天线均需要缆线(cable)与主屏上的射频前端进行互联，因此会增加手机的厚度或增加射频插损，降低整机的天线辐射(Over The Air，OTA)性能。The antennas of current foldable phones are mainly distributed on the main screen, and some frequency bands are distributed on the secondary screen. However, with the popularity of WIFI and cellular 4*4 multiple input multiple output (MIMO), the frequency bands of antennas are increasing, and the space on the main screen to carry antennas is decreasing. In order to improve performance, more and more antennas are distributed on the secondary screen. However, as shown in Figure 1, the RF front end is generally distributed on the main screen, and the antennas on the secondary screen need cables to be interconnected with the RF front end on the main screen, which will increase the thickness of the phone or increase the RF insertion loss, reducing the antenna radiation (Over The Air, OTA) performance of the entire machine.
发明内容Summary of the invention
本申请实施例中提供一种电子设备以及电子设备的产线组装方法、系统及介质。The embodiments of the present application provide an electronic device and a production line assembly method, system and medium for the electronic device.
第一方面，本申请实施例提供了一种电子设备，电子设备包括第一主板、第二主板、数控前端、基带和蜂窝射频前端；第一主板和第二主板通信连接；数控前端和基带设于第一主板和第二主板中的其中一个主板，蜂窝射频前端设于第一主板和第二主板中的另一个主板。In a first aspect, an embodiment of the present application provides an electronic device, which includes a first main board, a second main board, a numerical control front end, a baseband and a cellular radio frequency front end; the first main board and the second main board are communicatively connected; the numerical control front end and the baseband are arranged on one of the first main board and the second main board, and the cellular radio frequency front end is arranged on the other of the first main board and the second main board.
在本申请实施例中，当第一主板为主板时，第二主板为副板；当第一主板为副板时，第二主板为主板。数控(Numerical Control，NC)前端包括WIFI等，基带包括电源管理单元(Power Management Unit，PMU)或晶体振荡器(XO)或系统级芯片(System on Chip，SOC)等。In the embodiment of the present application, when the first main board is the main board, the second main board is the secondary board; when the first main board is the secondary board, the second main board is the main board. The numerical control (NC) front end includes WIFI, etc., and the baseband includes a power management unit (Power Management Unit, PMU) or a crystal oscillator (XO) or a system-on-chip (System on Chip, SOC), etc.
可以理解，第一主板和第二主板可以通过柔性电路板(Flexible Printed Circuit，FPC)连接。It can be understood that the first main board and the second main board can be connected via a flexible printed circuit (FPC).
本申请实施例提供的电子设备通过将数控前端和基带与蜂窝射频前端分离，即将蜂窝射频前端直接设置在第一主板或第二主板上，使第一主板或第二主板上的天线无需再通过FPC与射频前端连接，可以直接在第一主板或第二主板上连接，如此，可以有效降低连接第一主板或第二主板的天线与蜂窝射频前端的FPC的数量，进而显著降低了电子设备的厚度，并且由于FPC数量的减少，降低了射频插损，提高了整机的OTA性能。The electronic device provided in the embodiment of the present application separates the CNC front end and the baseband from the cellular RF front end, that is, directly sets the cellular RF front end on the first main board or the second main board, so that the antenna on the first main board or the second main board no longer needs to be connected to the RF front end through an FPC, and can be directly connected on the first main board or the second main board. In this way, the number of FPCs connecting the antenna of the first main board or the second main board and the cellular RF front end can be effectively reduced, thereby significantly reducing the thickness of the electronic device. In addition, due to the reduction in the number of FPCs, the RF insertion loss is reduced, and the OTA performance of the whole machine is improved.
在一种可能的实现中，第一主板和第二主板在组装为整机前，第一主板的第一校准参数存储于第一主板，第二主板的第二校准参数存储于服务器或者第二主板；第一主板和第二主板在组装为整机后，第一校准参数、第二校准参数存储于第一主板。In one possible implementation, before the first mainboard and the second mainboard are assembled into a complete machine, the first calibration parameters of the first mainboard are stored in the first mainboard, and the second calibration parameters of the second mainboard are stored in a server or the second mainboard; after the first mainboard and the second mainboard are assembled into a complete machine, the first calibration parameters and the second calibration parameters are stored in the first mainboard.
其中，当第一校准参数为主板校准参数时，第二校准参数为副板校准参数；当第一校准参数为副板校准参数时，第二校准参数为主板校准参数，服务器可以相当于本申请实施例的云端。Among them, when the first calibration parameter is the mainboard calibration parameter, the second calibration parameter is the sub-board calibration parameter; when the first calibration parameter is the sub-board calibration parameter, the second calibration parameter is the mainboard calibration parameter, and the server can be equivalent to the cloud in the embodiment of the present application.
在本申请实施例中，将数控前端和基带对应的校准参数与蜂窝射频前端对应的校准参数分开存储，即分开存储主板校准参数与副板校准参数，如此，可以在主板与任一副板组装后获取该副板的副板校准参数，并存入主板，实现了即使此时与主板匹配的副板不是主板中存储的副板校准参数对应的副板，主板也可以获取到该副板的副板校准参数，即此时主板与副板之间可以不存在对应关系，因此当主板或副板出现故障时，只需要更换出现故障的板即可，降低了维修成本。In an embodiment of the present application, the calibration parameters corresponding to the numerical control front end and the baseband are stored separately from the calibration parameters corresponding to the cellular RF front end, that is, the mainboard calibration parameters and the sub-board calibration parameters are stored separately. In this way, the sub-board calibration parameters of the sub-board can be obtained after the mainboard is assembled with any sub-board, and stored in the mainboard, so that even if the sub-board matched with the mainboard at this time is not the sub-board corresponding to the sub-board calibration parameters stored in the mainboard, the mainboard can also obtain the sub-board calibration parameters of the sub-board, that is, there may be no corresponding relationship between the mainboard and the sub-board at this time. Therefore, when the mainboard or the sub-board fails, only the faulty board needs to be replaced, thereby reducing the maintenance cost.
第二方面，本申请实施例提供了一种电子设备的产线组装方法：在第一主板和第二主板中的其中一个主板安装数控前端和基带，在第一主板和第二主板中的另一个主板安装蜂窝射频前端；获取第一主板的第一校准参数、第二主板的第二校准参数；将第一校准参数上传至第一主板，将第二校准参数上传至服务器或者第二主板；组装第一主板和第二主板，并将第二校准参数加载至第一主板。In a second aspect, an embodiment of the present application provides a production line assembly method for an electronic device: installing a CNC front end and a baseband on one of a first mainboard and a second mainboard, and installing a cellular RF front end on the other of the first mainboard and the second mainboard; obtaining a first calibration parameter of the first mainboard and a second calibration parameter of the second mainboard; uploading the first calibration parameter to the first mainboard, and uploading the second calibration parameter to a server or a second mainboard; assembling the first mainboard and the second mainboard, and loading the second calibration parameter to the first mainboard.
其中，服务器可以相当于本申请实施例的云端。第一校准参数可以为第一主板上安装的硬件对应的校准参数，第二校准参数可以为第二主板上安装的硬件对应的校准参数，例如，当第一主板安装数控前端和基带，第二主板安装蜂窝射频前端时，第一校准参数包括：XO校准参数等，第二校准参数包括射频(Radio Frequency，RF)校准参数等。可以理解，在电子设备的正常使用过程中，中央处理器(central processing unit，CPU)会根据第一主板中存储的第一校准参数、第二校准参数以及一定的算法对需要补偿的参数进行补偿，以保证电子设备各功能的正常使用。The server may be equivalent to the cloud in the embodiment of the present application. The first calibration parameter may be a calibration parameter corresponding to the hardware installed on the first motherboard, and the second calibration parameter may be a calibration parameter corresponding to the hardware installed on the second motherboard. For example, when the first motherboard is equipped with a CNC front When the cellular radio frequency front end is installed on the second mainboard, the first calibration parameters include: XO calibration parameters, etc., and the second calibration parameters include radio frequency (RF) calibration parameters, etc. It can be understood that during the normal use of the electronic device, the central processing unit (CPU) will compensate the parameters that need to be compensated according to the first calibration parameters, the second calibration parameters and a certain algorithm stored in the first mainboard to ensure the normal use of various functions of the electronic device.
本申请实施例将数控前端和基带对应的校准参数与蜂窝射频前端对应的校准参数分开存储，即分开存储主板校准参数(例如数控前端、基带对应的校准参数)与副板校准参数(例如蜂窝射频前端对应的校准参数)，如此，可以在主板与任一副板组装后获取该副板的副板校准参数，并存入主板，实现了即使此时与主板匹配的副板不是主板中存储的副板校准参数对应的副板，主板也可以获取到该副板的副板校准参数，即此时主板与副板之间可以不存在对应关系，因此当主板或副板出现故障时，只需要更换出现故障的板即可，降低了维修成本。The embodiment of the present application stores the calibration parameters corresponding to the numerical control front end and the baseband separately from the calibration parameters corresponding to the cellular RF front end, that is, the mainboard calibration parameters (such as the calibration parameters corresponding to the numerical control front end and the baseband) and the sub-board calibration parameters (such as the calibration parameters corresponding to the cellular RF front end) are stored separately. In this way, the sub-board calibration parameters of the sub-board can be obtained after the mainboard is assembled with any sub-board, and stored in the mainboard, so that even if the sub-board matched with the mainboard at this time is not the sub-board corresponding to the sub-board calibration parameters stored in the mainboard, the mainboard can also obtain the sub-board calibration parameters of the sub-board, that is, there may be no corresponding relationship between the mainboard and the sub-board at this time. Therefore, when the mainboard or the sub-board fails, only the faulty board needs to be replaced, thereby reducing the maintenance cost.
