自带驱动控制装置的 LED平板显示单元及其生产方法 技术领域 本发明属于 LED平板显示单元领域， 尤其是一种具有 LED像素间距极小、 成本低、 控制性能好、 易于安装拆卸的自带驱动控制装置的 LED平板显示单元 及生产方法。 自带驱动控制的 LED平板显示单元主要应用于 LED面板电视机， 也可应用于 LED全彩显示器等。 背景技术 自从电视机发明以来， 电视机产品的更新换代就一直没有停止过， 新产品 层出不穷。 目前最先进的电视机产品是 LCD液晶电视机， 国内外市场上畅销的 LED背光源电视机等均属于 LCD液晶电视的范畴， LED背光源电视机不是真正 意义上的 "LED电视机"，真正的 LED电视机应该是 LED直接成像的电视机。 LED 背光源电视机经常也被称为 LED电视机， 实际上是使用了 LED照亮屏幕的 LCD 液晶电视，它可以有两个方式达到这一目的：将显示屏的整个背面换成 LED (所 谓 "直下背光， '）， 或在周边放上 LED (所谓 "侧光"）。 如今的电视市场竟争曰 益激烈， 液晶电视的市场更是达到白热化的阶段， 差异化竟争成为各个企业全 新的发展战略。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of LED flat panel display units, and more particularly to a self-contained driver having an LED pixel pitch which is extremely small in pitch, low in cost, good in control performance, and easy to install and disassemble. LED flat panel display unit of control device and production method. The LED flat panel display unit with its own drive control is mainly used in LED panel TVs, and can also be applied to LED full color displays. BACKGROUND OF THE INVENTION Since the invention of televisions, the replacement of television products has not stopped, and new products have emerged one after another. At present, the most advanced TV products are LCD LCD TVs. The best-selling LED backlight TVs in the domestic and international markets are all in the category of LCD TVs. LED backlight TVs are not really "LED TVs". The LED TV should be a TV with direct LED imaging. LED backlight TVs, often referred to as LED TVs, are actually LCD LCD TVs that use LEDs to illuminate the screen. There are two ways to do this: replace the entire back of the display with an LED (so-called "Light down the backlight, '), or put LEDs around (the so-called "sidelight"). Today's TV market is fierce, and the market for LCD TVs is getting hotter, and the differentiation has become a new business. Development strategy.
LCD面板电视机由于其结构的特点， 具有以下不足： 1、 亮度不够， 2、 LCD 响应时间长， 3、 LCD色彩还原不够， 4、 LCD面板存在画面拖尾现象， 而 LED ( L i ght Emi t t ing D i ode ), 发光二极管， 简称 LED, , 是一种能够将电能转化 为可见光的固态的半导体器件， 它可以直接把电转化为光。 Due to its structural characteristics, LCD panel TVs have the following disadvantages: 1. Insufficient brightness, 2. Long LCD response time, 3. Insufficient LCD color reproduction, 4. LCD panel has a trailing phenomenon, and LED (L i ght Emi) Tt ing D i ode ), a light-emitting diode (LED), is a solid-state semiconductor device that converts electrical energy into visible light, which directly converts electricity into light.
虽然现在消费者广泛认识的 LED电视机的屏幕依然是液晶面板， 只是有 LED背光模组替代了传统背光源而已，仅仅是背光源的变换，却由于得益于 LED 光源的优秀特性， 因此能够大幅度提升液晶电视的色域值， 使液晶电视在较低 的功耗下实现更高的亮度和色彩饱和度， 以及动画表现力。 可想而知， 如果电 视机显示面板采用 LED技术， 那将会成为未来电视发展的新方向。 Although the screen of LED TVs widely recognized by consumers is still a liquid crystal panel, only the LED backlight module replaces the traditional backlight. It is only the backlight conversion, but thanks to the excellent characteristics of the LED light source, it can Significantly increase the color gamut value of LCD TVs, enabling LCD TVs to achieve higher brightness and color saturation at lower power consumption, as well as animation performance. It is conceivable that if the display panel of the TV adopts LED technology, it will become a new direction for the development of TV in the future.
