本发明涉及显示技术领域，尤其涉及一种显示装置及显示装置的制作方法。The present invention relates to the field of display technology, and in particular to a display device and a manufacturing method of the display device.
随着手机全面屏的普及和消费者对机身一体化的追求，屏下传感技术成为业界开发重点。With the popularization of full-screen mobile phones and consumers' pursuit of integrated fuselage, under-screen sensing technology has become the focus of development in the industry.
微发光二极管(Micro LED）因超高亮度、高对比度、相应时间快、信耐性好、透明度高等特点被认为是下一代显示装置。有机发光二极管（organic light-emitting diode, OLED）和微发光二极管做透明显示时，透过率都比液晶显示装置（liquid crystal display, LCD）有优势，但与OLED相比，Micro LED不存在高电流驱动下的寿命问题，故更适合用来作为透明显示。Micro LED能够以更小的像素尺寸达到高亮显示，透过率可达80%，OLED更需要考虑寿命与亮度间的平衡问题，故透过率被限制在50%。因此，现有LCD技术结合Micro LED高穿透特性方案，可共用OLED目前的屏下方案，并可以进一步拓展其他传感方案达成全面屏显示。Micro LED (Micro LED) is considered to be the next generation display device due to its ultra-high brightness, high contrast, fast response time, good reliability, and high transparency. Organic light-emitting diodeWhen the light-emitting diode (OLED) and micro light-emitting diode are used for transparent display, the transmittance is higher than that of liquid crystal display device (liquidCrystal display, LCD) has advantages, but compared with OLED, Micro LED does not have the life problem under high current driving, so it is more suitable for transparent display. MicroLED can achieve high-brightness display with a smaller pixel size, and the transmittance can reach 80%. OLED needs to consider the balance between life and brightness, so the transmittance is limited to 50%. Therefore, the existing LCD technology combined with the Micro LED high-penetration characteristic solution can share the current under-screen solution of OLED, and can further expand other sensing solutions to achieve a full-screen display.
LCD因属于整面背光的被动发光，光学式传感器与光学显示无法在空间上重合，较OLED和Micro LED像素级主动式发光显示存在透过率不足的问题。Because LCD belongs to the passive light emission of the entire backlight, the optical sensor and the optical display cannot overlap spatially. Compared with OLED and Micro LED pixel-level active light-emitting displays, there is a problem of insufficient transmittance.
综上所述，现有液晶显示装置存在透过率不足无法实现屏下传感技术的问题。故，有必要提供一种显示装置及显示装置的制作方法来改善这一缺陷。In summary, the existing liquid crystal display device has the problem of insufficient transmittance and cannot realize the under-screen sensing technology. Therefore, it is necessary to provide a display device and a manufacturing method of the display device to improve this defect.
本揭示实施例提供一种显示装置及显示装置的制作方法，用于解决现有液晶显示装置存在透过率不足无法实现屏下传感技术的问题。The embodiments of the present disclosure provide a display device and a manufacturing method of the display device, which are used to solve the problem that the existing liquid crystal display device has insufficient transmittance and cannot realize the under-screen sensing technology.
本揭示实施例提供一种显示装置，包括：The embodiments of the present disclosure provide a display device, including:
彩膜基板，包括第一衬底基板和设置于所述第一衬底基板上的彩色滤光层；The color film substrate includes a first base substrate and a color filter layer disposed on the first base substrate;
阵列基板，与所述彩膜基板相对设置，包括第二衬底基板、驱动电路层以及显示器件层，所述驱动电路层设置于所述第二衬底基板靠近所述彩膜基板的一侧上，所述显示器件层设置于所述第二衬底基板远离所述彩膜基板的一侧上；The array substrate is disposed opposite to the color filter substrate, and includes a second base substrate, a driving circuit layer, and a display device layer. The driving circuit layer is disposed on a side of the second base substrate close to the color filter substrate Above, the display device layer is disposed on a side of the second base substrate away from the color filter substrate;
液晶层，所述液晶层设置于所述阵列基板与所述彩膜基板之间；以及A liquid crystal layer, the liquid crystal layer is disposed between the array substrate and the color filter substrate; and
传感装置，所述传感装置设置于所述显示器件层远离所述阵列基板的一侧；A sensing device, which is arranged on a side of the display device layer away from the array substrate;
其中，所述显示器件层包括阵列排布的多个子像素单元和像素驱动电路，所述子像素单元包括微发光二极管。Wherein, the display device layer includes a plurality of sub-pixel units and pixel drive circuits arranged in an array, and the sub-pixel units include micro light-emitting diodes.
根据本揭示一实施例，所述显示装置包括显示区域和位于所述显示区域周围的非显示区域，所述显示区域包括第一显示区域和第二显示区域，所述显示器件层在所述第二衬底基板上的正投影区域与所述第一显示区域重叠，所述第二显示区域位于所述第一显示区域周围。According to an embodiment of the present disclosure, the display device includes a display area and a non-display area located around the display area, the display area includes a first display area and a second display area, and the display device layer is located in the first display area. The orthographic projection area on the second base substrate overlaps the first display area, and the second display area is located around the first display area.
根据本揭示一实施例，所述彩色滤光层在所述彩膜基板上的正投影区域与所述第二显示区域重叠。According to an embodiment of the present disclosure, the orthographic projection area of the color filter layer on the color filter substrate overlaps the second display area.
