WO2022247239A1 - Optimum design method for epoxy molding compound packaging structure - Google Patents
Optimum design method for epoxy molding compound packaging structureDownload PDFInfo
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- the inventionbelongs to the technical field of packaging structures, and in particular relates to an optimal design method of an epoxy plastic packaging structure.
- the present inventionprovides an optimal design method of the epoxy plastic packaging structure, so that the optimal design of the epoxy plastic packaging structure can obtain theoretical support and reduce the design cost.
- the present inventionadopts the following technical solutions:
- a kind of optimization design method of epoxy plastic encapsulation structureit comprises the following steps:
- step S50Perform F test analysis on the regression model to determine whether there is a physical parameter factor that has a significant impact on the certain performance; if so, perform the next step of processing, otherwise return to step S10 to adjust the selected physical parameter factor;
- the certain property mentionedis the magnitude of thermal stress, warpage level or humidity stress.
- the physical property parameter factorsinclude the Young's modulus, thermal expansion coefficient and thickness of the epoxy molding compound, and also include the Young's modulus, thermal expansion coefficient and thickness of the substrate.
- the step S60further includes: drawing a Pareto diagram according to the result of the T-test analysis, so as to visually display the physical parameter factors with significant influence.
- the reliability test datais imported to improve the accuracy of the simulation model.
- the optimal design method of the epoxy plastic packaging structureuses the method of combining experimental design and statistical analysis, through simulation experiments and data analysis and processing, and obtains experimental results with certain theoretical support on the theoretical level. Conclusion, so that the optimal design of the epoxy plastic packaging structure can get theoretical support and reduce the design cost.
- Fig. 1is the flowchart of the optimal design method of the epoxy plastic encapsulation structure in the embodiment of the present invention
- Fig. 2is a Pareto diagram of the standardized effect drawn according to the results of the T test in the embodiment of the present invention.
- Embodiments of the present inventionfirstly provide a method for optimizing the design of an epoxy plastic packaging structure, referring to Figure 1, the method includes the following steps:
- the certain property mentionedis the magnitude of thermal stress, warpage level or humidity stress.
- the physical property parameter factorsinclude the Young's modulus, thermal expansion coefficient and thickness of the epoxy molding compound, and also include the Young's modulus, thermal expansion coefficient and thickness of the substrate.
- the selection of a certain performanceis specified as the size of thermal stress, wherein the physical parameter factors include Young's modulus, thermal expansion coefficient and thickness of epoxy molding compound (EMC) and substrate ( Substrate) Young's modulus, coefficient of thermal expansion and thickness.
- EMCepoxy molding compound
- SubstrateSubstrate Young's modulus, coefficient of thermal expansion and thickness.
- the serial number in the standard sequenceis the serial number when designing the simulation test, and the running sequence is the serial number when performing the simulation test; in the corresponding column of the physical parameter factor EMC and Substrate: "1" indicates the corresponding The high-level value of the physical parameter factor, the specific value is obtained from Table 1; “-1" indicates the low-level value of the corresponding physical parameter factor, and the specific value is obtained from Table 1.
- the test result of the simulation testis the magnitude of the thermal stress of each test model.
- the reliability test datais imported to improve the accuracy of the simulation model.
- the solution set b obtained from this solutionis the coefficients of the regression equation, and then the fitting values of each group of experiments are calculated
- step S50Perform F-test analysis on the regression model to determine whether there is a physical parameter factor that has a significant impact on the certain performance; if yes, execute the next step, otherwise return to step S10 to adjust the selected physical parameter factor.
- T value T A of physical property parameter factor Acoefficient of A/standard error of coefficient of A.
- nis the number of trials.
- a Pareto diagramis drawn according to the results of the T-test analysis to visually display the physical parameter factors with significant influence. Specifically, draw the Pareto diagram as follows: take the T values obtained by the T test of each physical parameter factor as the vertical axis, arrange them according to the size of the absolute value, and according to the selected significance level ⁇ (two-sided 5%), Given the critical value of T value (2.26 in this embodiment), those whose absolute value exceeds the critical value will be selected as significant impact factors.