在一种可能的实现中，在第二校准参数被上传至服务器的情况下；将第二校准参数加载至第一主板，包括：将第二校准参数从服务器加载至第一主板。In a possible implementation, when the second calibration parameter is uploaded to the server; loading the second calibration parameter to the first mainboard includes: loading the second calibration parameter from the server to the first mainboard.
在一种可能的实现中，将第二校准参数从服务器加载至第一主板包括：基于第二主板的标志信息从服务器加载第二校准参数至第一主板。In a possible implementation, loading the second calibration parameter from the server to the first mainboard includes: loading the second calibration parameter from the server to the first mainboard based on the identification information of the second mainboard.
在一种可能的实现中，标志信息包括二维码、条形码、芯片标志位。In a possible implementation, the identification information includes a QR code, a barcode, or a chip identification bit.
在一种可能的实现中，在第二校准参数被上传至第二主板的情况下；将第二校准参数加载至第一主板包括：将第二校准参数从第二主板加载至第一主板。In a possible implementation, when the second calibration parameters are uploaded to the second mainboard; loading the second calibration parameters to the first mainboard includes: loading the second calibration parameters from the second mainboard to the first mainboard.
在一种可能的实现中，将第二校准参数从第二主板加载至第一主板包括：通过第一信令将第二校准参数从第二主板加载至第一主板。In a possible implementation, loading the second calibration parameter from the second main board to the first main board includes: loading the second calibration parameter from the second main board to the first main board through a first signaling.
其中，第一信令可以相当于本申请实施例的加载副板校准参数的指令。Among them, the first signaling can be equivalent to the instruction for loading the calibration parameters of the secondary board in the embodiment of the present application.
在一种可能的实现中，当在第一主板安装数控前端和基带，在第二主板安装蜂窝射频前端时，第一校准参数包括晶体振荡器校准参数，第二校准参数包括射频校准参数；当在第一主板安装蜂窝射频前端，在第二主板安装数控前端和基带时，第一校准参数包括射频校准参数，第二校准参数包括晶体振荡器校准参数。In one possible implementation, when a CNC front end and a baseband are installed on a first mainboard and a cellular RF front end is installed on a second mainboard, the first calibration parameters include crystal oscillator calibration parameters, and the second calibration parameters include RF calibration parameters; when a cellular RF front end is installed on the first mainboard and a CNC front end and a baseband are installed on the second mainboard, the first calibration parameters include RF calibration parameters, and the second calibration parameters include crystal oscillator calibration parameters.
在一种可能的实现中，第一主板与第二主板通过柔性电路板连接。In a possible implementation, the first main board is connected to the second main board via a flexible circuit board.
在一种可能的实现中，数控前端包括系统级芯片或闪存或电源管理单元。In one possible implementation, the digital control front end includes a system-on-chip or a flash memory or a power management unit.
第三方面，本申请实施例提供了一种产线组装系统，包括：安装单元，用于在第一主板和第二主板中的其中一个主板安装数控前端和基带，在第一主板和第二主板中的另一个主板安装蜂窝射频前端；获取单元，用于获取第一主板的第一校准参数、第二主板的第二校准参数；校准单元，将第一校准参数上传至第一主板，将第二校准参数上传至服务器或者第二主板；组装单元，用于组装第一主板和第二主板，并将第二校准参数加载至第一主板。In a third aspect, an embodiment of the present application provides a production line assembly system, including: an installation unit, used to install a CNC front end and a baseband on one of a first main board and a second main board, and to install a cellular RF front end on the other of the first main board and the second main board; an acquisition unit, used to obtain a first calibration parameter of the first main board and a second calibration parameter of the second main board; a calibration unit, which uploads the first calibration parameter to the first main board, and uploads the second calibration parameter to a server or a second main board; an assembly unit, used to assemble the first main board and the second main board, and load the second calibration parameter to the first main board.
可以理解，在电子设备的正常使用过程中，CPU会根据第一主板中存储的第一校准参数和第二校准参数以及一定的算法对需要补偿的参数进行补偿，以保证电子设备各功能的正常使用。It can be understood that during normal use of the electronic device, the CPU will compensate the parameters that need to be compensated according to the first calibration parameters and the second calibration parameters stored in the first mainboard and a certain algorithm to ensure normal use of various functions of the electronic device.
本申请实施例采用了将数控前端和基带对应的校准参数与蜂窝射频前端对应的校准参数分开存储，即分开存储主板校准参数与副板校准参数，如此，可以在主板与任一副板组装后获取该副板的副板校准参数，并存入主板，实现了即使此时与主板匹配的副板不是主板中存储的副板校准参数对应的副板，主板也可以获取到该副板的副板校准参数，即此时主板与副板之间可以不存在对应关系，因此当主板或副板出现故障时，只需要更换出现故障的板即可，降低了维修成本。The embodiment of the present application adopts the method of separately storing the calibration parameters corresponding to the numerical control front end and the baseband and the calibration parameters corresponding to the cellular RF front end, that is, separately storing the mainboard calibration parameters and the sub-board calibration parameters. In this way, the sub-board calibration parameters of the sub-board can be obtained after the mainboard is assembled with any sub-board, and stored in the mainboard, so that even if the sub-board matched with the mainboard at this time is not the sub-board corresponding to the sub-board calibration parameters stored in the mainboard, the mainboard can also obtain the sub-board calibration parameters of the sub-board, that is, there may be no corresponding relationship between the mainboard and the sub-board at this time. Therefore, when the mainboard or the sub-board fails, only the faulty board needs to be replaced, thereby reducing the maintenance cost.
第四方面，本申请实施例提供了一种电子设备，包括：存储器，用于存储由电子设备的一个或多个处理器执行的指令，以及处理器，是电子设备的一个或多个处理器之一，用于实现上述第二方面及上述第二方面的各种可能实现提供的任一种电子设备的产线组装方法。In a fourth aspect, an embodiment of the present application provides an electronic device, comprising: a memory for storing instructions executed by one or more processors of the electronic device, and a processor, which is one of the one or more processors of the electronic device, for implementing a production line assembly method of any electronic device provided by the above-mentioned second aspect and various possible implementations of the above-mentioned second aspect.
第五方面，本申请实施例提供了一种可读介质，可读介质上存储有指令，指令在电子设备上执行时使电子设备实现上述第二方面及上述第二方面的各种可能实现提供的任一种电子设备的产线组装方法。In a fifth aspect, an embodiment of the present application provides a readable medium having instructions stored thereon, which, when executed on an electronic device, enables the electronic device to implement a production line assembly method for any electronic device provided by the second aspect and various possible implementations of the second aspect.
图1示出了一种主板与副板射频分布架构的示意图；FIG1 shows a schematic diagram of a main board and a sub-board radio frequency distribution architecture;
图2a-2b根据本申请实施例，示出了两种主板与副板射频分布架构的示意图；2a-2b are schematic diagrams showing two main board and sub-board RF distribution architectures according to an embodiment of the present application;
图3根据本申请实施例，示出了一种主板与副板射频分布架构的示意图；FIG3 is a schematic diagram showing a RF distribution architecture of a main board and a sub-board according to an embodiment of the present application;
图4根据本申请实施例，示出了又一种主板与副板射频分布架构的示意图；FIG4 is a schematic diagram showing another RF distribution architecture of a main board and a sub-board according to an embodiment of the present application;
图5根据本申请实施例，示出了一种电子设备产线组装方法的示意图；FIG5 is a schematic diagram showing an assembly method of an electronic device production line according to an embodiment of the present application;
图6根据本申请实施例，示出了另一种电子设备产线组装方法的示意图；FIG6 is a schematic diagram showing another electronic device production line assembly method according to an embodiment of the present application;
图7根据本申请实施例，示出了再一种电子设备产线组装方法的示意图；FIG7 is a schematic diagram showing another electronic device production line assembly method according to an embodiment of the present application;
图8根据本申请实施例，示出了又一种电子设备产线组装方法的示意图；FIG8 is a schematic diagram showing another electronic device production line assembly method according to an embodiment of the present application;
图9根据本申请实施例，示出了一种电子设备结构的示意图。FIG9 is a schematic diagram showing a structure of an electronic device according to an embodiment of the present application.
本申请的说明性实施例包括但不限于一种电子设备以及电子设备的产线组装方法、系统及介质。The illustrative embodiments of the present application include, but are not limited to, an electronic device and a production line assembly method, system, and medium for the electronic device.
