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WO2012122142A3 - Selective metalization of electrical connector or socket housing - Google Patents

Selective metalization of electrical connector or socket housingDownload PDF

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Publication number
WO2012122142A3
WO2012122142A3PCT/US2012/027813US2012027813WWO2012122142A3WO 2012122142 A3WO2012122142 A3WO 2012122142A3US 2012027813 WUS2012027813 WUS 2012027813WWO 2012122142 A3WO2012122142 A3WO 2012122142A3
Authority
WO
WIPO (PCT)
Prior art keywords
openings
center
cross
electrical connector
sections
Prior art date
Application number
PCT/US2012/027813
Other languages
French (fr)
Other versions
WO2012122142A2 (en
Inventor
James Rathburn
Original Assignee
Hsio Technologies, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hsio Technologies, LlcfiledCriticalHsio Technologies, Llc
Publication of WO2012122142A2publicationCriticalpatent/WO2012122142A2/en
Publication of WO2012122142A3publicationCriticalpatent/WO2012122142A3/en

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Abstract

A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB. The electrical interconnect includes a multilayered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of spring probe contact members are located in the center openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively.
PCT/US2012/0278132011-03-072012-03-06Selective metalization of electrical connector or socket housingWO2012122142A2 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US201161449889P2011-03-072011-03-07
US61/449,8892011-03-07

Publications (2)

Publication NumberPublication Date
WO2012122142A2 WO2012122142A2 (en)2012-09-13
WO2012122142A3true WO2012122142A3 (en)2014-04-24

Family

ID=46798746

Family Applications (1)

Application NumberTitlePriority DateFiling Date
PCT/US2012/027813WO2012122142A2 (en)2011-03-072012-03-06Selective metalization of electrical connector or socket housing

Country Status (1)