根据本揭示一实施例，所述彩膜基板远离所述阵列基板的一侧上设有第一偏光片，所述第一偏光片位于所述第一显示区域的部分设有第一通孔。According to an embodiment of the present disclosure, a first polarizer is provided on a side of the color filter substrate away from the array substrate, and a portion of the first polarizer located in the first display area is provided with a first through hole.
根据本揭示一实施例，所述显示装置还包括第二偏光片和背光模组，所述背光模组设置于所述阵列基板远离所述彩膜基板的一侧，所述第二偏光片设置于所述背光模组与所述阵列基板之间，所述第二偏光片在所述第一衬底基板上的正投影区域与所述第一偏光片在所述第一衬底基板上的正投影区域重叠。According to an embodiment of the present disclosure, the display device further includes a second polarizer and a backlight module, the backlight module is disposed on a side of the array substrate away from the color filter substrate, and the second polarizer is disposed Between the backlight module and the array substrate, the orthographic projection area of the second polarizer on the first base substrate and the first polarizer on the first base substrate The orthographic projection areas overlap.
根据本揭示一实施例，所述子像素单元包括发光子区和外部光透射子区，所述微发光二极管设置于所述发光子区内。According to an embodiment of the present disclosure, the sub-pixel unit includes a light-emitting sub-area and an external light transmission sub-area, and the micro light-emitting diode is disposed in the light-emitting sub-area.
根据本揭示一实施例，所述外部光透射子区的面积大于或等于所述发光子区的面积。According to an embodiment of the present disclosure, the area of the external light-transmitting sub-region is greater than or equal to the area of the light-emitting sub-region.
根据本揭示一实施例，所述显示器件层还包括封装层，所述封装层设置于所述第二衬底基板远离所述驱动电路板的一侧上，并覆盖所述显示器件层。According to an embodiment of the present disclosure, the display device layer further includes an encapsulation layer, the encapsulation layer is disposed on a side of the second base substrate away from the driving circuit board, and covers the display device layer.
根据本揭示一实施例，所述微发光二极管包括红色微发光二极管、绿色微发光二极管和蓝色微发光二极管。According to an embodiment of the present disclosure, the micro light emitting diodes include red micro light emitting diodes, green micro light emitting diodes, and blue micro light emitting diodes.
本揭示实施例还提供一种显示装置，包括显示区域和位于所述显示区域周围的非显示区域，所述显示区域包括第一显示区域和第二显示区域，所述显示装置还包括：An embodiment of the present disclosure further provides a display device, including a display area and a non-display area located around the display area, the display area includes a first display area and a second display area, and the display device further includes:
彩膜基板，包括第一衬底基板和设置于所述第一衬底基板上的彩色滤光层，所述彩色滤光层在所述第一衬底基板上的正投影区域与所述第二显示区域重叠；The color film substrate includes a first base substrate and a color filter layer disposed on the first base substrate, and the orthographic projection area of the color filter layer on the first base substrate and the first base substrate 2. The display area overlaps;
阵列基板，与所述彩膜基板相对设置，包括第二衬底基板、驱动电路层以及显示器件层，所述驱动电路层设置于所述第二衬底基板靠近所述彩膜基板的一侧上，所述显示器件层设置于所述第二衬底基板远离所述彩膜基板的一侧上，并且所述显示器件层在所述第二衬底基板上的正投影区域与所述第一显示区域重叠；The array substrate is disposed opposite to the color filter substrate, and includes a second base substrate, a driving circuit layer, and a display device layer. The driving circuit layer is disposed on a side of the second base substrate close to the color filter substrate In the above, the display device layer is arranged on the side of the second base substrate away from the color filter substrate, and the orthographic projection area of the display device layer on the second base substrate and the first One display area overlaps;
液晶层，所述液晶层设置于所述阵列基板与所述彩膜基板之间；以及A liquid crystal layer, the liquid crystal layer is disposed between the array substrate and the color filter substrate; and
传感装置，所述传感装置设置于所述显示器件层远离所述阵列基板的一侧；A sensing device, which is arranged on a side of the display device layer away from the array substrate;
其中，所述显示器件层包括阵列排布的多个子像素单元和像素驱动电路，所述子像素单元包括微发光二极管。Wherein, the display device layer includes a plurality of sub-pixel units and pixel drive circuits arranged in an array, and the sub-pixel units include micro light-emitting diodes.
根据本揭示一实施例，所述彩膜基板远离所述阵列基板的一侧上设有第一偏光片，所述第一偏光片位于所述第一显示区域的部分设有第一通孔。According to an embodiment of the present disclosure, a first polarizer is provided on a side of the color filter substrate away from the array substrate, and a portion of the first polarizer located in the first display area is provided with a first through hole.
根据本揭示一实施例，所述显示装置还包括第二偏光片和背光模组，所述背光模组设置于所述阵列基板远离所述彩膜基板的一侧，所述第二偏光片设置于所述背光模组与所述阵列基板之间，所述第二偏光片在所述第一衬底基板上的正投影区域与所述第一偏光片在所述第一衬底基板上的正投影区域重叠。According to an embodiment of the present disclosure, the display device further includes a second polarizer and a backlight module, the backlight module is disposed on a side of the array substrate away from the color filter substrate, and the second polarizer is disposed Between the backlight module and the array substrate, the orthographic projection area of the second polarizer on the first base substrate and the first polarizer on the first base substrate The orthographic projection areas overlap.