为更加清楚地了解本申请，下面对本申请涉及的技术术语进行说明：In order to have a clearer understanding of the present application, the technical terms involved in the present application are explained below:
NC前端：NC前端一般用于对电子设备的电源系统、校准系统等系统进行控制，NC前端包括PMU或XO或SOC等。NC front end: The NC front end is generally used to control the power system, calibration system and other systems of electronic equipment. The NC front end includes PMU or XO or SOC, etc.
RF前端：用于过滤和放大射频信号，RF前端包括功率放大器(Power Amplifier，PA)、滤波器(Filter)、开关(Switch)、低噪音放大器(Low Noise Amplifier，LNA，、调谐器(Tuner)、双/多工器(Du/Multiplexer)等。RF front end: used to filter and amplify radio frequency signals. The RF front end includes a power amplifier (PA), a filter, a switch, a low noise amplifier (LNA), a tuner, a duplexer/multiplexer, etc.
插损：指将某些器件或分支电路(滤波器、阻抗匹配器等)加进某一电路时，能量或增益的损耗。Insertion loss: refers to the loss of energy or gain when certain devices or branch circuits (filters, impedance matchers, etc.) are added to a circuit.
印制电路板(Printed Circuit Board，PCB)：印制线路板由绝缘底板、连接导线和装配焊接电子元件的焊盘组成，具有导电线路和绝缘底板的双重作用，PCB包括射频前端。Printed Circuit Board (PCB): A printed circuit board consists of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components. It has the dual functions of a conductive circuit and an insulating base plate. The PCB includes a radio frequency front end.
可以理解，本申请的技术方案适用于具有两个主板的电子设备，例如，包括但不限于手机、可穿戴设备、增强现实(augmented reality，AR)/虚拟现实(virtual reality，VR)设备等，本申请实施例对电子设备的具体类型不作任何限制。It can be understood that the technical solution of the present application is applicable to electronic devices with two main boards, for example, including but not limited to mobile phones, wearable devices, augmented reality (AR)/virtual reality (VR) devices, etc. The embodiments of the present application do not impose any restrictions on the specific types of electronic devices.
为解决上述问题，一些实施例提供了一种电子设备，该电子设备的第一主板上包含NC前端和基带，基带包括PMU、XO和SOC，第二主板上包含蜂窝射频集成电路(Radio Frequency Integrated Circuit，RFIC)及前端，通过FPC连接第一主板与第二主板。其中，第一主板可以为电子设备的主板，第二主板可以为电子设备的副板；或者第一主板为电子设备的副板，第二主板可以为电子设备的主板。To solve the above problems, some embodiments provide an electronic device, wherein the first main board of the electronic device includes an NC front end and a baseband, the baseband includes a PMU, an XO and a SOC, and the second main board includes a cellular radio frequency integrated circuit (RFIC) and a front end, and the first main board and the second main board are connected by an FPC. The first main board may be the main board of the electronic device, and the second main board may be the sub-board of the electronic device; or the first main board may be the sub-board of the electronic device, and the second main board may be the main board of the electronic device.
例如，如图2a所示，将NC前端、基带设置在主板上，将蜂窝RFIC及前端设置在副板上；或如图2b所示，将蜂窝RFIC及前端设置在主板上，将NC前端、基带设置在副板上。For example, as shown in FIG2a, the NC front end and baseband are set on the main board, and the cellular RFIC and the front end are set on the sub-board; or as shown in FIG2b, the cellular RFIC and the front end are set on the main board, and the NC front end and baseband are set on the sub-board.
可以理解，现有技术中，蜂窝射频前端设置在主板上，副板上的天线需要cable或者FPC与主板上的射频前端连接，而上述实施例提供的电子设备可以通过将NC前端以及基带(如PMU或XO或SOC)与蜂窝射频前端分离，例如将蜂窝射频前端直接设置在副板上，副板上的天线无需再通过FPC或cable与射频前端连接，可以直接在副板上连接，如此，可以有效降低连接副板的天线与蜂窝射频前端的FPC的数量，并且上述实施例中，采用FPC连接主板和副板，由于FPC的线宽小于cable的线宽，进而显著降低了电子设备的厚度，并且由于FPC数量的减少，降低了射频插损，提高了整机的OTA性能。It can be understood that in the prior art, the cellular RF front end is arranged on the main board, and the antenna on the sub-board needs to be connected to the RF front end on the main board by cable or FPC, while the electronic device provided in the above embodiment can separate the NC front end and the baseband (such as PMU or XO or SOC) from the cellular RF front end. For example, the cellular RF front end is directly arranged on the sub-board, and the antenna on the sub-board no longer needs to be connected to the RF front end through FPC or cable, and can be directly connected on the sub-board. In this way, the number of FPCs connecting the antenna of the sub-board and the cellular RF front end can be effectively reduced. In the above embodiment, FPC is used to connect the main board and the sub-board. Since the line width of the FPC is smaller than the line width of the cable, the thickness of the electronic device is significantly reduced. Moreover, due to the reduction in the number of FPCs, the RF insertion loss is reduced, and the OTA performance of the whole machine is improved.
可以理解，主板与副板之间的FPC的数量越多，造成的射频插损越大；主板与副板之间的FPC的数量越少，造成的射频插损越小。It can be understood that the more FPCs there are between the main board and the sub-board, the greater the RF insertion loss caused; and the fewer FPCs there are between the main board and the sub-board, the smaller the RF insertion loss caused.
此外，对于现有技术中提及的射频前端和NC前端均安装在主板上的电子设备，在产线组装的过程中，一般会将NC前端对应的校准参数和射频前端对应的校准参数均存储在主板，即将主板校准参数与副板校准参数均存储在主板。在组装主板与副板时，需要基于主板内存储的副板校准参数确定对应的标识信息，然后根据标识信息找到与主板匹配的副板，与主板进行组装以获取整机。上述产线组装方案，在电子设备后续使用的过程中，若主板或副板中任意一个板出现故障时，由于副板是基于主板中存储的副板校准参数确定的，即主板与副板是匹配组装的对应关系，因此需要同时更换主板和副板，维修成本较大。In addition, for the electronic devices mentioned in the prior art in which the RF front end and the NC front end are both installed on the main board, during the production line assembly process, the calibration parameters corresponding to the NC front end and the calibration parameters corresponding to the RF front end are generally stored in the main board, that is, the main board calibration parameters and the sub-board calibration parameters are stored in the main board. When assembling the main board and the sub-board, it is necessary to determine the corresponding identification information based on the sub-board calibration parameters stored in the main board, and then find the sub-board that matches the main board according to the identification information, and assemble it with the main board to obtain the whole machine. In the above production line assembly scheme, during the subsequent use of the electronic device, if any one of the main board or the sub-board fails, since the sub-board is determined based on the sub-board calibration parameters stored in the main board, that is, the main board and the sub-board are in a matching assembly correspondence relationship, it is necessary to replace the main board and the sub-board at the same time, and the maintenance cost is relatively high.
主板校准参数可以为主板上安装的硬件对应的校准参数，副板校准参数可以为副板上安装的硬件对应的校准参数，例如，当主板安装数控前端和基带，副板安装蜂窝射频前端时，主板校准参数包括：XO校准参数等，副板校准参数包括RF校准参数等。在电子设备的正常使用过程中，CPU会根据主板中存储的校准参数以及一定的算法对需要补偿的参数进行补偿，以保证电子设备各功能的正常使用。The mainboard calibration parameters may be calibration parameters corresponding to the hardware installed on the mainboard, and the sub-board calibration parameters may be calibration parameters corresponding to the hardware installed on the sub-board. For example, when the mainboard is installed with a CNC front end and a baseband, and the sub-board is installed with a cellular RF front end, the mainboard calibration parameters include: XO calibration parameters, etc., and the sub-board calibration parameters include RF calibration parameters, etc. During normal use of the electronic device, the CPU will compensate the parameters that need to be compensated according to the calibration parameters stored in the mainboard and a certain algorithm to ensure the normal use of various functions of the electronic device.
例如，在一些实施例中，提供了一种应用于上述NC前端、基带(如PMU或XO或SOC)与蜂窝射频前端分离式电子设备的产线组装方法，包括：For example, in some embodiments, a production line assembly method for the above-mentioned NC front end, baseband (such as PMU or XO or SOC) and cellular RF front end separated electronic device is provided, including:
获取主板的主板校准参数以及副板的副板校准参数；将主板校准参数以及副板校准参数均上传至主板；基于副板的标志信息组装主板与副板。Get the mainboard calibration parameters of the main board and the sub-board calibration parameters of the sub-board; upload both the mainboard calibration parameters and the sub-board calibration parameters to the main Board; assemble the main board and the sub-board based on the marking information of the sub-board.
具体的，在一些实施例中，在主副板组装的过程中，可以在某一副板的标志信息与当前主板中存储的副板标志信息一致的情况下，确定该副板为与当前主板匹配的副板，然后将该副板与当前主板进行组装，获取整机设备。Specifically, in some embodiments, during the assembly of the main and sub-boards, when the identification information of a certain sub-board is consistent with the identification information of the sub-board stored in the current main board, the sub-board can be determined to be the sub-board that matches the current main board, and then the sub-board can be assembled with the current main board to obtain the complete device.
