WO2021244220A1 - Heat dissipation assembly, heat dissipation structure and heat dissipation method therefor, and electronic device and apparatus - Google Patents

Abstract

A heat dissipation assembly (100), a heat dissipation structure and a heat dissipation method therefor, and an electronic device and an apparatus. The heat dissipation assembly (100) comprises an acoustic wave oscillator (110) used for emitting acoustic waves; and an oscillating film (120) provided on a transmission path of the acoustic waves emitted by the acoustic wave oscillator (110), wherein the acoustic waves emitted by the acoustic wave oscillator (110) drive the oscillating film (120) to vibrate, to make the air flow around the oscillating film (120).

Description

Translated fromChinese

散热组件、散热结构以及散热方法、电子设备和装置Heat dissipation component, heat dissipation structure, heat dissipation method, electronic equipment and device

相关申请的交叉引用Cross-references to related applications

本申请基于申请号为202010499460.9、申请日为2020年06月04日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。This application is filed based on a Chinese patent application with an application number of 202010499460.9 and an application date of June 4, 2020, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference into this application.

技术领域Technical field

本发明实施例涉及但不限于散热技术领域，尤其涉及一种散热组件、散热结构、电子设备、散热装置、散热方法、电子装置及计算机可读存储介质。The embodiments of the present invention relate to, but are not limited to, the field of heat dissipation technology, and in particular, to a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium.

背景技术Background technique

集成度较高的电子产品其结构较为紧密，内部器件堆叠较近，随着内部诸如芯片器件等发热源持续发热，由于电子产品内部的空气不会自动流动，会使得器件所在位置的温度不断升高。在相关技术中，电子产品的散热是通过采用散热膜、散热胶、散热架、风扇、水冷管等技术手段将热量传导出去，但这样会增加产品整机的厚度，并且导热效果会随着时间的推移逐渐降低，散热效果不佳。Highly integrated electronic products have a tighter structure and close stack of internal devices. As the internal heat sources such as chip devices continue to heat up, the air inside the electronic product will not flow automatically, which will cause the temperature at the location of the device to continue to rise high. In related technologies, the heat dissipation of electronic products is conducted by using technical means such as heat dissipation film, heat dissipation glue, heat dissipation frame, fan, water cooling tube, etc., but this will increase the thickness of the product, and the heat conduction effect will be over time. The passage gradually decreases, and the heat dissipation effect is not good.

发明内容Summary of the invention

以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.

第一方面，本发明实施例提供了一种散热组件、散热结构、电子设备、散热装置、散热方法、电子装置及计算机可读存储介质。In the first aspect, embodiments of the present invention provide a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium.

第二方面，本发明实施例提供了一种散热组件，包括：In the second aspect, an embodiment of the present invention provides a heat dissipation assembly, including:

声波振荡器，被配置为发出声波；以及A sonic oscillator configured to emit sound waves; and

振荡膜，设置于所述声波振荡器所发出声波的传输路径上；以及The oscillating membrane is arranged on the transmission path of the sound wave emitted by the sound wave oscillator; and

其中，所述声波振荡器发出的声波带动所述振荡膜振动，以使所述振荡膜附近的空气流动。Wherein, the sound waves emitted by the acoustic wave oscillator drive the oscillating membrane to vibrate, so that the air near the oscillating membrane flows.

第三方面，本发明实施例提供了一种散热结构，包括：In the third aspect, an embodiment of the present invention provides a heat dissipation structure, including:

如上第二方面所述的散热组件；以及The heat dissipation assembly as described in the second aspect above; and

风道，所述散热组件设置于所述风道内。The air duct, the heat dissipation component is arranged in the air duct.

第四方面，本发明实施例还提供了一种电子设备，包括：In a fourth aspect, an embodiment of the present invention also provides an electronic device, including:

如上第二方面所述的散热组件和如上第三方面所述的散热结构。The heat dissipation assembly described in the second aspect above and the heat dissipation structure described in the third aspect above.

第五方面，本发明实施例还提供了一种电子设备，包括：In a fifth aspect, an embodiment of the present invention also provides an electronic device, including:

壳体；case;

电子器件，设置于所述壳体内，所述电子器件在工作状态下发热；以及The electronic device is arranged in the housing, and the electronic device generates heat in the working state; and

如上第二方面所述的散热组件，所述散热组件设置于所述壳体内，被配置为使所述壳体内的空气流动，以对所述电子器件散热。In the heat dissipation assembly described in the second aspect above, the heat dissipation assembly is disposed in the housing and is configured to flow air in the housing to dissipate heat from the electronic device.

第六方面，本发明实施例还提供了一种散热装置，应用于电子设备，且所述电子设备中设置有如上第二方面所述的散热组件或如上第三方面所述的散热结构；其中，所述散热装置包括：In a sixth aspect, an embodiment of the present invention also provides a heat dissipation device, which is applied to an electronic device, and the electronic device is provided with the heat dissipation component as described in the second aspect or the heat dissipation structure as described in the third aspect; wherein , The heat dissipation device includes:

检测部件，被配置为检测目标对象的温度值；以及The detection component is configured to detect the temperature value of the target object; and

控制部件，分别与所述散热组件和所述检测部件电连接。The control component is electrically connected with the heat dissipation component and the detection component, respectively.

第七方面，本发明实施例还提供了一种散热方法，应用于散热装置，且所述散热装置中设置有如上第二方面所述的散热组件、检测部件和控制部件，所述控制部件分别与所述散热组件和所述检测部件电连接；其中，所述散热方法包括：In a seventh aspect, an embodiment of the present invention also provides a heat dissipation method, which is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation assembly, detection component, and control component as described in the second aspect above, and the control components are respectively It is electrically connected to the heat dissipation assembly and the detection component; wherein the heat dissipation method includes:

获取目标对象的温度值；以及Obtain the temperature value of the target object; and

当目标对象的温度值超过预设温度值时，控制所述散热组件对目标对象进行散热。When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.

第八方面，本发明实施例还提供了一种电子装置，包括：存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，所述处理器执行所述计算机程序时实现如上第七方面所述的散热方法。In an eighth aspect, an embodiment of the present invention also provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and capable of running on the processor. The processor executes the computer program as described above. The heat dissipation method described in the seventh aspect.

第九方面，本发明实施例还提供了一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令被一处理器执行时，使得所述处理器执行如上第七方面所述的散热方法。In a ninth aspect, an embodiment of the present invention also provides a computer-readable storage medium that stores computer-executable instructions. When the computer-executable instructions are executed by a processor, the processor executes the above-mentioned seventh aspect. The heat dissipation method described.

本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the structures specifically pointed out in the specification, claims and drawings.

