WO2024086505A1

Movatterモバイル変換

Info

Publication number: WO2024086505A1
Application number: PCT/US2023/076942
Authority: WO
Inventors: Arun S. VEERAMANI; Ming Ting Wu; Dennis R. Smalley
Original assignee: Microfabrica Inc
Current assignee: Microfabrica Inc
Priority date: 2022-10-17
Filing date: 2023-10-16
Publication date: 2024-04-25
Anticipated expiration: 2025-04-17
Also published as: TW202417857A; TW202433064A; WO2024086546A9; WO2024086507A1; WO2024086546A1; WO2024085933A1; WO2024086506A1; TW202417858A; TW202417855A; TW202433062A; TW202433063A; WO2024085934A1

Abstract

Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased) and compression of probe ends may cause portions of spring elements to move closer together or further apart. Probes may comprise a longitudinal separation element connected to a standoff and to the planar compliant elements or at least one retaining structure laterally engaging probe modules.

Description

SPECIFICATION

Title: Probes with Planar Unbiased Spring Elements for Electronic Component Contact

Field of the Present Disclosure:

[01] Embodiments of the present disclosure relate to microprobes (e.g., for use in the wafer level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components) and more particularly to pin-like microprobes (i.e., microprobes that have vertical or longitudinal heights that are greater than their widths (e.g. greater by a factor of 5 in some embodiments, a factor of 10 in others and a factor of 20 in still others) or button-like probes wherein spring elements have planar configurations when in an unbiased state. In some embodiments, the microprobes are produced, at least in part, by electrochemical fabrication methods and more particularly by multi-layer, multi-material electrochemical fabrication methods, and wherein, in some embodiments, a plurality of probes are put to use while held in array formations including one or more plates with through holes that engage features of the probes and/or other array retention structures.

Background of the Present Disclosure:

Probes:

[02] Numerous electrical contact probe and pin configurations have been commercially used or proposed, some of which may qualify as prior art and others of which do not qualify as prior art. Electrochemical Fabrication:

[03] Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, or are being, commercially pursued by Microfabrica Inc. (formerly MEMGen Corporation) of Van Nuys, California under the process names EFAB and MICA FREEFORM®.

[04] Electrochemical fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, electrochemical fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical fabrication opens the spectrum for new designs and products in many industrial fields. Even though electrochemical fabrication offers this new capability, and it is understood that electrochemical fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for electrochemical fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art. [05] A need exists in various fields for miniature devices having improved characteristics, reduced fabrication times, reduced fabrication costs, simplified fabrication processes, greater versatility in device design, improved selection of materials, improved material properties, more cost effective and less risky production of such devices, and/or more independence between geometric configuration and the selected fabrication process.

Summary of the Present Disclosure:

[06] It is an object of some embodiments of the present disclosure to provide improved probes that include compliant elements formed from a plurality of compliant modules that include planar but non-linear (i.e. , not straight) spring configurations (i.e. the spring configurations are not straight bars without bends or angles but have some two-dimensional configuration within the plane of at least one layer that provides bends or curves), when unbiased, where the planes of the springs are perpendicular to a longitudinal axis of the probes and provide for compliance along the longitudinal axis of the probes wherein the compliant modules are stacked in a serial manner. The probes with non-linear spring configurations may provide linear spring return forces or non-linear return forces upon biasing.

[07] It is an object of some embodiments of the present disclosure to provide improved probes that include compliant elements formed from one or more compliant modules that include planar but non-linear (i.e., not straight) spring configurations, when unbiased, where the normals to planes of the springs are not perpendicular to a longitudinal axis of the probes and deflection of the springs out of the planes of the undeflected springs provide a majority of the compliance along the longitudinal axis of the probes. In some cases, the probe springs may extend laterally in the plane or planes of the layers from which the probe or probes are formed (i.e. the planes of the springs are perpendicular to a stacking direction of the layers from which the probe is formed) while the probe axis (extending from tip-to-tip) may not be perpendicular to the planes of the spring or springs (e.g., due to an intentional lateral offset between the opposing ends of the probe). In some variations, the probe axis may be substantially perpendicular to the plane or planes of the springs where “substantially” refers to an angular mismatch of less than 20°, less than 10°, less than 5°, less than 2°, or less than 1 ° and should be interpreted as the broadest of these unless specially indicated otherwise.

[08] It is an object of some embodiments of the present disclosure to use individual compliant modules as probes with a single contact tip.

[09] It is an object of some embodiments of the present disclosure to use individual compliant modules as probes with two oppositely facing contact tips.

[10] It is an object of some embodiments of the present disclosure to provide two or more compliant modules with reversed orientations to provide probes with two oppositely oriented contact surfaces or tips. [11] It is an object of some embodiments of the present disclosure to provide probes and/or compliant modules with base features for engaging array structures or for engaging tips of other compliant modules.

[12] It is an object of some embodiments of the present disclosure to provide probes and/or compliant modules with tip features for engaging tips or base structures of other compliant modules.

[13] It is an object of some embodiments of the present disclosure to provide array structures with through holes configured for accepting inserted probes or compliant modules, for retaining probes or compliant modules by limiting extent of insertion from at least one direction based, at least in part, on at least one feature of the array structure.

[14] It is an object of some embodiments of the present disclosure to provide probes or compliant modules with features for engaging through holes in array structures such that the probes or the compliant modules are retained by limiting extent of insertion from at least one direction based, at least in part, on one or more features of the probes or compliant modules.

[15] It is an object of some embodiments of the present disclosure to provide probes formed from compliant modules that include multiple spring elements wherein the spring elements support probe arms that support probe tips with at least two probe tips pointing in opposite directions which are configured for contacting different electronic components, such as a device under test DUT and an interface element to a test circuity such as a space transformer, an interposer or a PCB connected thereto.

[16] Other objects and advantages of various embodiments of the present disclosure will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the present disclosure, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, or alternatively may address some other object ascertained from the teachings herein without necessarily addressing any particular object set forth above. As such, it is not necessarily intended that all objects set forth above, or even a majority of the objects set forth above, or even a plurality of the objects set forth above, be addressed by any single aspect of the present disclosure or embodiment of the present disclosure even though that may be the case regarding some aspects or embodiments.

[19] In a second aspect of the present disclosure, a probe for making contact between two electronic circuit elements, includes: at least a first and a second probe module, each probe module comprising at least one standoff having a first end and a second end that are longitudinally separated; at least one planar compliant element providing compliance in a direction perpendicular to its planar configuration, wherein a first portion of the planar compliant element may functionally join the at least one standoff and a second portion of the planar compliant element may functionally join a tip arm that can elastically move relative to the at least one standoff and directly or indirectly holds a tip end; and at least one base provided with a down-facing retention structure extending from its bottom; wherein the first and second modules engage one another via the base as a tip end of one module is laterally bounded by an interior region of the down-facing retention structure of the other module, and wherein the first and second modules may be further laterally engaged one another via at least one retaining structure comprising at least a frame structure and an opening.

[20] Numerous variations of the second aspect of the present disclosure exist and include, for example: (1) the first probe module may include a frame structure connected to its base and defining openings in correspondence of its sides and the second module may include a frame in correspondence of sides of the first probe module, the frame having protruding portions able to insert into the openings of the first probe module, the engagement of the protruding portions of the frame structure into the openings preventing or limiting a lateral displacement of the first and probe modules; (2) the first probe module may include at least an opening provided within its at least one standoff and the second probe module may include a frame in correspondence of its at least one standoff, the frame having a protruding portion able to insert into the opening in the at least one standoff of the first probe module; and (3) the second probe module may further include additional frame structures associates with its base and the compliant portion of the second probe module as well as the compliant portionjand the base of the first probe module may have openings able to house the additional frame structures of the second probe module.

[21] Other aspects of the present disclosure will be understood by those of skill in the art upon review of the teachings herein. Other aspects of the present disclosure may involve combinations of the above noted aspects. These other aspects of the present disclosure may provide various combinations of the aspects presented above as well as provide other configurations, structures, functional relationships, and processes that have not been specifically set forth above but are taught by other specific teachings set forth herein or by the teachings of the specification as a whole.

Brief Description of the Drawings:

[22] FIGS. 1 A - 1 F schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.

[23] FIG. 1G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level. [24] FIGS. 1 H and 11 respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material.

[25] FIG. 2 depicts an isometric view of an example spring module or compliant module having two connected spring elements, a base, and a connecting support or standoff that may be used in a probe or as a probe.

[26] FIG. 3 depicts an isometric view of a second example spring module or compliant module that may be used in a probe, or as a probe, similar to the module of FIG. 2 with the exception that the two spring elements are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2.

[27] FIG. 4 depicts a partially cut view of a probe including a plurality of spring modules.

[28] FIGS. 5A - 5B, 6A - 6B, 7A - 7C, and 8 - 10 provide side views of spring modules or compliant modules similar to those of FIGS. 2 and 3 or cut views through planar spring elements of such modules.

[29] FIGS. 11 - 13 provide pairs of modules that share a common base with one of the modules oriented upward and the other oriented downward such that two oppositely oriented contact tips are provided along with two independently operable pairs of compliant elements.

[30] FIG. 14 illustrates a side view of three probes at different stages of mounting to an array plate.

[31] FIG. 15 is similar to that of FIG. 14 with the exception that the array structure is provided with recesses for receiving probe modules.

[32] FIG. 16 provides a side view showing the loading of a plurality of probes like those of FIG. 8 into an array structure plate having through holes.

[33] FIG. 17 provides a side view showing the loading of a plurality of probes like those of FIG. 9 into an array structure having through holes.

[34] FIG. 18A provides a top view of the upper surface of an example three-by-three array structure plate with circular through holes.

[35] FIG. 18B provides a cut view of the array structure plate of FIG. 18A along line

18B/18C - 18B/18C along with probes being loaded into the three openings at different stages of loading.

[36] FIG. 18C shows a similar view to that of FIG. 18B with the three probes loaded into their respective openings and with the lower portion of the probe bases providing lateral alignment and the upper portion of the bases providing a lip which engages the upper surface of the array structure to provide longitudinal alignment.

[37] FIG. 18D illustrates an assembled array configuration similar to that of FIG. 18C with the exception that the array includes not only a lower array structure but also an upper array structure such that the probes are clamped between the structures from below and above.

[38] FIG. 18E illustrates an assembled array configuration that uses two array structures to hold probes with one of the array structures (e.g., a guide plate) engaging the probes near their lower ends while the other array structure (e.g., a guide plate) engages the probes near their upper ends.

[39] FIGS. 18F1 and 18F2 illustrate a group of three probes that are ready for assembly with an array structure (FIG. 18F1) and after such assembly has occurred (FIG. 18F2).

[40] FIG. 18G provides a side cut view of a probe along with three example layer configurations (Examples A, B, and C) that may be used in forming the probe of FIG. 12.

[41] FIGS. 19 and 20 provide side views of a spring module similar to those of some of the previous embodiments, with the exception that the module includes not only a first upward facing tip attached to the compliant element but also a downward facing tip attached to a lower surface of the base of the module.

[42] FIGS. 21 A - 21 C provide different views of a module according to an embodiment of present disclosure.

[43] FIGS. 21 D and 21 E provide variations of the probe of FIG. 21 C.

[44] FIGS. 22A - 22C provide three similar views to those shown in FIGS. 21A - 21C for another embodiment.

[45] FIGS. 23A - 23C provide a side view of a single module (FIG. 23A), a cut view of a retention structure located at the bottom of the module of FIG. 23A (FIG. 23B), and a side view of two stacked modules (FIG. 23C).

[46] FIG. 24 provides a side view of a module according to another embodiment of the present disclosure.

[47] FIG. 25 provides a side view of a module with a single spring element supporting a tip.

[48] FIG. 26 provides a side view of a module with a single spring element supporting a tip.

[49] FIGS. 27A - 27B provide a side view and a cut view of a module according to another embodiment.

[50] FIG. 28A provides a side view of a probe according to another embodiment of the present disclosure.

[51] FIGS. 28B - 28N provide cross-sectional views of successive layers of structural material of the probe of FIG. 28A with views of the tips, the springs, and the standoff /base shown with different hatching patterns. [52] FIGS. 29A1 - 29L provide a pair of different side views (FIGS. 29A1 - 29A2) along with layer views (FIGS. 29B - 29L) of a probe according to another embodiment of the present disclosure.

[53] FIGS. 30A1 - 30A2 provide a pair of different side views of a probe, and FIG. 30A3 provides an alternative version of the probe with some optional stop features, while FIGS. 30B - 30J provide top views of layers (or simply layer views) of the probe of FIGS. 30A1 and 30A2 according to another embodiment of the present disclosure.

[54] FIG. 31 provides a schematic representation of a compression-type spring probe/module according to a generalized embodiment of the present disclosure having a single compliant structure and a first compliant element along with additional optional elements or features.

[55] FIG. 32 provides a schematic representation of a compression-type spring probe according to another generalized embodiment of the present disclosure having a single compliant structure with first and second oppositely facing compliant elements.

[56] FIG. 33 provides a schematic representation of an expansion-type spring probe according to another generalized embodiment of the present disclosure having a single compliant structure with first and second compliant elements.