在一些实施例中，可以将主板校准参数和副板校准参数存入主板的闪存(Flash)中。标志信息包括条形码、二维码、芯片标志位等代表主板或副板身份的唯一信息。主板中存储的副板标志信息为产线校准过程中存入主板的副板校准参数对应的副板的标志信息。In some embodiments, the main board calibration parameters and the sub-board calibration parameters can be stored in the flash memory (Flash) of the main board. The identification information includes unique information representing the identity of the main board or sub-board, such as a barcode, a QR code, and a chip identification bit. The sub-board identification information stored in the main board is the identification information of the sub-board corresponding to the sub-board calibration parameters stored in the main board during the production line calibration process.
可以理解，上述方案中，由于主板与副板在产线校准以及整机组装的过程中都是一一对应的关系，因此，当主板或副板出现故障时，需要整机拆除、整套更换，维修成本较大。It can be understood that in the above scheme, since the main board and the sub-board have a one-to-one correspondence during the production line calibration and the whole machine assembly process, when the main board or the sub-board fails, the whole machine needs to be dismantled and replaced as a whole, and the maintenance cost is relatively high.
为解决上述问题，本申请还提供一种用于上述电子设备的产线组装方法，用于上述NC前端、基带与蜂窝射频前端分离式电子设备的产线组装，在主板和副板组装前，将数控前端和基带对应的校准参数与蜂窝射频前端对应的校准参数分开存储，即分开存储主板校准参数与副板校准参数，如此，可以在主板与任一副板组装后获取该副板的副板校准参数，并存入主板，实现了即使此时与主板匹配的副板不是主板中存储的副板校准参数对应的副板，主板也可以获取到该副板的副板校准参数，即此时主板与副板之间可以不存在对应关系，因此当主板或副板出现故障时，只需要更换出现故障的板即可，降低了维修成本。In order to solve the above problems, the present application also provides a production line assembly method for the above-mentioned electronic equipment, which is used for the production line assembly of the above-mentioned electronic equipment with separate NC front end, baseband and cellular RF front end. Before the main board and the sub-board are assembled, the calibration parameters corresponding to the NC front end and the baseband are stored separately from the calibration parameters corresponding to the cellular RF front end, that is, the main board calibration parameters and the sub-board calibration parameters are stored separately. In this way, the sub-board calibration parameters of the sub-board can be obtained after the main board is assembled with any sub-board, and stored in the main board, so that even if the sub-board matched with the main board at this time is not the sub-board corresponding to the sub-board calibration parameters stored in the main board, the main board can also obtain the sub-board calibration parameters of the sub-board, that is, there may be no corresponding relationship between the main board and the sub-board at this time. Therefore, when the main board or the sub-board fails, only the faulty board needs to be replaced, thereby reducing the maintenance cost.
具体地，包括：获取主板的主板校准参数，并将主板校准参数存入主板，当主板与任一副板组装完成后，获取该副板的副板校准参数，并将该副板校准参数加载至主板；其中，主板校准参数包括XO校准参数等，副板校准参数包括RF校准参数等。Specifically, it includes: obtaining the mainboard calibration parameters of the mainboard, and storing the mainboard calibration parameters into the mainboard; when the mainboard is assembled with any sub-board, obtaining the sub-board calibration parameters of the sub-board, and loading the sub-board calibration parameters into the mainboard; wherein the mainboard calibration parameters include XO calibration parameters, etc., and the sub-board calibration parameters include RF calibration parameters, etc.
可以理解，在本申请实施例中，主板与副板之间没有对应关系，主板可以与任一副板组装，因此，当主板或副板出现故障时，只需要更换出现故障的板即可，无需同时更换两个板，降低了维修成本。It can be understood that in the embodiment of the present application, there is no corresponding relationship between the main board and the sub-board, and the main board can be assembled with any sub-board. Therefore, when the main board or the sub-board fails, only the failed board needs to be replaced, and there is no need to replace both boards at the same time, thereby reducing maintenance costs.
在一些实施例中，可以将主板校准参数、副板校准参数存入主板的Flash中。In some embodiments, the main board calibration parameters and the sub-board calibration parameters may be stored in the Flash of the main board.
可以理解，本申请实施例的主板校准参数与副板校准参数在主板与副板组装前分开存储，将主板与副板组装完成后，再将副板校准参数、副板的标志信息加载至主板中。下面对分开存储主板校准参数与副板校准参数的方式进行介绍。It can be understood that the mainboard calibration parameters and the sub-board calibration parameters of the embodiment of the present application are stored separately before the mainboard and the sub-board are assembled, and after the mainboard and the sub-board are assembled, the sub-board calibration parameters and the sub-board mark information are loaded into the mainboard. The following introduces the method of separately storing the mainboard calibration parameters and the sub-board calibration parameters.
在一些实施例中，如图3所示，在主板和副板进行组装前，可以将主板校准参数上传至主板的Flash中，副板校准参数上传至云端；由于主板和副板没有对应关系，因此在整机组装时，主板和副板可任意组合。当主板与副板组装完成后，读取副板的标志信息，基于副板的标志信息从云端获取副板校准参数，并将副板校准参数、副板的标志信息加载到主板的Flash中。In some embodiments, as shown in FIG3 , before the main board and the sub-board are assembled, the main board calibration parameters can be uploaded to the main board's Flash, and the sub-board calibration parameters can be uploaded to the cloud; since there is no corresponding relationship between the main board and the sub-board, the main board and the sub-board can be combined arbitrarily when the whole machine is assembled. When the main board and the sub-board are assembled, the sub-board's flag information is read, and the sub-board calibration parameters are obtained from the cloud based on the sub-board's flag information, and the sub-board calibration parameters and the sub-board's flag information are loaded into the main board's Flash.
在另一些实施例中，如图4所示，在主板和副板进行组装前，可以将主板校准参数上传至主板的Flash中，副板校准参数存储到副板的Flash中；由于主板和副板没有对应关系，因此在进行整机组装时，主板和副板可任意组合。当主板与副板组装完成后，主板获取到加载副板校准参数的指令时，通过主板与副板互联的方式读取副板的标志信息以及副板校准参数，并将副板的标志信息以及副板校准参数加载到主板的Flash中。其中，副板的Flash位于副板的RF板中，副板的硬件无Flash，保证了副板的硬件成本最优。In other embodiments, as shown in FIG. 4 , before the main board and the sub-board are assembled, the main board calibration parameters can be uploaded to the Flash of the main board, and the sub-board calibration parameters are stored in the Flash of the sub-board; since there is no corresponding relationship between the main board and the sub-board, the main board and the sub-board can be arbitrarily combined when the whole machine is assembled. After the main board and the sub-board are assembled, when the main board obtains the instruction to load the calibration parameters of the sub-board, the flag information of the sub-board and the calibration parameters of the sub-board are read by interconnecting the main board and the sub-board, and the flag information of the sub-board and the calibration parameters of the sub-board are loaded into the Flash of the main board. Among them, the Flash of the sub-board is located in the RF board of the sub-board, and the hardware of the sub-board has no Flash, which ensures that the hardware cost of the sub-board is optimal.
在本申请实施例中，当主板出现故障时，获取新的主板替换当前主板；当副板出现故障时，获取新的副板替换当前副板，实现了维修只更换单个单板，降低了维修成本。In an embodiment of the present application, when a main board fails, a new main board is obtained to replace the current main board; when a sub-board fails, a new sub-board is obtained to replace the current sub-board, thereby achieving maintenance by replacing only a single board and reducing maintenance costs.
图5示出了一种电子设备的产线组装方法的流程示意图，该电子设备产线组装方法可以由产线组装系统执行，下面结合图5对电子设备产线组装方法进行详细介绍，该方法包括如下步骤：FIG5 shows a schematic flow chart of a production line assembly method for electronic devices. The production line assembly method for electronic devices can be executed by a production line assembly system. The production line assembly method for electronic devices is described in detail below in conjunction with FIG5. The method includes the following steps:
501：获取主板的主板校准参数，并将主板校准参数上传至主板。501: Obtain the motherboard calibration parameters of the motherboard, and upload the motherboard calibration parameters to the motherboard.
可以理解，本申请实施例中，在执行步骤501之前，可以首先执行主板的组装和副板的组装，例如可以首先在主板上安装NC前端和基带，副板上安装蜂窝射频集成电路及前端。或者首先在主板上安装蜂窝射频集成电路及前端，副板上安装NC前端和基带。图5中以安装有NC前端和基带的主板，安装有蜂窝射频集成电路及前端的副板为例进行后续组装方法的说明。It can be understood that in the embodiment of the present application, before executing step 501, the main board assembly and the sub-board assembly can be performed first, for example, the NC front end and baseband can be first installed on the main board, and the cellular radio frequency integrated circuit and front end can be installed on the sub-board. Or the cellular radio frequency integrated circuit and front end can be first installed on the main board, and the NC front end and baseband can be installed on the sub-board. FIG5 takes a main board with an NC front end and baseband installed, and a sub-board with a cellular radio frequency integrated circuit and front end installed as an example to illustrate the subsequent assembly method.
在本申请实施例中，在产线校准时，可以预先通过测试设备，例如测试仪表测试主板的性能参数，作为主板校准参数；其中，主板校准参数包括XO校准参数等。In an embodiment of the present application, during production line calibration, the performance parameters of the mainboard may be tested in advance by a test device, such as a test meter, as mainboard calibration parameters; wherein the mainboard calibration parameters include XO calibration parameters, etc.