附图说明Description of the drawings

附图用来提供对本发明技术方案的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明的技术方案，并不构成对本发明技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solution of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention, and do not constitute a limitation to the technical solution of the present invention.

图1A是本发明一个实施例提供的散热组件的示意图；Fig. 1A is a schematic diagram of a heat dissipation assembly provided by an embodiment of the present invention;

图1B是本发明另一个实施例提供的散热组件的示意图；FIG. 1B is a schematic diagram of a heat dissipation component provided by another embodiment of the present invention;

图2A是本发明一个实施例提供的散热结构的示意图；2A is a schematic diagram of a heat dissipation structure provided by an embodiment of the present invention;

图2B是本发明另一个实施例提供的散热结构的示意图；2B is a schematic diagram of a heat dissipation structure provided by another embodiment of the present invention;

图3A是本发明一个实施例提供的电子设备的示意图；3A is a schematic diagram of an electronic device provided by an embodiment of the present invention;

图3B是本发明另一个实施例提供的电子设备的示意图；3B is a schematic diagram of an electronic device provided by another embodiment of the present invention;

图3C是本发明另一个实施例提供的电子设备的示意图；3C is a schematic diagram of an electronic device provided by another embodiment of the present invention;

图3D是本发明另一个实施例提供的电子设备的示意图；FIG. 3D is a schematic diagram of an electronic device provided by another embodiment of the present invention;

图4是本发明一个实施例提供的散热装置的示意图；Figure 4 is a schematic diagram of a heat dissipation device provided by an embodiment of the present invention;

图5A是本发明一个实施例提供的散热方法的流程图；以及FIG. 5A is a flowchart of a heat dissipation method according to an embodiment of the present invention; and

图5B是本发明另一个实施例提供的散热方法的流程图。FIG. 5B is a flowchart of a heat dissipation method according to another embodiment of the present invention.

具体实施方式detailed description

为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not used to limit the present invention.

需要说明的是，虽然在装置示意图中进行了功能模块划分，在流程图中示出了逻辑顺序，但是在某些情况下，可以以不同于装置中的模块划分，或流程图中的顺序执行所示出或描述的步骤。It should be noted that although functional modules are divided in the schematic diagram of the device, and the logical sequence is shown in the flowchart, in some cases, it can be executed in a different order from the module division in the device or in the sequence in the flowchart. Steps shown or described.

本发明提供了一种散热组件、散热结构、电子设备、散热装置、散热方法、电子装置及计算机可读存储介质，包括声波振荡器和振荡膜，其中，声波振荡器被配置为发出声波，振荡膜设置于声波振荡器所发出声波的传输路径上，声波振荡器发出的声波带动振荡膜振动，以使振荡膜附近的空气流动。根据本发明实施例提供的方案，利用声波振荡器带动振荡膜发生振动以使电子设备内部目标对象表面的空气流动加快，从而将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。此外，由于整体结构简单，占用空间小，因此，可根据电子设备内部结构和目标对象的位置进行灵活布局，且其功耗低、对电子设备干扰小。The present invention provides a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium, including an acoustic wave oscillator and an oscillating film, wherein the acoustic wave oscillator is configured to emit sound waves and oscillate The membrane is arranged on the transmission path of the sound wave emitted by the acoustic wave oscillator, and the sound wave emitted by the acoustic wave oscillator drives the oscillating membrane to vibrate, so that the air near the oscillating membrane flows. According to the solution provided by the embodiments of the present invention, the acoustic wave oscillator is used to drive the oscillating film to vibrate to accelerate the air flow on the surface of the target object inside the electronic device, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object . In addition, because the overall structure is simple and the space occupied is small, it can be flexibly laid out according to the internal structure of the electronic device and the location of the target object, and its power consumption is low and the interference to the electronic device is small.

下面结合附图，对本发明实施例作进一步阐述。The embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

如图1A所示，图1A是本发明一个实施例提供的散热组件100的示意图。在图1的示例中，该散热组件100包括声波振荡器110和振荡膜120，其中，声波振荡器110被配置为发出声波，振荡膜120设置于声波振荡器110所发出声波的传输路径上，声波振荡器110发出的声波带动振荡膜120振动，以使振荡膜120附近的空气流动。散热组件100整体结构简单，尺寸较小，占用空间小，因此，可灵活布局在电子设备300内部对目标对象所在的位置进行散热。其中，目标对象是指发热器件，例如芯片。此外，声波振荡器110工作时功耗低，利用声波振荡器110发出的声波带动振荡膜120振动，不存在电磁辐射，因此对电子设备300干扰小。As shown in FIG. 1A, FIG. 1A is a schematic diagram of aheat dissipation assembly 100 provided by an embodiment of the present invention. In the example of FIG. 1, theheat dissipation assembly 100 includes anacoustic wave oscillator 110 and anoscillating film 120, wherein theacoustic wave oscillator 110 is configured to emit sound waves, and theoscillating film 120 is disposed on the transmission path of the sound waves emitted by theacoustic wave oscillator 110, The sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, so that the air near theoscillating membrane 120 flows. The overall structure of theheat dissipation assembly 100 is simple, the size is small, and the space occupied is small. Therefore, it can be flexibly arranged inside theelectronic device 300 to dissipate heat at the location where the target object is located. Among them, the target object refers to a heating device, such as a chip. In addition, theacoustic wave oscillator 110 has low power consumption during operation, and the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, and there is no electromagnetic radiation, so the interference to theelectronic device 300 is small.

在一实施例中，振荡膜120和声波振荡器110之间间隔一定间隙，以利于振荡膜120 发生振荡时具有更大振幅的空间，本实施例不作具体限制。In an embodiment, there is a certain gap between theoscillating membrane 120 and theacoustic wave oscillator 110 to facilitate a larger amplitude space when theoscillating membrane 120 oscillates, which is not specifically limited in this embodiment.

需要指出的是，声波振荡器110发出的声波包括但不限于超声波、次声波，本实施例不作具体限制。It should be noted that the sound waves emitted by theacoustic wave oscillator 110 include but are not limited to ultrasonic waves and infrasound waves, which are not specifically limited in this embodiment.

在一实施例中，利用声波振荡器110带动振荡膜120发生振动以使电子设备300内部目标对象表面的空气流动加快，从而将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。In one embodiment, theacoustic wave oscillator 110 is used to drive the oscillatingmembrane 120 to vibrate to accelerate the air flow on the surface of the target object inside theelectronic device 300, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object .

