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WO2008108357A1 - Photosensitive composition, solder resist and photosensitive dry film - Google Patents

Photosensitive composition, solder resist and photosensitive dry filmDownload PDF

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Publication number
WO2008108357A1
WO2008108357A1PCT/JP2008/053827JP2008053827WWO2008108357A1WO 2008108357 A1WO2008108357 A1WO 2008108357A1JP 2008053827 WJP2008053827 WJP 2008053827WWO 2008108357 A1WO2008108357 A1WO 2008108357A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive composition
photosensitive
dry film
solder resist
compound
Prior art date
Application number
PCT/JP2008/053827
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Hirakawa
Masao Takei
Original Assignee
Toagosei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co., Ltd.filedCriticalToagosei Co., Ltd.
Priority to JP2009502584ApriorityCriticalpatent/JP5051217B2/en
Publication of WO2008108357A1publicationCriticalpatent/WO2008108357A1/en

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Abstract

Disclosed is a photosensitive composition containing a halogen-free flame retardant and having excellent resolution and storage stability. A cured product of such a photosensitive composition is excellent in flame retardancy, heat resistance, flexibility and electrical insulation. Specifically disclosed is a photosensitive composition containing a compound (A) having a skeleton derived from an epoxy compound and containing a carboxyl group and a radically polymerizable group, a urethane acrylate (B), a polymerizable compound (C) other than the compounds (A) and (B) which has a radically polymerizable group, a filler (D) containing a phosphorus atom and a photopolymerization initiator (E).
PCT/JP2008/0538272007-03-052008-03-04Photosensitive composition, solder resist and photosensitive dry filmWO2008108357A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP2009502584AJP5051217B2 (en)2007-03-052008-03-04 Photosensitive composition, solder resist and photosensitive dry film

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP20070544332007-03-05
JP2007-0544332007-03-05

Publications (1)

Publication NumberPublication Date
WO2008108357A1true WO2008108357A1 (en)2008-09-12

Family

ID=39738235

Family Applications (1)

Application NumberTitlePriority DateFiling Date
PCT/JP2008/053827WO2008108357A1 (en)2007-03-052008-03-04Photosensitive composition, solder resist and photosensitive dry film

Country Status (3)

CountryLink
JP (1)JP5051217B2 (en)
TW (1)TWI443454B (en)
WO (1)WO2008108357A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2010078949A (en)*2008-09-262010-04-08Goo Chemical Co LtdAlkali developable curable composition and cured product of the same
JP2010169810A (en)*2009-01-212010-08-05Hitachi Chem Co LtdPhotosensitive resin composition and photosensitive element using the same
JP2010204590A (en)*2009-03-062010-09-16Nippon Steel Chem Co LtdPhotosensitive resin composition and circuit wiring board using the same
JP2010250020A (en)*2009-04-142010-11-04Nitto Denko CorpPhotosensitive adhesive composition and electronic component-sealing material obtained using the same
WO2011062053A1 (en)*2009-11-172011-05-26株式会社タムラ製作所Flame-retardant solder resist composition and flexible wiring board which is obtained using same
WO2011093448A1 (en)*2010-02-012011-08-04富士フイルム株式会社Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
WO2011125604A1 (en)*2010-03-312011-10-13太陽ホールディングス株式会社Curable resin composition, dry film using same, and printed wiring board
JP2011257687A (en)*2010-06-112011-12-22Toagosei Co LtdPhotosensitive resin composition, solder resist and photosensitive dry film
JP2012008221A (en)*2010-06-222012-01-12Hitachi Chem Co LtdLight waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same
JP2012088360A (en)*2010-10-152012-05-10Hitachi Chem Co LtdPhotosensitive resin composition and photosensitive element using the same
CN102520585A (en)*2010-08-202012-06-27株式会社田村制作所Alkali soluble transparent resin composition
WO2012117915A1 (en)*2011-03-032012-09-07株式会社カネカNovel insulating film and printed wiring board provided with insulating film
WO2013008631A1 (en)*2011-07-112013-01-17富士フイルム株式会社Photosensitive composition
JP2013029556A (en)*2011-07-262013-02-07Fujifilm CorpPhotosensitive composition
JP2013033282A (en)*2012-10-262013-02-14Taiyo Holdings Co LtdCurable resin composition, and dry film and printed wiring board using the same
JP2013057956A (en)*2012-10-262013-03-28Taiyo Holdings Co LtdCurable resin composition, and dry film and printed wiring board using the same
CN103403619A (en)*2011-03-252013-11-20富士胶片株式会社Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
US8734406B2 (en)2009-11-242014-05-27Regents Of The University Of MinnesotaMethods and systems for chemical ablation
JP2014178708A (en)*2014-06-032014-09-25Taiyo Holdings Co LtdPhotocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product
US8926586B2 (en)2007-02-272015-01-06Regents Of The University Of MinnesotaThermochemical ablation of bodily tissue
US8979831B2 (en)2008-07-312015-03-17Regents Of The University Of MinnesotaThermochemical ablation system using heat from delivery of electrophiles
JP2021154641A (en)*2020-03-272021-10-07味の素株式会社Resin sheet
WO2021256333A1 (en)*2020-06-192021-12-23Canon Kabushiki KaishaPhoto-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2000128957A (en)*1998-10-282000-05-09Nicca Chemical Co LtdSolder photoresist ink composition
JP2002105340A (en)*2000-09-292002-04-10Toyobo Co LtdActive energy ray-curable liquid resin composition
JP2002265567A (en)*2001-03-062002-09-18Showa Highpolymer Co LtdPhotosensitive flame-retardant resin and its composition
JP2003177515A (en)*2001-12-122003-06-27Kanegafuchi Chem Ind Co LtdFlame-retardant photosensitive cover lay film
JP2003301013A (en)*2002-04-102003-10-21Nippon Kayaku Co LtdRadiation-curable flame-retardant resin composition and its use
JP2004012810A (en)*2002-06-062004-01-15Showa Denko KkCurable flame-retardant composition, its cured body and its producing method
JP2004062057A (en)*2002-07-312004-02-26Showa Denko KkPhotosensitive thermosetting resin composition and its hardened product
JP2005173577A (en)*2003-11-172005-06-30Showa Denko KkFlame retardant photosensitive composition and its cured object
JP2006011395A (en)*2004-05-262006-01-12Showa Denko KkPhotosensitive resin composition, and cured product and use thereof
JP2006084857A (en)*2004-09-162006-03-30Hitachi Chem Co LtdPhotosensitive resin composition, solder resist forming method and printed wiring board
JP2006220804A (en)*2005-02-092006-08-24Nichigo Morton Co LtdPhotosensitive resin composition and photosensitive resin laminate using it
JP2006316234A (en)*2005-04-132006-11-24Shin Etsu Chem Co LtdFlame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate
WO2007015423A1 (en)*2005-08-032007-02-08Toagosei Co., Ltd.Photosensitive resin composition, composition for solder resist, and photosensitive dry film