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WO (1)WO2012122142A2 (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US9276336B2 (en)2009-05-282016-03-01Hsio Technologies, LlcMetalized pad to electrical contact interface
US8955215B2 (en)2009-05-282015-02-17Hsio Technologies, LlcHigh performance surface mount electrical interconnect
WO2011153298A1 (en)2010-06-032011-12-08Hsio Technologies, LlcElectrical connector insulator housing
WO2010147939A1 (en)2009-06-172010-12-23Hsio Technologies, LlcSemiconductor socket
US9536815B2 (en)2009-05-282017-01-03Hsio Technologies, LlcSemiconductor socket with direct selective metalization
US9196980B2 (en)2009-06-022015-11-24Hsio Technologies, LlcHigh performance surface mount electrical interconnect with external biased normal force loading
US9318862B2 (en)2009-06-022016-04-19Hsio Technologies, LlcMethod of making an electronic interconnect
US8988093B2 (en)2009-06-022015-03-24Hsio Technologies, LlcBumped semiconductor wafer or die level electrical interconnect
US9414500B2 (en)2009-06-022016-08-09Hsio Technologies, LlcCompliant printed flexible circuit
US9232654B2 (en)2009-06-022016-01-05Hsio Technologies, LlcHigh performance electrical circuit structure
US9231328B2 (en)2009-06-022016-01-05Hsio Technologies, LlcResilient conductive electrical interconnect
WO2011002709A1 (en)2009-06-292011-01-06Hsio Technologies, LlcCompliant printed circuit semiconductor tester interface
US9184145B2 (en)2009-06-022015-11-10Hsio Technologies, LlcSemiconductor device package adapter
WO2010141296A1 (en)2009-06-022010-12-09Hsio Technologies, LlcCompliant printed circuit semiconductor package
US8955216B2 (en)2009-06-022015-02-17Hsio Technologies, LlcMethod of making a compliant printed circuit peripheral lead semiconductor package
WO2010141298A1 (en)2009-06-022010-12-09Hsio Technologies, LlcComposite polymer-metal electrical contacts
WO2010147934A1 (en)2009-06-162010-12-23Hsio Technologies, LlcSemiconductor die terminal
US8987886B2 (en)2009-06-022015-03-24Hsio Technologies, LlcCopper pillar full metal via electrical circuit structure
WO2012074963A1 (en)2010-12-012012-06-07Hsio Technologies, LlcHigh performance surface mount electrical interconnect
US9930775B2 (en)2009-06-022018-03-27Hsio Technologies, LlcCopper pillar full metal via electrical circuit structure
US9613841B2 (en)2009-06-022017-04-04Hsio Technologies, LlcArea array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
WO2010141313A1 (en)2009-06-022010-12-09Hsio Technologies, LlcCompliant printed circuit socket diagnostic tool
US9603249B2 (en)2009-06-022017-03-21Hsio Technologies, LlcDirect metalization of electrical circuit structures
US9136196B2 (en)2009-06-022015-09-15Hsio Technologies, LlcCompliant printed circuit wafer level semiconductor package
US9276339B2 (en)2009-06-022016-03-01Hsio Technologies, LlcElectrical interconnect IC device socket
US9320133B2 (en)2009-06-022016-04-19Hsio Technologies, LlcElectrical interconnect IC device socket
US8912812B2 (en)2009-06-022014-12-16Hsio Technologies, LlcCompliant printed circuit wafer probe diagnostic tool
US9699906B2 (en)2009-06-022017-07-04Hsio Technologies, LlcHybrid printed circuit assembly with low density main core and embedded high density circuit regions
US9054097B2 (en)2009-06-022015-06-09Hsio Technologies, LlcCompliant printed circuit area array semiconductor device package
WO2010147782A1 (en)2009-06-162010-12-23Hsio Technologies, LlcSimulated wirebond semiconductor package
US8984748B2 (en)2009-06-292015-03-24Hsio Technologies, LlcSingulated semiconductor device separable electrical interconnect
US9689897B2 (en)2010-06-032017-06-27Hsio Technologies, LlcPerformance enhanced semiconductor socket
US9350093B2 (en)2010-06-032016-05-24Hsio Technologies, LlcSelective metalization of electrical connector or socket housing
US10159154B2 (en)2010-06-032018-12-18Hsio Technologies, LlcFusion bonded liquid crystal polymer circuit structure
US9761520B2 (en)2012-07-102017-09-12Hsio Technologies, LlcMethod of making an electrical connector having electrodeposited terminals
US10506722B2 (en)2013-07-112019-12-10Hsio Technologies, LlcFusion bonded liquid crystal polymer electrical circuit structure
US10667410B2 (en)2013-07-112020-05-26Hsio Technologies, LlcMethod of making a fusion bonded circuit structure
JP2017534142A (en)*2014-11-062017-11-16アーデント コンセプツ，インコーポレイテッド Controlled impedance cable terminations using compatible interconnect elements
US9559447B2 (en)2015-03-182017-01-31Hsio Technologies, LlcMechanical contact retention within an electrical connector
EP3809518A4 (en)*2018-06-122022-03-16KMW Inc.Cavity filter and connecting structure included therein
WO2019240490A1 (en)2018-06-122019-12-19주식회사 케이엠더블유Cavity filter and connecting structure included therein
US12126103B2 (en)*2020-12-222024-10-22Intel CorporationCoaxial transmission line SLI socket designs for 224GBS and beyond

Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20020088116A1 (en)*2000-09-192002-07-11International Business Machines CorporationMethod of making a CTE compensated chip interposer
US20040029411A1 (en)*2000-01-202004-02-12Rathburn James J.Compliant interconnect assembly
US20060012966A1 (en)*2000-07-312006-01-19Intel CorporationElectronic assemblies and systems comprising interposer with embedded capacitors
US20070269999A1 (en)*2006-05-182007-11-22Centipede Systems, Inc.Socket for an electronic device
US20080143367A1 (en)*2006-12-142008-06-19Scott Chabineau-LovgrenCompliant electrical contact having maximized the internal spring volume

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20040029411A1 (en)*2000-01-202004-02-12Rathburn James J.Compliant interconnect assembly
US20060012966A1 (en)*2000-07-312006-01-19Intel CorporationElectronic assemblies and systems comprising interposer with embedded capacitors
US20020088116A1 (en)*2000-09-192002-07-11International Business Machines CorporationMethod of making a CTE compensated chip interposer
US20070269999A1 (en)*2006-05-182007-11-22Centipede Systems, Inc.Socket for an electronic device
US20080143367A1 (en)*2006-12-142008-06-19Scott Chabineau-LovgrenCompliant electrical contact having maximized the internal spring volume

Also Published As

Publication numberPublication date
WO2012122142A2 (en)2012-09-13

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