在一实施例中，声波振荡器110包括被配置为将电能转换为机械能的换能部件和被配置为发出声波的发振面，振荡膜120设置于发振面的前方。具体地，声波振荡器110包括换能部件和发振面，换能部件上电后将电能转换为机械能，以驱动发振面发出声波，由于振荡膜120设置在发振面的前方，所以，声波振荡器110发出的声波能够带动振荡膜120发生振动，以使振荡膜附近的空气流动。相对于现有技术中，利用电磁线圈通电时产生与磁体相作用的磁场来带动振膜发生振动的方式，本实施例的散热组件100工作时功耗较低，利用声波振荡器110发出的声波带动振荡膜120振动，不存在电磁辐射，因此对电子设备300干扰小。In an embodiment, theacoustic wave oscillator 110 includes a transducing component configured to convert electrical energy into mechanical energy and a vibrating surface configured to emit sound waves, and theoscillating membrane 120 is disposed in front of the vibrating surface. Specifically, theacoustic wave oscillator 110 includes a transducing component and a vibrating surface. After the transducing component is powered on, the electrical energy is converted into mechanical energy to drive the vibrating surface to emit sound waves. Since theoscillating membrane 120 is arranged in front of the vibrating surface, The sound waves emitted by theacoustic wave oscillator 110 can drive the oscillatingmembrane 120 to vibrate, so that the air near the oscillating membrane can flow. Compared with the prior art, the magnetic field that interacts with the magnet is used to drive the diaphragm to vibrate when the electromagnetic coil is energized, theheat dissipation assembly 100 of this embodiment has lower power consumption during operation, and uses the sound waves emitted by theacoustic wave oscillator 110 Theoscillating membrane 120 is driven to vibrate, and there is no electromagnetic radiation, so the interference to theelectronic device 300 is small.

在一实施例中，包括多个声波振荡器110，多个声波振荡器110组成声波振荡器阵列。在本实施例中，多个声波振荡器110可以采取并排的方式组成声波振荡器阵列，声波振荡器110发出的声波带动各自对应的振荡膜120发生振动，以进一步使振荡膜120附近的空气流动加快。In one embodiment, a plurality ofacoustic wave oscillators 110 are included, and the plurality ofacoustic wave oscillators 110 form an array of acoustic wave oscillators. In this embodiment, a plurality ofacoustic wave oscillators 110 can be arranged side by side to form an array of acoustic wave oscillators, and the sound waves emitted by theacoustic wave oscillators 110 drive their correspondingoscillating membranes 120 to vibrate, so as to further make the air near theoscillating membrane 120 flow. accelerate.

在一实施例中，振荡膜120的数量为一个，振荡膜120设置于声波振荡器阵列所发出声波的传输路径上。在本实施例中，声波振荡器阵列对应一个振荡膜120，声波振荡器阵列发出的声波带动该振荡膜120发生振动，由于振荡膜120的振动加剧，使得振荡膜120附近的空气流动加快。In an embodiment, the number of theoscillating film 120 is one, and theoscillating film 120 is disposed on the transmission path of the sound waves emitted by the acoustic wave oscillator array. In this embodiment, the acoustic wave oscillator array corresponds to anoscillating membrane 120, and the sound waves emitted by the acoustic wave oscillator array drive the oscillatingmembrane 120 to vibrate. As the vibration of theoscillating membrane 120 is intensified, the air flow near theoscillating membrane 120 is accelerated.

在一实施例中，声波振荡器110发出的声波为超声波。超声波是一种频率高于20000赫兹的声波，它的方向性好，反射能力强，易于获得较集中的声能。由于超声波其频率下限超过人的听觉上限，所以不会对人产生噪音。In one embodiment, the sound waves emitted by theacoustic wave oscillator 110 are ultrasonic waves. Ultrasound is a sound wave with a frequency higher than 20000 Hz. It has good directivity, strong reflection ability, and is easy to obtain concentrated sound energy. Since the lower limit of ultrasonic frequency exceeds the upper limit of human hearing, it will not produce noise to humans.

在一实施例中，如图1B所示，散热组件100还包括腔体130，腔体包括出风端131；声波振荡器110和振荡膜120设置于腔体130内。当声波振荡器110发出的声波带动振荡膜120发生振动，流动的空气集中从出风端131加快流出，加快流动的空气将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。In one embodiment, as shown in FIG. 1B, theheat dissipation assembly 100 further includes acavity 130, and the cavity includes anair outlet 131; theacoustic wave oscillator 110 and theoscillating membrane 120 are arranged in thecavity 130. When the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, the flowing air concentrates and accelerates out of theair outlet 131, and the accelerated air quickly removes heat from the surface of the target object, achieving the effect of reducing the surface temperature of the target object.

在一实施例中，振荡膜120的一侧面向出风端131，振荡膜120的另一侧面向声波振荡器110。即振荡膜120正对出风端131，且出风端131处于声波振荡器110所发出声波 的传输路径上，当声波振荡器110发出的声波带动振荡膜120发生振动，更利于流动的空气集中从出风端131加快流出，加快流动的空气将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。In one embodiment, one side of theoscillating membrane 120 faces theair outlet 131 and the other side of theoscillating membrane 120 faces theacoustic wave oscillator 110. That is, theoscillating membrane 120 is facing theair outlet 131, and theair outlet 131 is on the transmission path of the sound wave emitted by theacoustic wave oscillator 110. When the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, it is more conducive to the concentration of flowing air. The air flowing out from theair outlet 131 accelerates, and the accelerated air quickly takes away the heat from the surface of the target object, so as to achieve the effect of reducing the surface temperature of the target object.

下面将对散热结构200的具体结构作出各种实施例描述。Various embodiments will be described below for the specific structure of theheat dissipation structure 200.

如图2A所示，图2A是本发明一个实施例提供的散热结构200的示意图。As shown in FIG. 2A, FIG. 2A is a schematic diagram of aheat dissipation structure 200 provided by an embodiment of the present invention.

散热结构200包括散热组件100和风道210，散热组件100设置于风道210内。Theheat dissipation structure 200 includes aheat dissipation assembly 100 and anair duct 210, and theheat dissipation assembly 100 is disposed in theair duct 210.

在一实施例中，针对需要散热的目标对象，设计风道210作为专用的散热通道，以控制空气的流动路径和流动量，达到有针对性的散热。将散热组件100设置于风道210内，当声波振荡器110发出的声波带动振荡膜120发生振动，并使得空气在风道210内流动，通过流动的空气将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。In one embodiment, theair duct 210 is designed as a dedicated heat dissipation channel for the target object that needs heat dissipation, so as to control the flow path and flow volume of the air to achieve targeted heat dissipation. Theheat dissipation assembly 100 is arranged in theair duct 210. When the sound wave emitted by thesonic oscillator 110 drives theoscillating membrane 120 to vibrate and causes air to flow in theair duct 210, the heat from the surface of the target object is quickly taken away by the flowing air. Achieve the effect of reducing the surface temperature of the target object.