当测试设备对主板测试完成后，将主板校准参数上传至主板的Flash；如图3或图4所示，主板中包括Flash、SOC、XO、PMU。When the test equipment completes the test on the mainboard, the mainboard calibration parameters are uploaded to the mainboard's Flash; as shown in FIG. 3 or FIG. 4 , the mainboard includes Flash, SOC, XO, and PMU.
502：当主板与副板组装完成后，获取副板的副板校准参数、副板的标志信息。502: After the main board and the sub-board are assembled, obtain sub-board calibration parameters and sub-board mark information of the sub-board.
在本申请实施例中，在产线校准时，可以预先通过测试设备，例如测试仪表测试副板的性能参数，作为副板校准参数；其中，副板校准参数包括副板的RF校准参数等。In an embodiment of the present application, during production line calibration, the performance parameters of the sub-board can be tested in advance by testing equipment, such as a test meter, as sub-board calibration parameters; wherein the sub-board calibration parameters include the RF calibration parameters of the sub-board, etc.
标志信息包括条形码、二维码、芯片标志位等代表副板身份的唯一信息。The identification information includes a barcode, a QR code, a chip identification bit, and other unique information representing the identity of the sub-board.
可以理解，在一些实施例中，当测试设备测试完成后，对于副板中没有地方存储副板校准参数的情况，如图3所示，可以将副板校准参数上传至云端，当主板与副板整机组装完成后，获取副板的标志信息，根据副板的标志信息从云端获取副板的副板校准参数，以基于副板的标志信息将副板校准参数、副板的标志信息加载到主板的Flash中。It can be understood that in some embodiments, when the test equipment is tested, if there is no place to store the calibration parameters of the sub-board in the sub-board, as shown in Figure 3, the calibration parameters of the sub-board can be uploaded to the cloud. When the main board and the sub-board are assembled, the identification information of the sub-board is obtained, and the sub-board calibration parameters of the sub-board are obtained from the cloud according to the identification information of the sub-board, so as to load the calibration parameters of the sub-board and the identification information of the sub-board into the Flash of the main board based on the identification information of the sub-board.
在另一些实施例中，当副板中的RF板有Flash时，如图4所示，可以将副板校准参数存入副板中RF板的Flash中，当主板与副板组装完成后，主板接收到加载副板校准参数的指令时，由于此时主板与副板相连接，因此可以通过互联的FPC从副板的RF板中读取副板校准参数，并将副板校准参数加载到主板的Flash中。In other embodiments, when the RF board in the sub-board has Flash, as shown in Figure 4, the sub-board calibration parameters can be stored in the Flash of the RF board in the sub-board. When the main board and the sub-board are assembled, when the main board receives an instruction to load the sub-board calibration parameters, since the main board and the sub-board are connected at this time, the sub-board calibration parameters can be read from the RF board of the sub-board through the interconnected FPC, and the sub-board calibration parameters can be loaded into the Flash of the main board.
503：基于副板的标志信息，将副板校准参数加载到主板。503: Based on the identification information of the slave board, the slave board calibration parameters are loaded into the main board.
例如，副板的标志信息为“ABC”，副板校准参数为RF校准参数，当主板与副板组装完成后，将“ABC”与RF校准参数一起加载到主板的Flash中。For example, the identification information of the slave board is "ABC", and the calibration parameters of the slave board are RF calibration parameters. When the main board and the slave board are assembled, "ABC" and the RF calibration parameters are loaded into the Flash of the main board.
可以理解，由于本申请采用了NC前端、基带与蜂窝射频前端分离式电子设备，将数控前端和基带对应的校准参数与蜂窝射频前端对应的校准参数分开存储，因此可以在主板与任一副板组装后获取该副板的副板校准参数，并存入主板，实现了即使此时与主板匹配的副板不是主板中存储的副板校准参数对应的副板，也可以获取到该副板的副板校准参数；因此此时主板与副板可以随意组装，因此，当主板或副板出现故障时，可以只更换单个板。例如，当主板出现故障时，获取新的主板替换当前主板，并将新的主板的标志信息与主板校准参数、副板的标志信息、副板校准参数加载到新的主板；当副板出现故障时，获取新的副板替换当前副板，并将新的副板的标志信息与副板校准参数加载到当前主板。由此，不需要整机更换，降低了维修成本。It can be understood that since the present application adopts a separate electronic device of NC front end, baseband and cellular RF front end, the calibration parameters corresponding to the NC front end and baseband are stored separately from the calibration parameters corresponding to the cellular RF front end, so the calibration parameters of the sub-board of the sub-board can be obtained after the main board is assembled with any sub-board, and stored in the main board, so that even if the sub-board matched with the main board at this time is not the sub-board corresponding to the sub-board calibration parameters stored in the main board, the sub-board calibration parameters of the sub-board can be obtained; therefore, the main board and the sub-board can be assembled at will at this time, so when the main board or the sub-board fails, only a single board can be replaced. For example, when the main board fails, a new main board is obtained to replace the current main board, and the new main board's logo information and the main board calibration parameters, the sub-board's logo information, and the sub-board calibration parameters are loaded to the new main board; when the sub-board fails, a new sub-board is obtained to replace the current sub-board, and the new sub-board's logo information and the sub-board calibration parameters are loaded to the current main board. As a result, there is no need to replace the entire machine, reducing maintenance costs.
图6示出了本申请实施例中一种产线组装方法的流程示意图。如图6所示，该方法包括如下步骤：FIG6 shows a schematic flow chart of a production line assembly method in an embodiment of the present application. As shown in FIG6 , the method includes the following steps:
601：获取主板的标志信息、主板校准参数、副板的标志信息、副板校准参数。601: Obtain the main board's logo information, main board calibration parameters, sub-board's logo information, and sub-board calibration parameters.
可以理解，本申请实施例中，在执行步骤601前，可以首先执行主板的组装和副板的组装，例如在主板上安装NC前端和基带，副板上安装蜂窝射频集成电路及前端。It can be understood that in an embodiment of the present application, before executing step 601, the main board and the sub-board can be assembled first, for example, the NC front end and baseband are installed on the main board, and the cellular radio frequency integrated circuit and front end are installed on the sub-board.
可以理解，在电子设备的产线校准的过程中，可以通过测试设备，例如测试仪表测试主板、副板的性能参数，得到主板校准参数、副板校准参数。It can be understood that during the production line calibration of electronic equipment, the performance parameters of the main board and the sub-board can be tested by testing equipment, such as a test meter, to obtain the main board calibration parameters and the sub-board calibration parameters.
主板或副板的标志信息包括条形码、二维码等代表主板或副板身份的唯一信息。The identification information of the main board or the sub-board includes a barcode, a QR code, or other unique information representing the identity of the main board or the sub-board.
602：将主板的标志信息、主板校准参数、副板的标志信息、副板校准参数上传至主板。602: Upload the main board's logo information, the main board's calibration parameters, the sub-board's logo information, and the sub-board's calibration parameters to the main board.
在本申请实施例中，测试设备将主板校准参数、副板校准参数、主板的标志信息、副板的标志信息上传至主板的Flash。In the embodiment of the present application, the testing device uploads the main board calibration parameters, the sub-board calibration parameters, the main board's flag information, and the sub-board's flag information to the main board's Flash.
603:在主副板组装的过程中，基于主板的标志信息、副板的标志信息组装主板与副板。603: During the process of assembling the main and sub-boards, the main board and the sub-board are assembled based on the marking information of the main board and the marking information of the sub-board.
可以理解，在主副板组装前，主板的Flash中已经存储了主副板标志信息。当组装主副板时，根据主板中存储的副板标志信息确定对应的副板，以进行主副板的组装，保证主副板的匹配。It can be understood that before the main and sub-boards are assembled, the main and sub-board identification information is stored in the main board's Flash. When assembling the main and sub-boards, the corresponding sub-board is determined according to the sub-board identification information stored in the main board to assemble the main and sub-boards to ensure matching of the main and sub-boards.
当主板或副板出现故障需要售后维修时，由于主板与副板在产线校准以及整机组装的过程中都是一一对应的关系，因此，当主板或副板出现故障时，需要整机拆除、整套更换，维修成本较大。When the main board or sub-board fails and needs after-sales repair, since the main board and the sub-board have a one-to-one correspondence during the production line calibration and the whole machine assembly process, when the main board or sub-board fails, the whole machine needs to be dismantled and replaced as a whole, and the repair cost is high.
图7示出了本申请实施例中一种产线组装方法的流程示意图。如图7所示，该方法包括如下步骤：FIG7 shows a schematic flow chart of a production line assembly method in an embodiment of the present application. As shown in FIG7 , the method includes the following steps:
701：获取主板的主板校准参数，并将主板校准参数上传至主板。701: Obtain the motherboard calibration parameters of the motherboard, and upload the motherboard calibration parameters to the motherboard.