直接釆用 LED面板作为电视机的显示屏， 减小 LED像素间距是一个非常重 要技术问题， 对 LED的封装工艺技术的要求很高， 通常使用的封装技术是表面 贴装式 LED, 采用 PCB片式 LED , 采用自动化机器进行固晶和焊线。 此工艺虽 然具有体积小、 发射角大、 发光均匀性好、 可靠性高等优点， 但是仍然不能满 足 LED面板作为电视屏幕的要求。 发明内容 本发明的目的是提供一种具有 LED像素间距极小、成本低、控制性能好、 易于安装拆卸的自带驱动控制装置的 LED平板显示单元及生产方法。Directly using the LED panel as the display screen of the TV, reducing the LED pixel pitch is a very important technical problem, and the packaging technology of the LED is very demanding. The commonly used packaging technology is a surface mount LED, which uses a PCB. LED, using automated machines for die bonding and wire bonding. Although this process has the advantages of small volume, large emission angle, good uniformity of illumination, high reliability, etc., it still cannot be full. Foot LED panels are required as TV screens. SUMMARY OF THE INVENTION An object of the present invention is to provide an LED flat panel display unit and a production method thereof with a self-contained drive control device with extremely small pixel pixel pitch, low cost, good control performance, and easy installation and disassembly.
本发明的技术方案是： 自带驱动控制的 LED平板显示单元， 其特征在于： 由上层绝缘电路基板、 中间多级绝缘电路基板和下层绝缘电路基板组成， 所述 上层绝缘电路基板、 中间多级绝缘电路基板和下层绝缘电路基板经高温压合在 一起， 所述上层绝缘电路基板、 中间多级绝缘电路基板和下层绝缘电路基板的 外表面设置有环氧树脂或硅胶树脂填充覆盖物； The technical solution of the present invention is: an LED flat panel display unit with built-in drive control, characterized in that: an upper insulated circuit substrate, an intermediate multi-level insulated circuit substrate and a lower insulated circuit substrate, the upper insulated circuit substrate, intermediate multi-stage The insulating circuit substrate and the lower insulating circuit substrate are pressed together at a high temperature, and an outer surface of the upper insulating circuit substrate, the intermediate multi-level insulating circuit substrate and the lower insulating circuit substrate is provided with an epoxy or silicone resin filling cover;
其中， 上层绝缘电路基板上设置有由均勾分布的多个 LED晶粒组成的 LED 矩阵； Wherein, the upper insulating circuit substrate is provided with an LED matrix composed of a plurality of LED crystal grains uniformly distributed;
下层绝缘电路基板上设置有数个恒流控制电路、数个扫描电路线控制芯片 和数个数据电路线控制芯片，所述恒流控制电路的输出端口分别与 LED晶粒引 线端子的阴极进行电连接， 以便给 LED晶粒进行供电； The lower insulating circuit substrate is provided with a plurality of constant current control circuits, a plurality of scanning circuit line control chips and a plurality of data circuit control chips, wherein the output ports of the constant current control circuit are electrically connected to the cathodes of the LED chip lead terminals, respectively. , in order to supply power to the LED die;
中间多级绝缘电路基板上设置有数条扫描电路线和数条数据电路线，所述 扫描电路线与数据电路线相垂直布置，扫描电路线与数据电路线的每一个垂直 交叉点分别位于 LED晶粒的下面，所述的扫描电路线的一端分别与对应 LED晶 粒引线端子的阴极进行电连接，用于以一个确定扫描频率的选择对应 LED晶粒， 扫描电路线的另一端分别与对应的扫描电路线控制芯片相连；数据电路线的一 端分别与对应的晶粒引线端子的阳极进行电连接，数据电路线的另一端分别与 数据电路线控制芯片相连， 用于驱动对应的 LED晶粒。 The intermediate multi-level insulated circuit substrate is provided with a plurality of scanning circuit lines and a plurality of data circuit lines, wherein the scanning circuit lines are arranged perpendicular to the data circuit lines, and each of the vertical intersections of the scanning circuit lines and the data circuit lines is respectively located in the LED crystal Below the granules, one end of the scanning circuit line is electrically connected to a cathode of a corresponding LED die lead terminal, respectively, for selecting a corresponding scanning LED frequency corresponding to the LED die, and the other end of the scanning circuit line respectively corresponds to The scanning circuit line control chip is connected; one end of the data circuit line is electrically connected to the anode of the corresponding die lead terminal, and the other end of the data circuit line is respectively connected to the data circuit line control chip for driving the corresponding LED die.
所述 LED晶粒由 LED芯片、 引线框、 散热基片和透明封胶组成， The LED die is composed of an LED chip, a lead frame, a heat dissipation substrate and a transparent sealant.