在一实施例中，如图2B所示，风道210包括第一进风口211和至少一个第一出风口212，散热组件100设置于第一进风口211处。在本实施例中，风道210可以根据散热需要设计有一个第一出风口212或者多个第一出风口212，而散热组件100可以设置于第一进风口211处。需要指出的是，风道210走向途经的路径可以有单个需要散热的目标对象，也可以有多个需要散热的目标对象。In an embodiment, as shown in FIG. 2B, theair duct 210 includes afirst air inlet 211 and at least onefirst air outlet 212, and theheat dissipation assembly 100 is disposed at thefirst air inlet 211. In this embodiment, theair duct 210 may be designed with afirst air outlet 212 or a plurality offirst air outlets 212 according to heat dissipation requirements, and theheat dissipation assembly 100 may be disposed at thefirst air inlet 211. It should be pointed out that the path along which theair duct 210 travels may have a single target object requiring heat dissipation, or there may be multiple target objects requiring heat dissipation.

在一实施例中，散热结构200还包括调节机构，调节机构与散热组件100连接，调节机构被配置为调节散热组件100的方向或位置。对于处于不同方位的多个需要散热的目标对象，采用调节机构来调节散热组件100的方向或位置，以使得散热组件100可以根据控制要求依次对不同方位的目标对象进行散热，使得散热更加合理。In an embodiment, theheat dissipation structure 200 further includes an adjustment mechanism connected to theheat dissipation assembly 100, and the adjustment mechanism is configured to adjust the direction or position of theheat dissipation assembly 100. For multiple target objects in different orientations that require heat dissipation, an adjustment mechanism is used to adjust the direction or position of theheat dissipation assembly 100, so that theheat dissipation assembly 100 can sequentially dissipate heat for the target objects in different orientations according to the control requirements, making the heat dissipation more reasonable.

在一实施例中，调节机构包括旋转组件，旋转组件与散热组件100连接，旋转组件带动散热组件100旋转。对于处于不同方向的多个需要散热的目标对象，每个目标对象都设计有相对应的风道210，通过旋转组件带动散热组件100旋转，以使得散热组件100可以对接到对应的风道210，从而对不同方向的目标对象进行散热。In an embodiment, the adjustment mechanism includes a rotating component, the rotating component is connected to theheat dissipation component 100, and the rotating component drives theheat dissipation component 100 to rotate. For multiple target objects that need heat dissipation in different directions, each target object is designed with acorresponding air duct 210, and theheat dissipation assembly 100 is driven to rotate through the rotating assembly, so that theheat dissipation assembly 100 can be docked to thecorresponding air duct 210. So as to dissipate heat from target objects in different directions.

此外，本发明的一个实施例还提供了一种电子设备，该电子设备包括散热组件100或散热结构200。In addition, an embodiment of the present invention also provides an electronic device, which includes aheat dissipation assembly 100 or aheat dissipation structure 200.

在一实施例中，利用声波振荡器110让空气发生振动，带动声波振荡器110前方的振荡膜120，振荡膜120发生规律性振动，振荡膜120两侧的空气在垂直于振荡膜120的方向上被压缩，让电子设备300内部空气发生横向波动，进而使得电子设备300内部空气被压缩造成空气加速流动，电子设备300内部的空气加速流动带走目标对象表面的热量，从而达到电子设备300降温的效果。In one embodiment, theacoustic wave oscillator 110 is used to make the air vibrate, which drives theoscillating membrane 120 in front of thesonic oscillator 110. Theoscillating membrane 120 vibrates regularly. The air on both sides of theoscillating membrane 120 is perpendicular to theoscillating membrane 120. The air inside theelectronic device 300 is compressed, causing the air inside theelectronic device 300 to fluctuate laterally, and the air inside theelectronic device 300 is compressed to cause the air to flow faster. The air inside theelectronic device 300 accelerates to flow away from the surface of the target object, thereby cooling theelectronic device 300 Effect.

如图3A所示，图3A是本发明一个实施例提供的电子设备300的结构示意图。As shown in FIG. 3A, FIG. 3A is a schematic structural diagram of anelectronic device 300 according to an embodiment of the present invention.

该电子设备300包括壳体310和散热组件100；电子器件314设置于壳体310内，电子器件314在工作状态下发热；散热组件100设置于壳体310内，被配置为使壳体310内的空气流动，以对电子器件314散热。Theelectronic device 300 includes ahousing 310 and aheat dissipation assembly 100; theelectronic device 314 is arranged in thehousing 310, and theelectronic device 314 generates heat in the working state; theheat dissipation assembly 100 is arranged in thehousing 310 and is configured to make thehousing 310 The air flows to dissipate the heat of theelectronic device 314.

在一实施例中，声波振荡器110发出的声波带动振荡膜120振动，以使振荡膜120附近的空气流动，流动的空气会将电子器件314表面的热量快速带走，达到降低电子器件314表面温度的效果。In one embodiment, the sound waves emitted by theacoustic wave oscillator 110 drive the oscillatingmembrane 120 to vibrate, so that the air near theoscillating membrane 120 flows. The flowing air will quickly take away the heat from the surface of theelectronic device 314, thereby reducing the surface of theelectronic device 314. The effect of temperature.

需要指出的是，电子设备300包括但不限于手机、客户终端设备CPE、笔记本电脑、平板电脑、智能穿戴设备、智能家电以及车载系统等集成度较高的电子消费产品。It should be pointed out that theelectronic device 300 includes, but is not limited to, mobile phones, client terminal equipment CPEs, notebook computers, tablet computers, smart wearable devices, smart home appliances, and in-vehicle systems and other highly integrated electronic consumer products.

下面将对电子设备300的具体结构作出各种实施例描述。Various embodiments will be described below for the specific structure of theelectronic device 300.

在一实施例中，散热组件100靠近电子器件314布置，这样，声波振荡器110发出的声波带动振荡膜120振动，以使振荡膜120附近电子器件314的空气流动加快，流动的空气会将电子器件314表面的热量快速带走，达到降低电子器件314表面温度的效果。In one embodiment, theheat dissipation assembly 100 is arranged close to theelectronic device 314. In this way, the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, so that the air flow of theelectronic device 314 near theoscillating membrane 120 is accelerated. The heat on the surface of thedevice 314 is quickly taken away, achieving the effect of reducing the surface temperature of theelectronic device 314.