- Fig. 2is the Pareto diagram of the standardized effect drawn according to the result of T test in the present embodiment, as can be seen from the figure, the coefficient of thermal expansion and the Young's modulus of EMC (epoxy molding compound) in the present embodiment are to the thermal stress size of package structure It is a significant influencing factor and has a great influence. It should be considered in the packaging structure design and material selection to avoid the failure of the packaging structure due to this parameter.
- the optimal design method of the epoxy plastic packaging structureuses the method of combining experimental design and statistical analysis, and through simulation experiments and data analysis and processing, it is theoretically concluded that Certain theoretically supported experimental conclusions are required to enable the optimal design of the epoxy plastic packaging structure to obtain theoretical support and reduce design costs.
- the present inventioncan screen out the factor that has the greatest impact on the failure of the packaging structure, so that corresponding measures can be specifically proposed to reduce the failure of the packaging structure caused by the factor.
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Abstract
Description
Translated fromChinese本发明属于封装结构技术领域，具体涉及一种环氧塑封封装结构的优化设计方法。The invention belongs to the technical field of packaging structures, and in particular relates to an optimal design method of an epoxy plastic packaging structure.
随着电子信息技术的发展和社会的需要，电子产品不断向小型化、轻量化、高性能、多功能、低成本方向发展，电子封装技术在其中发挥着重要的作用。封装形式也从原先的陶瓷封装、金属封装向塑料封装过渡，而现在环氧塑封结构逐渐成为塑料封装形式的主流。With the development of electronic information technology and the needs of society, electronic products continue to develop in the direction of miniaturization, light weight, high performance, multi-function and low cost, and electronic packaging technology plays an important role in it. The packaging form has also transitioned from the original ceramic packaging and metal packaging to plastic packaging, and now the epoxy plastic packaging structure has gradually become the mainstream of plastic packaging.
在环氧塑封封装结构中，由于EMC(环氧塑封料)、芯片、基板等材料之间的材料特性不同，比如热膨胀系数、杨氏模量等物性参数，在升温回流的过程中不同材料界面之间受力不同，出现不同程度的形变，导致封装结构失效。In the epoxy plastic packaging structure, due to the different material properties between EMC (epoxy molding compound), chip, substrate and other materials, such as thermal expansion coefficient, Young's modulus and other physical parameters, different material interfaces in the process of temperature rise and reflow The force between them is different, and there are different degrees of deformation, which leads to the failure of the packaging structure.
目前国内外对于环氧塑封封装结构的失效形式及失效原因都做了比较多的研究，比如采用不同物性参数的环氧塑封料，不同材料特性的基板等，做一些可靠性试验来观察失效的具体位置和失效原因。现有技术只是根据试验现象表述试验结果，虽然能够在具体的试验范围内给出相对正确的结论，但没有具体的理论支撑，不能说明总体的试验样本得出的数据是可靠的，且进行具体试验所需要的成本较高。At present, a lot of research has been done on the failure mode and failure cause of the epoxy plastic packaging structure at home and abroad, such as using epoxy molding compounds with different physical parameters, substrates with different material characteristics, etc., and doing some reliability tests to observe the failure. specific location and cause of failure. The existing technology only expresses the test results according to the test phenomena. Although relatively correct conclusions can be given within the specific test range, there is no specific theoretical support, and it cannot be proved that the data obtained from the overall test samples are reliable. The cost of testing is high.
发明内容Contents of the invention
鉴于现有技术存在的不足，本发明提供一种环氧塑封封装结构的优化设计方法，以使得环氧塑封封装结构的优化设计能够得到理论支撑并降低设计成本。In view of the deficiencies in the prior art, the present invention provides an optimal design method of the epoxy plastic packaging structure, so that the optimal design of the epoxy plastic packaging structure can obtain theoretical support and reduce the design cost.