LED芯片位于散热基片上， 在散热基片的外围设置有引线框； 所述引线框设置 有阴阳两极引线端子， 所述引线端子向其外部延伸突出； LED芯片通过金丝与 引线框进行电连接，透明封胶位于 LED芯片的上面，透明封胶与和引线框相连； 所述 LED芯片由硅铝线或金丝进行电连接成为一个矩阵。The LED chip is disposed on the heat dissipation substrate, and the lead frame is disposed on the periphery of the heat dissipation substrate; the lead frame is provided with the cathode and cathode lead terminals, and the lead terminals extend to the outside thereof; the LED chip is electrically connected to the lead frame through the gold wire The transparent encapsulant is located on the upper surface of the LED chip, and the transparent encapsulant is connected to the lead frame; the LED chip is electrically connected by a silicon aluminum wire or a gold wire to form a matrix.
所述环氧树脂或硅胶树脂填充覆盖物的顶部平坦并且与绝缘电路基板平 行， 所述填充覆盖物的外周侧面与所述绝缘电路基板的外周侧面相平齐。 The top of the epoxy or silicone resin filled cover is flat and parallel to the insulating circuit substrate, and the outer peripheral side of the filled cover is flush with the outer peripheral side of the insulated circuit substrate.
所述多个 LED 晶粒的间距 2隱， 所述每一个 LED 晶粒具有发光峰波长 465誦—— 6 32nm的发光光谱。 The pitch of the plurality of LED dies is hidden, and each of the LED dies has an illuminating spectrum of an illuminating peak wavelength of 465 诵 - 6 32 nm.
恒流控制电路电流由电流增益调整电路、控制逻辑电路、控制状态寄存器、 位移寄存器、输出緩存器、输出驱动器、 LED开路 /短路侦测电路、使能信号端、 数据闪烁控制输入端、 数据时钟信号端、 输入至位移寄存器的串行数据输入端 和串行数据输出端组成。The constant current control circuit current is composed of a current gain adjustment circuit, a control logic circuit, a control status register, a shift register, an output buffer, an output driver, an LED open/short detection circuit, an enable signal terminal, The data flicker control input, the data clock signal end, the serial data input input to the shift register, and the serial data output end.
其中， 电流增益调整电路分别与使能信号端、 控制状态寄存器和 LED晶粒 引线端子的阴极连接； 控制逻辑电路分别与数据闪烁控制输入端、 数据时钟信 号端、 LED开路 /短路侦测电路、输出緩存器、控制状态寄存器和位移寄存器连 接； 控制状态寄存器还与位移寄存器连接； 位移寄存器还与数据时钟信号端、 输入至位移寄存器的串行数据输入端、 串行数据输出端、 输出緩存器和 LED开 路 /短路侦测电路相连； 输出緩存器还与 LED开路 /短路侦测电路相连， LED开 路 /短路侦测电路还与 LED晶粒引线端子的阴极连接。 Wherein, the current gain adjustment circuit is respectively connected with the enable signal terminal, the control state register and the cathode of the LED die lead terminal; the control logic circuit and the data flicker control input terminal, the data clock signal terminal, the LED open/short detection circuit, Output buffer, control status register and shift register connection; control status register is also connected with shift register; shift register is also connected with data clock signal terminal, serial data input terminal input to shift register, serial data output terminal, output buffer It is connected to the LED open/short detection circuit; the output buffer is also connected to the LED open/short detection circuit, and the LED open/short detection circuit is also connected to the cathode of the LED die lead terminal.
所述数据电路线控制电路执行行顺序驱动， 进行行顺序扫描， 以便同 时把电信号提供给 LED晶粒的数据电路线， 另外数据电路线控制电路执行 点时序驱动， 所述点时序驱动是由数据电路线控制电路中控制其输出信 号， 其输出信号不仅与其输入信号有关， 同时与其芯片记录的状态信号有 关， 以便进行点时序扫描， 把一个电信号提供到 LED平板显示单元中一个 选择行的 LED晶粒。 The data circuit line control circuit performs line sequential driving to perform line sequential scanning to simultaneously supply an electrical signal to the data circuit line of the LED die, and the data circuit line control circuit performs point timing driving, wherein the point timing driving is performed by The data circuit control circuit controls its output signal, and its output signal is not only related to its input signal, but also related to the status signal recorded by the chip for point timing scanning, and an electrical signal is supplied to a selected row of the LED flat panel display unit. LED die.