在一实施例中，如图3B所示，壳体310包括第二进风口311和至少一个第二出风口312，散热组件100设置于第二进风口311处，散热组件100使第二进风口311和第二出风口312之间形成空气流动风道313，空气流动风道313覆盖电子器件314。在本实施例中，将散热组件100设置于第二进风口311处，当声波振荡器110发出的声波带动振荡膜120发生振动，并使得空气在第二进风口311和第二出风口312之间形成的空气流动风道313内流动，通过流动的空气将电子器件314表面的热量快速带走传到出壳体310之外，达到降低电子器件314表面温度的效果。In one embodiment, as shown in FIG. 3B, thehousing 310 includes asecond air inlet 311 and at least onesecond air outlet 312, theheat dissipation assembly 100 is disposed at thesecond air inlet 311, and theheat dissipation assembly 100 makes the second air inlet Anair flow duct 313 is formed between 311 and thesecond air outlet 312, and theair flow duct 313 covers theelectronic device 314. In this embodiment, theheat dissipation assembly 100 is arranged at thesecond air inlet 311, when the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, and causes air to flow between thesecond air inlet 311 and thesecond air outlet 312 Theair flow channel 313 formed in between flows in, and the heat on the surface of theelectronic device 314 is quickly taken away and transferred out of thehousing 310 through the flowing air, so as to achieve the effect of reducing the surface temperature of theelectronic device 314.

在一实施例中，包括两个以上电子器件314，两个以上电子器件314分布设置于空气流动风道313上，当声波振荡器110发出的声波带动振荡膜120发生振动，并使得空气在第二进风口311和第二出风口312之间形成的空气流动风道313内流动，通过流动的空气将多个电子器件314表面的热量快速带走，达到降低多个电子器件314表面温度的效果。In one embodiment, it includes two or moreelectronic devices 314, and the two or moreelectronic devices 314 are distributed on theair flow duct 313. When the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, the air is in the first place. The air flow in theair passage 313 formed between thesecond air inlet 311 and thesecond air outlet 312 flows, and the heat on the surface of the multipleelectronic devices 314 is quickly taken away by the flowing air, so as to achieve the effect of reducing the surface temperature of the multipleelectronic devices 314 .

在一实施例中，如图3C所示，包括两个以上电子器件314，两个以上电子器件314分别设置于壳体310内的不同位置；电子设备300还包括与散热组件100连接的调节机构315，调节机构315被配置为控制散热组件100的方向或位置。在本实施例中，由于多个电子器件314处于壳体310内的不同位置，通过采用调节机构315来调节散热组件100的方向或位置，以使得散热组件100可以根据控制要求依次对不同位置的电子器件314进行散热，使得散热更加合理。In one embodiment, as shown in FIG. 3C, two or moreelectronic devices 314 are included, and the two or moreelectronic devices 314 are respectively disposed in different positions in thehousing 310; theelectronic device 300 further includes an adjustment mechanism connected to theheat dissipation assembly 100 315. Theadjustment mechanism 315 is configured to control the direction or position of theheat dissipation assembly 100. In this embodiment, since the multipleelectronic devices 314 are in different positions in thehousing 310, theadjustment mechanism 315 is used to adjust the direction or position of theheat dissipating assembly 100, so that theheat dissipating assembly 100 can sequentially adjust the positions of theheat dissipating assembly 100 according to the control requirements. Theelectronic device 314 performs heat dissipation, which makes the heat dissipation more reasonable.

在一实施例中，如图3D所示，还包括两个以上分别与电子器件314对应的第一风道320，调节机构315控制散热组件100的方向或位置以对接第一风道320。对于处于不同方 向的多个电子器件314，每个电子器件314都设计有相对应的第一风道320，通过调节机构315带动散热组件100旋转，以使得散热组件100可以对接到对应的第一风道320，从而对不同方向的目标对象进行散热。In one embodiment, as shown in FIG. 3D, it further includes two or morefirst air ducts 320 corresponding to theelectronic device 314, and theadjustment mechanism 315 controls the direction or position of theheat dissipation assembly 100 to be connected to thefirst air duct 320. For a plurality ofelectronic devices 314 in different directions, eachelectronic device 314 is designed with a correspondingfirst air duct 320, and theheat dissipation assembly 100 is driven to rotate through theadjustment mechanism 315, so that theheat dissipation assembly 100 can be docked to the corresponding first air duct. Theair duct 320 dissipates heat from target objects in different directions.

在一实施例中，电子设备300为移动终端，移动终端包括但不限于手机。In an embodiment, theelectronic device 300 is a mobile terminal, and the mobile terminal includes but is not limited to a mobile phone.

如图4所示，图4是本发明一个实施例提供的散热装置400的示意图。As shown in FIG. 4, FIG. 4 is a schematic diagram of aheat dissipation device 400 provided by an embodiment of the present invention.

该散热装置400应用于电子设备，且电子设备中设置有散热组件100或散热结构200。散热装置400包括检测部件410和控制部件420，其中，检测部件410被配置为检测目标对象的温度值，控制部件420分别与散热组件100和检测部件410电连接。Theheat dissipation device 400 is applied to electronic equipment, and the electronic equipment is provided with aheat dissipation component 100 or aheat dissipation structure 200. Theheat dissipation device 400 includes adetection component 410 and acontrol component 420, wherein thedetection component 410 is configured to detect the temperature value of the target object, and thecontrol component 420 is electrically connected to theheat dissipation component 100 and thedetection component 410, respectively.

在一实施例中，散热装置400通过检测部件410检测电子设备内部电子器件的温度值，控制部件420会根据检测到电子器件的温度值来控制散热组件100开启或者关闭。当散热组件100启动后，声波振荡器110发出的声波带动振荡膜120振动，以使振荡膜120附近的空气流动，流动的空气会将电子器件表面的热量快速带走，达到降低电子器件表面温度的效果。其中，检测部件410可以为温度传感器，控制部件420可以为单片机或者现场可编程逻辑门阵列(Field Programmable Gate Array，PFGA)芯片，本实施例并不对其作具体限制。In one embodiment, theheat dissipation device 400 detects the temperature value of the electronic device inside the electronic device through thedetection component 410, and thecontrol component 420 controls theheat dissipation assembly 100 to turn on or off according to the detected temperature value of the electronic device. When theheat dissipation assembly 100 is activated, the sound wave emitted by theacoustic wave oscillator 110 drives theoscillating membrane 120 to vibrate, so that the air near theoscillating membrane 120 flows, and the flowing air will quickly take away the heat from the surface of the electronic device to reduce the surface temperature of the electronic device. Effect. Thedetection component 410 may be a temperature sensor, and thecontrol component 420 may be a single-chip microcomputer or a Field Programmable Gate Array (PFGA) chip, which is not specifically limited in this embodiment.