Detailed Description of Preferred Embodiments:

Electrochemical Fabrication in General

[57] FIGS. 1 A - 11 illustrate side views of various states in an example multi-layer, multi-material electrochemical fabrication process. FIGS. 1A - 1G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metal form part of the layer. In FIG. 1 A, a side view of a substrate 82 having a surface 88 is shown, onto which patternable photoresist 84 is located as shown in FIG. 1 B. In FIG. 10, a pattern of resist is shown that results from the curing, exposing, and developing of the resist. The patterning of the photoresist 84 results in openings or apertures 92(a) - 92(c) extending from a surface 86 of the photoresist through the thickness of the photoresist to surface 88 of the substrate 82. In FIG. 1 D, a metal 94 (e.g., nickel) is shown as having been electroplated into the openings 92(a) - 92(c). In FIG. 1 E, the photoresist has been removed (i.e., chemically, or otherwise stripped) from the substrate to expose regions of the substrate 82 which are not covered with the first metal 94. In FIG. 1 F, a second metal 96 (e.g., silver) is shown as having been blanket electroplated over the entire exposed portions of the substrate 82 (which is conductive) and over the first metal 94 (which is also conductive). FIG. 1G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer. In FIG. 1 H, the result of repeating the process steps shown in FIGS. 1 B - 1G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed, as shown in FIG. 11, to yield a desired 3- D structure 98 (e.g., component or device) or multiple such structures.

[58] Various embodiments of various aspects of the present disclosure are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in the example of FIGS. 1A - 11). Some of these structures may be formed from a single build level formed from one or more deposited materials while others are formed from a plurality of build layers, each including at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers). In some embodiments, layer thicknesses may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used while in other embodiments, thicker layers may be used. In some embodiments, microscale structures have lateral features positioned with 0.1 - 10-micron level precision and minimum feature sizes on the order of microns to tens of microns. In other embodiments, structures with less precise feature placement and/or larger minimum features may be formed. In still other embodiments, higher precision and smaller minimum feature sizes may be desirable. In the present application, meso-scale and millimeter-scale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.5 - 50-millimeter range, or larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of tens of microns to hundreds of microns.

[59] The various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the present disclosure may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e. masks and operations based on masks whose contact surfaces are not significantly conformable), and/or adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it). Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse. Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material. In some embodiments, adhered mask material may be used as a sacrificial for the layer or may be used only as a masking material which is replaced by another material (e.g., dielectric, or conductive material) prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer. Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.

[60] Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material. Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material. In some embodiments, the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e. , regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration). The selective etching and/or interlaced material deposition can be also used in association with multiple layers.

[61] Temporary substrates on which structures may be formed may be of the sacrificial-type (i.e., destroyed or damaged during separation of deposited materials to the extent they cannot be reused) or non-sacrificial-type (i.e., not destroyed or excessively damaged, i.e., not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed). Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., by replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.

[62] Definitions of various terms and concepts that may be used in understanding the embodiments of the present disclosure (either for the devices themselves, certain methods for making the devices, or certain methods for using the devices) will be understood by those of skill in the art.

Probes with Planar Spring Modules:

[63] Some embodiments of the present disclosure are directed to spring modules with each spring module including at least one centrally located tip attached to at least one planar compliant spring element (while in an unbiased state) which is in turn attached to a base via a connecting bridge or standoff or where the base provides at least a portion of the standoff functionality wherein an axis of primary spring compliance is perpendicular to the plane of the spring arm or arms that form the spring element. Some embodiments are directed to spring modules including compliant elements that have flat springs in the form of inward winding spirals (whether of a smooth curved configuration or of a polygonal configuration or angled configuration) that end in longitudinally extending contact tips or tip extensions, standoffs, or arms. Some embodiments are directed to probes formed as, or from, single spring modules. Some embodiments are directed to probes formed as, or from, back-to-back spring modules that may share a common base element that connects standoffs, a base element that functions as a standoff, or simply have one or more joined standoffs that connect to spring elements. Some embodiments are directed to probes formed from a plurality of spring modules in combination with other components such as probe tips (that may be separate from spring module tips), tip extensions, and sheaths. Some embodiments are directed to methods for forming spring modules; forming probes that include single spring modules, forming probes that include back-to-back spring modules, or forming probes that include a plurality of adhered or contacting spring modules built up during a process that forms and simultaneously assembles components or structures, while still others are directed to forming probe components and thereafter assembling them into working probe structures. Still other embodiments are directed to probe arrays that include one or more of the probe types noted above along with array structures (e.g., substrates, guide plates, and the like). Still other embodiments are directed to methods of making such probe arrays.

[64] Planar springs or planar compliant elements of the present disclosure may be formed in a number of different ways and take a number of different configurations. Generally, the compliant elements include planar springs that have portions that extend from a standoff to a tip or tip arm in a cantilever or bridged manner (e.g., two or more springs starting from different lateral standoff locations and joining to a common tip arm - herein generally referred to as a cantilever or cantilevers) over a gap or open area into which the spring may deflect during normal operation. These compliant portions generally have two-dimensional non-linear configurations within a lateral plane and a thickness extending perpendicular to the plane (e.g., in longitudinal direction), where two-dimensional configuration may be in the form of a beam structure with a curved or angled configuration with a length much larger than its width, e.g. at least 5, 10, 20, or even 50 times or more in some variations, wherein the thickness is generally smaller than the length of the beam, e.g. at least 5, 10, 20, or even 50 times or more in some variations, or a lateral dimension of the spring element, e.g. 2, 5, 10, or even 20 times or more in some variations. In some embodiments, the plane of such configurations may be parallel to layer planes when the probes or modules are formed from a plurality of adhered layers (e.g., X- Y plane). The thickness (e.g., in a Z-direction) of a spring may be that of a single layer or may be multiple layer thicknesses. In some embodiments, compliant elements include a plurality of spaced planar spring elements.

[65] In some embodiments the compliant elements may include planar spring elements that are joined not only at a standoff or tip structure to one another but also at locations intermediate to such end elements. In some such embodiments, the planar spring elements may start from one end (e.g., a standoff or tip arm) as one or more thickened springs with a relatively high spring constant and then be provided with a reduced spring constant by removal of some intermediate spring material between the top and bottom of the initial spring structure such that what started as a small but thick number of planar compliant elements (e.g. 1 , 2, or 3 elements) transitions to a larger number of thinner planar elements, with some initial planar elements dividing into 2, 3 ,4, 5 or more planar but thinner elements, prior to reaching the other end (e.g. a tip arm of standoff) whereby, for example, the spring constant, force requirements, overtravel, stress, strain, current carrying capacity, overall size and other operational parameters can be tailored to meet requirements of a given application.

[66] Reference numbers are included in many of FIGS. 2 to 33 wherein like numbers are used to represent similar structures or features in the different embodiments. In particular, when the FIGS, of the various embodiments (i.e., FIGS. 2 to 33) use reference numbers, the reference numbers are provided in a 3 or 4 digit format which may be followed by letters, dashes, and/or additional numbers, wherein the first digit or first two digits (from the left) represent the FIG. number while the final two digits to the right along with any trailing letters, dashes, or numbers represent a particular general structure or feature. When two or more figures include a reference having the same left most digits (and following letters, dashes, and additional numbers), It is intended to indicate a similarity of the features indicated. The following table sets forth these two right most digits along with supplemental letters, dashes, and numbers, and a general description of the structure or feature being represented. Here and below, relative terms like “top”, “bottom”, “upper”, “lower”, “downward”, “upward” and similar ones are intended as referring to the illustrations given in the drawings, for sake of conciseness. Similarly, terms like “left”, “right”, “above”, “below” and similar ones are used still with reference to the drawings.

Table of Reference Numbers for Structures/Features

[67] Example spring modules are shown in FIGS. 2 - 3. FIG. 2 depicts an isometric view of an example spring module 200 with two undeflected spring elements 221-1 and 221-2, a base 201 spaced from the spring elements and a connecting support (e.g., a standoff or bridge) 211 that bridges a longitudinal module gap MG between the spring elements 221-1 , 221-2 and the base 201. In the example of FIG. 2, each of the two spring elements 221-1 , 221- 2 take the form of a planar radially extending spiral that extends from the radially displaced bridge 211 to a centrally or axially positioned tip element 231 via a downward extending portion of the tip structure 231 . The spring elements 221-1 , 221-2 are separated longitudinally by a gap SG. In this example, the bridge 211 connects one end of each spring element 221-1 , 221-2 together while the tip structure 231 connects the other ends of the spring elements 221-1 , 221 - 2 together via an extended portion of the tip structure 231 . The tip structure 231 is formed with a desired width TW and desired tip height TH extending above the upper spring element 221-2, and each spring element 221-1 , 221-2 is formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing between spring coils CS, and coiled beam length that allows the spring element to deflect a desired amount without exceeding an elastic deflection limit of the structure and associated material from which it is formed while providing a desired fixed or variable spring force over its deflection range. In particular, the length of the tip structure 231 may be such that a desired compression of a module tip structure toward the base can occur without the base, bridge, and spring elements interfering with one another. In some embodiments, for example, a maximum travel distance for the tip of each module may be as little as 5 urn (urn = micron) or less or as much as 500 urn (e.g., 25 urns, 50 urns, 100 urns or 200 urns) or more. For example, in some embodiments, a maximum travel distance per module may be 25 urn to 200 urn while in other example embodiments, the maximum travel distance per module may be 50 urn to 150 urn. In some embodiments, the maximum travel distance of the tip structure may be set by a hard stop such as by the deflected portion of the spring element or tip structure coming into contact with the base, by a stop structure on the base, or possibly by a surface that contacts the tip structure (e.g., the surface of an adjacent module) coming into contact with the upper portion of the bridge. In other embodiments, the maximum travel distance may be instilled by the compliant spring element or tip structure coming into contact with a soft stop or compliance decreasing structure. The force to achieve maximum deflection (or travel) may be as small as 0.1 gram force to as large as 20 or more gram force. In some embodiments, a force target of 0.5 grams may be appropriate. In others, 1 gram, 2 grams, 4 grams, 8 grams or more may be appropriate. In some embodiments, a module height MH (longitudinal dimension) of 50 urns or less may be targeted while in others, a module height of 500 urns or more may be targeted. In some embodiments, overall module radial diameter or width MW may be 100 urns or less or 400 urns or more (e.g., 150 urns, 200 urns, or 250 urns). The spring elements, or beam elements, of a module may have spring heights (or beam heights) SH from 1 urn, or less, to 100 urn, or more (e.g., 10, 20, 30, or 40 urn), and spring widths (or beam widths) SWfrom 1 urn or less to 100 urn or more (e.g., 10, 20, 30, or 40 urn). Tip structures may have uniform or changing geometries (e.g., with cylindrical, rectangular, conical, multi-prong, or other configurations, or combinations of configurations). Tip structures, where joining to spring elements or beams, will generally possess larger cross- sectional widths TW than the widths SW of the spring (beam) or springs (beams) to which they connect.

[68] FIG. 3 depicts an isometric view of a second example spring module 300 that is similar to the module of FIG. 2 with the exception that the two spring elements 321-1 , 321-2 are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2. From another perspective, the example of FIG. 3 will require more force for a given deflection and, as such, will reach a yield strength (e.g., reach an elastic deflection limit) of the combined material and structural geometry with less deflection than the example of FIG. 2.

[69] In other embodiments, spring modules may take different forms than those shown in FIG. 2 or FIG. 3. For example: (1) a module may have a single spring element or more than two spring elements; (2) each of the spring elements may have variations in one or more of widths, thicknesses, lengths, or extent of rotations; (3) spring elements may change over the lengths of the elements; (4) spring elements may have configurations other than Euler spirals, e.g. rectangular spirals, rectangular spirals with rounded corners, S-shaped structures, or C-shaped structures; (5) individual spring elements may connect to more than a single bridge junction, e.g. to bridge connection points located at 180 degrees around the module, 120 degrees or 90 degrees; (6) bridge junctions may be located on distinct bridges; (7) base elements may have smaller radial extents than spring/bridge junctions such that bases of higher modules may extend below upper extents of lower adjacent modules upon sufficient compression of module tips when modules are stacked; (8) module bases may be replaced with additional springs that allow compression of module springs from both directions upon deflection, (9) probe tips may not be laterally centered relative to the overall lateral configuration of the module (i.e. not coincident or even co-linear with the primary axis of compression or the primary build axis when formed on a layer-by-layer basis).

[70] FIG. 4 depicts a partially cut view of a probe 400 including: (a) a plurality of spring modules 200 and 300 similar to those of FIGS. 2 and 3, (b) a first or upper multi-module tip 432-U, (c) a first or upper tip support or extension arm 432-UA that may or may not be attached or bonded to a tip of the module that it directly interacts with, (c) a first or upper tip over-compression stop 435-U, (d) a second or lower tip 432-L, (e) a second tip or lower support or extension arm 432-LA that may or may not be attached or bonded to a tip of the module that it directly interacts with, and (f) a sheath 451 (shown in a cut view that holds the spring modules in a substantially linear configuration with respect to one another as well as limiting the longitudinal extension of the tips) where the sheath has openings 442-U and 442-L for passing tip support arms 432-UA and 432-LA, respectively. Tip 432-L has a rectangular configuration that may be useful for contacting a solder bump or other protruding contact surface. In the probe design of FIG. 4, each module, if sufficient compression occurs, reaches a compression limit upon one of two events: (1) when the central portion of the lower spring element of a spring module comes into contact with the upper surface of the module base, or (2) when the lower surface of an immediately adjacent upper module base contacts the upper surface of the lower module bridge. The probe 400 as a whole may reach a compression limit when both an upper tip support arm 432-UA and a lower tip support arm 432-I.A reach compression limits which may occur before any spring modules reach compression limits or after only a portion of the modules reach their own compression limits. Probes may have diameters of an appropriate size for the array pitch desired. For example, effective probe diameters may be as small as 100 microns, or smaller, or as large as 600 microns, or larger. In some embodiments, for example, probes may have effective diameters in the range of 250 - 350 microns for use in an array having a 400 micron pitch or they may have effective diameters in the range of 150 to 250 microns for use in an array of 300 microns. Probe heights may be set to provide effective longitudinal travel so that overtravel requirements for individual modules, probes, or arrays as a whole can be accommodated when engaging semiconductor wafers or other electronic components. For example, overtravel may be in the range of 25 microns, or less, to 400 microns, or more, and probe heights may be in the range of 150 microns, or less, to 2000 microns, or more.