为了解决以上所述的问题，本发明采用了如下的技术方案：In order to solve the problems described above, the present invention adopts the following technical solutions:
一种环氧塑封封装结构的优化设计方法，其包括以下步骤：A kind of optimization design method of epoxy plastic encapsulation structure, it comprises the following steps:
S10、根据已有经验筛选对于环氧塑封封装结构的某一性能具有影响的物性参数因子，并确定各个物性参数因子高水平值和低水平值；S10. Screen the physical parameter factors that have an impact on a certain performance of the epoxy plastic packaging structure according to the existing experience, and determine the high-level value and low-level value of each physical parameter factor;
S20、依据选取的物性参数因子设计正交试验表；S20, designing an orthogonal test table according to the selected physical parameter factors;
S30、依据选取的物性参数因子建立有限元模型，并按照所述正交试验表进行仿真模拟试验，获取的试验结果填入所述正交试验表形成完整的试验数据表；S30. Establishing a finite element model based on the selected physical parameter factors, and performing a simulation test according to the orthogonal test table, and filling the obtained test results into the orthogonal test table to form a complete test data table;
S40、对所述试验数据表的所有试验数据进行处理，建立回归模型，求出样本均值和拟合值；S40. Process all the test data in the test data table, establish a regression model, and obtain the sample mean and fitting value;
S50、对所述回归模型进行F检验分析，判断是否存在对于所述某一性能具有显著影响的物性参数因子；如是则执行下一步处理，若否则返回步骤S10调整选取的物性参数因子；S50. Perform F test analysis on the regression model to determine whether there is a physical parameter factor that has a significant impact on the certain performance; if so, perform the next step of processing, otherwise return to step S10 to adjust the selected physical parameter factor;
S60、对所述回归模型进行T检验分析，确定对于所述某一性能具有显著影响的物性参数因子；S60. Perform T-test analysis on the regression model to determine a physical parameter factor that has a significant impact on the certain property;
S70、依据以上的分析结果对环氧塑封封装结构的优化设计进行指导。S70. Based on the above analysis results, guide the optimal design of the epoxy plastic packaging structure.
具体地，所述的某一性能为热应力大小、翘曲水平或湿应力大小。Specifically, the certain property mentioned is the magnitude of thermal stress, warpage level or humidity stress.
具体地，所述的物性参数因子包括环氧塑封料的杨氏模量、热膨胀系数和厚度，还包括基板的杨氏模量、热膨胀系数和厚度。Specifically, the physical property parameter factors include the Young's modulus, thermal expansion coefficient and thickness of the epoxy molding compound, and also include the Young's modulus, thermal expansion coefficient and thickness of the substrate.
具体地，所述步骤S60还包括：根据所述T检验分析的结果绘制Pareto图，以直观显示具有显著影响的物性参数因子。Specifically, the step S60 further includes: drawing a Pareto diagram according to the result of the T-test analysis, so as to visually display the physical parameter factors with significant influence.
具体地，所述步骤S30中，对于某一仿真模拟试验，若是有相应的可靠性试验数据，则导入可靠性试验数据以提高仿真模型的准确度。Specifically, in the step S30, for a simulation test, if there is corresponding reliability test data, the reliability test data is imported to improve the accuracy of the simulation model.
本发明实施例提供的环氧塑封封装结构的优化设计方法，运用试验设计与统计学分析相结合的方法，通过仿真模拟试验并进行数据分析处理，在理论层面上得出具有一定理论支撑的试验结论，以使得环氧塑封封装结构的优化设计能够得到理论支撑并降低设计成本。The optimal design method of the epoxy plastic packaging structure provided by the embodiment of the present invention uses the method of combining experimental design and statistical analysis, through simulation experiments and data analysis and processing, and obtains experimental results with certain theoretical support on the theoretical level. Conclusion, so that the optimal design of the epoxy plastic packaging structure can get theoretical support and reduce the design cost.
图1是本发明实施例中的环氧塑封封装结构的优化设计方法的流程图；Fig. 1 is the flowchart of the optimal design method of the epoxy plastic encapsulation structure in the embodiment of the present invention;
图2是本发明实施例中根据T检验的结果绘制的标准化效应的Pareto图。Fig. 2 is a Pareto diagram of the standardized effect drawn according to the results of the T test in the embodiment of the present invention.
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的 具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。In order to make the object, technical solution and advantages of the present invention clearer, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in and described with reference to the drawings are merely exemplary, and the invention is not limited to these embodiments.
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。Here, it should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only the structures and/or processing steps closely related to the solution according to the present invention are shown in the drawings, and the related Other details are not relevant to the invention.