自带驱动控制的 LED平板显示单元的生产方法， 其特征是包括下列步驟： The production method of the LED flat panel display unit with its own drive control, comprising the following steps:
( 1 )进行 LED晶粒、 芯片、 电阻、 电容的分档和抽检；(1) Perform binning and sampling of LED dies, chips, resistors, and capacitors;
( 2 )放置芯片、 电阻和电容于所述下层绝缘电路基板上， 组合形成恒流 控制电路、 扫描电路线控制电路和数据电路线控制电路， 进行功能性与稳定性 测试； (2) placing chips, resistors and capacitors on the underlying insulated circuit substrate to form a constant current control circuit, a scanning circuit line control circuit and a data circuit line control circuit for functional and stability testing;
( 3 )将所述上层绝缘电路基板进行打孔， 并将金属引线框对应于上述打 孔部位进行安放； (3) punching the upper insulating circuit substrate, and placing the metal lead frame corresponding to the punched portion;
( 4 )将所述 LED晶粒进行逐个检验。 然后将所述经过检验的 LED晶粒对 应安放在所述引线框上， 进行高温金丝键合并进行电连接； 然后将引线框的阴 阳两极引线端子向其下部突出； (4) The LED dies are inspected one by one. Then, the tested LED dies are placed on the lead frame, and high temperature gold wire bonds are combined for electrical connection; then the male and female lead terminals of the lead frame are protruded toward the lower portion thereof;
( 5 )进行硅铝线或金丝电连接， 将所述 LED晶粒彼此同极相连接后组合 为所述 LED晶粒矩阵； (5) performing a silicon-aluminum wire or a gold wire electrical connection, and combining the LED dies with each other to form the LED die matrix;
( 6 )将所述中层绝缘电路基板进行高温打孔压线， 将多条扫描电路线与 多条数据电路线彼此相垂直的压合分布在所述中层绝缘电路基板上， 并且多条 扫描电路线与对应 LED晶粒引线端子的阴极进行电连接，数据电路线与对应晶 粒引线端子的阳极进行电连接； (6) performing the high-temperature punching and pressing line on the middle-layer insulated circuit substrate, and pressing the plurality of scanning circuit lines and the plurality of data circuit lines perpendicularly to each other on the intermediate-layer insulated circuit substrate, and the plurality of scanning circuits The wire is electrically connected to the cathode of the corresponding LED die lead terminal, and the data circuit line is electrically connected to the anode of the corresponding die lead terminal;
( 7 )将所述下层绝缘电路基板上恒流控制电路输出端口与 LED晶粒引线 端子的阴极进行电连接， 所述扫描电路线控制电路与扫描电路线对应电连接， 所述数据电路线控制电路与数据电路线对应电连接；(7) electrically connecting the output port of the constant current control circuit on the lower insulated circuit substrate to the cathode of the LED die lead terminal, and the scan circuit line control circuit is electrically connected to the scan circuit line. The data circuit line control circuit is electrically connected to the data circuit line;
( 8 )进行所述 LED晶粒的测试与老化， 确保其性能可靠性与稳定性； (8) performing test and aging of the LED die to ensure performance reliability and stability;
( 9 )将所述绝缘电路基板进行整体压合， 并且放入上模具内， 进行顶层 绝缘电路基板的透光性环氧树脂或硅胶灌封与固化， 然后拆除上模具；(9) integrally pressing the insulating circuit substrate, and placing it in the upper mold, performing potting and curing of the translucent epoxy resin or the silicon dioxide of the top insulating circuit substrate, and then removing the upper mold;
( 10 )将上述进行过顶层灌封与固化后的电路基板放入与上述上模具相对 应的下模具中， 进行底层绝缘电路基板的透光性环氧树脂或硅胶灌封与固化， 然后拆除下模具； (10) putting the above-mentioned top-side potting and curing circuit substrate into a lower mold corresponding to the above upper mold, performing potting and curing of the light-transmitting epoxy resin or silicone of the underlying insulating circuit substrate, and then removing Lower mold
( 11 )对进行过灌封与固化的电路基板进行整体成型； (11) integrally molding the circuit substrate subjected to potting and curing;
( 12 )对所述自带驱动控制的 LED平板显示单元进行单点色度亮度的校正， 并将参数记录归档后， 重新输入到所述自带驱动控制的 LED平板显示单元中。 (12) Performing correction of the single-point chrominance brightness on the LED panel display unit with its own drive control, and archiving the parameter records, and then inputting them into the LED panel display unit with the built-in drive control.