[71] Numerous variations of the embodiment of the probe of FIG. 4 are possible and include for example: (1) module tips being joined to adjacent module bases or module tips may simply be contacted to adjacent module bases; (2) more than four or less than four spring modules may be used in forming a given probe; (3) some or all spring modules in a given probe may have similar spring constants and/or configurations or different spring constants and/or configurations; (4) tip arms may have compression stops located on them that are spaced from contact tips; (5) probes may have a contact tip on each end or may have a contact tip on one end and a bondable tip or attachment structure on the other end; (6) probes may have one or more fixed end caps that inhibit spring modules from sliding out of one or both ends of the sheath, or may have no fixed end caps; (7) probes may have sheath ends that allow spring module loading to occur and thus allow biasing of springs within the module without maintaining compressive pressure on probe end tips or that may allow spring modules to be formed in build locations that are different from working range locations within a sheath; (8) spring modules or tip arms may have sliding contacts or other contacts that allow current to be shunted away from the spring elements and instead to flow through the sheaths; (9) spring modules may be formed with some dielectric elements; (10) spring modules and/or sheaths may include dielectric elements or be separated by dielectric elements such that electrical isolation of the spring modules/tip arms from the sheaths occurs, e.g. to provide dual electrically isolated conductive current paths or to ensure that central conductive paths of one probe of an array are not inadvertently shorted to a conductive path on another adjacent probe; (11) sheaths may be formed in two or more parts that allow formation or assembly of spring modules and other components into sheaths to form probes; (12) a plurality of spring modules may be formed in an attached manner to one another to provide a monolithic compliant structure (with or without tip arms and tips) that may be formed fully within a sheath, partially within a sheath for which loading will be completed subsequent to formation, or separate from a sheath for later assembly into a sheath; (13) split sheaths may be formed with snap together features that provide for easy assembly after formation; and (14) holes or openings may be made at selected locations of the spring modules or the sheaths to provide improved access of a sacrificial material etching to interior portions which might be useful when the probe or modules are formed using a multi-material, multi-layer electrochemical fabrication process that involves a sacrificial material that must be removed.

[72] F-GS. 5A — 5B, 6A — 6B, 7 A - 7C- and 8 - 10 provide side views of spring modules or compliant modules similar to those of FIGS. 2 and 3 with different compliant element rotational extents, with different rotational orientations between the pairs of compliant elements, with different base configurations for engaging array structures, and/or with different numbers of contact elements. In other embodiments, different configurations and combinations of features are possible.

[73] FIGS. 5A and 5B show a spring module 500 from a side view and a cut view, respectively, where a number of the successively connected, coupled, or joined elements can be seen including a base 501 , a standoff, bridge, or support 511 , a pair of planar spring elements 521-1 and 521-2 (e.g. in the form of spirals), a tip arm 531-UA, and a tip 531-U. As used herein, with regard to this embodiment or with regard to the other embodiments, the tip and the tip arm may be distinguished from one another or be simply referred to as the tip or tip structure when not explicitly required to be distinguished. As shown in FIG. 5B, the spring elements 521-1 and 521-2 of this spring module 500 have a polygonal shape and more specifically an octagonal shape. FIG. 5A shows two spring elements with one being more interior 521-1 and being more exterior 521-2, each having a backside spring feature on a right portion 521-1 B and 521-2B, respectively, and a left front side spring feature on a left portion 521-1 F and 521-2F, respectively. The right backside spring features start at the standoff, bridge, or support, 511 and wrap around the back of the central moveable tip element 531-U and tip arm 531-UA and then continue to become the left front side features which in turn join the tip element 531-U via the tip arm 531-UA on the front left side of the probe. The standoff, bridge, or support 511 bridges a longitudinal module gap between the spring elements 521-1 and 521-2 and the base 501 of the spring module 500.ln this example, the springs or spring elements have an octagonal form with rotational extents between 180 degrees and 270 degrees. In alternative embodiments, the various elements of the spring module may take on different dimensional configurations and be formed from the same or different materials, the various elements may be included in different multiple or singular quantities, and the spring may take different forms. In some alternatives, multiple functionalities may be included in a single element such as an annular base configured to function as a stabilizing base or mounting structure and as a standoff for supporting a longitudinal separation of planar spring elements. For example: (1) the standoff, bridge or support may be formed from multiple separated standoff, bridge or support elements, (2) the spring elements may be provided in the form of three or more planar, two-dimensional springs (when the thickness of the spring is small compared to the cross-sectional area of the spring) or as a single spring or be formed of multiple springs that are joined to one another at intermediate locations, (3) the spring elements may alternatively, or additionally, have different rotational extents, and be formed to have different curved, polygonal, straight, angular, or spiral configurations, (4) the base may have a configuration for accepting and laterally retaining (e.g. by surrounding or extending into) a tip of a lower spring module, or have an opening for allowing protrusion of a tip partially or completely therethrough where the tip could be part of a preceding spring module or be part of the present spring module that extends from the bottom of the spring element or elements or be attached to and extend downward from the bottom of the base itself, and/or (5) tips may take on different configurations.

[74] FIGS. 6A and 6B show spring module 600 from a side view and a cut view respectively where a number of the successively connected, coupled, or joined elements can be seen including a base 601 , a standoff, bridge or support 611 , a pair of planar spring elements 621-1 and 621-2, a tip arm 631-UA, and a tip 631-U. As used herein, the tip and the tip arm may be distinguished from one another or simply referred to as the tip or tip structure when not explicitly required to be distinguished. As shown in FIG. 6B, the spring elements 621- 1 and 621-2 of this spring module 600 have a polygonal shape and more specifically an inward extending rectangular spiral shape. FIG. 6A shows the two spring elements 621-1 and 621-2 (e.g. in the form of spirals) starting at the standoff and wrapping around the back of the central contact element as portions 621-1 B and 621 -2B and then extending around the front of the contact element as portions 621-1 F and 621-2F with the joining location of spring elements and the tip arm element 631-UA hidden from view such that the rotational extents of the spiral are something greater than 360 degrees. The standoff, bridge, or support 611 bridges a longitudinal module gap between the spring elements 621-1 and 621-2 and the base 601. The full standoff, bridge, or support 611 to tip arm 631-UA spiral of the top spring element 621-2 can be seen in FIG. 6B along with portions of the standoff or support material 611 surrounding the initial portion of the spring element along with the tip arm 631-UA on the opposite end of the spiral. Variations of the spring module of FIGS. 6A and 6B are possible and include, mutatis mutandis, the features and variations noted in the previous and subsequent module and probe embodiments.

[75] FIGS. 7 A, 7B, and 7C show an alternative spring module 700 from a side view and at two different cut levels where a number of the successively connected, coupled, or joined elements can be seen including a base 701 , a standoff, bridge or support 711 , a pair of planar spring elements 721-1 and 721-2 having opposite orientations, a tip arm 731-UA, and a tip 731 -U. The standoff, bridge, or support 711 bridges a longitudinal module gap between first or lower and second or upper spring elements 721-1 and 721-2 and the base 701 . As used herein, the tip and the arm may be distinguished from one another or simply referred to as the tip when not explicitly required to be distinguished. FIG. 7A shows the two spring elements 721 - 1 and 721-2 wrapping around the tip arm 731-UA in different directions with the upper compliant element (i.e. , the spring element) 721-2 showing a back feature 721-2B on the right side of FIG. 7A and a front feature 721 -2F on the left side of FIG. 7A and having a rotational extent between 180 degrees and 360 degrees and with the lower compliant element 721-1 showing only a front or forward feature 721-1 F since the backside features are hidden behind the front side features wherein its rotational extent is hidden from view (in FIG. 7A) such that the extent is greater than 180 degrees. When viewing from the top, the upper compliant element 721-2 has an inward spiral rotation in the counterclockwise direction while the lower compliant element 721-1 has a reversed rotation as shown in FIGS. 7B and 7C. Variations of the module of FIGS. 7A - 7C are possible and include, mutatis mutandis, the features and variations noted in the previous and subsequent module embodiments.

[76] FIG. 8 shows a compliant or spring module 800 similar to that of FIG. 6 with the exception of there being a modification to the base of the compliant or spring module which provides a configuration that allows the module to sit on and engage a recess or opening in, or through, an array structure (e.g. an array plate - not shown) wherein the compliant or spring module could be loaded in such a recess or opening from the top of the array structure such that a central/lower portion 801 -L of a base 801 may slide into the recess to provide horizontal or lateral centering of the compliant or spring module within a slightly larger opening in the array plate while the outer edges of an upper portion 801 -U of the base 801 provide a lip that can sit on the array plate surface to provide vertical or longitudinal positioning. The other reference numbers in FIG. 8 refer to similar features as did the corresponding numbers in FIG. 6 with the exception that the numbers are incremented from the 600 series to the 800 series. Numerous variations of this embodiment are possible and include, for example: (1) the compliant or spring module being configured to engage other position or retention structures such as probe sheaths, (2) the module base and the array opening having keyed features so that loading of the compliant or spring module into an opening in an engagement structure can only be completed when the rotational orientation (e.g. about the longitudinal axis of the module) is aligned with a complementary feature associated with the recess or opening in the engagement structure, (3) the base or the array structure may be provided with tabs, spring arms, spring arms with retention hooks or other locking features, or the like, that provide for one or both of enhanced lateral alignment or centering during engagement and/or improved retention of the compliant or spring module and an engagement structure.

[77] FIG. 9 shows a compliant or spring module 900 similar to that of FIG. 8 with the exception of the compliant or spring module having a base 901 configured to abut and engage an array structure from below the array structure such that the compliant or spring module can be inserted into an opening in the array structure from below (while the compliant or spring module is in a tip-up orientation). An upper portion 901-U of the base 901 may slide into the opening to provide horizontal or lateral centering of the compliant or spring module within a slightly larger opening in the array plate while the outer edges of a lower portion 901 -L of the base 901 provide a lip that can sit on the lower surface of the array plate to provide vertical or longitudinal positioning. Variations of the embodiment of the compliant or spring module of FIG. 9 are possible and include those noted for the embodiment of FIG. 8. The other reference numbers in FIG. 9 refer to similar features as did the corresponding numbers in FIGS. 6 and 8 with the exception that the numbers are incremented from the 600 and 800 series, respectively, to the 900 series.

[78] FIG. 10 shows a compliant or spring module 1000 similar to that of FIG. 5 with the exception that the module includes a lower contact element or tip 1031 -L and associated arm 1031 -LA extending from a central portion of a base 1001 of the spring module 1000 such that the spring module 1000 is provided with two contact tips, namely a first or upper contact element or tip 1031-U and the second or lower contact element or tip 1031-L. The other reference numbers in FIG. 10 refer to similar features as did the corresponding numbers in FIG. 5 with the exception that the numbers are incremented from the 500 series to the 1000 series.

[79] FIGS. 11 - 13 provide pairs of compliant or spring modules that share a common base with one of the modules oriented upward and the other oriented downward such that two oppositely oriented contact tips are provided which are connected to independent compliant elements with each independent compliant element including two planar spring elements with the two spring elements having the same rotational orientation but with the spring elements of the separate compliant element having reversed orientations wherein the example spring modules are similar to that of FIG. 6 wherein different base structures are provided that allow for insertion into openings in an array structure from one or both directions and with or without guide features or features that provide for known lateral or longitudinal positioning.

[80] FIG. 11 provides for a probe 1100 formed from a pair of joined and oppositely oriented compliant or spring modules having a common substrate or base 1101 , separate upper and lower standoffs 1111-U and 1111-L supporting separate upper and lower pairs of planar springs 1121-2U and 1121-1 U, and 1121-1 L and 1121-2L, respectively, e.g. in the forms of spirals, which in turn are connected to associated tips 1131-U and 1131-L via respective tip arms 1131-UA and 1131-LA. Such probes may be inserted into openings in an array structure where the base may sit on a surface of the array structure, the base may float within an opening in the array structure, or the base may enter an opening in the array structure and rest on a lip within the opening of the array structure. In such uses, insertion may occur from above or below the array structure. In other uses, insertion may sandwich the bases of the probes between upper and lower array structures plates. In still other embodiments, the compliant or spring modules may be formed with or assembled with dielectric or conductive shield or skeleton structures which could form part of the probes. In still further embodiments, bonding materials such as solder may be added to selected locations on the compliant or spring modules or on any shield or skeleton structures to aid in mounting the module or probe to an array structure or bonding one of the tips to an electronic circuit element.

[81] FIG. 12 provides a similar spring module or probe 1200 configuration to that shown in FIG. 11 with the exception that a base 1201 has a bottom 1201 -L having a smaller diameter or width that a top 1201-U of the base 1201 , here and below diameter or width meaning a maximum transversal dimension of an element, e.g., the base portions, even not circular in section. Other reference numbers in FIG. 12 remain the same as noted for FIG. 11 with the exception that their series numbers have been incremented from 1100 to 1200. In particular, the probe 1200 is formed from a pair of joined and oppositely oriented compliant or spring modules having the common base 1201 , separate upper and lower standoffs 1211-U and 1211-L supporting separate upper and lower pairs of planar springs 1221-2U and 1221-1 U, and 1221-1 L and 1221-2L, respectively, which in turn are connected to associated tips 1231-U and 1231-L. All the loading possibilities noted for the FIG. 11 example apply, but preferentially the probe 1200 may be loaded into an array structure from above, with the probe 1200 being in an up-facing configuration as shown in FIG. 12, particularly when the array structure has an opening larger than the bottom 1201-L of the base 1201 but smaller than the top 1201-U of the base 1201 such that the bottom 1201-L of the base 1201 and the walls of the opening in the array structure provide for some degree of lateral alignment when inserted (i.e. alignment perpendicular to the longitudinal axis of the probe 1200 or perpendicular to the primary compressional axis of the probe 1200) while the top 1201-U of the base 1201 provides for longitudinal alignment (i.e. known stopping location, or alignment, along the length of the probe 1200 from tip-to-tip). In the present embodiment, as in the other illustrated embodiments, it is assumed the base 1201 has a circular configuration so that any rotational alignment upon insertion is possible, but in other embodiments (particularly if the tips of the spring modules or probe are not centered), other configurations may be provided for the base 1201 and for the openings in an array structure such that rotational orientation of the probe 1200 and the array structure are ensured (e.g. (1) a square configuration could limit full insertion to four possible orientations, (2) an equilateral triangular configuration may limit full insertion to three orientations, (3) a rectangular or oval configuration may limit full insertion to two orientations, or (4) a non-equilateral triangular configuration may limit full insertion to a single orientation. Tabbed, notched, or other configurations may also be used to limit full insertion to a single orientation.