本发明实施例首先提供了一种环氧塑封封装结构的优化设计方法，参阅图1，所述方法包括以下步骤：Embodiments of the present invention firstly provide a method for optimizing the design of an epoxy plastic packaging structure, referring to Figure 1, the method includes the following steps:
S10、根据已有经验筛选对于环氧塑封封装结构的某一性能具有影响的物性参数因子，并确定各个物性参数因子高水平值和低水平值。S10. Screen physical property parameter factors that affect a certain performance of the epoxy plastic packaging structure according to existing experience, and determine high-level values and low-level values of each physical property parameter factor.
具体地，所述的某一性能为热应力大小、翘曲水平或湿应力大小。Specifically, the certain property mentioned is the magnitude of thermal stress, warpage level or humidity stress.
具体地，所述的物性参数因子包括环氧塑封料的杨氏模量、热膨胀系数和厚度，还包括基板的杨氏模量、热膨胀系数和厚度。Specifically, the physical property parameter factors include the Young's modulus, thermal expansion coefficient and thickness of the epoxy molding compound, and also include the Young's modulus, thermal expansion coefficient and thickness of the substrate.
在本发明具体的实施例中，所述的某一性能选择为热应力大小进行具体说明，其中的物性参数因子包括环氧塑封料(EMC)的杨氏模量、热膨胀系数和厚度以及基板(Substrate)的杨氏模量、热膨胀系数和厚度。本实施例中选取的对于环氧塑封热应力大小可能具有显著影响的物性参数因子参见如下表1。In a specific embodiment of the present invention, the selection of a certain performance is specified as the size of thermal stress, wherein the physical parameter factors include Young's modulus, thermal expansion coefficient and thickness of epoxy molding compound (EMC) and substrate ( Substrate) Young's modulus, coefficient of thermal expansion and thickness. The physical parameter factors selected in this embodiment that may have a significant impact on the thermal stress of the epoxy plastic seal are shown in Table 1 below.
表1：Table 1:
需要说明的是，表1中，“低”表示对应的物性参数因子的低水平值，“高” 表示对应的物性参数因子的高水平值，T1～T3表示温度条件，T1＝25℃，T2＝125℃，T3＝220℃。It should be noted that in Table 1, "low" indicates the low level value of the corresponding physical parameter factor, "high" indicates the high level value of the corresponding physical parameter factor, T1 ~ T3 indicate the temperature condition, T1 =25 °C, T2 =125 °C, T3 =220 °C.
S20、依据选取的物性参数因子设计正交试验表。S20. Design an orthogonal test table according to the selected physical parameter factors.
本实施例中，根据表1的物性参数因子，设计如下表2的正交试验表。In this embodiment, according to the physical parameter factors in Table 1, an orthogonal test table as shown in Table 2 is designed.
表2：Table 2:
需要说明的是，表2中，标准序中的序号是在设计仿真试验时的序号，运行序是在进行仿真试验时的序号；物性参数因子EMC和Substrate对应列中：“1”表示对应的物性参数因子的高水平值，具体取值从表1中获得；“-1”表示对应的物性参数因子的低水平值，具体取值从表1中获得。It should be noted that in Table 2, the serial number in the standard sequence is the serial number when designing the simulation test, and the running sequence is the serial number when performing the simulation test; in the corresponding column of the physical parameter factor EMC and Substrate: "1" indicates the corresponding The high-level value of the physical parameter factor, the specific value is obtained from Table 1; "-1" indicates the low-level value of the corresponding physical parameter factor, and the specific value is obtained from Table 1.
S30、依据选取的物性参数因子建立有限元模型，并按照所述正交试验表(如表2所示)进行仿真模拟试验，获取的试验结果填入所述正交试验表形成完整的试验数据表。S30, establish the finite element model according to the selected physical parameter factors, and carry out the simulation test according to the orthogonal test table (as shown in Table 2), and the obtained test results are filled in the orthogonal test table to form complete test data surface.
在本实施例中，仿真模拟试验的试验结果即每一试验模型的热应力大小。In this embodiment, the test result of the simulation test is the magnitude of the thermal stress of each test model.
在优选的实施例中，在所述步骤S30中，对于某一仿真模拟试验，若是有相应的可靠性试验数据，则导入可靠性试验数据以提高仿真模型的准确度。In a preferred embodiment, in the step S30, if there is corresponding reliability test data for a certain simulation test, the reliability test data is imported to improve the accuracy of the simulation model.