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2000128957A (en)*1998-10-282000-05-09Nicca Chemical Co LtdSolder photoresist ink composition
JP2002105340A (en)*2000-09-292002-04-10Toyobo Co LtdActive energy ray-curable liquid resin composition
JP2002265567A (en)*2001-03-062002-09-18Showa Highpolymer Co LtdPhotosensitive flame-retardant resin and its composition
JP2003177515A (en)*2001-12-122003-06-27Kanegafuchi Chem Ind Co LtdFlame-retardant photosensitive cover lay film
JP2003301013A (en)*2002-04-102003-10-21Nippon Kayaku Co LtdRadiation-curable flame-retardant resin composition and its use
JP2004012810A (en)*2002-06-062004-01-15Showa Denko KkCurable flame-retardant composition, its cured body and its producing method
JP2004062057A (en)*2002-07-312004-02-26Showa Denko KkPhotosensitive thermosetting resin composition and its hardened product
JP2005173577A (en)*2003-11-172005-06-30Showa Denko KkFlame retardant photosensitive composition and its cured object
JP2006011395A (en)*2004-05-262006-01-12Showa Denko KkPhotosensitive resin composition, and cured product and use thereof
JP2006084857A (en)*2004-09-162006-03-30Hitachi Chem Co LtdPhotosensitive resin composition, solder resist forming method and printed wiring board
JP2006220804A (en)*2005-02-092006-08-24Nichigo Morton Co LtdPhotosensitive resin composition and photosensitive resin laminate using it
JP2006316234A (en)*2005-04-132006-11-24Shin Etsu Chem Co LtdFlame retardant adhesive composition, adhesive sheet using the same, cover lay film and flexible copper clad laminate
WO2007015423A1 (en)*2005-08-032007-02-08Toagosei Co., Ltd.Photosensitive resin composition, composition for solder resist, and photosensitive dry film