[82] The probe 1300 of FIG. 13 is similar to that of FIG. 12 with the exception that a base 1301 is provided with three distinct longitudinal levels as opposed to two such levels as in FIG. 12 and where common reference numbers in FIG. 13 remain the same as those noted for FIGS. 11 and 12 with the exception that their series numbers have been incremented from 1100 or 1200 to 1300. In particular, the probe 1300 is formed from a pair of joined and oppositely oriented compliant or spring modules having the common base 1301 , separate upper and lower standoffs 1311-U and 1311-L supporting separate upper and lower pairs of planar springs 1321-2U, 1321-1 U, and 1321-1 L, 1321-2L, respectively, which in turn are connected to associated tips 13231-U and 1331-L. A smaller diameter base configuration is provided at an upper portion 1301-U and a lower portion 1301 -L of the base 1301 with a central or middle portion 1301-M having a larger diameter such that insertion of modules or probes can occur from above or below an array structure while still providing full engagement while avoiding the disadvantage that could occur if right-side-up or upside-down probe loading inadvertently occurred. In some usage embodiments, a plurality of probes may be sandwiched between a lower and upper array structure where both structures may benefit from both of the upper and lower longitudinal and lateral alignment features of the probe base. In still other embodiments, precautions or configurational changes may limit the ability for inverted loading of modules.

[83] FIG. 14 provides a side view of a partially formed array 1499 with three probes 600, corresponding to the embodiment shown in FIG. 6, only as an example, at different stages of mounting to an array plate 1440 where the array plate 1440 may be a dielectric, a conductor, a dielectric with conductive traces or conductive vias (e.g. a space transformer), or a conductive plate with dielectric regions that provide electrical isolation or selected connection to individual or groups of probes. The probes 600 may be mounted to the array plate 1440 using an adhesive, solder, solder with regions of solder masking material, ultrasonic bonding, laser welding, brazing, or the like. Probes 600 may be loaded onto the array plate 1440 one at a time or in groups. Probe modules or probes may be formed with desired array spacings and temporarily or permanently held together by conductive tethers or dielectric tethers.

[84] FIG. 15 is similar to that of FIG. 14 with the exception that the array 1599 includes an array structure 1540 that is provided with recesses 1541 for receiving probe modules or probes 600. Such recesses 1541 may be useful in helping to ensure proper probe positioning and possibly rotational alignment if necessary. The recesses 1541 may be formed with vertical side walls, with sloped side walls, or a combination of the two to aid in insertion. In some embodiments, bases 601 of the probe modules or probes 600 may alternatively or additionally have sloped sidewalls to aid in insertion and alignment. [85] FIG. 16 provides a side view of an array 1699 being formed with the loading of probes 800 of FIG. 8, as an example, into an array structure 1640 having through holes 1641 where three probes 800 are shown at different stages of loading with the bottom portion 801 -L of the base 801 providing lateral alignment and the upper portion 801 -U of the base 801 providing a lower lip which rests against an upper surface 1640A of the array structure 1640 to provide longitudinal alignment or a longitudinal stop.

[86] FIG. 17 provides a side view of an array 1799 being formed with the loading of probes 900 of FIG. 9, as an example, into an array structure 1740 having through holes 1741 into which three probes 900 are shown at different stages of loading with the upper portion 901- U of the base 901 providing lateral alignment and the lower portion 901 -L of the base 901 providing an upper lip which rests against a lower surface 1740B of the array structure 1740 to provide longitudinal alignment or a longitudinal stop.

[87] FIG. 18A provides a view of the upper surface of an example three-by-three array structure 1840 with circular through holes 1841 (1 ,1) to 1841 (3,3) along with cut lines 18B- 18B and 18C-18C that reflect cross-sectional positions or thin slices of the array plate and their viewing directions as shown in FIGS. 18B and 18C. In variations of this example, numbers of holes, diameters of holes, sizes of holes, hole shapes, hole positions, general array layout, and the like may be varied to match requirements for mating with a particular device or grid of devices to be tested (i.e. , DUTS).

[88] FIG. 18B provides a cut view of the array structure 1840 of FIG. 18A along cut line 18B - 18B along with three probes 1200, corresponding to the probes of FIG. 12, only as an example, being loaded into the three openings at different stages of loading to provide a partially formed array 1899. The probes 1200 include a base 1201 having a bottom or lower portion 1201 -L with a smaller diameter or width than a top or upper portion 1201-U, diameter or width meaning a maximum transversal dimension of the base portions, even not circular in section.

[89] FIG. 18C shows a similar cut view of the array 1899 to that of FIG. 18B, along line 18C - 18C, with the exception that the three probes 1200 have been loaded into their respective openings 1841 and with the lower portion 1201 -L of the probe bases 1201 providing lateral alignment and the upper portion 1201-U of the bases 1201 providing a lip which engages the upper surface 1840A of the array structure 1840 to provide longitudinal alignment.

[90] FIG. 18D illustrates an assembled array configuration similar to that of FIG. 18C with the exception that the array structure 1840 includes a lower array structure 1840-L and an upper array structure 1840-U such that the probes 1200, in particular their bases 1201 , are clamped between the structures from below and above. In particular, the lower array structure

1840-L includes openings able to house the bottom or lower portions 1201 -L of the bases 1201 of the probes 1200 and the upper array structure 1840-U comprises a first portion 1840-U 1 including openings able to house the upper portion 1201-U of the bases 1201 of the probes 1200 and a second portion 1840-U2 superimposed to the first portions 1840-U1 and including openings having a width less that the width of the openings defined in the first portions 1840-U1 so as to clamp the bases 1201 of the probes 1200. Also in this case, the bottom or lower portion 1201 -L of the base 1201 of each probe 1200-A has a smaller diameter or width than a top or upper portion 1201-U, diameter or width meaning a maximum transversal dimension of the base portions, even not circular in section.

[91] FIG. 18E illustrates an assembled array configuration that uses an array structure 1840 including two array structures to hold probes 1200-A with one of the array structures (e.g. a guide plate), in particular a first or lower array structure 1840-L engaging the probes near their lower ends 1231-L while the other array structure (e.g. a guide plate), in particular a second or upper array structure 1840-U engages the probes near their upper ends 1231-U wherein the probes are a modified version of the probes 1200 of FIG. 12 wherein the modification includes the addition of probe structures 1817-L and 1817-U which are framing elements that effectively provide a frame or sheath structure through which the compliant element forming each of the probe modules can deform during compression of the tips 1231-U, 1231-L toward one another, the probe module provided with the framing elements being housed in openings of the upper and lower array structure 1840-U, 1840-L.

[92] FIGS. 18F1 and 18F2 illustrate a group of three probes that are ready for assembly with an array structure (FIG. 18F1) and after such assembly has occurred (FIG. 18F2) wherein the probes 1200 are similar to that of FIG. 12 and where the array structure 1840-L includes retention or alignment spring structures 1840-S that compress upon insertion of lower portion 1201 -L of the probe base 1201 into the openings in the array structure 1840-L yielding compressed spring retention structures 1840-CS to help hold the probes 1200 in position in their appropriate array locations. In alternative embodiments, spring-type retention or alignment structures may be formed as part of probes instead of part of an array structure. In still other embodiments, spring elements may be formed at multiple locations laterally around the probes or along the longitudinal length of the probes.

[93] Modules and probes may be formed using only multi-layer, multi-material electrochemical methods as disclosed herein, partially using multi-layer, multi-material electrochemical methods as disclosed herein or using some other method that does not involve electrochemical fabrication methods. When formed using electrochemical methods, probes may be built up by deposition of material such that upon completion of deposition and separation of any sacrificial material, a resulting configuration occurs: (1) a fully assembled probe array is formed, (2) a partially assembled probe array is formed with all or a portion of the array elements formed as part of the same build up process or as part of a build substrate, e.g. with all elements positioned and aligned for final movement from build locations to working locations, or (3) individual components formed separately or together but unaligned which can thereafter undergo an automated or manual assembly into operational probes. [94] FIG. 18G provides three example layer configurations (Examples A, B, and C) that may be used in forming the probe 1200 of FIG. 12, only by way of example. In Example A, the probe 1200A is formed from 12 layers with each formed with one or more structural materials, with the layers having different thickness, and with the layer levels dictated by longitudinal (z-direction) geometric changes that require different patterning for the successful formation of the probe structure. In Example B, the probe 1200B is formed with 17 layers with different build levels formed with multiple layers so that the layer thicknesses become more uniform. What were layers 1 , 5, 6, 8, and 12 of Example A respectively become layers 1 & 2, 6 & 7, 8 & 9, 11 & 12, and 16 & 17 of Example B. In Example C, the probe 1200C is formed with 26 layers with each layer having the same thickness. For example, what were layers 1 & 2 of Example B are now formed as layers 1 - 3 and what were layers 6 & 7 of Example B are formed as layers 7 - 10 of Example C. In other embodiments, different layer numbers and configurations may be used.

[95] FIG. 19 provides a side view of a spring module 1900 similar to those of some of the previous embodiments (with like reference numbers representing similar features with the exception of updates to series numbers), with two primary exceptions: (1) the spring module 1900 has a single planar spring element 1921 (e.g. in the form of a spiral) and (2) a downward facing tip 1931 -L that extends from a lower surface of a base 1901 of the spring module 1900 to provide a contact surface. A standoff, bridge, or support 1911 bridges a longitudinal module gap between the spring element 1921 and the base 1901.

[96] FIG. 20 provides a side view of a module 2000 including a standoff 2011 that supports an upper compliant element 2021-U having two longitudinally spaced planar spring elements 2021-1 U and 2021-2U and a lower compliant element 2021-L having two longitudinally spaced planar spring elements 2021-1 L and 2021-2L that join to respective tip arms 2031 -UA and 2031 -l_A which each in turn are coupled to respective tips 2031 -U and 2031-L. In other alternative embodiments, other compliant element arrangements may be used to engage upper and lower tips, tips may or may not be centered, and tips may have different conf igurations to those shown. For example, tips may have (1) single points, (2) elongated structures, (3) open structures or multiple points (e.g., for stably engaging bumps), (4) structures with curved upper or lower surfaces, and (5) the like. As shown in FIG. 20, the spring element 2021-1 U has a first portion 2021-1 UB functionally joining the standoff 2011 and a second portion 2021-1 UF functionally joining the first tip arm 2031-UA, and the spring element 2021-2U has a first portion 2021-2UB functionally joining the standoff 2011 and a second portion 2021-2UF functionally joining the first tip arm 2031-UA. The first tip arm 2031-UA directly or indirectly holds the first tip 2031 -U that extends longitudinally beyond a first end of the standoff 2011 when the upper compliant element 2021-U is not biased. The spring element 2021-1 L has a first portion 2021-1 LB functionally joining the standoff 2011 and a second portion 2021-1 LF functionally joining the second tip arm 2031-LA, and the spring element 2021-2L has a first portion 2021 -2LB functionally joining the standoff 2011 and a second portion 2021 -2LF functionally joining the second tip arm 2031 -LA. The second tip arm 2031 -LA directly or indirectly holds the second tip 2031 -L that extends longitudinally beyond a second end of the standoff 2011 when the lower compliant element 2021-L is not biased. The upper compliant elements 2021-1-U, 2021-2-U thus move together upon longitudinal compression of the first tip 2031-U toward the second tip 2031-L, and the lower compliant elements 2021-1-L, 2021-2-L move together upon longitudinal compression of the second tip 2031-L toward the first tip 2031- U.

[97] FIGS. 21 A - 21 C provide, respectively, a sideview of a module or probe 2100 according to an embodiment of the present disclosure (FIG. 21A), a cut view through a downfacing engagement or retention structure 2131 -R, e.g. a ring as shown (FIG. 21 B) of the module, and a side view of two laterally aligned longitudinally stacked modules (FIG. 21 C) that engage one another via the base as laterally bounded by the interior region of the ring forming a lower surface of an upper probe module 2100-U and a tip on an upper portion of a lower probe module 2100-L such that even under deflection, the two probe modules will remain engaged with one another without excessive lateral slippage or misalignment occurring. In FIG. 21 C, the retention structure 2131-R is shown as partially transparent such that a tip 2131 -L of the lower probe module 2100-L can be seen through the side of the retention structure 2131-R as it extends into the opening inside the ring configuration of the structure. With the exception of the ring-like retention structure 2131-R extending from a bottom of a base 2101 of each probe module 2100-U, 2100-L, the probe module is similar to the spring module 1000 of FIG. 10 with similar reference numbers being used to represent similar features with the exception of the series number being changed from 1000 to 2100. In other embodiments, different fully enclosed retention structure configurations may be used. In still other embodiments, the fully enclosed retention structure may be formed on a module tip while a base may have a structure extending therefrom that engages such fully enclosed retention structure. In still other alternative embodiments, the base may include a recess into which a tip of an adjacent module can be engaged.