根据本揭示一实施例，所述子像素单元包括发光子区和外部光透射子区，所述微发光二极管设置于所述发光子区内。According to an embodiment of the present disclosure, the sub-pixel unit includes a light-emitting sub-area and an external light transmission sub-area, and the micro light-emitting diode is disposed in the light-emitting sub-area.
根据本揭示一实施例，所述外部光透射子区的面积大于或等于所述发光子区的面积。According to an embodiment of the present disclosure, the area of the external light-transmitting sub-region is greater than or equal to the area of the light-emitting sub-region.
根据本揭示一实施例，所述显示器件层还包括封装层，所述封装层设置于所述第二衬底基板远离所述驱动电路板的一侧上，并覆盖所述显示器件层。According to an embodiment of the present disclosure, the display device layer further includes an encapsulation layer, the encapsulation layer is disposed on a side of the second base substrate away from the driving circuit board, and covers the display device layer.
根据本揭示一实施例，所述微发光二极管包括红色微发光二极管、绿色微发光二极管和蓝色微发光二极管。According to an embodiment of the present disclosure, the micro light emitting diodes include red micro light emitting diodes, green micro light emitting diodes, and blue micro light emitting diodes.
本揭示实施例还提供一种显示装置的制作方法，包括：The embodiments of the present disclosure also provide a manufacturing method of a display device, including:
提供阵列基板，所述阵列基板包括衬底基板和位于所述衬底基板一侧的驱动电路层；An array substrate is provided, the array substrate includes a base substrate and a driving circuit layer located on one side of the base substrate;
在所述衬底基板与所述驱动电路层相反的一侧上形成子像素图案和像素驱动电路；Forming a sub-pixel pattern and a pixel driving circuit on the side of the base substrate opposite to the driving circuit layer;
将微发光二极管转移到相应所述子像素图案；Transferring the micro light-emitting diode to the corresponding sub-pixel pattern;
通过光刻制程，将所述微发光二极管与所述像素驱动电路连接；以及Connecting the micro light emitting diode and the pixel driving circuit through a photolithography process; and
在所述衬底基板远离所述驱动电路层的一侧形成封装层，所述封装层覆盖所述微发光二极管以及所述像素驱动电路。An encapsulation layer is formed on the side of the base substrate away from the driving circuit layer, and the encapsulation layer covers the micro light emitting diode and the pixel driving circuit.
本揭示实施例的有益效果：本揭示实施例通过在阵列基板的第二衬底基板与驱动电路相反的一侧上设置显示器件层，并在显示器件层与第二衬底基板相反的一侧设置传感装置，当显示器件层需要显示画面时，子像素单元的微发光二极管自发光实现正常的画面显示，与显示装置的其他显示画面衔接，实现全屏显示的效果；当需要使用传感装置时，微发光二极管不发光，传感装置通过显示器件层进行图形采集成像，实现屏下传感的技术效果。Beneficial effects of the embodiments of the present disclosure: In the embodiments of the present disclosure, the display device layer is arranged on the side of the second base substrate of the array substrate opposite to the driving circuit, and the display device layer is located on the side opposite to the second base substrate. Set up a sensor device, when the display device layer needs to display a picture, the micro-light emitting diode of the sub-pixel unit self-luminesce to realize the normal picture display, and connects with other display pictures of the display device to realize the effect of full-screen display; when the sensor device needs to be used When the micro-light emitting diode does not emit light, the sensing device performs graphic acquisition and imaging through the display device layer to achieve the technical effect of under-screen sensing.
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for disclosure. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.
图1为本揭示实施例一提供的显示装置的截面结构示意图；1 is a schematic diagram of a cross-sectional structure of a display device provided in the first embodiment of the disclosure;
图2为本揭示实施例一提供的显示器件层的平面结构示意图；2 is a schematic diagram of the planar structure of the display device layer provided in the first embodiment of the disclosure;
图3为本揭示实施例一提供的显示器件层的截面结构示意图；3 is a schematic diagram of a cross-sectional structure of the display device layer provided in the first embodiment of the disclosure;
图4为本揭示实施例一提供的另一种显示装置的截面结构示意图；4 is a schematic diagram of a cross-sectional structure of another display device provided in the first embodiment of the disclosure;
图5为本揭示实施例二提供的显示装置的制作方法的流程示意图。FIG. 5 is a schematic flowchart of the manufacturing method of the display device provided in the second embodiment of the disclosure.
以下各实施例的说明是参考附加的图示，用以例示本揭示可用以实施的特定实施例。本揭示所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。在图中，结构相似的单元是用以相同标号表示。The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that can be implemented by the present disclosure. The directional terms mentioned in this disclosure, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to illustrate and understand the present disclosure, rather than to limit the present disclosure. In the figure, units with similar structures are indicated by the same reference numerals.