在一实施例中，响应于目标对象的温度值超过预设温度值，控制部件420控制散热组件100对目标对象进行散热。其中，预设温度值为默认的或者可设定的安全范围温度值。若检测部件410检测到电子器件的温度值超过预设温度值，控制部件420会控制散热组件100启动，声波振荡器110发出的声波带动振荡膜120振动，以使振荡膜120附近的空气流动，流动的空气会将电子器件表面的热量快速带走，达到降低电子器件表面温度的效果。而当检测部件410检测到电子器件温度值降低到预设温度值以下，控制部件420会关闭散热组件100，声波振荡器110停止工作，振荡膜120也随之停止振荡，整个过程实现电子设备内部电子器件温度的实时动态调节。In an embodiment, in response to the temperature value of the target object exceeding the preset temperature value, thecontrol component 420 controls theheat dissipation assembly 100 to dissipate heat to the target object. Among them, the preset temperature value is a default or settable safety range temperature value. If thedetection component 410 detects that the temperature value of the electronic device exceeds the preset temperature value, thecontrol component 420 will control theheat dissipation assembly 100 to start, and the sound wave emitted by thesonic oscillator 110 drives theoscillating membrane 120 to vibrate, so that the air near theoscillating membrane 120 flows. The flowing air will quickly take away the heat from the surface of the electronic device, achieving the effect of reducing the surface temperature of the electronic device. When thedetection component 410 detects that the temperature of the electronic device drops below the preset temperature value, thecontrol component 420 will turn off theheat dissipation assembly 100, theacoustic wave oscillator 110 will stop working, and theoscillating membrane 120 will also stop oscillating. The whole process is realized inside the electronic device. Real-time dynamic adjustment of electronic device temperature.

如图5A所示，图5A是本发明一个实施例提供的散热方法的流程图。As shown in FIG. 5A, FIG. 5A is a flowchart of a heat dissipation method provided by an embodiment of the present invention.

该散热方法应用于散热装置，且散热装置中设置有如上述的散热组件、检测部件和控制部件，控制部件分别与散热组件和检测部件电连接。The heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation component, the detection component and the control component as described above, and the control component is electrically connected with the heat dissipation component and the detection component respectively.

散热方法包括但不限于如下步骤：The heat dissipation method includes but is not limited to the following steps:

步骤S510：获取目标对象的温度值；Step S510: Obtain the temperature value of the target object;

步骤S520：当目标对象的温度值超过预设温度值时，控制散热组件对目标对象进行散热。Step S520: When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.

在一实施例中，控制部件通过检测部件获取目标对象的温度值，当目标对象的温度值 超过预设温度值时，控制部件会控制散热组件对目标对象进行散热。其中，预设温度值为默认的或者可设定的安全范围温度值。若检测部件检测到电子器件的温度值超过预设温度值，控制部件会控制散热组件启动，声波振荡器发出的声波带动振荡膜振动，以使振荡膜附近的空气流动，流动的空气会将电子器件表面的热量快速带走，达到降低电子器件表面温度的效果。而当检测部件检测到电子器件温度值降低到预设温度值以下，控制部件会控制散热组件进入待机状态，声波振荡器停止工作，振荡膜也随之停止振荡，整个过程实现电子设备内部电子器件温度的实时动态调节。In one embodiment, the control component obtains the temperature value of the target object through the detection component, and when the temperature value of the target object exceeds a preset temperature value, the control component controls the heat dissipation component to dissipate heat to the target object. Among them, the preset temperature value is a default or settable safety range temperature value. If the detection component detects that the temperature value of the electronic device exceeds the preset temperature value, the control component will control the heat dissipation component to start, and the sound wave emitted by the acoustic wave oscillator will drive the oscillating membrane to vibrate, so that the air near the oscillating membrane will flow, and the flowing air will cause the electrons to flow. The heat on the surface of the device is quickly taken away, achieving the effect of reducing the surface temperature of the electronic device. When the detection component detects that the temperature value of the electronic device has dropped below the preset temperature value, the control component will control the heat dissipation component to enter the standby state, the acoustic wave oscillator will stop working, and the oscillating film will stop oscillating. The whole process realizes the internal electronic device of the electronic device. Real-time dynamic adjustment of temperature.

另外，如图5B所示，本申请的另一个实施例还提供了一种散热方法方法，该散热方法应用于散热装置，且散热装置中还设置有与散热组件连接的调节部件。本实施例是上述实施例中步骤S520的细化流程的另一个实施例，该步骤S520包括但不限于：In addition, as shown in FIG. 5B, another embodiment of the present application also provides a heat dissipation method. The heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is also provided with an adjusting component connected to the heat dissipation component. This embodiment is another embodiment of the detailed process of step S520 in the above embodiment, and this step S520 includes but is not limited to:

步骤S521，当目标对象的温度值超过预设温度值时，控制调节部件调整散热组件的方向或位置以对目标对象进行散热。In step S521, when the temperature value of the target object exceeds the preset temperature value, the adjustment component is controlled to adjust the direction or position of the heat dissipation component to dissipate the heat of the target object.

值得注意的是，本实施例中的步骤S521，是对上述实施例中步骤S520的进一步限定。本实施例中的步骤S521，当电子设备内部存在多个位于不同位置的电子器件，通过采用调节部件来调节散热组件的方向或位置，以使得散热组件可以根据控制要求依次对不同位置的电子器件进行散热，使得散热更加合理。It is worth noting that step S521 in this embodiment is a further limitation of step S520 in the foregoing embodiment. In step S521 in this embodiment, when there are multiple electronic devices located in different positions inside the electronic device, the direction or position of the heat dissipation assembly is adjusted by adopting adjustment components, so that the heat dissipation assembly can sequentially control the electronic devices at different positions according to the control requirements. Perform heat dissipation to make the heat dissipation more reasonable.

在一实施例中，调节机构为旋转组件，旋转组件与散热组件连接，旋转组件带动散热组件旋转。对于处于不同方向的多个需要散热的目标对象，每个目标对象都设计有相对应的风道，通过旋转组件带动散热组件旋转，以使得散热组件可以对接到对应的风道，从而对不同方向的目标对象进行散热。In one embodiment, the adjustment mechanism is a rotating component, the rotating component is connected to the heat dissipation component, and the rotating component drives the heat dissipation component to rotate. For multiple target objects that need heat dissipation in different directions, each target object is designed with a corresponding air duct. The rotating component drives the heat dissipation component to rotate, so that the heat dissipation component can be docked to the corresponding air duct for different directions. The target object for heat dissipation.

此外，本发明的一个实施例还提供了一种电子装置，该电子装置包括：存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序。In addition, an embodiment of the present invention also provides an electronic device, which includes a memory, a processor, and a computer program stored on the memory and running on the processor.

处理器和存储器可以通过总线或者其他方式连接。The processor and the memory can be connected by a bus or in other ways.