[98] FIGS. 21 D and 21 E provide variations of the probe of FIG. 21 C wherein a pair of probe modules 2100-A1 and 2100-A2 that make up the probe of FIG. 21 D have different configurations from each other and different configurations from that of probe module 2100 of FIG. 21 A. The variations provide exoskeletal or frame structures 2151 and openings 2152 that provide relative engagement so that the two probe modules 2100-A1 and 2100-A2 can elastically move longitudinally while maintaining lateral alignment and orientation due to the frame structures 2151 and openings 2152 engaging. In other words, the frame structures 2151 and openings 2152 form a structure for retaining the compliant structures of the pair of probe modules 2100-A1 and 2100-A2 in lateral alignment and inhibiting excessive lateral displacement of the compliant structures relative to one another while still allowing longitudinal compliant movement of the tips of the pair of probe modules 2100-A1 and 2100-A2 connected to the compliant structures.

[99] More particular, according to the embodiment shown in FIG. 21 D, one of the probe modules, e.g., the first or upper probe module 2100-A1 includes a frame structure 2151 connected to its base 2101 and defining openings 2152 in correspondence of sides of the upper probe module 2100-A1 , while the other of the probe modules, e.g., a second or lower probe module 2100-A2 includes a frame 2151 in correspondence of sides of the lower probe module 2100-A2 having protruding portions 2151-X toward the upper probe module 2100-A1 able to insert into the openings 2152 of the upper probe module 2100-A1 when one of the tips of the probe is biased toward the other. The engagement of the protruding portions 2151-X of the frame structure 2151 of the lower probe module 2100-A2 into the openings 2152 of the upper probe module 2100-A1 preventing or limiting the lateral displacement of the probe modules 2100-A1 , 2100-A2.

[100] The probe of FIG. 21 E similarly includes two modules 2100-A3 and 2100-A4 that have configurations different from each other and different from those of FIGS. 21 A - 21 D and that provide endoskeletal or frame structures 2151 with openings 2101-C, 2111-C, and 2121-C that provide relative engagement so that the two probe modules 2100-A3 and 2100-A4 can elastically move longitudinally while maintaining lateral alignment and orientation. Other reference numbers in FIGS. 21 D and 21 E have the same meaning as used in FIGS. 21A - 21C and similar configurations, though some differences may exist that allow for the inclusion of the framing elements. According to this embodiment, a first or upper probe module 2100-A3 includes at least an opening 2111-C provided within its standoff 2111 and the second or lower probe module 2100-A4 includes a frame 2151 in correspondence of its standoff 2111 having a protruding portion 2151-X toward the upper probe module 2100-A3 able to insert into the opening 2111-C in the standoff 2111 of the upper probe module 2100-A3 when one of the tips of the probe is biased toward the other. The lower probe module 2100-A4 further includes additional frame structures 2151 associated with its base 2101-L, the compliant portion 2121-L of the lower probe module 2100-A4 as well as the compliant portion 2121-U and the base 2101- U of the upper probe module 2100-A3 having openings 2121-C and 2101-C able to house the additional frame structures 2151 of the lower probe module 2100-A4.

[101] Numerous alternative embodiments with endoskeletons and exoskeletons are possible and may include probes formed with more than two modules, modules that are identical to one another, or where some modules are the same and some are different. In some variations, the probe modules may include framing features not only on the probe sides as depicted in FIGS. 21 D and 21 E but framing features in the front and back as well. In some variations, a frame structure may provide a combination of endoskeletal and exoskeletal framing elements. In some embodiments, the probe modules may be formed with some or all framing elements while in other embodiments, some or all framing elements may be added in an assembly process after separate formation. In some embodiments, single framing elements may extend between more than two modules while in others, they may not.

[102] FIGS. 22A - 22C provide three views that are similar to those shown in FIGS. 21 A - 21 C for another example module 2200 wherein an engagement or retention structure 2231-R extending from the bottom of a base 2201 of the present embodiment takes the form of an arc, instead of a full ring as in FIGS. 21A - 21C, i.e. , it is an open retention structure 2231-R. The opening of the arc faces toward a standoff 2211 with the direction of the opening selected so that the existing portion of the arc is positioned to block any anticipated excess lateral movement of a tip against the base 2201 in absence of a barrier to slippage that the arc provides. In other embodiments, the configuration of the open retention structure 2231-R may take on other configurations with the open direction selected based on an anticipated direction of potential slippage between engaged modules. As in FIGS. 21A - 21C, the retention structure 2231-R is shown as being partially transparent so that a tip 2231 -L of a lower module can be seen extending to the base 2201 of an upper module to better illustrate the capturing of the tip by the arc configuration of the open retention structure 2231-R against leftward slippage of the upper tip 2231 -U of the lower module against the base 2201 of the upper module. The other reference numbers in FIGS. 22A - 22C, with the exception numbers being in the 2200 series number, identify similar features to those identified with similar reference numbers as set forth in the other figures. In some variations, not shown, instead of a protruding engagement configuration, the base 2201 may include a recess for securely providing lateral engagement with the upper tip of the lower module. In still other variations, the base 2201 of the upper module may have a hole through which a distal end of the upper tip of the lower module extends while a wider portion of the upper tip (e.g., associated with a tip arm) may provide a longitudinal stop.

[103] FIGS. 23A - 23B provide a side view of a module 2300 with a lower tip 2331-L that protrudes from a base 2301 of the module 2300 and includes a retention structure 2331 -R that may be used to engage bumps of an electronic device that is to be contacted or that may be used to engage an upper tip 2331 -U of another module as shown in the laterally aligned and longitudinally stacked modules of FIG. 23C wherein an upper tip 2331-U of a lower module 2300-L engages a lower tip 2331-L of the base 2301 of the upper module 2300-U and is laterally retained by the retention structure 2331 -R of the lower tip 2331-L so as to minimize slippage and misalignment risks during module stacking. An example of the retention structure 2331 -R configuration is shown as being ring-like in the cross-section cut view shown in FIG. 23B which is taken along cut line 23B-23B of FIG. 23A. Following the examples of FIGS. 21 A - 21C and 22A - 22C, the retention structure 2331-R is shown as being partially transparent so that the upper tip 2331-U of the lower module 2300-L can be seen extending to the tip 2331-L surface protruding from the base 2301 of the upper module 2300-U to better illustrate the capturing of the tip 2331-U of the lower module by the ring configuration of the retention structure against slippage of the upper tip 2331 -U of the lower module 2300-L against the base 2301 of the upper module 2300-U. In other embodiments, the retention structure 2331-R may function as a contact surface as well as a lateral retention structure. For example, the retention structure 2331-R may take the form of three or more protruding surfaces that can engage the slopped portions of solder bumps that are to be contacted by the tip/retention structure. In other embodiments, the retention structure 2331-R may take a polygonal form such as the square form of the lower tip of the probe of FIG. 4. The other reference numbers in FIGS. 23A - 23B, with the exception numbers being in the 2300 series number, identify similar features to those identified with similar reference numbers as set forth in the other figures. In other embodiments, different retention structural configurations may be used, some may be closed, some may be open, some may involve complementary features on both of the surfaces that are to be engaged, and some may simply involve textured surfaces that provide enhanced friction and thus provide for reduced slippage as compared to smooth surfaces. In still other embodiments, retention configurations may be replaced by direct bonding of contact surfaces to one another.

[104] FIG. 24 provides a side view of a module 2400 according to another embodiment of the present disclosure where the module 2400 does not include a rigid base but does include a pair of compliant intermediate base elements 2401 -CU and 2401 -CL that join two oppositely oriented standoffs 2411-U and 2411-L and compliant pairs of upper and lower spring elements 2421-1 U, 2421-2U, 2421-1 L, and 2421-2L which in turn support tip arms 2431- UA and 2431-LA which join upper and lower tips 2431-U and 2431-L. In this embodiment, the intermediate elements 2401 -CU and 2401-CL, in addition to connecting upper and lower independent standoffs 2411-U and 2411-L, provide a standoff functionality of their own by providing additional longitudinal separation of the upper and lower spring elements. The other reference numbers used in the drawing, with the exception of the 2400 series number, are similar to the corresponding references used in the other figures and particularly to those of FIG. 11 . The flexible base elements 2401-CU and 2401-CL may take on a variety of different forms which may or may not be similar to the tip arm supporting spring elements. For example, they may consist of thin discs, thin rings, pairs of inward rotating spirals that meet toward the lateral center of the probe or module, straight cantilever arms or bars. In some variations, the upper and lower base springs may be joined to one another by intermediate bridging elements.

[105] FIG. 25 provides a side view of probe module 2500 with a single spring element with front and back portions 2521 -F and 2521 -B supporting a tip 2531 -U where the tip 2531 -U includes a down-facing tip arm stop 2531-S that can act as a longitudinal movement stop in the event that an excessive compression force is applied to compress the tip 2531 -U and the base 2501 toward one another, the down-facing tip arm stop 2531-S engaging with an upper face of the base 2501 . Other reference numbers provided in FIG. 25 use similar numbering for similar elements to those used in the previous figures but with the series number updated to 2500. In variations of the embodiment of FIG. 25, multiple longitudinally displaced springs may join the tip 2531 -U (or tip extension) to the standoff 2511 to provide a configuration that helps the tip 2531-U maintain a more vertical or longitudinal orientation upon longitudinal compression of the tip 2531-U and the base 2511 as well as to help tailor the spring force of the module 2500.

[106] FIG. 26 provides a side view of probe module 2600 with a single spring element with front and back portions 2621 -F and 2621 -B supporting a tip 2631 -U and where a longitudinally protruding stop structure 2601 -S extends upward from the base 2601 such that a lower portion of the tip 2631 -U will be engaged by the stop structure 2601 -S in the event that an excessive compression force is applied to compress the tip 2631 -U and the base 2601 toward one another. Other reference numbers provided in FIG. 26 use similar numbering for similar elements to those used in the previous figures but with the series number updated to 2600. In other embodiments, stop elements may exist on both the tip 2631-U, as the embodiment of FIG. 25, as well as the base 2601. In other embodiments, other stop structures may be used. An example of such alternative structures may include a standoff of one module being configured to contact a base of another module. As with other configurations, one or more additional spring elements may be mounted to the standoff and be longitudinally connected to the first compliant or spring element by a tip extension or tip arm.

[107] FIGS. 27A - 27B provide a side view and a cut view of a module 2700 according to another embodiment of the present disclosure where a base structure 2701 supports two laterally opposed standoffs 2711-1 and 2711-2 which each in turn support two spiral compliant spring elements 2721-1 F and 2721-2F, starting on the left, and 2721-1 B and 2721-2B, starting on the right, such that a movable central tip 2731 -U, joined to a tip arm 2731 -UA, is supported on each side by a spring force such that any tilting bias upon compression of the tip structure is reduced. In other embodiments, different numbers of longitudinally spaced support springs may exist (e.g., 1 spring, 2 springs, or more), and different numbers of support springs per longitudinal level may be used with their connection points having an appropriate angular orientation (e.g., three elements separated by 120°, four elements separated by 90°, or the like). Different springs may have different thicknesses, different widths, or may vary in width or thickness from one end to another. In some embodiments, more than two standoffs may be used particularly when there are more than two spring elements per longitudinal level. In still other embodiment variations, the multiple standoffs may be joined to form a single standoff with a ring-like configuration with multiple springs extending therefrom at a given longitudinal height. In still other variations, a single spring (e.g., a spiral spring may extend from any given longitudinal height but with spring elements extending from different peripheral standoffs or from different lateral locations on a single standoff such that the central tip/tip arm is supported from different directions by two or more springs. In still other variations, multiple springs (e.g., 2 or more) may extend from different lateral locations of one or more standoffs at any given longitudinal level with two or more sets of springs extending from different lateral positions at different longitudinal levels. For example, with two sets of longitudinally separated spring pairs, a central probe tip may be supported from four different lateral standoff positions when peripheral starting points of the springs are at different lateral positions or with two sets of longitudinally separated spring triplets, a central probe tip may be supported from six different lateral standoff positions when peripheral starting points of the springs are at different lateral positions. Moreover, the base 2701 may comprise a pair of compliant intermediate base elements that connect the two standoffs and act as a longitudinal separation element, similarly to the embodiment of FIG.24.

[108] FIG. 28A provides a side view of a probe 2800 according to another embodiment of the present disclosure where the probe 2800 is formed from two back-to-back (or base-to- base) modules similar to the module of FIGS. 27A - 27B where the two modules share a common base 2801 that has an annular configuration and acts as a longitudinal separation element. FIG. 28A provides a side view of spring module, or probe, 2800 that includes a common base structure 2801 that supports two upper, laterally opposed standoffs 2811-1 and

2811-2 along with two lower, laterally opposed standoffs 2812-1 and 2812-2 as well as providing a standoff functionality of its own by providing additional longitudinal separation of upper and lower spring elements. According to an alternative embodiment, the common base 2801 may comprise a pair of compliant intermediate base elements that connect the two upper and lower standoffs, 2811-1 , 2811-2 and 2812-1 , 2812-2 and act as a longitudinal separation element, similarly to the embodiment of FIG.24.