Cited By (40)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8926586B2 (en)2007-02-272015-01-06Regents Of The University Of MinnesotaThermochemical ablation of bodily tissue
US9848934B2 (en)2007-02-272017-12-26Regents Of The University Of MinnesotaThermochemical ablation of bodily tissue
US8979831B2 (en)2008-07-312015-03-17Regents Of The University Of MinnesotaThermochemical ablation system using heat from delivery of electrophiles
JP2010078949A (en)*2008-09-262010-04-08Goo Chemical Co LtdAlkali developable curable composition and cured product of the same
JP2010169810A (en)*2009-01-212010-08-05Hitachi Chem Co LtdPhotosensitive resin composition and photosensitive element using the same
JP2010204590A (en)*2009-03-062010-09-16Nippon Steel Chem Co LtdPhotosensitive resin composition and circuit wiring board using the same
JP2010250020A (en)*2009-04-142010-11-04Nitto Denko CorpPhotosensitive adhesive composition and electronic component-sealing material obtained using the same
WO2011062053A1 (en)*2009-11-172011-05-26株式会社タムラ製作所Flame-retardant solder resist composition and flexible wiring board which is obtained using same
JP5613172B2 (en)*2009-11-172014-10-22株式会社タムラ製作所 Flame retardant solder resist composition and flexible wiring board obtained using the same
US9907601B2 (en)2009-11-242018-03-06Regents Of The University Of MinnesotaMethods and systems for chemical ablation
US8734406B2 (en)2009-11-242014-05-27Regents Of The University Of MinnesotaMethods and systems for chemical ablation
JP2011175254A (en)*2010-02-012011-09-08Fujifilm CorpPhotosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
WO2011093448A1 (en)*2010-02-012011-08-04富士フイルム株式会社Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
CN102741751A (en)*2010-02-012012-10-17富士胶片株式会社Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
CN102741751B (en)*2010-02-012014-07-16富士胶片株式会社Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board
JP2011213828A (en)*2010-03-312011-10-27Taiyo Holdings Co LtdCurable resin composition and dry film and printed wiring board using the same
WO2011125604A1 (en)*2010-03-312011-10-13太陽ホールディングス株式会社Curable resin composition, dry film using same, and printed wiring board
CN102822284A (en)*2010-03-312012-12-12太阳控股株式会社Curable resin composition, dry film using same, and printed wiring board
JP2011257687A (en)*2010-06-112011-12-22Toagosei Co LtdPhotosensitive resin composition, solder resist and photosensitive dry film
JP2012008221A (en)*2010-06-222012-01-12Hitachi Chem Co LtdLight waveguide clad resin composition, light waveguide clad resin film and light waveguide using the same
CN102520585A (en)*2010-08-202012-06-27株式会社田村制作所Alkali soluble transparent resin composition
JP2012088360A (en)*2010-10-152012-05-10Hitachi Chem Co LtdPhotosensitive resin composition and photosensitive element using the same
JP6006716B2 (en)*2011-03-032016-10-12株式会社カネカ Novel insulating film and printed wiring board with insulating film
KR20140009329A (en)*2011-03-032014-01-22가부시키가이샤 가네카Novel insulating film and printed wiring board provided with insulating film
KR101899338B1 (en)*2011-03-032018-09-17가부시키가이샤 가네카Novel insulating film and printed wiring board provided with insulating film
JPWO2012117915A1 (en)*2011-03-032014-07-07株式会社カネカ Novel insulating film and printed wiring board with insulating film
US8883894B2 (en)2011-03-032014-11-11Kaneka CorporationInsulating film and printed wiring board provided with insulating film
WO2012117915A1 (en)*2011-03-032012-09-07株式会社カネカNovel insulating film and printed wiring board provided with insulating film
CN103403619A (en)*2011-03-252013-11-20富士胶片株式会社Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern formation method, and printed substrate
JP2013020047A (en)*2011-07-112013-01-31Fujifilm CorpPhotosensitive composition
WO2013008631A1 (en)*2011-07-112013-01-17富士フイルム株式会社Photosensitive composition
JP2013029556A (en)*2011-07-262013-02-07Fujifilm CorpPhotosensitive composition
JP2013057956A (en)*2012-10-262013-03-28Taiyo Holdings Co LtdCurable resin composition, and dry film and printed wiring board using the same
JP2013033282A (en)*2012-10-262013-02-14Taiyo Holdings Co LtdCurable resin composition, and dry film and printed wiring board using the same
JP2014178708A (en)*2014-06-032014-09-25Taiyo Holdings Co LtdPhotocurable resin composition, dry film and cured product of the same, and printed wiring board using the dry film or the cured product
JP2021154641A (en)*2020-03-272021-10-07味の素株式会社Resin sheet
JP7459611B2 (en)2020-03-272024-04-02味の素株式会社 Resin Sheet
WO2021256333A1 (en)*2020-06-192021-12-23Canon Kabushiki KaishaPhoto-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same
US11835858B2 (en)2020-06-192023-12-05Canon Kabushiki KaishaPhoto-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same
US12189289B2 (en)2020-06-192025-01-07Canon Kabushiki KaishaPhoto-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Also Published As

Publication numberPublication date
JPWO2008108357A1 (en)2010-06-17
TW200844655A (en)2008-11-16
JP5051217B2 (en)2012-10-17
TWI443454B (en)2014-07-01

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