下面结合附图和具体实施例对本揭示做进一步的说明：The disclosure will be further described below in conjunction with the drawings and specific embodiments:
实施例一：Example one:
本揭示实施例提供一种显示装置，下面结合图1至图3进行详细说明。The embodiments of the present disclosure provide a display device, which will be described in detail below with reference to FIGS. 1 to 3.
如图1所示，图1为本揭示实施例提供的显示装置100的截面结构示意图，所述显示装置100包括彩膜基板110、与所述彩膜基板110相对设置的阵列基板120以及设置于所述彩膜基板110和阵列基板120之间的液晶层130。As shown in FIG. 1, FIG. 1 is a schematic cross-sectional structure diagram of a display device 100 provided by an embodiment of the disclosure. The display device 100 includes a color filter substrate 110, an array substrate 120 disposed opposite to the color filter substrate 110, and The liquid crystal layer 130 between the color filter substrate 110 and the array substrate 120.
具体地，所述彩膜基板110包括第一衬底基板111和设置于所述第一衬底基板111上的彩色滤光层112，所述彩色滤光层112设置于所述第一衬底基板111靠近所述阵列基板120的一侧。所述阵列基板120包括第二衬底基板121、驱动电路层122以及显示器件层123，所述驱动电路层122设置于所述第二衬底基板121靠近所述彩膜基板110的一侧上，所述显示器件层123设置于所述第二衬底基板121远离所述彩膜基板110的一侧上。所述传感装置170设置于所述显示器件层123远离所述阵列基板120的一侧。Specifically, the color filter substrate 110 includes a first base substrate 111 and a color filter layer 112 disposed on the first base substrate 111, and the color filter layer 112 is disposed on the first substrate. The substrate 111 is close to the side of the array substrate 120. The array substrate 120 includes a second base substrate 121, a driving circuit layer 122, and a display device layer 123. The driving circuit layer 122 is disposed on a side of the second base substrate 121 close to the color filter substrate 110 The display device layer 123 is disposed on a side of the second base substrate 121 away from the color filter substrate 110. The sensing device 170 is disposed on a side of the display device layer 123 away from the array substrate 120.
在本实施例中，如图1所示，所述显示装置100包括显示区域和位于所述显示区域周围的非显示区域，所述显示区域包括第一显示区域A1和第二显示区域A2，所述显示器件层123在所述第二衬底基板121上的正投影区域与所述第一显示区域A1重叠，所述第二显示区域A2位于所述第一显示区域A1周围。当所述显示器件层123工作时，所述微发光二极管127发光，所述第一显示区域A1显示所述显示器件层123的显示画面，所述第二显示区域A2显示彩膜基板110、液晶层130和阵列基板120工作所形成的显示画面，两个显示画面衔接，实现全屏显示的显示效果。当传感装置170工作时，显示器件层123停止工作，第一显示区域A1不显示画面，外界光线通过显示器件层123抵达传感装置170，传感装置170进行图像采集成像。In this embodiment, as shown in FIG. 1, the display device 100 includes a display area and a non-display area located around the display area. The display area includes a first display area A1 and a second display area A2. The orthographic projection area of the display device layer 123 on the second base substrate 121 overlaps the first display area A1, and the second display area A2 is located around the first display area A1. When the display device layer 123 is working, the micro light-emitting diode 127 emits light, the first display area A1 displays the display image of the display device layer 123, and the second display area A2 displays the color film substrate 110 and the liquid crystal The display screen formed by the operation of the layer 130 and the array substrate 120, the two display screens are connected to realize the display effect of full-screen display. When the sensing device 170 is working, the display device layer 123 stops working, the first display area A1 does not display an image, and external light passes through the display device layer 123 to reach the sensing device 170, and the sensing device 170 performs image acquisition and imaging.
优选的，所述传感装置170包括屏下摄像装置、面部识别装置、距离感应装置以及指纹识别装置等其中的一种或多种。此外，可以根据第一显示区域A1的面积大小，还可以在所述第一显示区域A1内增设补光灯、呼吸灯以及时间显示等效果。Preferably, the sensor device 170 includes one or more of an under-screen camera device, a face recognition device, a distance sensor device, and a fingerprint recognition device. In addition, according to the area of the first display area A1, effects such as supplementary light, breathing light, and time display can also be added in the first display area A1.
优选的，所述第一显示区域A1可以位于显示装置100的显示区域的任意位置，也可以不具有显示作用，仅作为传感装置170获取外界光线的媒介，设置于非显示区域。同样，所述第一显示区域A1的形状也可以是圆形、水滴状、“美人尖”等。Preferably, the first display area A1 may be located at any position of the display area of the display device 100, or may not have a display function, and is only used as a medium for the sensor device 170 to obtain external light, and is set in a non-display area. Similarly, the shape of the first display area A1 may also be a circle, a drop shape, a "beauty tip", or the like.
优选的，所述第一显示区域A1的面积应远小于第二显示区域A2的面积，例如小于或等于20mm*10mm，且所述第一显示区域A1所需要的像素的数量较少，从而可以保证第一显示区域A1微发光二极管的巨量转印良率以及生产成本的控制。Preferably, the area of the first display area A1 should be much smaller than the area of the second display area A2, for example, less than or equal to 20mm*10mm, and the number of pixels required by the first display area A1 is small, so that Ensure the mass transfer yield and production cost control of the micro light-emitting diodes in the first display area A1.
