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WO2009069683A1 - Method for manufacturing multilayer printed wiring board - Google Patents

Method for manufacturing multilayer printed wiring boardDownload PDF

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Publication number
WO2009069683A1
WO2009069683A1PCT/JP2008/071511JP2008071511WWO2009069683A1WO 2009069683 A1WO2009069683 A1WO 2009069683A1JP 2008071511 WJP2008071511 WJP 2008071511WWO 2009069683 A1WO2009069683 A1WO 2009069683A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
wiring board
multilayer printed
printed wiring
Prior art date
Application number
PCT/JP2008/071511
Other languages
French (fr)
Japanese (ja)
Inventor
Takeshi Nishio
Atsuhiro Uratsuji
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device CorporationfiledCriticalSony Chemical & Information Device Corporation
Priority to JP2009511283ApriorityCriticalpatent/JPWO2009069683A1/en
Priority to CN2008801183337Aprioritypatent/CN101878679A/en
Publication of WO2009069683A1publicationCriticalpatent/WO2009069683A1/en

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Abstract

Disclosed is a method for exposing an inner layer of a multilayer printed wiring board. In the method, a first pattern (3) is formed at least on one surface (2a) of a first insulating layer (2), and an alkali-soluble ink layer (13) is formed in an exposure region (11) from which the first wiring pattern (3) on the first insulating layer (2) is to be exposed. Furthermore, a second insulating layer (4) is formed on the surface of the first insulating layer (2) whereupon the ink layer is formed so that the ink layer (13) is exposed from the second insulating layer (4), a metal layer (14) is formed on the second insulating layer (4), and a second wiring pattern (5) is formed by patterning the metal layer (14). Then, the ink layer (13) is dissolved and removed, and the first insulating layer (2) and the first wiring pattern (3) are exposed in the exposure region (11).
PCT/JP2008/0715112007-11-302008-11-27Method for manufacturing multilayer printed wiring boardWO2009069683A1 (en)

Priority Applications (2)

Application NumberPriority DateFiling DateTitle
JP2009511283AJPWO2009069683A1 (en)2007-11-302008-11-27 Manufacturing method of multilayer printed wiring board
CN2008801183337ACN101878679A (en)2007-11-302008-11-27Method for manufacturing multilayer printed wiring board

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2007-3111812007-11-30
JP20073111812007-11-30

Publications (1)

Publication NumberPublication Date
WO2009069683A1true WO2009069683A1 (en)2009-06-04

Family

ID=40678575

Family Applications (1)

Application NumberTitlePriority DateFiling Date
PCT/JP2008/071511WO2009069683A1 (en)2007-11-302008-11-27Method for manufacturing multilayer printed wiring board

Country Status (3)

CountryLink
JP (1)JPWO2009069683A1 (en)
CN (1)CN101878679A (en)
WO (1)WO2009069683A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2013520007A (en)*2010-02-122013-05-30エルジー イノテック カンパニー リミテッド Printed circuit board and manufacturing method thereof
JP2014093527A (en)*2012-11-022014-05-19Samsung Electro-Mechanics Co LtdPrinted circuit board manufacturing method
US20160007442A1 (en)*2014-07-012016-01-07Isola Usa Corp.Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs
CN112996237A (en)*2019-12-122021-06-18三星电机株式会社Printed circuit board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102883545B (en)*2012-09-172015-04-22东莞康源电子有限公司Protection process for inner layer welding point of soft and hard combined plate
KR101307163B1 (en)*2012-11-292013-09-11주식회사 에스아이 플렉스The printed circuit board manufacturing method
JP6240007B2 (en)*2014-03-182017-11-29日本メクトロン株式会社 Method for manufacturing flexible printed circuit board and intermediate product used for manufacturing flexible printed circuit board
CN106231820A (en)*2016-07-292016-12-14台山市精诚达电路有限公司Rigid Flex processing method
WO2020175476A1 (en)*2019-02-272020-09-03住友電工プリントサーキット株式会社Printed wiring board, and method for manufacturing printed wiring board
CN113573461B (en)*2020-04-292023-01-17鹏鼎控股(深圳)股份有限公司Semi-flexible circuit board and manufacturing method thereof
CN112730230B (en)*2020-12-242022-10-11中国航空工业集团公司成都飞机设计研究所Device and method for measuring viscosity of prepreg tows after automatic fiber laying
CN113966096A (en)*2021-09-262022-01-21东莞康源电子有限公司Machining method of miniature flip-chip welding type cavity carrier plate

Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0239594A (en)*1988-07-291990-02-08Sharp CorpManufacture of flexible rigid wiring board
JPH08174755A (en)*1994-12-211996-07-09Toagosei Co LtdManufacture of copper-clad insulation sheet and multilayer printed wiring board
JP2001015917A (en)*1999-06-302001-01-19Toshiba Corp Manufacturing method of rigid flex printed wiring board
JP2005085839A (en)*2003-09-052005-03-31Cmk Corp Manufacturing method of rigid-flex multilayer printed wiring board
JP2006203155A (en)*2005-01-202006-08-03Samsung Electro Mech Co LtdMethod for manufacturing rigid flexible printed circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH09283932A (en)*1996-04-081997-10-31Ibiden Co LtdMultilayer printed wiring board manufacturing method
JPH1013027A (en)*1996-06-191998-01-16Matsushita Electric Works LtdMethod for manufacturing multilayer printed wiring board
JPH10126056A (en)*1996-10-181998-05-15Victor Co Of Japan LtdManufacturing method of printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0239594A (en)*1988-07-291990-02-08Sharp CorpManufacture of flexible rigid wiring board
JPH08174755A (en)*1994-12-211996-07-09Toagosei Co LtdManufacture of copper-clad insulation sheet and multilayer printed wiring board
JP2001015917A (en)*1999-06-302001-01-19Toshiba Corp Manufacturing method of rigid flex printed wiring board
JP2005085839A (en)*2003-09-052005-03-31Cmk Corp Manufacturing method of rigid-flex multilayer printed wiring board
JP2006203155A (en)*2005-01-202006-08-03Samsung Electro Mech Co LtdMethod for manufacturing rigid flexible printed circuit board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2013520007A (en)*2010-02-122013-05-30エルジー イノテック カンパニー リミテッド Printed circuit board and manufacturing method thereof
JP2014093527A (en)*2012-11-022014-05-19Samsung Electro-Mechanics Co LtdPrinted circuit board manufacturing method
KR101814113B1 (en)2012-11-022018-01-02삼성전기주식회사Method for manufacturing of printed circuit board
US20160007442A1 (en)*2014-07-012016-01-07Isola Usa Corp.Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs
US9764532B2 (en)*2014-07-012017-09-19Isola Usa Corp.Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
US10307989B2 (en)2014-07-012019-06-04Isola Usa Corp.Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
CN112996237A (en)*2019-12-122021-06-18三星电机株式会社Printed circuit board

Also Published As

Publication numberPublication date
CN101878679A (en)2010-11-03
JPWO2009069683A1 (en)2011-04-14

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