本发明的效果是： 本发明是在原有的封装基础上， 将 PCB片式封装 LED 与控制电路及恒流驱动电路集成为一个整体，具有 LED像素间距极小、成本低、 控制性能好、 易于安装拆卸等优点， 适用于产业化的加工生产。 下面结合附图和实施例对本发明做进一步的说明。 附图说明 图 1是本发明的整体结构示意图； The invention has the following effects: the invention integrates the PCB chip package LED with the control circuit and the constant current driving circuit as a whole on the basis of the original package, and has the LED pixel pitch minimum, low cost, good control performance and easy Advantages of installation and disassembly, suitable for industrial processing and production. The invention will be further described below in conjunction with the drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of the overall structure of the present invention;
图 2是本发明整体结构连接示意图； Figure 2 is a schematic view showing the connection of the overall structure of the present invention;
图 3是中间多层电路的具体结构示意图； 3 is a schematic structural diagram of an intermediate multilayer circuit;
图 4是图 2的单点 LED晶粒局部结构放大图； Figure 4 is an enlarged plan view showing a partial structure of the single-point LED of Figure 2;
图 5是下层绝缘电路基板的结构示意图； 5 is a schematic structural view of a lower insulated circuit substrate;
图 6是下层绝缘电路基板恒流控制电路的结构示意图； 6 is a schematic structural view of a constant current control circuit of a lower insulated circuit substrate;
图 7是本发明的制作方法流程图。 具体实施方式 如图 1和 2所示， LED显示装置由顶层绝缘电路基板 1、 中层绝缘电路基 板 2和底层绝缘电路基板 3构成，三层绝缘电路基板顺序高温压合成为一个整 体； LED晶粒 4矩阵式排列于顶层绝缘电路基板 1上表面； 在中层绝缘电路基 板 1上设置有多条扫描电路线 L和多条数据电路线 D , 以便控制 LED晶粒 4的 点亮与熄灭； 在底层绝缘电路基板上设置有多个恒流控制电路， 以便对 LED晶 粒进行供电， 多个扫描电路线控制芯片和多个数据电路线控制芯片以便对多条 扫描电路线 L和多条数据电路线 D进行控制。Figure 7 is a flow chart of the manufacturing method of the present invention. 1 and 2, an LED display device is composed of a top insulating circuit substrate 1, a middle insulating circuit substrate 2, and a bottom insulating circuit substrate 3. The three-layer insulating circuit substrate is sequentially combined at a high temperature into a whole; 4 is arranged in a matrix on the upper surface of the top insulating circuit substrate 1; a plurality of scanning circuit lines L and a plurality of data circuit lines D are disposed on the intermediate insulating circuit substrate 1 to control the lighting and extinction of the LED die 4; A plurality of constant current control circuits are disposed on the insulating circuit substrate to supply power to the LED dies, and the plurality of scanning circuit line control chips and the plurality of data circuit line control chips are provided for multiple The scanning circuit line L and the plurality of data circuit lines D are controlled.
如图 3在中层绝缘电路基板 2上设置有多条扫描电路线 L和多条数据电路 线 D， 多条扫描电路线 L， 其一端与对应 LED晶粒 4引线端子的阴极进行电连 接， 并用于以一个确定扫描频率的选择对应 LED晶粒 4 , 另一端与扫描电路线 控制芯片相连； 多条数据电路线 D, 其一端与对应 LED晶粒 4引线端子的阳极 进行电连接， 用于驱动对应的所述 LED晶粒 4 ; 另一端与数据电路线控制芯片 相连. 把一个电信号提供到矩阵型 LED晶粒中一个选择行的像素的发光 LED , 图像显示装置包括行顺序驱动与点时序驱动。 该装置可以根据调整 发光 LED亮度和显示时间， 从而控制整个显示面板的色彩平衡。 As shown in FIG. 3, a plurality of scanning circuit lines L and a plurality of data circuit lines D are disposed on the intermediate insulated circuit substrate 2, and a plurality of scanning circuit lines L are electrically connected to one end of the cathode of the LED chip 4 lead terminal. The LED chip 4 is connected to the selected one with the selected scanning frequency, and the other end is connected to the scanning circuit control chip; the plurality of data circuit lines D are electrically connected to the anode of the lead terminal of the corresponding LED die 4 for driving. Corresponding to the LED die 4; the other end is connected to the data circuit control chip. An electrical signal is provided to the LED of a selected row of pixels in the matrix LED die, and the image display device includes line sequential driving and dot timing drive. The device can control the color balance of the entire display panel according to the brightness and display time of the illuminated LED.