可以理解，本申请实施例中，在执行步骤701前，可以首先执行主板的组装和副板的组装，例如，在主板上安装NC前端和基带，副板上安装RFIC及射频前端。It can be understood that in an embodiment of the present application, before executing step 701, the main board and the sub-board can be assembled first, for example, the NC front end and baseband can be installed on the main board, and the RFIC and RF front end can be installed on the sub-board.
在一些实施例中，如图3所示，主板上具有PMU、XO、SOC、Flash，副板上具有RFIC和射频前端。In some embodiments, as shown in FIG3 , the main board has a PMU, an XO, a SOC, and a Flash, and the sub-board has an RFIC and a radio frequency front end.
可以理解，在产线校准时，可以通过测试设备，例如测试仪表测试主板的性能参数，得到主板校准参数；然后测试设备将主板校准参数上传至主板的Flash。It is understandable that during production line calibration, the performance parameters of the mainboard can be tested by a test device, such as a test meter, to obtain the mainboard calibration parameters; and then the test device uploads the mainboard calibration parameters to the mainboard's Flash.
702:获取副板的标志信息、副板校准参数，并将副板的标志信息、副板校准参数上传至云端。702: Obtain the identification information and calibration parameters of the sub-board, and upload the identification information and calibration parameters of the sub-board to the cloud.
可以理解，在产线校准时，可以通过测试设备，例如测试仪表测试副板的性能参数，得到副板校准参数；然后测试设备将副板校准参数以及副板的标志信息上传至云端。副板的硬件可以不设置Flash，如此，可以降低副板的硬件成本。It can be understood that during production line calibration, the performance parameters of the sub-board can be tested by a test device, such as a test meter, to obtain the sub-board calibration parameters; then the test device uploads the sub-board calibration parameters and the sub-board identification information to the cloud. The hardware of the sub-board may not be set with Flash, such as Therefore, the hardware cost of the sub-board can be reduced.
副板的标志信息包括条形码、二维码等代表副板身份的唯一信息。The identification information of the sub-board includes a barcode, a QR code, and other unique information representing the identity of the sub-board.
可以理解，本申请对步骤701、步骤702的执行顺序不做限定，例如可以先执行步骤701，再执行步骤702；也可以先执行步骤702，再执行步骤701；还可以同时执行步骤701和步骤702。It can be understood that the present application does not limit the execution order of step 701 and step 702. For example, step 701 can be executed first, and then step 702; step 702 can be executed first, and then step 701; or step 701 and step 702 can be executed simultaneously.
703:当主板与副板组装完成后，基于副板的标志信息，从云端获取副板的副板校准参数。703: After the main board and the sub-board are assembled, the sub-board calibration parameters of the sub-board are obtained from the cloud based on the identification information of the sub-board.
在本申请实施例中，主板与副板之间可以任意进行组合，当主板与副板完成整机组装后，主板可以通过互联信令获取副板的标志信息。In the embodiment of the present application, the main board and the sub-board can be combined arbitrarily. After the main board and the sub-board are assembled into a whole machine, the main board can obtain the flag information of the sub-board through interconnection signaling.
704:将副板的标志信息、副板校准参数加载至主板的Flash。704: Load the identification information and calibration parameters of the slave board into the Flash of the main board.
当主板或副板出现故障需要售后维修时，可以获取新的板更换出现故障的板。例如，当主板出现故障时，获取新的主板替换当前主板，并将新的主板的标志信息与主板校准参数加载到主板，将副板的标志信息和副板校准参数直接从云端加载至新的主板中，如此，可以实现只更换主板，无需更换副板；当副板出现故障时，获取新的副板替换当前副板，并将新的副板的标志信息与副板校准参数加载到当前主板，如此，不需要整机更换，降低了维修成本。When the main board or sub-board fails and needs after-sales repair, a new board can be obtained to replace the failed board. For example, when the main board fails, a new main board is obtained to replace the current main board, and the new main board's logo information and main board calibration parameters are loaded into the main board, and the sub-board's logo information and sub-board calibration parameters are directly loaded from the cloud to the new main board. In this way, only the main board can be replaced without replacing the sub-board; when the sub-board fails, a new sub-board is obtained to replace the current sub-board, and the new sub-board's logo information and sub-board calibration parameters are loaded into the current main board. In this way, there is no need to replace the entire machine, reducing the maintenance cost.
图8示出了本申请实施例中一种产线组装方法的流程示意图。如图8所示，该方法包括如下步骤：FIG8 is a schematic diagram showing a flow chart of a production line assembly method in an embodiment of the present application. As shown in FIG8 , the method includes the following steps:
801：获取主板的主板校准参数，并将主板校准参数上传至主板。801: Obtaining motherboard calibration parameters of the motherboard, and uploading the motherboard calibration parameters to the motherboard.
可以理解，本申请实施例中，在执行步骤801前，可以首先执行主板的组装和副板的组装，例如，在主板上安装NC前端和基带，副板上安装RFIC及射频前端。It can be understood that in an embodiment of the present application, before executing step 801, the main board and the sub-board can be assembled first, for example, the NC front end and baseband can be installed on the main board, and the RFIC and RF front end can be installed on the sub-board.
在一些实施例中，如图4所示，主板上具有PMU、XO、SOC、Flash，副板上可以具有RFIC、射频前端以及Flash。In some embodiments, as shown in FIG. 4 , the main board has a PMU, an XO, a SOC, and a Flash, and the sub-board may have an RFIC, a radio frequency front end, and a Flash.
802:获取副板的标志信息、副板校准参数，并将副板的标志信息、副板校准参数上传至副板。802: Obtain the identification information and calibration parameters of the secondary board, and upload the identification information and calibration parameters of the secondary board to the secondary board.
可以理解，可以通过测试设备，例如测试仪表测试副板的性能参数，得到副板校准参数；然后如图4所示，可以将副板校准参数存储至副板的Flash中。It is understandable that the performance parameters of the sub-board can be tested by a test device, such as a test meter, to obtain the sub-board calibration parameters; then, as shown in FIG. 4 , the sub-board calibration parameters can be stored in the Flash of the sub-board.
可以理解，本申请对步骤801、步骤802的执行顺序不做限定，例如可以先执行步骤801，再执行步骤802；也可以先执行步骤802，再执行步骤801；还可以同时执行步骤801和步骤802。It can be understood that the present application does not limit the execution order of step 801 and step 802. For example, step 801 can be executed first, and then step 802; step 802 can be executed first, and then step 801; or step 801 and step 802 can be executed simultaneously.
803:当主板与副板组装完成后，主板接收到加载副板校准参数的指令时，基于副板的标志信息，将副板校准参数从副板的Flash加载到主板。803: When the main board and the sub-board are assembled, when the main board receives an instruction to load the calibration parameters of the sub-board, the calibration parameters of the sub-board are loaded from the Flash of the sub-board to the main board based on the flag information of the sub-board.
在本申请实施例中，主板与副板之间进行任意组合，当主板与副板完成整机组装后，主板接收到加载副板校准参数的指令时，主板可以通过互联的FPC从副板的RF板中读取副板的标志信息、副板校准参数，然后基于副板的标志信息，将副板的标志信息、副板校准参数从副板的Flash加载到主板。In an embodiment of the present application, the main board and the sub-board are arbitrarily combined. After the main board and the sub-board complete the assembly of the whole machine, when the main board receives an instruction to load the calibration parameters of the sub-board, the main board can read the sub-board's flag information and the sub-board's calibration parameters from the RF board of the sub-board through the interconnected FPC, and then load the sub-board's flag information and the sub-board's calibration parameters from the Flash of the sub-board to the main board based on the flag information of the sub-board.
当主板或副板出现故障需要售后维修时，可以获取新的板更换出现故障的板。例如，当主板出现故障时，获取新的主板替换当前主板，并将新的主板的标志信息与主板校准参数加载到主板，将副板的标志信息和副板校准参数直接从当前副板中加载至新的主板中，如此，可以实现只更换主板，无需更换副板；当副板出现故障时，获取新的副板替换当前副板，并将新的副板的标志信息与副板校准参数加载到当前主板。由此，不需要整机更换，降低了维修成本。When the main board or sub-board fails and needs after-sales repair, a new board can be obtained to replace the failed board. For example, when the main board fails, a new main board is obtained to replace the current main board, and the new main board's logo information and main board calibration parameters are loaded into the main board, and the sub-board's logo information and sub-board calibration parameters are directly loaded from the current sub-board into the new main board. In this way, only the main board can be replaced without replacing the sub-board; when the sub-board fails, a new sub-board is obtained to replace the current sub-board, and the new sub-board's logo information and sub-board calibration parameters are loaded into the current main board. As a result, there is no need to replace the entire machine, reducing maintenance costs.
本申请还提供一种产线组装系统，包括：安装单元，用于在第一主板和第二主板中的其中一个主板安装数控前端和基带，在第一主板和第二主板中的另一个主板安装蜂窝射频前端；获取单元，用于获取第一主板的第一校准参数、第二主板的第二校准参数；校准单元，用于将第一校准参数上传至第一主板，将第二校准参数上传至服务器或者第二主板；组装单元，用于组装第一主板和第二主板，并将第二校准参数加载至第一主板。The present application also provides a production line assembly system, including: an installation unit, used to install a CNC front end and a baseband on one of the first mainboard and the second mainboard, and to install a cellular RF front end on the other of the first mainboard and the second mainboard; an acquisition unit, used to obtain a first calibration parameter of the first mainboard and a second calibration parameter of the second mainboard; a calibration unit, used to upload the first calibration parameter to the first mainboard, and upload the second calibration parameter to a server or the second mainboard; an assembly unit, used to assemble the first mainboard and the second mainboard, and load the second calibration parameter to the first mainboard.