存储器作为一种非暂态计算机可读存储介质，可用于存储非暂态软件程序以及非暂态性计算机可执行程序。此外，存储器可以包括高速随机存取存储器，还可以包括非暂态存储器，例如至少一个磁盘存储器件、闪存器件、或其他非暂态固态存储器件。在一些实施方式中，存储器可选包括相对于处理器远程设置的存储器，这些远程存储器可以通过网络连接至该处理器。上述网络的实例包括但不限于互联网、企业内部网、局域网、移动通信网及其组合。As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged with respect to the processor, and these remote memories may be connected to the processor through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

实现上述实施例中应用于电子装置的散热方法所需的非暂态软件程序以及指令，或者实现上述实施例中应用于服务器的散热方法所需的非暂态软件程序以及指令，存储在存储 器中，当被处理器执行时，执行上述实施例中应用于电子装置的散热方法，例如，执行以上描述的图5A中的方法步骤S510至S520、图5B中的方法步骤S510至S521。The non-transitory software programs and instructions required to implement the heat dissipation method applied to the electronic device in the foregoing embodiment, or the non-transitory software programs and instructions required to implement the heat dissipation method applied to the server in the foregoing embodiment, are stored in the memory When executed by the processor, the heat dissipation method applied to the electronic device in the above embodiment is executed, for example, the method steps S510 to S520 in FIG. 5A and the method steps S510 to S521 in FIG. 5B described above are executed.

此外，本发明的一个实施例还提供了一种计算机可读存储介质，该计算机可读存储介质存储有计算机可执行指令，该计算机可执行指令被一个处理器或控制器执行，例如，被上述电子装置实施例中的一个处理器执行，可使得上述处理器执行上述实施例中的散热方法，例如，执行以上描述的图5A中的方法步骤S510至S520、图5B中的方法步骤S510至S521。In addition, an embodiment of the present invention also provides a computer-readable storage medium that stores computer-executable instructions, and the computer-executable instructions are executed by a processor or a controller, for example, by the aforementioned The execution of a processor in the embodiment of the electronic device may cause the processor to execute the heat dissipation method in the embodiment, for example, to execute the method steps S510 to S520 in FIG. 5A and the method steps S510 to S521 in FIG. 5B described above. .

本发明实施例包括：声波振荡器和振荡膜，其中，声波振荡器用于发出声波，振荡膜设置于声波振荡器所发出声波的传输路径上，声波振荡器发出的声波带动振荡膜振动，以使振荡膜附近的空气流动。根据本发明实施例提供的方案，利用声波振荡器带动振荡膜发生振动以使电子设备内部目标对象表面的空气流动加快，从而将目标对象表面的热量快速带走，达到降低目标对象表面温度的效果。此外，由于整体结构简单，占用空间小，因此，可根据电子设备内部结构和目标对象的位置进行灵活布局，且其功耗低、对电子设备干扰小。The embodiment of the present invention includes: an acoustic wave oscillator and an oscillating membrane, where the acoustic wave oscillator is used to emit sound waves, the oscillating membrane is arranged on the transmission path of the sound waves emitted by the sonic oscillator, and the sound waves emitted by the sonic oscillator drive the oscillating membrane to vibrate to Allow the air near the oscillating membrane to flow. According to the solution provided by the embodiments of the present invention, the acoustic wave oscillator is used to drive the oscillating film to vibrate to accelerate the air flow on the surface of the target object inside the electronic device, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object . In addition, because the overall structure is simple and the space occupied is small, it can be flexibly laid out according to the internal structure of the electronic device and the location of the target object, and its power consumption is low and the interference to the electronic device is small.

本领域普通技术人员可以理解，上文中所公开方法中的全部或某些步骤、系统可以被实施为软件、固件、硬件及其适当的组合。某些物理组件或所有物理组件可以被实施为由处理器，如中央处理器、数字信号处理器或微处理器执行的软件，或者被实施为硬件，或者被实施为集成电路，如专用集成电路。这样的软件可以分布在计算机可读介质上，计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的，术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外，本领域普通技术人员公知的是，通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据，并且可包括任何信息递送介质。A person of ordinary skill in the art can understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Certain physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit . Such software may be distributed on a computer-readable medium, and the computer-readable medium may include a computer storage medium (or a non-transitory medium) and a communication medium (or a transitory medium). As is well known by those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile data implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Sexual, removable and non-removable media. Computer storage media include but are not limited to RAM, ROM, EEPROM, flash memory or other storage technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or Any other medium used to store desired information and that can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, communication media usually contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as carrier waves or other transmission mechanisms, and may include any information delivery media. .

以上是对本发明的实施进行了具体说明，但本发明并不局限于上述实施方式，熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换，这些等同的变形或替换均包含在本发明权利要求所限定的范围内。The above is a specific description of the implementation of the present invention, but the present invention is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. These are equivalent. Variations or replacements of are included within the scope defined by the claims of the present invention.

Claims (20)