如图2至图3所示，图2为本揭示实施例提供的显示器件层的平面结构示意图，图3为本揭示实施例提供的显示器件层的截面结构示意图，所述显示器件层123包括阵列排布的多个子像素单元124和像素驱动电路。As shown in FIGS. 2 to 3, FIG. 2 is a schematic diagram of a plan structure of a display device layer provided by an embodiment of the disclosure, and FIG. 3 is a schematic diagram of a cross-sectional structure of a display device layer provided by an embodiment of the disclosure. The display device layer 123 includes A plurality of sub-pixel units 124 and pixel driving circuits arranged in an array.
具体地，所述子像素单元124包括发光子区125和外部光透射子区126，所述子像素单元124还包括微发光二极管127，所述微发光二极管设置于所述发光子区125内。所述外部光透射子区126用于为外部光线穿过所述显示器件层123提供途径，从而提升显示器件层123的光线透过率。所述子像素驱动电路设置于所述发光子区125内以及显示器件层123内除子像素单元124以外的其他部分。Specifically, the sub-pixel unit 124 includes a light-emitting sub-region 125 and an external light transmission sub-region 126, and the sub-pixel unit 124 further includes a micro light-emitting diode 127, and the micro light-emitting diode is disposed in the light-emitting sub-region 125. The external light transmission sub-region 126 is used to provide a way for external light to pass through the display device layer 123, thereby improving the light transmittance of the display device layer 123. The sub-pixel driving circuit is disposed in the light-emitting sub-region 125 and in other parts of the display device layer 123 except for the sub-pixel unit 124.
将显示器件层123设置于第二衬底基板121远离彩膜基板110的一侧，可以解决微发光二极管127转移、绑定以及像素驱动电路的制作等高温制程导致的彩膜基板110的色阻不耐高温被破坏的问题，同时，还可以省去液晶盒玻璃和微发光二极管玻璃对组制程，并解决显示器件层123厚度与液晶盒厚度不兼容的问题。Disposing the display device layer 123 on the side of the second base substrate 121 away from the color filter substrate 110 can solve the color resistance of the color filter substrate 110 caused by high-temperature manufacturing processes such as the transfer and binding of the micro-light emitting diode 127 and the manufacture of the pixel drive circuit. It is not resistant to high temperature damage. At the same time, it can also save the liquid crystal cell glass and the micro light emitting diode glass pair assembly process, and solve the problem of incompatibility between the thickness of the display device layer 123 and the thickness of the liquid crystal cell.
在本实施例中，所述微发光二极管127包括红色微发光二极管、绿色微发光二极管和蓝色微发光二极管，相邻三个所述子像素单元124组成一个像素。在一些实施例中，所述微发光二极管127也可以全部都是蓝色微发光二极管，此时，蓝色发光二极管作为光源，所述显示器件层123还应包括量子点膜层，所述量子点膜层位于所述微发光二极管127与第二衬底基板121之间，所述量子点膜层在所述蓝色微发光二极管发出的蓝光的激发下，可以产生其他颜色的光，从而实现全彩化的显示效果。当然，在其他的一些实施例中，也可以采用荧光粉或者色彩转换层代替量子点膜层，实现全彩化的显示效果。In this embodiment, the micro light emitting diode 127 includes a red micro light emitting diode, a green micro light emitting diode, and a blue micro light emitting diode, and three adjacent sub-pixel units 124 form one pixel. In some embodiments, all of the micro light emitting diodes 127 may also be blue micro light emitting diodes. In this case, the blue light emitting diodes are used as the light source, and the display device layer 123 should also include a quantum dot film layer. The dot film layer is located between the micro light emitting diode 127 and the second substrate 121. The quantum dot film layer can generate light of other colors under the excitation of the blue light emitted by the blue micro light emitting diode, thereby achieving Full-color display effect. Of course, in some other embodiments, phosphors or a color conversion layer can also be used instead of the quantum dot film layer to achieve a full-color display effect.
优选的，为防止微发光二极管127的尺寸过大影响显示器件层123的光线透过率，所述微发光二极管127的尺寸大小应小于所述子像素的尺寸大小，具体地，所述微发光二极管的尺寸范围为1μm~500μm，所述子像素单元124的尺寸范围为10μm~1000μm，使得显示器件层123具有良好的透明显示效果，保证传感装置170的屏下传感技术效果。Preferably, in order to prevent the size of the micro light emitting diode 127 from being too large to affect the light transmittance of the display device layer 123, the size of the micro light emitting diode 127 should be smaller than the size of the sub-pixel, specifically, the micro light emitting diode 127 The size of the diode ranges from 1 μm to 500 μm, and the size range of the sub-pixel unit 124 is from 10 μm to 1000 μm, so that the display device layer 123 has a good transparent display effect and ensures the under-screen sensing technology effect of the sensing device 170.
优选的，同样为保证显示器件层123的光线透过率，所述外部光透射子区126的面积应大于或等于所述发光子区125的面积，所述第一衬底基板111和所述第二衬底基板121的材料也应当选用高透过率材料，包括玻璃、无色PI、PMMA等。Preferably, also in order to ensure the light transmittance of the display device layer 123, the area of the external light transmission sub-region 126 should be greater than or equal to the area of the light-emitting sub-region 125, the first base substrate 111 and the The material of the second base substrate 121 should also be a material with high transmittance, including glass, colorless PI, PMMA, and so on.