[109] The upper standoffs 2811-1 and 2811-2 each in turn support an upper compliant element 2821 including two spiral compliant spring elements 2821-1 and 2821-2 having portions 2821-1 F and 2821 -2F starting on the left and 2821-1 B and 2821 -2B starting on the right, respectively, such that a movable central tip arm 2831-UA and tip form an upper tip structure 2831 -U which is supported by a spring force from four springs originating at two longitudinal levels and from two opposing lateral positions such that any tilting bias upon compression of the upper tip structure 2831 -U is reduced. The portions starting on the right or first portions 2821-1 B and 2821-2B of the spring elements 2821-1 and 2821-2 functionally join the upper standoff 2811-1 , and the spring elements 2821-1 and 2821-2 have second portions 2821-1 F and 2821-2F functionally joining the upper tip arm 2831-UA that can elastically move relative to the upper standoff 2811-1 . The upper tip arm 2831-UA directly or indirectly holds the upper tip 2831 -U that extends longitudinally beyond the upper end of the upper standoff 2811-1 when the upper compliant element 2821 is not biased. Similarly, the lower standoffs 2812-1 and

2812-2 each in turn support a lower compliant element 2822 including two spiral compliant spring elements 2822-1 and 2822-2 having portions 2822-1 F and 2822-2F, starting on the left, and 2822-1 B and 2822-2B, starting on the right, respectively, such that a movable central tip arm 2831 -l_A and a tip form a lower tip structure 2831 -L which is supported on each side by a spring force such that any tilting bias upon compression of the lower tip structure 2831 -L is reduced. The portions starting on the right or first portions 2822-1 B and 2822-2B of the spring elements 2822-1 and 2822-2 functionally join the lower standoff 2812-1 , and the portions starting on the left or portions 2822-1 F and 2822-2F of spring elements 2822-1 and 2822-2 functionally join the lower tip arm 2831 -LA that can elastically move relative to the lower standoff 2812-1. The tip arm 2831-LA directly or indirectly holds the lower tip 2831-L that extends longitudinally beyond the lower end of the lower standoff 2812-1 when the lower compliant element 2822 is not biased. As shown in FIG. 28A, the first portions 2821-1 B, 2821- 2B, 2822-1 B and 2822-2B of the upper and lower compliant elements 2821 and 2822 are longitudinally spaced from one another by the standoffs 2811-1 and 2812-1. Upon biasing of at least one of the tips 2831 -U and 2831-L toward the other, the second portions 2821-1 F, 2821- 2F, 2822-1 F and 2822-2F of the upper and lower compliant elements 2821 and 2822 move longitudinally closer together.

[110] In other embodiments, different numbers of longitudinally separated spring structures may exist on the top and the bottom, and the numbers may be different between the top and the bottom. For example, a single pair of springs at the same longitudinal level may support the upper tip or the lower tip. Three or more springs may support one or both of the lower tip and the upper tip. Different numbers of support springs at the same longitudinal level may be used with their connection points having an appropriate angular orientation (e.g., three elements separated by 120°). In still other embodiments, some amount of tilt or lateral movement of tip elements may be targeted so as to provide scrubbing to improve contact between tips and contact pads that they contact during use. Different springs may have different thicknesses, different widths, or may vary in width or thickness from one end to another. Springs at different longitudinal levels may have different rotational orientations relative to the longitudinal axis of the probe (e.g., some counterclockwise and some clockwise). At any given longitudinal level, the spring or springs may be supplied in different numbers or with different tip or standoff connection locations relative to such locations at another longitudinal level. Upper tips and lower tips may have tips that are laterally offset from one another, or they may be vertically aligned in the center of the probe or shifted away from the longitudinal center of the probe. Tips may have different configurations than those shown and may be formed of the same material as the spring structures or may be formed of a different material. Upper and lower standoffs, springs, and tips may have different configurations and may include hard and/or soft stop elements that provide some protection against overloading via compression. In other variations, the probes may be provided with dielectric and/or conductive coatings or shielding to improve electrical isolation, controlled current flow paths, and/or high frequency operation.

[111] According to another embodiment, one of the compliant elements may comprise two co-planar cantilever springs at a same longitudinal height that are laterally interleaved with one another and are attached to a tip arm and with each being attached to laterally displaced locations on at least one standoff, the laterally displaced locations being located on two laterally separated portions of the at least one standoff that are in turn functionally and rigidly connected to one another via at least one laterally extending bridge element.

[112] Moreover, the first planar compliant element 2821 may comprises at least two co-planar springs each have an inward rotating spiral configuration that couples the at least one standoff 2811-1 , 2811-2 to the first tip arm 2831-UA wherein the spiral has a configuration selected from the group consisting of: (i) a circular spiral, (ii) a rectangular spiral, (iii) a hexagonal spiral, (iv) an octagonal spiral, (v) a counterclockwise rotating inward spiral, (vi) a clockwise inward rotating spiral, and (vii) a spiral having a radially extending connection to the first tip arm 2831-UA.

[113] Similarly, the second planar compliant element 2822 may comprise at least two inward rotating spirals that extend from different portions of the at least one standoff 2812-1 and join the second tip arm 2831 -l_A, wherein the spirals each have a configuration selected from a group consisting of: (i) an inward rotating circular spiral, (ii) an inward rotating rectangular spiral, (iii) an inward rotating hexagonal spiral, (iv) an inward rotating octagonal spiral, (v) an inward rotating counterclockwise spiral as observed looking from the second tip end 2831 -L toward the first tip end 2831 -U, and (vi) an inward rotating clockwise spiral as observed looking from the second tip end 2831 -L toward the first tip end 2831 -U.

[114] FIGS. 28B - 28N, respectively, provide top layer views of each of 13 cross- sectional configurations, or layers L1 - L13, from which the probe or module 2800 can be formed using, for example, a multi-layer, multi-material electrochemical fabrication process. Each of FIGS. 28B - 28N includes a dashed comparison feature 2809 which provides a figure- to-figure (i.e. , layer-to-layer) stacking reference for lateral cross-sectional alignment purposes so that the reader can more confidentially see such alignment. More particularly, FIGS. 28B - 28N provide cross-sectional views of successive layers of structural material of the probe of FIG. 28A with views of the tips, the springs, and the standoffs shown with different hatching patterns where upward movement of the lower tip biases the central portion of the lower (connected) springs upward, and downward movement of the upper tip biases the central portion of the upper (connected) springs downward. Features of FIGS. 28B - 28N are identified using similar reference numbers as used in FIG. 28A and using identifiers that similar to those used with the other figures herein where the series number is set at 2800. In the embodiment of probe 2800, it can be seen that the proximal or interior upper and lower spring portions or beams 2821-1 B, 2821-1 F, 2822-1 B, and 2822-1 F, having end portions 2821-E and 2822-E, are surrounded, enclosed, or encapsulated by standoff material from the sides as well as from above and below which may provide a junction of the beams and standoffs with a stronger bond particularly if the beams and the standoffs are made from different materials or are formed separately from one another and then attached. The ends of the more longitudinally distal or exterior spring portions or beams 2821-2 B, 2821-2F, 2822-2B, and 2822-2F are only partially encased in standoff material (i.e., on the sides and the interior portions not the exterior portions) though they may be more fully encased in other embodiments by covering the distal regions with standoff material as well. In other alternatives, it may be acceptable not to use such encapsulation on the ends of either the proximal spring beams or the distal spring beams (e.g., neither may held by widen regions of standoff material).

[115] Numerous additional variations of the embodiment of FIGS. 28A - 28N are possible and include, for example: (1) use of planar springs having different configurations than the inward counterclockwise rotating rectangular spirals as shown; (2) probes of different heights; (3) probes of different widths; (4) probes of similar lateral extents in both X and Y (e.g. with an aspect ratio of X/Y in the range of 5 to 1/5, in the range of 3 to 1/3, in the range of 2 to¹X, in the range of 3/2 to 2/3, or even in the range of 1 .1 to 0.9; (5) probes with similar heights and maximum lateral extents (aspect ratio of Z/X or Z/Y in the range of 5 to 1/5, in the range of 3 to 1/3, in the range of 2 to¹X, in the range of 3/2 to 2/3, or even in the range of 1 .1 to 0.9; (6) different numbers of longitudinally separate spring elements; (7) adding in features that provide for over travel stops to minimize risk of probe damage; (8) use of a single type of material for all elements including standoffs, springs, tip-arms, and tips; (9) use of at least two different materials for different functional portions of the probe; (10) inclusion of dielectrics; (11) inclusion of abrasion resistant materials as contact elements or in regions where abrasive rubbing and associated wear may be a problem; (12) inclusion of conductive shields to improve probe performance in certain applications; (13) formation using a different number of layers, e.g. using single layers to form L5 & L6 and/or L8 & L9 or using multiple layers to form one or both of L1 & L13; (14) providing a base having a different configuration and/or standoffs with different configurations; (15) providing the base with a configuration and central opening that is sufficient to allow spring movement into the opening such that the separate standoffs may be shortened in height or even eliminated in favor of a probe base that provides complete or partial standoff functionality; and/or (16) features mentioned with regard to other embodiments, their alternatives, and/or features of prior art probes.

[116] FIGS. 29A1 - 29A2 provide a pair of different side views along two different perpendicular axes that illustrate a probe 2900 according to another embodiment of the present disclosure while FIGS. 29B - 29L provide top views of eleven planar layers from which the probe of FIGS. 29A1 and 29A2 can be formed wherein the springs and tips of probe 2900 are oppositely, or cross, connected such that inner most portions of the upper and lower spring elements separate upon tip compression as opposed to moving closer together as was the case for probe 2800 of FIGS. 28A - 28N. In the views of FIGS. 29A1 and 29A2, the longitudinal axis of the probe is the Z-axis and extends upward along the page while the horizontal or lateral axes of the probe are the X and Y axes.

[117] The probe 2900 of FIGS. 29A1 - 29A2 includes: (1) a lower central contact tip 2931 -L that joins a central upper spring element 2921 -U via a tip extension or tip arm 2931 -l_A, (2) an upper contact tip element 2931 -U that is connected to an upper bridge 2931 -UB that in turn connects to a pair of tip extensions or tip arms 2931 -UA that join to central portions of a pair of lower coplanar spring elements 2921-L, and (3) two upper standoffs 2911 and two lower standoffs 2912 that are joined to one another by a common base or frame 2901 in the form of a central annular rectangular ring element acting as a longitudinal separation element and wherein the two upper standoffs 2911 and the two lower standoffs 2912 support the outermost ends of pairs of co-planar inward rotating, planar, spiral, upper and lower spring elements 2921- U and 2921-L. FIG. 29A1 provides a side view of the sample probe 2900 looking along the positive Y-axis (i.e. an X-Z plane view) while FIG. 29A2 provides a side view of the sample probe 2900 looking along the positive X-axis (i.e. a Y-Z plane view) with each figure also illustrating various portions, or layers L1 - L11 , of the probe 2900 that are shown in FIGS. 29B - 29L using labels L1 - L11 along with brackets showing the longitudinal extent of each layer. The bridge element 2931-UB and pair of tip arms 2931-UA are better seen in FIG. 29A2 as much of their configuration is masked or hidden in the view of FIG. 29A1 . When probe 2900 is put to use, upward movement of the lower tip biases the central portion of the upper (connected) springs upward, and downward movement of the upper tip biases the central portion of the lower (connected) co-planar springs downward, thus causing a larger separation between the springs upon relative compression of the tips toward one another.

[118] FIGS. 29B - 29L, respectively, provide top layer views looking down along the Z- axis of each of 11 cross-sectional configurations, or layers L1 - L11 , from which the probe 2900 can be formed using, for example, a multi-layer, multi-material electrochemical fabrication process. Each of FIGS. 29B - 29L include a dashed alignment element 2909 which provides a lateral reference that may be aligned from figure-to-figure, or layer-to-layer, for conceptual, lateral alignment or registration purposes. Features of FIGS. 29B - 29L are identified using similar reference numbers as used in FIG. 29A1 and 29A2.

[119] The first layer L1 of probe 2900 provides a lower length of a tip portion of the probe including a lower contact portion of the tip 2931 -L (FIG. 29B). The second layer L2 provides an additional portion of the tip, i.e., a portion of a tip arm 2931-LA, along with a lower bounding portion of an optional pair of lower standoffs 2912 that help encapsulate the ends 2921-E of both lower spring elements 2921-L (shown in FIG. 29D) within a body of standoff material (FIG. 29C). The third layer L3 provides additional standoff material along with an opening in the standoff material that holds the outermost ends 2921-E of the two coplanar spiral spring elements 2921-L. The two spring elements 2921-L are shown as rotating in the same direction (counterclockwise from outer most lateral extents to inner most lateral extents) and whose inner ends are located at two separate locations for engaging with the two upper tip arm elements 2931-UA (FIG. 29D). The third layer L3 also includes a central region of lower tip arm material 2931-LA that extends through the spring elements uninterrupted. The fourth layer L4 includes a cross-section that provides additional regions of lower standoff material 2912, two separate regions of upper tip arm material 2931-UA, and a region of lower probe tip arm material 2931-LA (FIG. 29E). The fifth layer L5 includes a central rectangular, annular frame structure 2901 along with an opening for passing the two continuing regions of upper tip arm material 2931-UA and a central region of lower tip arm material 2931-LA (FIG. 29F). The sixth layer L6 provides a similar pattern of structural material to that of the fourth layer (FIG. 29G). The seventh layer L7 provides structural material in the form of two inward rotating, upper, spiral spring elements 2921 -U that have outer portions that are embedded in upper standoff material 2911 (and are bounded from below by standoff material on that layer and will be bounded from above by additional standoff material so as to provide for their complete encapsulation) and inner portions that join an uppermost portion of the lower tip arm 2931-LA (FIG. 29H). The seventh layer L7 also provides two continuing regions of upper tip arm material 2931-UA. The eighth layer L8 provides two regions of upper standoff material 2911 that cap the standoff and outer portions of the upper spring elements 2921 -U of the prior layer. The eighth layer L8 also provides two continuing regions of upper tip arm material 2931-UA (FIG. 29I). The ninth layer L9 provides an additional level of material for the two upper tip arms 2931-UA (FIG. 29J) while the tenth layer L10 provides a region of upper bridge material 2931- UB that joins the two upper tip arms 2931-UA (FIG. 29K). The eleventh, and final, layer L11 provides an upper length and contact portion of an upper tip 2931 -U (FIG. 29L). During operation of probe 2900, involving the relative compression of the probe tips toward one another, the relative displacement of the inner portions of the upper and lower spring elements 2921-U and 2921-L becomes larger, not smaller, as was the case for the previous embodiments set forth herein. In some variations of the embodiment of FIGS. 29A1 - 29L, the standoffs may be replaced by an appropriately configured base structure that provides side-to- side lateral joining as well as sufficient longitudinal functionality to allow probe operation and monolithic probe formation (i.e. , formation without assembly other than layer-to-layer build-up).