下面以电子设备为折叠屏用户设备(User Equipment，UE)折叠屏手机进行介绍。如图9所示，折叠屏手机10可以包括处理器110、电源模块140、存储器180，移动通信模块130、无线通信模块120、传感器模块190、音频模块150、摄像头170、接口模块160、按键101以及显示屏102等。The following is an introduction to the electronic device, which is a folding screen user equipment (UE) folding screen mobile phone. As shown in FIG9 , the folding screen mobile phone 10 may include a processor 110, a power module 140, a memory 180, a mobile communication module 130, a wireless communication module 120, a sensor module 190, an audio module 150, a camera 170, an interface module 160, a button 101, and a display screen 102.
可以理解的是，本发明实施例示意的结构并不构成对折叠屏手机10的具体限定。在本申请另一些实施例中，折叠屏手机10可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。It is understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the foldable screen mobile phone 10. In other embodiments of the present application, the foldable screen mobile phone 10 may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
处理器110可以包括一个或多个处理单元，例如，可以包括中央处理器(Central Processing Unit，CPU)、图像处理器(Graphics Processing Unit，GPU)、数字信号处理器DSP、微处理器(Micro-programmed Control Unit，MCU)、人工智能(Artificial Intelligence，AI)处理器或可编程逻辑器件(Field Programmable Gate Array，FPGA)等的处理模块或处理电路。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。处理器110中可以设置存储单元，用于存储指令和数据。在一些实施例中，处理器110中的存储单元为高速缓冲存储器180。The processor 110 may include one or more processing units, for example, a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor DSP, a microprocessor (MCU), an artificial intelligence (AI) processor, or a programmable logic device (FPGA). The processor 110 may be a processor module or a processing circuit such as a CPU, an FPGA, or the like. The different processing units may be independent devices or integrated into one or more processors. The processor 110 may be provided with a storage unit for storing instructions and data. In some embodiments, the storage unit in the processor 110 is a cache memory 180.
可以理解，本申请实施例中的电子设备的产线组装方法可以由对应的电子设备的处理器110执行。电源模块140可以包括电源、电源管理部件等。电源可以为电池。电源管理部件用于管理电源的充电和电源向其他模块的供电。在一些实施例中，电源管理部件包括充电管理模块和电源管理模块。充电管理模块用于从充电器接收充电输入；电源管理模块用于连接电源，充电管理模块与处理器110。电源管理模块接收电源和/或充电管理模块的输入，为处理器110，显示屏102，摄像头170，及无线通信模块120等供电。It can be understood that the production line assembly method of the electronic device in the embodiment of the present application can be executed by the processor 110 of the corresponding electronic device. The power module 140 may include a power supply, a power management component, etc. The power supply may be a battery. The power management component is used to manage the charging of the power supply and the power supply of the power supply to other modules. In some embodiments, the power management component includes a charging management module and a power management module. The charging management module is used to receive charging input from the charger; the power management module is used to connect the power supply, the charging management module and the processor 110. The power management module receives input from the power supply and/or the charging management module to power the processor 110, the display screen 102, the camera 170, and the wireless communication module 120.
移动通信模块130可以包括但不限于天线、功率放大器、滤波器、低噪声放大器(Low noise amplify，LNA)等。移动通信模块130可以提供应用在折叠屏手机10上的包括2G/3G/4G/5G等无线通信的解决方案。移动通信模块130可以由天线接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调处理器进行解调。移动通信模块130还可以对经调制解调处理器调制后的信号放大，经天线转为电磁波辐射出去。在一些实施例中，移动通信模块130的至少部分功能模块可以被设置于处理器110中。在一些实施例中，移动通信模块130至少部分功能模块可以与处理器110的至少部分模块被设置在同一个器件中。The mobile communication module 130 may include, but is not limited to, an antenna, a power amplifier, a filter, a low noise amplifier (LNA), etc. The mobile communication module 130 may provide a solution for wireless communications including 2G/3G/4G/5G, etc., applied to the folding screen mobile phone 10. The mobile communication module 130 may receive electromagnetic waves through an antenna, filter, amplify, and process the received electromagnetic waves, and transmit them to a modulation and demodulation processor for demodulation. The mobile communication module 130 may also amplify the signal modulated by the modulation and demodulation processor, and convert it into electromagnetic waves for radiation through the antenna. In some embodiments, at least some of the functional modules of the mobile communication module 130 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 130 may be disposed in the same device as at least some of the modules of the processor 110.
无线通信模块120可以包括天线，并经由天线实现对电磁波的收发。无线通信模块120可以提供应用在折叠屏手机10上的包括无线局域网(wireless localarea networks，WLAN)(如无线保真(wireless fidelity，Wi-Fi)网络)，蓝牙(bluetooth，BT)，全球导航卫星系统(global navigation satellite system，GNSS)，调频(frequency modulation，FM)，近距离无线通信技术(near field communication，NFC)，红外技术(infrared，IR)等无线通信的解决方案。折叠屏手机10可以通过无线通信技术与网络以及其他设备进行通信。The wireless communication module 120 may include an antenna, and transmit and receive electromagnetic waves via the antenna. The wireless communication module 120 may provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., which are applied to the folding screen mobile phone 10. The folding screen mobile phone 10 can communicate with the network and other devices through wireless communication technology.
可以理解，本申请实施例中，在电子设备为接收设备时，可以通过无线通信模块接收的来自录制群组中其他电子设备的视频数据和音频数据，以及各数据对应的录制内容标签以及时间标记信息。且在电子设备为发送设备时，可以通过无线通信模块向录制群组中的其他电子设备发送视频数据和音频数据，以及各数据对应的录制内容标签以及时间标记信息。It can be understood that in the embodiment of the present application, when the electronic device is a receiving device, the video data and audio data from other electronic devices in the recording group, as well as the recording content label and time stamp information corresponding to each data, can be received through the wireless communication module. And when the electronic device is a sending device, the video data and audio data, as well as the recording content label and time stamp information corresponding to each data, can be sent to other electronic devices in the recording group through the wireless communication module.
在一些实施例中，折叠屏手机10的移动通信模块130和无线通信模块120也可以位于同一模块中。In some embodiments, the mobile communication module 130 and the wireless communication module 120 of the foldable screen mobile phone 10 may also be located in the same module.
显示屏102用于显示人机交互界面、图像、视频等。显示屏102包括显示面板。显示面板可以采用液晶显示屏(liquid crystal display，LCD)，有机发光二极管(organic light-emitting diode，OLED)，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light emitting diode的，AMOLED)，柔性发光二极管(flex light-emitting diode，FLED)，MiniLed，MicroLed，Micro-oLed，量子点发光二极管(quantum dot light emitting diodes，QLED)等。The display screen 102 is used to display a human-computer interaction interface, images, videos, etc. The display screen 102 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), MiniLed, MicroLed, Micro-oLed, quantum dot light-emitting diodes (QLED), etc.
传感器模块190可以包括接近光传感器、压力传感器，陀螺仪传感器，气压传感器，磁传感器，加速度传感器，距离传感器，指纹传感器，温度传感器，触摸传感器，环境光传感器，骨传导传感器等。The sensor module 190 may include a proximity light sensor, a pressure sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.
可以理解，本申请实施例中的环境光传感器可以用于获取光照状态信息，并将光照状态信息发送至处理器。It can be understood that the ambient light sensor in the embodiment of the present application can be used to obtain lighting status information and send the lighting status information to the processor.
音频模块150用于将数字音频信息转换成模拟音频信号输出，或者将模拟音频输入转换为数字音频信号。音频模块150还可以用于对音频信号编码和解码。在一些实施例中，音频模块150可以设置于处理器110中，或将音频模块150的部分功能模块设置于处理器110中。在一些实施例中，音频模块150可以包括扬声器、听筒、麦克风以及耳机接口。摄像头170用于捕获静态图像或视频。物体通过镜头生成光学图像投射到感光元件。感光元件把光信号转换成电信号，之后将电信号传递给图像信号处理(Image Signal Processing，ISP)转换成数字图像信号。折叠屏手机10可以通过ISP，摄像头170，视频编解码器，图形处理器(Graphic Processing Unit，GPU)，显示屏102以及应用处理器等实现拍摄功能。The audio module 150 is used to convert digital audio information into an analog audio signal output, or to convert analog audio input into a digital audio signal. The audio module 150 can also be used to encode and decode audio signals. In some embodiments, the audio module 150 can be set in the processor 110, or some functional modules of the audio module 150 can be set in the processor 110. In some embodiments, the audio module 150 may include a speaker, an earpiece, a microphone, and an earphone interface. The camera 170 is used to capture static images or videos. The object generates an optical image through the lens and projects it onto the photosensitive element. The photosensitive element converts the light signal into an electrical signal, and then passes the electrical signal to the image signal processing (Image Signal Processing, ISP) to convert it into a digital image signal. The folding screen mobile phone 10 can realize the shooting function through the ISP, camera 170, video codec, graphics processor (Graphic Processing Unit, GPU), display screen 102 and application processor.