如图3所示，所述微发光二极管127为正装微发光二极管芯片结构，所述像素驱动电路包括栅极信号线180和数据信号线181，所述栅极信号线180和数据信号线181分别通过金属线182与微发光二极管127的N pad和P pad相连接，所述微发光二极管127的出光面朝向所述彩膜基板110，可以避免倒装微发光二极管结构导致的基板和芯片电极材料匹配难的问题，可以实现与倒装微发光二极管相同的技术效果。当然，在一些实施例中，所述微发光二极管127也可以为台面微发光二极管芯片结构。As shown in FIG. 3, the micro light emitting diode 127 has a front-mounted micro light emitting diode chip structure, and the pixel driving circuit includes a gate signal line 180 and a data signal line 181. The gate signal line 180 and the data signal line 181 are respectively The metal wire 182 is connected to the N pad and P pad of the micro light emitting diode 127, and the light emitting surface of the micro light emitting diode 127 faces the color film substrate 110, which can avoid the substrate and chip electrode materials caused by the flip-chip micro light emitting diode structure The problem of difficult matching can achieve the same technical effect as flip-chip micro-light emitting diodes. Of course, in some embodiments, the micro light emitting diode 127 may also be a mesa micro light emitting diode chip structure.
在一些实施例中，所述像素驱动电路的驱动方式可以为有源寻址驱动或无源寻址驱动，所述有源寻址驱动则包括α-Si、IGZO、LTPS，上述驱动方式均能够实现相同的技术效果，此处不做限定。In some embodiments, the driving mode of the pixel driving circuit may be active addressing driving or passive addressing driving, and the active addressing driving includes α-Si, IGZO, LTPS, and all of the above driving modes can be To achieve the same technical effect, there is no limitation here.
在本实施例中，如图3所示，所述显示器件层123还包括封装层184，所述封装层184设置于所述第二衬底基板121远离所述驱动电路层122的一侧上，并覆盖所述显示器件层123，所述封装层184用于保护所述显示器件层123。In this embodiment, as shown in FIG. 3, the display device layer 123 further includes an encapsulation layer 184, which is disposed on a side of the second base substrate 121 away from the driving circuit layer 122 , And cover the display device layer 123, and the encapsulation layer 184 is used to protect the display device layer 123.
在本实施例中，所述彩色滤光层112在所述彩膜基板110上的正投影区域与所述第二显示区域A2重叠，因此，所述彩色滤光层112在所述第一显示区域A1的部分形成一通孔，所述通孔的形状与所述显示器件层123相同，可以减少彩色滤光层112对外界光线的影响，提升彩膜基板110的光线透过率。In this embodiment, the orthographic projection area of the color filter layer 112 on the color filter substrate 110 overlaps with the second display area A2. Therefore, the color filter layer 112 is in the first display area A2. A through hole is formed in the area A1, and the shape of the through hole is the same as that of the display device layer 123, which can reduce the influence of the color filter layer 112 on external light and improve the light transmittance of the color filter substrate 110.
在本实施例中，所述彩膜基板110远离所述阵列基板120的一侧上设有第一偏光片140，所述第一偏光片140用于第二显示区域A2的成像，如图1所述，所述第一偏光片140全贴合于所述第一衬底基板111上。In this embodiment, a first polarizer 140 is provided on the side of the color filter substrate 110 away from the array substrate 120, and the first polarizer 140 is used for imaging in the second display area A2, as shown in FIG. 1 Said, the first polarizer 140 is fully attached to the first base substrate 111.
在一些实施例中，如图4所示，图4为本揭示实施例提供的另一种显示装置100的截面结构示意图，所述第一偏光片140在位于所述第一显示区域A1的部分设有第一通孔141，所述第一通孔141用于提供外界光线通过的途径，减少第一偏光片140对外界光线的过滤，提高传感装置170的屏下传感技术效果。In some embodiments, as shown in FIG. 4, FIG. 4 is a schematic cross-sectional structure diagram of another display device 100 provided by an embodiment of the present disclosure. The first polarizer 140 is located in a portion of the first display area A1. A first through hole 141 is provided, and the first through hole 141 is used to provide a path for external light to pass through, reduce the filtering of the external light by the first polarizer 140, and improve the effect of the under-screen sensing technology of the sensing device 170.
在本实施例中，如图1所示，所述显示装置100还包括第二偏光片150和背光模组160，所述背光模组160设置于所述阵列基板120远离所述彩膜基板110的一侧，所述第二偏光片150设置于所述背光模组160与所述阵列基板120之间，所述第二偏光片150在所述第一衬底基板111上的正投影区域与所述第一偏光片140在所述第一衬底基板111上的正投影区域重叠。所述背光模组160包括导光板161和设置于所述导光板161一侧的光源162，所述导光板161在所述第一显示区域A1的部分设有通孔，所述通孔用于放置所述所述传感装置170。In this embodiment, as shown in FIG. 1, the display device 100 further includes a second polarizer 150 and a backlight module 160. The backlight module 160 is disposed on the array substrate 120 away from the color filter substrate 110. On one side, the second polarizer 150 is disposed between the backlight module 160 and the array substrate 120, and the orthographic projection area of the second polarizer 150 on the first base substrate 111 and The first polarizer 140 overlaps the orthographic projection area on the first base substrate 111. The backlight module 160 includes a light guide plate 161 and a light source 162 arranged on one side of the light guide plate 161. The light guide plate 161 is provided with a through hole in a portion of the first display area A1, and the through hole is used for Place the sensor device 170.