[120] FIGS. 30A1 - 30J provide a pair of different side views (FIGS. 30A1 - 30A2) along with nine top layer views (FIGS. 30B - 30J) of a probe 3000 according to another embodiment of the present disclosure wherein the probe 3000 operates in a manner similar to that of the probe 2900 of FIGS. 29A1 - 29L but with the rectangular ring-like frame structure and the associated standoffs replaced with a central connecting structure, base, or standoff such that outermost portions of the springs move relative to one another in association with tip displacement as opposed to the inner most portions undergoing such movement. Like the operation of the probe 2900, portions of the lower and upper spring elements of the probe of the present embodiment separate during relative tip compression.

[121] The example probe 3000 shown in the Y-Z plane side view of FIG. 30A1 and in the X-Z side view of FIG. 30A2 shows the probe with a vertical longitudinal axis (i.e. the Z-axis) and illustrates (1) a lower central contact tip element 3031 -L that is connected to a lower bridge 3031-LB that joins laterally displaced portions of a pair of coplanar, upper spring elements 3021-U via two laterally displaced tip extensions or tip arms 3031-LA, (2) an upper contact tip element 3031 -U that is connected to an upper bridge 3031 -UB that in turn connects to a pair of tip extensions or tip arms 3031 -UA that join laterally displaced portions of a pair of lower coplanar spring elements 3021-L, and (3) a central standoff 3011 that joins and supports the innermost ends of the coplanar pair of upper, outward rotating, planar, spiral, spring elements 3021-U and the coplanar pair of lower outward rotating, planar, spiral, lower spring elements 3021-L. The central standoff 3011 may be at least part of an internal frame structure and provides longitudinal separation of upper and lower spring elements, acting as a longitudinal separation element like the common base of the embodiment of FIG. 28A. FIG. 30A1 provides a side view of the sample probe 3000 looking along the positive Y-axis while FIG. 30A2 provides a side view of the sample probe 3000 looking along the positive X-axis. The bridge elements can be seen in FIG. 30A1 but are masked by the tip arm elements (more like tip arm panels in this embodiment) in FIG. 30A2. When probe 3000 is put to use, upward movement of the lower tip 3031-L biases the peripheral portions (i.e. the portions most remote from the central axis of the probe) of the upper coplanar springs 3021-U upward, and downward movement of the upper tip 3031-U biases the peripheral portions of the lower coplanar springs 3021-L downward, thus causing a larger separation between the peripheral portion of springs upon tip compression. FIGS. 30A1 and 30A2 also provide brackets and references indicating the longitudinal extents of each of the nine layers (30B - 30J) from which probe 3000 of the present example, is formed.

[122] FIG. 30A3 provides a side view of a probe 3000-A which is a variation of probe 3000 illustrating six optional stop features that may be incorporated into the probe individually or in combination: (1) a horizontal stop feature 3031 -UAHS attached to one or both of the tip arms 3031-UA connected to the upper bridge 3031-UB that moves with the lower spring that may act as a movement stop when it encounters the upper end of a tip arm 3031-LA of the lower bridge 3031 -LB or an associated feature, (2) a horizontal stop feature 3031 -UBS attached to the upper bridge 3031- UB that moves with the lower spring that may act as a movement stop when it encounters the upper end of a tip arm 3031-LA of the lower bridge 3031 -LB or an associated feature, (3) a vertical stop feature 3031 -UAVS attached to one or both of the lower portions of the tip arms 3031-UA connected to the upper bridge 3031-UB that moves with the lower spring that may act as a movement stop when it encounters a feature associated with the lower bridge 3031 -LB or one or both of the tip arms 3031-LA, 3031-UA, (4) a horizontal stop feature 3031 -LAHS attached to the lower bridge 3031 -LB that moves with the upper spring that may act as a movement stop when it encounters the lower ends of the tip arms 3031-UA connected to the upper bridge 3031-UB or an associated feature, (5) a horizontal stop feature 3031 -LBS attached to the lower bridge 3031 -LB that moves with the upper spring that may act as a movement stop when it encounters the lower end of the tip arms 3031-UA connected to the upper bridge 3031-UB or an associated feature, (6) a vertical stop feature 3031 -LAVS attached to upper portions of one or both of the tip arms 3031-LA connected to the lower bridge 3031-LB that moves with the upper spring that may act as a movement stop when it encounters a feature associated with the upper bridge 3031 -UB or one of the tip arms 3031 -UA connected to the upper bridge 3031-UB. In some embodiments, all such stop features may be used while in others, less than all such features may be used or even no such features used. In still other alternatives, stop features may take on different configurations and/or be attached to different portions of the probe (e.g. features could extend vertically from the upper or lower portion of the base or from the central portion of the springs attached thereto or downward from the central portion of the upper bridge or upward from the central portion of the lower bridge to act as stops when they engage opposing features as tip-to-tip compression occurs).

[123] FIGS. 30B - 30J, respectively, provide top layer views of each of 9 cross- sectional configurations, or layers L1 - L9, from which the probe 3000 can be formed using, for example, a multi-layer, multi-material electrochemical fabrication process. Each of FIGS. 30B - 30J include a dashed alignment element 3009 which provides a conceptual, lateral stacking alignment or registration reference for the structural material of successive figures. More particularly, FIGS. 30B - 30J provide cross-sectional views of successive layers of structural material of the probe 3000. Features of FIGS. 30B - 30J are identified using similar reference numbers as used in FIG. 30A1 and 30A2.

[124] The first layer L1 provides a lower length of a tip portion of the probe including a lower contact portion of the tip 3031 -L (FIG. 30B). The second layer L2 provides an additional portion of the probe tip in the form of an extended bridge element 3031-LB (FIG. 30C). The third layer L3 provides a pair of displaced lateral tip extension or tip arm elements 3031 -LA that connect to the bridge 3031-LB of the prior layer (FIG. 30D). The fourth layer L4 continues to provide a pair of displaced lateral lower tip arm elements 3031 -LA that connect to the arm elements on the prior layer. The fourth layer L4 also provides a first portion of a centrally located standoff 3011 that joins to the inner most portion of two lower outwardly rotating, interleaved co-planar spiral spring elements 3021 -L that deflect in association with the displacement on an upper tip of the probe (FIG. 30E). The fifth layer L5 continues to provide a pair of displaced lateral, lower tip extension or tip arm elements 3031 -LA that connect to the lower arm elements on the prior layer, a continuation of the central standoff 3011 , and the beginning of a pair of displaced lateral, upper tip arm elements 3031-UA that connect to the laterally displaced ends of the lower coplanar spring elements 3021-L of the prior layer (FIG. 30F). The sixth layer L6 continues to provide the pair of displaced lateral upper probe tip arm elements 3031-UA that connect to the tip arm elements 3031-UA on the prior layer (FIG. 30G). It also provides a top portion of the central standoff 3011 which joins to the innermost portion of two outwardly rotating, co-planar, upper, interleaved, spiral spring elements 3021-U that deflect in association with the displacement of the lower tip of the probe. The seventh layer L7 continues to provide the pair of displaced lateral upper probe tip arm elements 3031-UA that connect to similar elements on the prior layer (FIG. 30H). The eighth layer L8 provides an additional portion of the upper probe tip in the form of an extended bridge element 3031-UB (FIG. 30I) that joins the laterally displaced upper arm elements 3031 -UA of the prior layer to one another. The ninth layer L9 provides an upper length of an upper tip portion of the probe including an upper contact portion of the tip 3031-U (FIG. 30J). During operation of the probe that involves the compression of the probe tips toward one another, the relative displacement of the outer portions of the upper and lower spring elements becomes larger while the inner portions of the spring elements remain at a relatively fixed spacing. In some variations of the embodiment of FIGS. 30A1 to 30J, the standoff 3011 may be modified to provide lateral extensions, if necessary, to provide structural features (e.g., base like features) for interacting with array structures if the arm and bridging elements are insufficient to provide such functionality.

[125] Numerous other variations of the embodiments of FIGS. 29A1 - 29L and FIGS. 30A1 - 30J are possible and include, for example: (1) variations in materials used in different portions of the probe including variations that range from a probe being formed from a single material type to probes being formed with different materials for at least two of the springs, contact portions of tips, tip arms, and tip bridges; (2) variations in dimensions; (3) use of more than two tip arms that extend between compliant elements and tip bridge elements; (4) use of only a single tip arm for both upper and lower springs, (5) use of upper and lower contact elements that are not co-linear; (6) use of two tip arms for both upper and lower springs and tips; (7) use of only a single spring with a movable tip while an opposing tip, contact surface, or mounting location is hard mounted to a frame element; (8) use of springs, tip arms, bridge elements, and/or frame elements that result in relative displacement on an inner portion of a spring element in combination with a tip element that cause relative displacement of an outer portion of another spring element; (9) instead of using tip arm elements that have elongated linear configurations (like those in the figures), tip arm elements may include one or more features that extend from the linear element to provide greater stiffness in a direction perpendicular to the linear dimension, e.g. t-shaped structure, angled structures such as corner pieces, use of upper and lower springs where at least one of the springs includes a lateral extension that is larger than a corresponding lateral extension of the other spring such that larger springs may provide a stop structure when loading the spring into a guide plate or other array structure (e.g. where the springs have similar oblong shapes but where the shapes are rotated relative to one another about the longitudinal axis of the probe); (10) use of a frame element or elements, like annular rings, which are not centrally located but are displaced longitudinally somewhere between the top of the upper spring element and the bottom of the lower spring element; (11) embodiments where the probes function as modules and are actually components of probe assemblies having larger longitudinal lengths; (12) use of one or more additional longitudinally displaced spring or coplanar spring pairs as part of one or both of upper or lower spring structures, wherein the rotational orientations of adjacent springs may be the same or reversed or even include different numbers of spring elements at a given longitudinal level; (13) use of one or more probe tips that include a plurality of contact elements;

(14) embedding of the central or interior ends of spring beam material into base material or in tip arm material to strengthen interconnections particularly when different materials are used;

(15) use of different layer counts, different or even varying layer thicknesses, and/or (16) features or variations noted in the other embodiments or aspects set forth herein, mutatis mutandis.

[126] FIG. 31 provides a schematic representation of a compression-type spring probe/module 3100 according to a generalized embodiment of the present disclosure. The probe 3100 includes a single compliant structure with a first compliant element. It also includes an option of having the at least one standoff implemented as two separate standoffs, the option of having the first compliant element include a second longitudinally displaced biasing spring or spring set, the option of having a base tip arm and/or tip end, and the option of having or engaging a guide or mounting structure that can also engage other probes/modules as part of an array. In still further generalizations, more than two standoffs may be used, the first compliant element may include even more than two longitudinally displaced biasing springs, positioning of standoffs may be closer to the probe axis while tip arm extensions may be further displaced from the probe axis, the probe tips or tips may be along the probe axis, displaced from the probe axis or in the case of multiple tips, they may be non-co-linear, and a base or mounting structure may be joined to the probe at any longitudinal position, not just near the longitudinal center of the probe. Numerous other variations are also possible which will be apparent to those of skill in the art upon review of the present disclosure and may for example include a feature or multiple features from the various embodiments and aspects set forth herein.

[127] FIG. 32 provides a schematic representation of a compression-type spring probe 3200 according to another generalized embodiment of the present disclosure having a single compliant structure with first and second oppositely facing compliant elements with an option of having the at least one standoff implemented as two separate standoffs, with the option of having a base solid or hollow (e.g. annular base), the option of having the first and second compliant elements include a second longitudinally displaced biasing spring or spring set, and the option of having or engaging a guide or mounting structure that can also engage other probes as part of an array. The additional variations noted for FIG. 31 also apply to this generalized embodiment.

[128] FIG. 33 provides a schematic representation of an expansion-type spring probe 3300, according to another generalized embodiment of the present disclosure, having a single compliant structure with first and second oppositely facing compliant elements with an option of having the at least one standoff implemented as two separate standoffs, with the option of having a base, the option of having the first compliant element including a second longitudinally displaced biasing spring or springs, and the option of having or engaging a guide or mounting structure that can also engage other probes as part of an array. The 1^st and 2^nd tip arms and tip ends are shown as being laterally displaced to illustrate their distinctness, though this might not be the case in all implementations which may or may not also include tip arm bridging elements to promote tip placement and/or placement of tip arms for passing through spring elements. In some variations, the single upward and downward pointing tip arms may each be replaced by multiple tip arms. In some variations, a single tip arm may point in one direction while multiple tip arms may point in the opposite direction and form a substantially concentric structure around the opposite tip arm. The central portions of the springs attached to oppositely directed tips move apart from one another during tip compression. In alternative embodiments, the central portion of the springs may have a longitudinally fixed relationship, when the standoff elements are moved to the central region of the probes wherein the peripheral regions of the springs may separate upon tip compression. The additional variations noted for FIGS. 31 and 32 also apply to this generalized embodiment.