S40、对所述试验数据表的所有试验数据进行处理，建立回归模型，求出样本均值
其中，拟合值
式1：Xb＝Y，其中，X为物性参数因子的值，b为回归模型中各项系数，Y为试验结果即热应力大小。Formula 1: Xb=Y, where X is the value of the physical parameter factor, b is the coefficient of each item in the regression model, and Y is the test result, that is, the size of the thermal stress.
由于该方程组是超定方程，即方程数大于自变量数，故需对方程组做如下矩阵变换：Since the equation system is an overdetermined equation, that is, the number of equations is greater than the number of independent variables, it is necessary to perform the following matrix transformation on the equation system:
式2：XTXb＝XTY；Formula 2: XT Xb = XT Y;
式3：b＝(XTX)-1XTY。Formula 3: b=(XT X)-1 XT Y.
由此求解得出的解集合b即为回归方程的各项系数，然后再求出各组试验的拟合值
S50、对所述回归模型进行F检验分析，判断是否存在对于所述某一性能具有显著影响的物性参数因子；如是则执行下一步处理，若否则返回步骤S10调整选取的物性参数因子。S50. Perform F-test analysis on the regression model to determine whether there is a physical parameter factor that has a significant impact on the certain performance; if yes, execute the next step, otherwise return to step S10 to adjust the selected physical parameter factor.
根据以下步骤计算回归模型F值：Calculate the F value of the regression model according to the following steps:
(1)、回归平方和：
(2)、回归自由度：dfR＝k，k为自变量个数，即选取的物性参数因子的数量；(2), regression degree of freedom: dfR =k, k is the number of independent variables, namely the quantity of the selected physical parameter factors;
(3)、残差平方和：
(4)、残差自由度：dfE＝n-k-1，n为试验次数，k为自变量个数，即选取的物性参数因子的数量；(4), residual degrees of freedom: dfE =nk-1, n is the number of trials, and k is the number of independent variables, i.e. the number of selected physical parameter factors;
(5)、回归模型F值：(5), regression model F value:
以上式子中，
按照所求的自由度，从F分布临界值表中按照横轴自由度dfR和纵轴自由度dfE的大小，查表确定所选定的显著水平(本实施例中显著水平为α＝0.05)的临界F值，然后将所求的回归模型F值与临界F值对比，若回归模型F值大于临界F值，则说明模型可靠，即模型中存在具有对结果显著影响的因子，可进行下一步分析，反之，则需要重新选取影响因子返回步骤S10重复上述步骤。According to the degree of freedom sought, according to the size of the horizontal axis degree of freedom dfR and the vertical axis degree of freedom dfE from the F distribution critical value table, the table look-up determines the selected significant level (in this embodiment, the significant level is α= 0.05), and then compare the obtained regression model F value with the critical F value, if the regression model F value is greater than the critical F value, it means that the model is reliable, that is, there are factors that have a significant impact on the results in the model, which can be Carry out the next step of analysis, otherwise, you need to re-select the impact factor and return to step S10 to repeat the above steps.
S60、对所述回归模型进行T检验分析，确定对于所述某一性能具有显著影响的物性参数因子。S60, performing T-test analysis on the regression model to determine a physical parameter factor that has a significant impact on the certain property.
具体地，参照以下步骤计算物性参数因子A的T值：Specifically, refer to the following steps to calculate the T value of the physical parameter factor A:
(1)、A的效应＝[Y的平均值|A＝高]-[Y的平均值|A＝低]，其中，[Y的平均值|A＝高]是指物性参数因子A取值为高水平值时对应的试验结果Y的平均值，[Y的平均值|A＝低]是指物性参数因子A取值为低水平值时对应的试验结果Y的平均值；(1), the effect of A = [the average value of Y | A = high] - [the average value of Y | A = low], wherein, [the average value of Y | A = high] refers to the value of the physical parameter factor A is the average value of the corresponding test result Y when it is a high level value, [the average value of Y|A=low] refers to the average value of the corresponding test result Y when the value of the physical parameter factor A is a low level value;
(2)、A的系数＝A的效应/2；(2), the coefficient of A=the effect of A/2;
(3)、
(4)、
(5)、物性参数因子A的T值TA＝A的系数/A的系数标准误。(5) T value T A of physical property parameter factorA = coefficient of A/standard error of coefficient of A.