如图 4为单个 LED晶粒的结构， LED芯片 5位于散热基片上 6 , 在散热 基片 6的外围设置有引线框 7 ; 引线框 7设置有阴阳两极引线端子 8， 引线端 子 8向其外部延伸突出； LED芯片 5通过金丝 9与引线框 7进行电连接， 透明 封胶 10位于 LED芯片的上面， 透明封胶 10与和引线框 7相连； LED芯片 5由 硅铝线或金丝进行电连接成为一个矩阵。 4 is a structure of a single LED die, the LED chip 5 is located on the heat dissipation substrate 6, and a lead frame 7 is disposed on the periphery of the heat dissipation substrate 6. The lead frame 7 is provided with the cathode and cathode terminal 8 and the lead terminal 8 is externally The LED chip 5 is electrically connected to the lead frame 7 through the gold wire 9, the transparent seal 10 is located on the upper surface of the LED chip, and the transparent seal 10 is connected to the lead frame 7; the LED chip 5 is made of silicon aluminum wire or gold wire Electrical connections become a matrix.
生产方法是： 首先固定引线框， 引线框有阴阳两极引线端子， 其引线 端子向下延伸； 然后将单个 LED晶粒放置在引线框上部， 并且配置一片散 热基片在 LED晶粒底部； 并用金丝将 LED晶粒与引线框连接并固定； 当整 个自带驱动控制的 LED平板显示单元各层绝缘基板准备完毕， 最后由环氧 树脂或硅树脂材质进行整体填充覆盖， 也可称为封胶。 The production method is as follows: First, the lead frame is fixed, the lead frame has male and female lead terminals, and the lead terminals thereof extend downward; then a single LED die is placed on the upper part of the lead frame, and a heat dissipation substrate is disposed at the bottom of the LED die; The wire connects and fixes the LED die to the lead frame; when the entire insulating substrate of the LED flat panel display unit with the built-in drive control is prepared, the entire filling is covered by epoxy resin or silicone material, which may also be called sealing glue. .
图 5中为下层绝缘电路基板的结构示意， 主要由多个恒流控制电路、 多个 扫描电路线控制电路和多个数据电路线控制电路构成。 其中， 由多个逻辑组合 元件、 多个阻容元件、 多个寄存器、 多个移位器、 多个緩存器构成恒流控制电 路。恒流控制电路的多个输出端口与多个 LED晶粒引线端子的阴极进行电连接， 以便对 LED晶粒进行供电。 多个扫描电路线控制电路与多条扫描电路线连接， 用于进行 LED晶粒矩阵中每一行 LED晶粒进行确定频率的扫描选择； 多个数据 电路线控制电路与多条数据电路线连接， 用于进行 LED晶粒矩阵中每一列 LED 晶粒的点亮时间的控制。 Fig. 5 is a schematic structural view of a lower insulated circuit substrate, and is mainly composed of a plurality of constant current control circuits, a plurality of scanning circuit line control circuits, and a plurality of data circuit line control circuits. The constant current control circuit is constituted by a plurality of logic combination elements, a plurality of resistance and capacitance elements, a plurality of registers, a plurality of shifters, and a plurality of buffers. A plurality of output ports of the constant current control circuit are electrically connected to cathodes of the plurality of LED die lead terminals to supply power to the LED dies. The plurality of scanning circuit line control circuits are connected to the plurality of scanning circuit lines for performing scanning selection of the determined frequency of each row of LED dies in the LED die matrix; the plurality of data circuit line control circuits are connected to the plurality of data circuit lines, Used to control the lighting time of each column of LED dies in the LED die matrix.