Translated fromChinese

一种散热组件，包括：A heat dissipation component, including:声波振荡器，被配置为发出声波；以及A sonic oscillator configured to emit sound waves; and振荡膜，设置于所述声波振荡器所发出声波的传输路径上；以及The oscillating membrane is arranged on the transmission path of the sound wave emitted by the sound wave oscillator; and其中，所述声波振荡器发出的声波带动所述振荡膜振动，以使所述振荡膜附近的空气流动。Wherein, the sound waves emitted by the acoustic wave oscillator drive the oscillating membrane to vibrate, so that the air near the oscillating membrane flows.根据权利要求1所述的散热组件，其中，The heat dissipation assembly according to claim 1, wherein:所述声波振荡器包括换能部件和发振面，其中，所述换能部件被配置为将电能转换为机械能，所述发振面被配置为发出声波，所述振荡膜设置于所述发振面的前方。The acoustic wave oscillator includes a transducing member and a vibrating surface, wherein the transducing member is configured to convert electrical energy into mechanical energy, the vibrating surface is configured to emit sound waves, and the oscillating membrane is disposed on the generating surface. The front of the vibration surface.根据权利要求1所述的散热组件，包括多个所述的声波振荡器，其中多个所述的声波振荡器组成声波振荡器阵列。The heat dissipation assembly according to claim 1, comprising a plurality of said acoustic wave oscillators, wherein the plurality of said acoustic wave oscillators form an array of acoustic wave oscillators.根据权利要求3所述的散热组件，其中，所述振荡膜的数量为一个，所述振荡膜设置于所述声波振荡器阵列所发出声波的传输路径上。3. The heat dissipation assembly according to claim 3, wherein the number of the oscillating film is one, and the oscillating film is arranged on the transmission path of the sound wave emitted by the acoustic wave oscillator array.根据权利要求1至4任意一项所述的散热组件，其中，The heat dissipation assembly according to any one of claims 1 to 4, wherein:所述声波振荡器发出的声波为超声波。The sound waves emitted by the sound wave oscillator are ultrasonic waves.根据权利要求1至4任意一项所述的散热组件，还包括：The heat dissipation assembly according to any one of claims 1 to 4, further comprising:腔体，所述腔体包括出风端；以及A cavity, the cavity includes an air outlet; and其中，所述声波振荡器和所述振荡膜设置于所述腔体内。Wherein, the acoustic wave oscillator and the oscillating membrane are arranged in the cavity.根据权利要求6所述的散热组件，其中，所述振荡膜的一侧面向所述出风端，所述振荡膜的另一侧面向所述声波振荡器。7. The heat dissipation assembly according to claim 6, wherein one side of the oscillating membrane faces the wind outlet, and the other side of the oscillating membrane faces the acoustic wave oscillator.一种散热结构，包括：A heat dissipation structure, including:根据权利要求1至7任意一项所述的散热组件；以及The heat dissipation assembly according to any one of claims 1 to 7; and风道，所述散热组件设置于所述风道内。The air duct, the heat dissipation component is arranged in the air duct.根据权利要求8所述的散热结构，其中，所述散热结构还包括调节机构，所述调节机构与所述散热组件连接，所述调节机构被配置为调节所述散热组件的方向或位置。8. The heat dissipation structure according to claim 8, wherein the heat dissipation structure further comprises an adjustment mechanism connected to the heat dissipation assembly, and the adjustment mechanism is configured to adjust the direction or position of the heat dissipation assembly.根据权利要求9所述的散热结构，其中，所述调节机构包括旋转组件，所述旋转组件与所述散热组件连接，所述旋转组件带动所述散热组件旋转。9. The heat dissipation structure according to claim 9, wherein the adjustment mechanism comprises a rotating assembly connected to the heat dissipation assembly, and the rotating assembly drives the heat dissipation assembly to rotate.一种电子设备，包括：An electronic device including:壳体；case;电子器件，设置于所述壳体内，所述电子器件在工作状态下发热；以及The electronic device is arranged in the housing, and the electronic device generates heat in the working state; and根据权利要求1至7中任意一项所述的散热组件，所述散热组件设置于所述壳体内， 并被配置为使所述壳体内的空气流动，以对所述电子器件散热。7. The heat dissipation assembly according to any one of claims 1 to 7, the heat dissipation assembly is disposed in the casing and is configured to flow air in the casing to dissipate heat from the electronic device.根据权利要求11所述的电子设备，其中，所述壳体包括第二进风口和至少一个第二出风口，所述散热组件设置于所述第二进风口处，所述散热组件使第二进风口和第二出风口之间形成空气流动风道，所述空气流动风道覆盖所述电子器件。The electronic device according to claim 11, wherein the housing includes a second air inlet and at least one second air outlet, the heat dissipation component is disposed at the second air inlet, and the heat dissipation component makes the second air inlet An air flow duct is formed between the air inlet and the second air outlet, and the air flow duct covers the electronic device.根据权利要求12所述的电子设备，其特征在于，包括两个以上所述的电子器件，两个以上所述的电子器件分布设置于所述空气流动风道上，或分别设置于所述壳体内的不同位置；The electronic device according to claim 12, characterized in that it comprises more than two electronic devices, and the two or more electronic devices are distributed on the air flow duct, or are respectively arranged in the housing Different positions;所述电子设备还包括与所述散热组件连接的调节机构，所述调节机构用于控制所述散热组件的方向或位置。The electronic device further includes an adjustment mechanism connected to the heat dissipation assembly, and the adjustment mechanism is used to control the direction or position of the heat dissipation assembly.根据权利要求13所述的电子设备，还包括两个以上分别与所述电子器件对应的第一风道，其中所述调节机构控制所述散热组件的方向或位置以对接所述第一风道。The electronic device according to claim 13, further comprising two or more first air ducts respectively corresponding to the electronic device, wherein the adjustment mechanism controls the direction or position of the heat dissipation component to be connected to the first air duct .一种散热装置，应用于电子设备，且所述电子设备中设置根据如权利要求1至7中任意一项所述的散热组件或根据权利要求8至10中任意一项所述的散热结构；其中，所述散热装置包括：A heat dissipation device applied to electronic equipment, and the electronic equipment is provided with the heat dissipation component according to any one of claims 1 to 7 or the heat dissipation structure according to any one of claims 8 to 10; Wherein, the heat dissipation device includes:检测部件，被配置为检测目标对象的温度值；以及The detection component is configured to detect the temperature value of the target object; and控制部件，分别与所述散热组件和所述检测部件电连接。The control component is electrically connected with the heat dissipation component and the detection component, respectively.根据权利要求15所述的散热装置，其中，The heat dissipation device according to claim 15, wherein:响应于目标对象的温度值超过预设温度值，所述控制部件控制所述散热组件对目标对象进行散热。In response to the temperature value of the target object exceeding the preset temperature value, the control component controls the heat dissipation assembly to dissipate heat to the target object.一种散热方法，应用于散热装置，且所述散热装置中设置有根据权利要求1至7中任意一项所述的散热组件、检测部件和控制部件，所述控制部件分别与所述散热组件和所述检测部件电连接；其中，所述散热方法包括：A heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation assembly, the detection part and the control part according to any one of claims 1 to 7, the control part and the heat dissipation assembly respectively Electrically connected to the detection component; wherein the heat dissipation method includes:获取目标对象的温度值；以及Obtain the temperature value of the target object; and当目标对象的温度值超过预设温度值时，控制所述散热组件对目标对象进行散热。When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.根据权利要求17所述的散热方法，其中，所述散热装置中还设置有与所述散热组件连接的调节部件；其中，所述当目标对象的温度值超过预设温度值时，控制所述散热组件对目标对象进行散热包括：The heat dissipation method according to claim 17, wherein the heat dissipation device is further provided with an adjusting component connected to the heat dissipation component; wherein, when the temperature value of the target object exceeds a preset temperature value, the control The heat dissipation component to dissipate the target object includes:当目标对象的温度值超过预设温度值时，控制所述调节部件调整所述散热组件的方向或位置以对目标对象进行散热。When the temperature value of the target object exceeds the preset temperature value, the adjustment component is controlled to adjust the direction or position of the heat dissipation component to dissipate heat of the target object.一种电子装置，包括：存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，其中，所述处理器执行所述计算机程序时实现根据权利要求17至18中任意 一项所述的散热方法。An electronic device, comprising: a memory, a processor, and a computer program stored on the memory and running on the processor, wherein the processor executes the computer program according to any one of claims 17 to 18 The heat dissipation method described.一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令被一处理器执行时，使得所述处理器执行根据权利要求17至18中任意一项所述的散热方法。A computer-readable storage medium storing computer-executable instructions. When the computer-executable instructions are executed by a processor, the processor executes the heat dissipation method according to any one of claims 17 to 18.

Images