Further Comments and Conclusions:

[129] Numerous embodiments have been presented above, but many additional embodiments are possible without deviating from the spirit of the present disclosure. Some of these additional embodiments may be based on a combination of the teachings herein with various teachings of the prior art. Some fabrication embodiments may use multi-layer electrochemical deposition processes while others may not. Some embodiments may use a combination of selective deposition and blanket deposition processes while others may use neither, while still others may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and/or they may not use a planarization process in the formation of successive layers. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments, for example, may use nickel (Ni), nickelphosphorous (Ni-P), nickel-cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AICu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chrome, chromium copper (CrCu), other palladium alloys, copper-silver alloys, as structural materials or sacrificial materials while other embodiments may use different materials. Some of the above materials may, for example, be preferentially used for their spring properties while others may be used for their enhanced conductivity, for their wear resistance, for their barrier properties, for their thermal properties (e.g. yield strength at high temperature or high thermal conductivity), while some may be chosen for their bonding characteristics, for their separability from other materials, and even chosen for other characteristics of interest in a desired application or usage. Other embodiments may use different materials or different combinations of materials including dielectrics (e.g., ceramics, plastics, photoresist, polyimide, glass, ceramics, or other polymers), other metals, semiconductors, and the like as structural materials, sacrificial materials, or patterning materials. Some embodiments, for example, may use copper, tin, zinc, solder, photoresist, or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may form probe structures while other embodiments may use the spring modules of the present disclosure for non-probing purposes (e.g., to bias other operational devices with a desired spring force or compliant engagement).

[130] It will be understood by those of skill in the art that additional operations may be used in implementing the above presented embodiments or used in variations of the above presented embodiments. These additional operations may, for example, provide: (1) surface cleanings , (2) surface activations, (3) heat treatments (e.g. to improve interlayer adhesion, to improve properties of selected materials or features of the probes, such as yield strength, spring constant and the like), (4) provide conformal coatings, (5) provide surface smoothing, roughening, or other surface conditioning, (6) provide surface texture, (7) provide doping of primary materials with secondary materials to provide improved material properties, and/or to provide (8) process monitoring, testing, and/ or measurements to ensure that fabrication occurs according to specifications or other requirements (which may be set by customers, users, quality standard testing, or process standards defined by the process operator itself) as part of ensuring that manufactured parts or products that are supplied to customers or end users are fully functional and meet all requirements.

[131] It will also be understood that the probe elements of some aspects of the present disclosure may be formed with processes which are very different from the processes set forth herein, and it is not intended that structural aspects of the present disclosure need to be formed by only those processes taught herein or by processes made obvious by those taught herein.

[132] Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment are intended to apply to all embodiments to the extent that the features of the different embodiments make such application functional and do not otherwise contradict or remove all benefits of the adopted embodiment.

[133] It is intended that any aspects of the present disclosure set forth herein represent independent present disclosure descriptions which Applicant contemplates as full and complete present disclosure descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements, from other embodiments or aspects set forth herein, for interpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or added as dependent claims to further define a disclosure being claimed by those respective dependent claims should they be written.

[134] In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant disclosure will be apparent to those of skill in the art. As such, it is not intended that the present disclosure be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.

Claims

What is claimed is:

1 . A probe (2800) for making contact between two electronic circuit elements, comprising:

(a) at least one compliant structure, comprising:

(i) at least one standoff (2811-1 , 2811-2, 2812-1 , 2812-2) having a first end and a second end that are longitudinally separated;

(ii) at least one first planar compliant element (2821) providing compliance in a direction perpendicular to its planar configuration, wherein a first portion (2821-1 B, 2821-2B) of the first planar compliant element (2821) functionally joins the at least one standoff (2811-1) and a second portion (2821-1 F, 2821 -2F) of the first planar compliant element (2821) functionally joins a first tip arm (2831 -UA) that can elastically move relative to the at least one standoff (2811-1), wherein the first tip arm (2831-UA) directly or indirectly holds a first tip end (2831 -U) that extends longitudinally beyond the first end of the at least one standoff (2811-1 ) when the first planar compliant element (2821) is not biased; and

(iii) at least one second planar compliant element (2822) providing compliance in a direction perpendicular to its planar configuration, wherein a first portion (2822-1 B, 2822-2B) of the second planar compliant element (2822) functionally joins the at least one standoff (2812-1) and a second portion (2822-1 F, 2822-2F) of the second planar compliant element (2822) functionally joins a second tip arm (2831 -LA) that can elastically move relative to the at least one standoff (2812-1), wherein the second tip arm (2831 -LA) directly or indirectly holds a second tip end (2831 -L) that extends longitudinally beyond the second end of the at least one standoff (2812-1) when the second planar compliant element (2822) is not biased, and

(iv) a longitudinal separation element (2801) connected to the at least one standoff (2811-1 , 2811-2, 2812-1 , 2812-2) as well as to the first and second planar compliant elements (2821 , 2822), wherein the first portions (2821-1 B or 2821-2B, 2822-1 B or 2822-2B) of the first and second planar compliant elements (2821 , 2822) are longitudinally spaced from one another by the at least one standoff (2811-1 , 2812-1) and wherein upon biasing of at least one of the first and second tip ends toward the other, the second portions (2821-1 F, 2821-2F, 2822-1 F, 2822-2F) of the first and second planar compliant elements (2821 , 2822) move longitudinally closer together.

2. The probe of claim 1 wherein the first portion (2821-1 B or 2821 -2B) of the first planar compliant element (2821) is located closer to the first end of the at least one standoff (2811-1) than is the first portion (2822-1 B or 2822-2B) of the second planar compliant element (2822) and the first portion (2822-1 B or 2822-2B) of the second planar compliant element (2822) is located closer to the second end of the at least one standoff (2812-1) than is the first portion (2821-1 B or 2821-2B) of the first planar compliant element (2821).

3. The probe of claim 1 wherein the first planar compliant element (2821) comprises a two-dimensional planar spring.

4. The probe of claim 3 wherein the second planar compliant element (2822) comprises a spring having a two-dimensional planar configuration, when not biased, that is parallel to the planar configuration of the two-dimensional planar spring of the first planar compliant element (2821).

5. The probe of claim 4 wherein the first planar compliant element (2821) comprises at least two longitudinally spaced compliant elements (2821-1 , 2821-2) which are functionally joined to the first tip (2831 -U) such that they move together upon longitudinal compression of the first tip end (2831 -U) toward the second tip end (2831 -L) and the second planar compliant element (2822) comprises at least two longitudinally spaced compliant elements (2822-1 , 2822-2) which are functionally joined to the second tip (2831 -L) such that they move together upon longitudinal compression of the second tip end (2831 -L) toward the first tip end (2831 -U).

6. The probe of claim 1 wherein the at least one standoff includes at least two laterally opposed standoffs (2811-1 , 2811-2, 2812-1 , 2812-2) and the longitudinal separation element includes a common base (2801) supporting the at least two laterally opposed standoffs.

7. The probe of claim 6 wherein the common base includes a frame (2901) in the form of a central annular rectangular ring element.

8. The probe of claim 7 further including at least one bridge (2931 -UB) connecting the first tip arm (2931 -UA) to first tip end (2931 -U).

9. The probe of claim 1 wherein the longitudinal separation element (2801) includes at least a pair of compliant intermediate base elements.

10. The probe of claim 1 wherein the first compliant element (2821) comprises at least two co-planar cantilever springs at a same longitudinal height that are laterally interleaved with one another and are attached to the first tip arm (2831 -U A) and with each being attached to laterally displaced locations on the at least one standoff (2811-1 , 2811-2).

11. The probe of claim 1 wherein the first planar compliant element (2821) comprises at least two co-planar springs each have an inward rotating spiral configuration that couples the at least one standoff (2811-1 , 2811-2) to the first tip arm (2831 -UA) wherein the spiral has a configuration selected from the group consisting of: (i) a circular spiral, (ii) a rectangular spiral, (iii) a hexagonal spiral, (iv) an octagonal spiral, (v) a counterclockwise rotating inward spiral, (vi) a clockwise inward rotating spiral, and (vii) a spiral having a radially extending connection to the first tip arm (2831 -UA).

12. The probe of claim 11 wherein at least one spiral has a rotational extent selected from a group consisting of: (i) at least 180°, (ii) at least 360°, (iii) at least 540°, and (iv) at least 720°.

13. The probe of claim 1 wherein the second planar compliant element (2822) comprises at least two inward rotating spirals that extend from different portions of the at least one standoff (2812-1) and join the second tip arm (2831-LA), wherein the spirals each have a configuration selected from a group consisting of: (i) an inward rotating circular spiral, (ii) an inward rotating rectangular spiral, (iii) an inward rotating hexagonal spiral, (iv) an inward rotating octagonal spiral, (v) an inward rotating counterclockwise spiral as observed looking from the second tip end (2831 -L) toward the first tip end (2831 -U), and (vi) an inward rotating clockwise spiral as observed looking from the second tip end (2831 -L) toward the first tip end (2831-U).

14. The probe of claim 13 wherein at least one spiral of the second planar compliant element (2822) has a rotational extent selected from a group consisting of: (i) at least 180°, (ii) at least 360°, (iii) at least 540°, and (iv) at least 720°.

15. The probe of claim 1 wherein at least one of the planar compliant elements (2821 , 2822) comprises at least two compliant elements having rotational orientations selected from a group consisting of: (i) the same orientation, and (ii) different orientations.

16. The probe of claim 1 wherein the at least one standoff includes a central standoff (3011) that joins and supports the first and second planar compliant elements (2821 , 2822) also acting as a longitudinal separation element, the probe further comprising at least a first bridge (3031 -UB) connecting the first tip end (3031 -U) to a first coplanar pair of outward rotating spring elements (3021-L) via two laterally displaced tip arms (3031-UA) and at least a second bridge (3031 -LB) connecting the second tip end (3031 -L) to a second coplanar pair of outward rotating spring elements (3021-U) via two laterally displaced tip arms (3031-LA).

17. The probe of claim 16 wherein the central standoff (3011) joins and supports innermost ends of the first and second coplanar pairs of outward rotating spring elements (3021-L, 3021-U), upward movement of the second tip end (3031 -L) biasing peripheral portions most remote from central axis of the probe of the second coplanar pairs of outward rotating spring elements (3021-U) upward, and downward movement of the first tip end (3031-U) biasing peripheral portions of the first coplanar pairs of outward rotating spring elements (3021- L) downward, causing a larger separation between peripheral portions upon tip compression.

18. The probe of claim 16 further comprises at least one additional feature selected from a group consisting of: (i) a horizontal stop feature (3031 -UAHS) attached to one or both of the tip arms (3031-UA) connected to the first bridge (3031-UB), (ii) a horizontal stop feature (3031 -UBS) attached to the first bridge (3031-UB), (iii) a vertical stop feature (3031 -UAVS) attached to one or both of lower portions of the tip arms (3031-UA) connected to the first bridge (3031-UB), (iv) a horizontal stop feature (3031 -LAHS) attached to the second bridge (3031 -LB), (v) a horizontal stop feature (3031 -LBS) attached to the second bridge (3031 -LB), and (vi) a vertical stop feature (3031 -LAVS) attached to upper portions of one or both of the tip arms (3031-LA) connected to the second bridge (3031 -LB).

19. A probe (2100) for making contact between two electronic circuit elements, comprising:

(a) at least a first and a second probe module (2100-A1 , 2100-A2, 2100-A3, 2100-A4), each probe module comprising:

(i) at least one standoff (2111-U, 2111-L) having a first end and a second end that are longitudinally separated;

(ii) at least one planar compliant element (2121-U, 2121 -L) providing compliance in a direction perpendicular to its planar configuration, wherein a first portion of the planar compliant element (2121-U, 2121 -L) functionally joins the at least one standoff (2111-U, 2111-L) and a second portion of the planar compliant element (2121- U, 2121 -L) functionally joins a tip arm (2131-UA, 2131-LA) that can elastically move relative to the at least one standoff (2111-U) and directly or indirectly holds a tip end (2131-U, 2131-L); and

(iii) at least one base (2101) provided with a down-facing retention structure (2131 -R) extending from its bottom; wherein the first and second modules (2100-A1 , 2100-A2, 2100-A3, 2100-A4) engage one another via the base (2101) as a tip end (2131 -L) of one module (2100-A2, 2100-A4) is laterally bounded by an interior region of the down-facing retention structure (2131-R) of the other module (2100-A1 , 2100-A3), and wherein the first and second modules (2100-A1 , 2100-A2, 2100-A3, 2100-A4) are further laterally engaged one another via at least one retaining structure comprising at least a frame structure (2151) and an opening (2152).

20. The probe of claim 19 wherein the first probe module (2100-A1) includes a frame structure (2151) connected to its base (2101) and defining openings (2152) in correspondence of its sides and the second module (2100-A2) includes a frame (2151) in correspondence of sides of the first probe module (2100-A2), the frame (2151) having protruding portions (2151-X) able to insert into the openings (2152) of the first probe module (2100-A1), the engagement of the protruding portions (2151-X) of the frame structure (2151) into the openings (2152) preventing or limiting a lateral displacement of the first and probe modules (2100-A1 , 2100-A2).

21 . The probe of claim 19 wherein the first probe module (2100-A3) includes at least an opening (2111-C) provided within its at least one standoff (2111) and the second probe module (2100-A4) includes a frame (2151) in correspondence of its at least one standoff

(2111), the frame (2151) having a protruding portion (2151-X) able to insert into the opening (2111-C) in the at least one standoff (2111) of the first probe module (2100-A3).

22. The probe of claim 21 wherein the second probe module (2100-A4) further includes additional frame structures (2151) associates with its base (2101 -L) and the compliant portion (2121 -L) of the second probe module (2100-A4) as well as the compliant portion (2121- U) and the base (2101-U) of the first probe module (2100-A3) have openings (2121-C, 2101-C) able to house the additional frame structures (2151) of the second probe module (2100-A4).