图 6为恒流控制电路的结构示意，恒流控制电路电流由电流增益调整电路、 控制逻辑电路、 控制状态寄存器、 位移寄存器、 输出緩存器、 输出驱动器、 LED 开路 /短路侦测电路、 使能信号端、 数据闪烁控制输入端、 数据时钟信号端、 输入至位移寄存器的串行数据输入端和串行数据输出端组成。 Figure 6 is a schematic diagram of the structure of the constant current control circuit. The current of the constant current control circuit is controlled by a current gain adjustment circuit, a control logic circuit, a control status register, a shift register, an output buffer, an output driver, an LED open/short detection circuit, and an enable The signal terminal, the data flicker control input terminal, the data clock signal terminal, the serial data input terminal input to the shift register, and the serial data output terminal are composed.
其中， 电流增益调整电路分别与使能信号端、 控制状态寄存器和 LED晶粒 引线端子的阴极连接； 控制逻辑电路分别与数据闪烁控制输入端、 数据时钟信 号端、 LED开路 /短路侦测电路、输出緩存器、控制状态寄存器和位移寄存器连 接； 控制状态寄存器还与位移寄存器连接； 位移寄存器还与数据时钟信号端、 输入至位移寄存器的串行数据输入端、 串行数据输出端、 输出緩存器和 LED开 路 /短路侦测电路相连； 输出緩存器还与 LED开路 /短路侦测电路相连， LED开 路 /短路侦测电路还与 LED晶粒引线端子的阴极连接。Wherein, the current gain adjustment circuit is respectively connected with the enable signal terminal, the control state register and the cathode of the LED die lead terminal; the control logic circuit and the data flicker control input terminal, the data clock signal terminal, the LED open/short detection circuit, Output buffer, control status register, and shift register The control status register is also connected to the shift register; the shift register is also connected to the data clock signal terminal, the serial data input terminal input to the shift register, the serial data output terminal, the output buffer, and the LED open/short detection circuit; The output buffer is also connected to the LED open/short detection circuit, and the LED open/short detection circuit is also connected to the cathode of the LED die lead terminal.
其中， VDD为外接电源端口； 51为使能信号端； LE为数据闪烁控制输入 端， 配合时钟信号的输入； CLK为数据时钟信号端， 当 LE启动时， CLK可输入 控制信号； SDI为输入至位移寄存器的串行数据输入； SD0为串行数据输出端， 可接到下一个驱动控制电路的 SDI端口； 控制逻辑由多个逻辑元件构成， 以便 对状态寄存器， 位移寄存器进行控制， 同时可向输出驱动器进行信号驱动； 位 移寄存器和输出緩存器可将串行式输入数据转为并列式输出格式； 通过输出驱 动器可控制输出端提供稳定的电流源， 可应对 LED晶粒负载电压的变化， 提供 均匀、 稳定的电流以驱动 LED晶粒的点亮。 同时设置有 LED开路 /短路侦测电 路， 可以实时的监控 LED晶粒的开路或短路情况， 而且并不影响整个恒流控制 电路的正常工作； 同时设置电流增益调整电路， 可通过微调进行输出电流的调 整， 以便达到更加优越的现实效杲。 Among them, VDD is the external power port; 51 is the enable signal; LE is the data flicker control input, with the input of the clock signal; CLK is the data clock signal end, when LE starts, CLK can input the control signal; SDI is the input Serial data input to the shift register; SD0 is the serial data output terminal, which can be connected to the SDI port of the next drive control circuit; The control logic is composed of multiple logic elements to control the status register and the shift register. Signal drive to the output driver; the shift register and output buffer can convert the serial input data into a parallel output format; the output driver can control the output to provide a stable current source to cope with changes in the LED die load voltage. Provides a uniform, stable current to drive the illumination of the LED die. At the same time, an LED open/short detection circuit is provided, which can monitor the open or short circuit of the LED die in real time, and does not affect the normal operation of the entire constant current control circuit. At the same time, the current gain adjustment circuit can be set, and the output current can be adjusted by fine adjustment. Adjustments in order to achieve a more realistic reality.