以上式子中，yi、
按照以上步骤计算每一个物性参数因子的T值，根据步骤S50所求的残差自由度dfE，从T分布临界值表中查表确定所选定的显著水平(本实施例中显著水平为双侧α＝0.05)的临界T值，然后将所求的每个物性参数因子的T值与临界T值对比，若某个物性参数因子的T值大于临界T值，则该物性参数因子为对试验结果具有显著影响的因子，反之则不是。Calculate the T value of each physical parameter factor according to the above steps, according to the residual degree of freedom dfE obtained in step S50, determine the selected significant level from the table look-up in the T distribution critical value table (significant level in this embodiment is Two-sided α=0.05) critical T value, then compare the T value of each physical parameter factor with the critical T value, if the T value of a certain physical parameter factor is greater than the critical T value, then the physical parameter factor is A factor that has a significant effect on the outcome of an experiment but not vice versa.
在本实施例中，根据所述T检验分析的结果绘制Pareto图，以直观显示具有显著影响的物性参数因子。具体地，按照如下方法绘制Pareto图：将各物性参数因子的T检验所获得的T值作为纵坐标，按照绝对值的大小排列起来，根据选定的显著性水平α(双侧5％)，给出T值的临界值(本实施例中为2.26)，绝对值超过临界值的将被选中为显著的影响因子。In this embodiment, a Pareto diagram is drawn according to the results of the T-test analysis to visually display the physical parameter factors with significant influence. Specifically, draw the Pareto diagram as follows: take the T values obtained by the T test of each physical parameter factor as the vertical axis, arrange them according to the size of the absolute value, and according to the selected significance level α (two-sided 5%), Given the critical value of T value (2.26 in this embodiment), those whose absolute value exceeds the critical value will be selected as significant impact factors.
图2为本实施例中根据T检验的结果绘制的标准化效应的Pareto图，由图可知，本实施例中EMC(环氧塑封料)的热膨胀系数和杨氏模量对于封装结构的热应力大小来说是显著的影响因子，具有较大影响，在封装结构设计和材料选材时应该着重考虑，避免由于该参数引起封装结构失效。Fig. 2 is the Pareto diagram of the standardized effect drawn according to the result of T test in the present embodiment, as can be seen from the figure, the coefficient of thermal expansion and the Young's modulus of EMC (epoxy molding compound) in the present embodiment are to the thermal stress size of package structure It is a significant influencing factor and has a great influence. It should be considered in the packaging structure design and material selection to avoid the failure of the packaging structure due to this parameter.
S70、依据以上的分析结果对环氧塑封封装结构的优化设计进行指导。S70. Based on the above analysis results, guide the optimal design of the epoxy plastic packaging structure.
综上所述，本发明实施例提供的环氧塑封封装结构的优化设计方法，运用试验设计与统计学分析相结合的方法，通过仿真模拟试验并进行数据分析处理， 在理论层面上得出具有一定理论支撑的试验结论，以使得环氧塑封封装结构的优化设计能够得到理论支撑并降低设计成本。本发明能够筛选出对于封装结构失效影响最大的因子，从而可以有针对性地提出相应的措施以降低由于该因子所引起的封装结构失效的情形。To sum up, the optimal design method of the epoxy plastic packaging structure provided by the embodiment of the present invention uses the method of combining experimental design and statistical analysis, and through simulation experiments and data analysis and processing, it is theoretically concluded that Certain theoretically supported experimental conclusions are required to enable the optimal design of the epoxy plastic packaging structure to obtain theoretical support and reduce design costs. The present invention can screen out the factor that has the greatest impact on the failure of the packaging structure, so that corresponding measures can be specifically proposed to reduce the failure of the packaging structure caused by the factor.
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。While the invention has been shown and described with reference to particular embodiments, it will be understood by those skilled in the art that changes may be made in the form and scope thereof without departing from the spirit and scope of the invention as defined by the claims and their equivalents. Various changes in details.
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