所述第二偏光片150与所述显示器件层123设置于同一层，且所述第二偏光片150在所述第一显示区域A1的部分设置有通孔，所述显示器件层123设置于所述通孔内，可以减小阵列基板120的厚度。The second polarizer 150 and the display device layer 123 are disposed on the same layer, and the second polarizer 150 is provided with a through hole in the first display area A1, and the display device layer 123 is disposed on the same layer. In the through hole, the thickness of the array substrate 120 can be reduced.
本揭示实施例通过在阵列基板的第二衬底基板与驱动电路相反的一侧上设置显示器件层，并在显示器件层与第二衬底基板相反的一侧设置传感装置，当显示器件层需要显示画面时，子像素单元的微发光二极管自发光实现正常的画面显示，与显示装置的其他显示画面衔接，实现全屏显示的效果；当需要使用传感装置时，微发光二极管不发光，传感装置通过显示器件层进行图形采集成像，实现屏下传感的技术效果，解决了液晶显示装置与光学式传感器无法在空间重合的问题。In the embodiment of the present disclosure, the display device layer is arranged on the side of the second base substrate of the array substrate opposite to the driving circuit, and the sensor device is arranged on the side of the display device layer opposite to the second base substrate. When the display device When the layer needs to display the picture, the micro-light-emitting diode of the sub-pixel unit self-luminesce to realize the normal picture display, and is connected with other display pictures of the display device to achieve the effect of full-screen display; when the sensor device needs to be used, the micro-light-emitting diode does not emit light. The sensing device uses the display device layer to perform image acquisition and imaging, to achieve the technical effect of under-screen sensing, and to solve the problem that the liquid crystal display device and the optical sensor cannot overlap in space.
实施例二：Embodiment two:
本揭示实施例提供一种显示装置的制作方法，下面结合图1、图2、图3和图5进行详细说明。The embodiments of the present disclosure provide a manufacturing method of a display device, which will be described in detail below with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. 5.
如图5所示，图5为本揭示实施例提供的显示装置的制作方法的流程示意图，所述制作方法包括：As shown in FIG. 5, FIG. 5 is a schematic flowchart of a manufacturing method of a display device provided by an embodiment of the disclosure, and the manufacturing method includes:
步骤S10：提供阵列基板，所述阵列基板包括衬底基板121和位于所述衬底基板121一侧的驱动电路层122；Step S10: Provide an array substrate, the array substrate includes a base substrate 121 and a driving circuit layer 122 located on one side of the base substrate 121;
步骤S20：在所述衬底基板121与所述驱动电路层122相反的一侧上形成子像素图案和像素驱动电路；Step S20: forming a sub-pixel pattern and a pixel driving circuit on the opposite side of the base substrate 121 and the driving circuit layer 122;
步骤S30：将微发光二极管127放置到相应所述子像素图案；Step S30: Place the micro light emitting diode 127 in the corresponding sub-pixel pattern;
步骤S40：通过光刻制程，将所述微发光二极管127与所述像素驱动电路连接；Step S40: Connect the micro light emitting diode 127 and the pixel driving circuit through a photolithography process;
步骤S50：在所述衬底基板121远离所述驱动电路层122的一侧形成封装层184，所述封装层184覆盖所述微发光二极管127以及所述像素驱动电路。Step S50: forming an encapsulation layer 184 on the side of the base substrate 121 away from the driving circuit layer 122, and the encapsulation layer 184 covers the micro light emitting diode 127 and the pixel driving circuit.
如图2所示，所述像素电极图案124包括发光子区125和外部光透射子区126，所述像素驱动电路在所述发光子区125形成有绑定电极，所述步骤S30中，微发光二极管127应放置到相应子像素图案发光子区125的绑定电极。所述发光子区125不透光，用于放置所述微发光二极管127，所述外部光透射子区126用于透过外部光线，从而实现显示装置的屏下传感技术。As shown in FIG. 2, the pixel electrode pattern 124 includes a light-emitting sub-region 125 and an external light transmission sub-region 126, and the pixel driving circuit forms a binding electrode in the light-emitting sub-region 125. In step S30, micro The light emitting diode 127 should be placed on the bonding electrode of the light emitting sub-region 125 of the corresponding sub-pixel pattern. The light-emitting sub-region 125 is opaque and is used to place the micro-light-emitting diode 127, and the external light-transmitting sub-region 126 is used to transmit external light, thereby realizing the under-screen sensing technology of the display device.
如图3所示，所述像素驱动电路包括栅极信号线180和数据信号线181，所述栅极信号线180和数据信号线181分别通过金属线182与微发光二极管127的N pad和P pad相连接。As shown in FIG. 3, the pixel driving circuit includes a gate signal line 180 and a data signal line 181. The gate signal line 180 and the data signal line 181 respectively pass through the metal line 182 and the N pad and P of the micro light emitting diode 127. The pad is connected.