图 7为自带驱动控制的 LED平板显示单元的制作流程： Figure 7 shows the production process of the LED flat panel display unit with its own drive control:
第一步： 进行多个 LED晶粒、 多个芯片、 多个电阻、 多个电容的分档和抽 检； The first step: performing binning and sampling of multiple LED dies, multiple chips, multiple resistors, multiple capacitors;
第二步： 放置多个芯片、 多个电阻和多个电容器件于所述下层绝缘电路基 板上， 组合形成多个恒流控制电路、 多个扫描电路线控制电路和多个数据电路 线控制电路； 进行功能性与稳定性测试； The second step: placing a plurality of chips, a plurality of resistors and a plurality of capacitor devices on the underlying insulated circuit substrate, combining to form a plurality of constant current control circuits, a plurality of scan circuit line control circuits, and a plurality of data circuit line control circuits ; perform functional and stability tests;
第三步： 将所述上层绝缘电路基板进行打孔， 并将所述金属引线框对应于 上述打孔部位进行安放； The third step: punching the upper insulating circuit substrate, and placing the metal lead frame corresponding to the punching portion;
第四步： 将所述多个 LED晶粒进行逐个检验。 然后将所述经过检验的多个 LED晶粒对应安放在所述引线框上， 进行高温金丝键合并进行电连接； 然后将 引线框的阴阳两极引线端子向其下部突出； The fourth step: the plurality of LED dies are inspected one by one. Then, the plurality of tested LED dies are correspondingly placed on the lead frame, and high temperature gold wire bonds are combined for electrical connection; then the male and female lead terminals of the lead frame are protruded toward the lower portion thereof;
第五步： 进行硅铝线或金丝电连接， 将所述多个 LED晶粒彼此同极相连接 后组合为所述多个 LED晶粒矩阵； The fifth step: performing a silicon-aluminum wire or a gold wire electrical connection, connecting the plurality of LED dies to each other and combining the plurality of LED die matrices;
第六步： 将所述中层绝缘电路基板进行高温打孔压线， 将多条扫描电路线 与多条数据电路线彼此相垂直的压合分布在所述中层绝缘电路基板上， 并且多 条扫描电路线，与对应 LED晶粒引线端子的阴极进行电连接，多条数据电路线， 与对应晶粒引线端子的阳极进行电连接； The sixth step: performing the high-temperature punching and pressing line on the middle-layer insulated circuit substrate, and pressing the plurality of scanning circuit lines and the plurality of data circuit lines perpendicularly to each other on the intermediate-layer insulating circuit substrate, and scanning the plurality of layers a circuit line electrically connected to a cathode of the corresponding LED die lead terminal, and a plurality of data circuit lines electrically connected to the anode of the corresponding die lead terminal;
第七步： 将所述下层绝缘电路基板上多个恒流控制电路输出端口与多个 LED晶粒引线端子的阴极进行电连接， 所述多个扫描电路线控制电路与多条扫 描电路线对应电连接，所述多个数据电路线控制电路与多条数据电路线对应电 连接；Step 7: outputting a plurality of constant current control circuit output ports on the lower insulated circuit substrate The cathodes of the LED chip lead terminals are electrically connected, and the plurality of scan circuit line control circuits are electrically connected to the plurality of scan circuit lines, and the plurality of data circuit line control circuits are electrically connected to the plurality of data circuit lines;
第八步： 进行所述 LED晶粒的测试与老化， 确保其性能可靠性与稳定性； 第九步： 将所述绝缘电路基板进行整体压合， 并且放入上模具内， 进行顶 层绝缘电路基板的透光性环氧树脂或硅胶濯封与固化， 然后拆除上模具； 第十步，将上述进行过顶层灌封与固化后的电路基板放入与上述上模具相 对应的下模具中， 进行底层绝缘电路基板的透光性环氧树脂或硅胶灌封与固 化， 然后拆除下模具； Step 8: Perform testing and aging of the LED die to ensure performance reliability and stability; Step 9: integrally press the insulating circuit substrate and put it into the upper mold to perform a top insulating circuit The light-transmissive epoxy resin or the silicone resin of the substrate is sealed and cured, and then the upper mold is removed; in the tenth step, the circuit substrate after the top sealing and curing is placed in the lower mold corresponding to the upper mold; Performing potting and curing of the transparent epoxy resin or silicone of the underlying insulating circuit substrate, and then removing the lower mold;
第十一步： 对进行过灌封与固化的电路基板进行整体成型。 The eleventh step: integrally molding the circuit substrate subjected to potting and curing.
第十二步： 对所述自带驱动控制的 LED平板显示单元进行单点色度亮度的 校正， 并将参数记录归档后， 重新输入到 L所述自带驱动控制的 LED平板显示 单元中。 Step 12: Perform calibration of the single-point chrominance brightness on the LED panel display unit with the built-in drive control, and archive the parameter record, and then re-enter it into the LED flat panel display unit with the built-in drive control.