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WO2007002455A3 - Helicon plasma source with permanent magnets - Google Patents

Helicon plasma source with permanent magnetsDownload PDF

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Publication number
WO2007002455A3
WO2007002455A3PCT/US2006/024565US2006024565WWO2007002455A3WO 2007002455 A3WO2007002455 A3WO 2007002455A3US 2006024565 WUS2006024565 WUS 2006024565WWO 2007002455 A3WO2007002455 A3WO 2007002455A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasma source
discharge tube
permanent magnets
helicon plasma
permanent magnet
Prior art date
Application number
PCT/US2006/024565
Other languages
French (fr)
Other versions
WO2007002455A2 (en
Inventor
Francis F Chen
Original Assignee
Univ California
Francis F Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California, Francis F ChenfiledCriticalUniv California
Publication of WO2007002455A2publicationCriticalpatent/WO2007002455A2/en
Priority to US12/003,330priorityCriticalpatent/US8179050B2/en
Publication of WO2007002455A3publicationCriticalpatent/WO2007002455A3/en

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Abstract

A helicon plasma source has a discharge tube, a radio frequency antenna disposed proximate the discharge tube, and a permanent magnet positioned with respect to the discharge tube so that the discharge tube is in a far-field region of a magnetic field produced by the permanent magnet.
PCT/US2006/0245652005-06-232006-06-23Helicon plasma source with permanent magnetsWO2007002455A2 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US12/003,330US8179050B2 (en)2005-06-232007-12-21Helicon plasma source with permanent magnets

Applications Claiming Priority (4)

Application NumberPriority DateFiling DateTitle
US69305405P2005-06-232005-06-23
US60/693,0542005-06-23
US80150106P2006-05-182006-05-18
US60/801,5012006-05-18

Related Child Applications (1)

Application NumberTitlePriority DateFiling Date
US12/003,330Continuation-In-PartUS8179050B2 (en)2005-06-232007-12-21Helicon plasma source with permanent magnets

Publications (2)

Publication NumberPublication Date
WO2007002455A2 WO2007002455A2 (en)2007-01-04
WO2007002455A3true WO2007002455A3 (en)2008-08-07

Family

ID=37595889

Family Applications (1)

Application NumberTitlePriority DateFiling Date
PCT/US2006/024565WO2007002455A2 (en)2005-06-232006-06-23Helicon plasma source with permanent magnets

Country Status (1)

CountryLink
WO (1)WO2007002455A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN103843465A (en)*2011-10-132014-06-04韩国科学技术院 Plasma device and substrate processing device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
KR20160072846A (en)2008-05-022016-06-23샤인 메디컬 테크놀로지스, 인크.Device and method for producing medical isotopes
US10978214B2 (en)2010-01-282021-04-13SHINE Medical Technologies, LLCSegmented reaction chamber for radioisotope production
US10734126B2 (en)2011-04-282020-08-04SHINE Medical Technologies, LLCMethods of separating medical isotopes from uranium solutions
KR101241049B1 (en)2011-08-012013-03-15주식회사 플라즈마트Plasma generation apparatus and plasma generation method
CN104321623B (en)2012-04-052018-11-30阳光医疗技术公司 Aqueous component and control method
KR20140087215A (en)*2012-12-282014-07-09주식회사 윈텔Plasma generation apparatus and substrate processing apparatus
US9299536B2 (en)2013-10-172016-03-29Varian Semiconductor Equipment Associates, Inc.Wide metal-free plasma flood gun

Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6087778A (en)*1996-06-282000-07-11Lam Research CorporationScalable helicon wave plasma processing device with a non-cylindrical source chamber having a serpentine antenna
US6264812B1 (en)*1995-11-152001-07-24Applied Materials, Inc.Method and apparatus for generating a plasma
US20030029837A1 (en)*2001-08-102003-02-13Applied Materials, Inc.Dielectric etch plasma chamber utilizing a magnetic filter to optimize plasma characteristics
US6635578B1 (en)*1998-02-092003-10-21Applied Materials, IncMethod of operating a dual chamber reactor with neutral density decoupled from ion density
US20030218430A1 (en)*2002-05-222003-11-27Ka-Ngo LeungIon source with external RF antenna
US6771026B2 (en)*2002-06-122004-08-03Tokyo Electron LimitedPlasma generation by mode-conversion of RF-electromagnetic wave to electron cyclotron wave

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6264812B1 (en)*1995-11-152001-07-24Applied Materials, Inc.Method and apparatus for generating a plasma
US6087778A (en)*1996-06-282000-07-11Lam Research CorporationScalable helicon wave plasma processing device with a non-cylindrical source chamber having a serpentine antenna
US6635578B1 (en)*1998-02-092003-10-21Applied Materials, IncMethod of operating a dual chamber reactor with neutral density decoupled from ion density
US20030029837A1 (en)*2001-08-102003-02-13Applied Materials, Inc.Dielectric etch plasma chamber utilizing a magnetic filter to optimize plasma characteristics
US20030218430A1 (en)*2002-05-222003-11-27Ka-Ngo LeungIon source with external RF antenna
US6771026B2 (en)*2002-06-122004-08-03Tokyo Electron LimitedPlasma generation by mode-conversion of RF-electromagnetic wave to electron cyclotron wave

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN103843465A (en)*2011-10-132014-06-04韩国科学技术院 Plasma device and substrate processing device

Also Published As

Publication numberPublication date
WO2007002455A2 (en)2007-01-04

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