所述步骤S30中，可以通过电磁力、静电力、范德华力等方式将生长基板或中间基板上的微发光二极管转移到相应所述子像素图案上，此处不做限制。In the step S30, the micro light-emitting diodes on the growth substrate or the intermediate substrate can be transferred to the corresponding sub-pixel pattern by means of electromagnetic force, electrostatic force, van der Waals force, etc., which is not limited here.
在本实施例中，所述微发光二极管127包括红色微发光二极管、绿色微发光二极管和蓝色微发光二极管，相邻三个所述子像素单元124组成一个像素，所制作的显示面板即可实现全彩化的显示效果。In this embodiment, the micro light emitting diodes 127 include red micro light emitting diodes, green micro light emitting diodes, and blue micro light emitting diodes. Three adjacent sub-pixel units 124 form one pixel, and the manufactured display panel is sufficient. Achieve a full-color display effect.
在一些实施例中，所述微发光二极管127也可以全部都是蓝色微发光二极管，此时，在进行步骤S40后，还应在阵列基板和彩膜基板之间制作形成量子点膜层，所述量子点膜层在蓝色微发光二极管发出的蓝光的激发下，可以产生其他颜色的光，同样能够实现全彩化的显示效果。当然，在其他的实施例中，也可以采用荧光粉或者色彩转换层代替量子点膜层，实现全彩化的显示效果。In some embodiments, all the micro light emitting diodes 127 may also be blue micro light emitting diodes. In this case, after step S40 is performed, a quantum dot film layer should be fabricated between the array substrate and the color film substrate. The quantum dot film layer can generate light of other colors under the excitation of the blue light emitted by the blue micro-light emitting diode, and can also achieve a full-color display effect. Of course, in other embodiments, phosphors or color conversion layers can also be used instead of the quantum dot film layer to achieve a full-color display effect.
在完成所述步骤S50后即可按照正常的液晶显示装置制作方法，将阵列基板与彩膜基板进行成盒等制程，获得完整的显示装置。After completing the step S50, the array substrate and the color filter substrate can be processed into a box and other processes according to the normal liquid crystal display device manufacturing method to obtain a complete display device.
所述显示装置的截面结构示意图如图1所示，包括第一显示区域A1和第二显示区域A2，微发光二极管127以及像素驱动电路形成的显示器件层123通过发光可以实现第一显示区域A1的正常显示，且能够与第二显示区域A2的显示画面衔接，实现全屏现实的技术效果。当显示器件层123不工作时，外界光线可以通过显示器件层123抵达传感装置170，并进行图像采集成像，实现屏下传感的技术效果。The cross-sectional structure diagram of the display device is shown in FIG. 1, including a first display area A1 and a second display area A2, a display device layer 123 formed by a micro light emitting diode 127 and a pixel driving circuit can realize the first display area A1 by emitting light. It can be displayed normally and can be connected with the display screen of the second display area A2 to achieve the technical effect of full-screen reality. When the display device layer 123 is not working, external light can reach the sensing device 170 through the display device layer 123, and image acquisition and imaging are performed to achieve the technical effect of under-screen sensing.
本揭示实施例提供一种显示装置的制作方法，通过在阵列基板的驱动电路层相反的一侧制作形成像素驱动电路、子像素图案以及微发光二极管，可以解决微发光二极管转移、绑定以及像素驱动电路的制作等高温制程导致的彩膜基板110的色阻不耐高温被破坏的问题，同时，还可以省去液晶盒玻璃和微发光二极管玻璃对组制程，并解决显示器件层123厚度与液晶盒厚度不兼容的问题。The embodiments of the present disclosure provide a method for manufacturing a display device. By fabricating and forming pixel drive circuits, sub-pixel patterns, and micro-light-emitting diodes on the opposite side of the drive circuit layer of an array substrate, the transfer, binding, and pixel of micro-light-emitting diodes can be solved. The problem of the color resistance of the color film substrate 110 caused by high-temperature manufacturing processes such as the production of the driving circuit is not resistant to high temperature damage. At the same time, it can also save the LCD cell glass and the micro-light-emitting diode glass pairing process, and solve the problem of the thickness of the display device layer 123. The thickness of the LCD cell is not compatible.
综上所述，虽然本揭示以优选实施例揭露如上，但上述优选实施例并非用以限制本揭示，本领域的普通技术人员，在不脱离本揭示的精神和范围内，均可作各种更动与润饰，因此本揭示的保护范围以权利要求界定的范围为基准。In summary, although the present disclosure is disclosed as above in preferred embodiments, the above preferred embodiments are not intended to limit the present disclosure. Those of ordinary skill in the art can make various modifications without departing from the spirit and scope of the present disclosure. Changes and modifications, so the protection scope of this disclosure is based on the scope defined by the claims.
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| CN201911198107.0ACN110794604A (en) | 2019-11-29 | 2019-11-29 | Display device and manufacturing method thereof |
| CN201911198107.0 | 2019-11-29 |
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| WO2021103390A1true WO2021103390A1 (en) | 2021-06-03 |
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| PCT/CN2020/084929CeasedWO2021103390A1 (en) | 2019-11-29 | 2020-04-15 | Display apparatus and method for manufacturing display apparatus |
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