接口模块160包括外部存储器接口、通用串行总线(universal serial bus，USB)接口及用户标识模块(subscriber identification module，SIM)卡接口等。其中外部存储器接口可以用于连接外部存储卡，例如Micro SD卡，实现扩展折叠屏手机10的存储能力。外部存储卡通过外部存储器接口与处理器110通信，实现数据存储功能。通用串行总线接口用于折叠屏手机10和其他电子设备进行通信。用户标识模块卡接口用于与安装至折叠屏手机10的SIM卡进行通信，例如读取SIM卡中存储的电话号码，或将电话号码写入SIM卡中。The interface module 160 includes an external memory interface, a universal serial bus (USB) interface, and a subscriber identification module (SIM) card interface. The external memory interface can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the folding screen mobile phone 10. The external memory card communicates with the processor 110 through the external memory interface to realize the data storage function. The universal serial bus interface is used for the folding screen mobile phone 10 to communicate with other electronic devices. The subscriber identification module card interface is used to communicate with the SIM card installed in the folding screen mobile phone 10, such as reading the phone number stored in the SIM card, or writing the phone number to the SIM card.
在一些实施例中，折叠屏手机10还包括按键101、马达以及指示器等。其中，按键101可以包括音量键、开/关机键等。马达用于使折叠屏手机10产生振动效果，例如在用户的折叠屏手机10被呼叫的时候产生振动，以提示用户接听折叠屏手机10来电。指示器可以包括激光指示器、射频指示器、LED指示器等。In some embodiments, the foldable screen mobile phone 10 further includes a button 101, a motor, and an indicator. The button 101 may include a volume button, a power on/off button, etc. The motor is used to make the foldable screen mobile phone 10 vibrate, for example, when the user's foldable screen mobile phone 10 is called. Vibration is generated to prompt the user to answer the call of the folding screen mobile phone 10. The indicator may include a laser indicator, a radio frequency indicator, an LED indicator, etc.
本申请公开的机制的各实施例可以被实现在硬件、软件、固件或这些实现方法的组合中。本申请的实施例可实现为在可编程系统上执行的计算机程序或程序代码，该可编程系统包括至少一个处理器、存储系统(包括易失性和非易失性存储器和/或存储元件)、至少一个输入设备以及至少一个输出设备。The various embodiments of the mechanism disclosed in the present application can be implemented in hardware, software, firmware or a combination of these implementation methods. The embodiments of the present application can be implemented as a computer program or program code executed on a programmable system, which includes at least one processor, a storage system (including volatile and non-volatile memory and/or storage elements), at least one input device and at least one output device.
可将程序代码应用于输入指令，以执行本申请描述的各功能并生成输出信息。可以按已知方式将输出信息应用于一个或多个输出设备。为了本申请的目的，处理系统包括具有诸如例如数字信号处理器(DSP)、微控制器、专用集成电路(ASIC)或微处理器之类的处理器的任何系统。Program code can be applied to input instructions to perform the functions described in this application and generate output information. The output information can be applied to one or more output devices in a known manner. For the purposes of this application, a processing system includes any system having a processor such as, for example, a digital signal processor (DSP), a microcontroller, an application specific integrated circuit (ASIC), or a microprocessor.
程序代码可以用高级程序化语言或面向对象的编程语言来实现，以便与处理系统通信。在需要时，也可用汇编语言或机器语言来实现程序代码。事实上，本申请中描述的机制不限于任何特定编程语言的范围。在任一情形下，该语言可以是编译语言或解释语言。Program code can be implemented with high-level programming language or object-oriented programming language to communicate with the processing system. When necessary, program code can also be implemented with assembly language or machine language. In fact, the mechanism described in this application is not limited to the scope of any specific programming language. In either case, the language can be a compiled language or an interpreted language.
在一些情况下，所公开的实施例可以以硬件、固件、软件或其任何组合来实现。所公开的实施例还可以被实现为由一个或多个暂时或非暂时性机器可读(例如，计算机可读)存储介质承载或存储在其上的指令，其可以由一个或多个处理器读取和执行。例如，指令可以通过网络或通过其他计算机可读介质分发。因此，机器可读介质可以包括用于以机器(例如，计算机)可读的形式存储或传输信息的任何机制，包括但不限于，软盘、光盘、光碟、只读存储器(Compact Disc-Read Only Memory，CD-ROMs)、磁光盘、只读存储器(Read Only Memory，ROM)、随机存取存储器((Random-Access Memory，RAM)、可擦除可编程只读存储器(Erasable Programmable Read Only Memory，EPROM)、电可擦除可编程只读存储器(Electrically Erasable Programmable Read-Only Memory，EEPROM)、磁卡或光卡、闪存、或用于利用因特网以电、光、声或其他形式的传播信号来传输信息(例如，载波、红外信号数字信号等)的有形的机器可读存储器。因此，机器可读介质包括适合于以机器(例如，计算机)可读的形式存储或传输电子指令或信息的任何类型的机器可读介质。In some cases, the disclosed embodiments may be implemented in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented as instructions carried by or stored on one or more temporary or non-temporary machine-readable (e.g., computer-readable) storage media, which may be read and executed by one or more processors. For example, the instructions may be distributed over a network or through other computer-readable media. Therefore, machine-readable media may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computer), including but not limited to floppy disks, optical disks, optical discs, compact discs, read-only memories (CD-ROMs), magneto-optical disks, read-only memories (ROMs), random-access memories (RAMs), erasable programmable read-only memories (EPROMs), electrically erasable programmable read-only memories (EEPROMs), magnetic or optical cards, flash memory, or tangible machine-readable storage for transmitting information using the Internet in the form of electrical, optical, acoustic or other forms of propagation signals (e.g., carrier waves, infrared signals, digital signals, etc.). Therefore, machine-readable media include any type of machine-readable media suitable for storing or transmitting electronic instructions or information in a form readable by a machine (e.g., a computer).
在附图中，可以以特定布置和/或顺序示出一些结构或方法特征。然而，应该理解，可能不需要这样的特定布置和/或排序。而是，在一些实施例中，这些特征可以以不同于说明性附图中所示的方式和/或顺序来布置。另外，在特定图中包括结构或方法特征并不意味着暗示在所有实施例中都需要这样的特征，并且在一些实施例中，可以不包括这些特征或者可以与其他特征组合。In the accompanying drawings, some structural or method features may be shown in a specific arrangement and/or order. However, it should be understood that such a specific arrangement and/or order may not be required. Instead, in some embodiments, these features may be arranged in a manner and/or order different from that shown in the illustrative drawings. In addition, the inclusion of structural or method features in a particular figure does not mean that such features are required in all embodiments, and in some embodiments, these features may not be included or may be combined with other features.
需要说明的是，本申请各设备实施例中提到的各单元/模块都是逻辑单元/模块，在物理上，一个逻辑单元/模块可以是一个物理单元/模块，也可以是一个物理单元/模块的一部分，还可以以多个物理单元/模块的组合实现，这些逻辑单元/模块本身的物理实现方式并不是最重要的，这些逻辑单元/模块所实现的功能的组合才是解决本申请所提出的技术问题的关键。此外，为了突出本申请的创新部分，本申请上述各设备实施例并没有将与解决本申请所提出的技术问题关系不太密切的单元/模块引入，这并不表明上述设备实施例并不存在其它的单元/模块。It should be noted that the units/modules mentioned in the various device embodiments of the present application are all logical units/modules. Physically, a logical unit/module can be a physical unit/module, or a part of a physical unit/module, or can be implemented as a combination of multiple physical units/modules. The physical implementation method of these logical units/modules themselves is not the most important. The combination of functions implemented by these logical units/modules is the key to solving the technical problems proposed by the present application. In addition, in order to highlight the innovative part of the present application, the above-mentioned device embodiments of the present application do not introduce units/modules that are not closely related to solving the technical problems proposed by the present application, which does not mean that there are no other units/modules in the above-mentioned device embodiments.
需要说明的是，在本专利的示例和说明书中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that in the examples and description of this patent, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.
虽然通过参照本申请的某些优选实施例，已经对本申请进行了图示和描述，但本领域的普通技术人员应该明白，可以在形式上和细节上对其作各种改变，而不偏离本申请的精神和范围。Although the present application has been illustrated and described with reference to certain preferred embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present application.
| Application Number | Priority Date | Filing Date | Title |
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| CN202211478366.0ACN118075380A (en) | 2022-11-23 | 2022-11-23 | Electronic equipment and production line assembly method, system and medium thereof |
| CN202211478366.0 | 2022-11-23 |
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| WO2024109514A1true WO2024109514A1 (en) | 2024-05-30 |
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| PCT/CN2023/129140CeasedWO2024109514A1 (en) | 2022-11-23 | 2023-11-01 | Electronic device, production line assembly method for electronic device, system and medium |
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| CN (1) | CN118075380A (en) |
| WO (1) | WO2024109514A1 (en) |
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