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UST955008I4 - Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate - Google Patents

Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrateDownload PDF

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Publication number
UST955008I4
UST955008I4US05/693,385US69338576AUST955008I4US T955008 I4UST955008 I4US T955008I4US 69338576 AUS69338576 AUS 69338576AUS T955008 I4UST955008 I4US T955008I4
Authority
US
United States
Prior art keywords
semiconductor element
base substrate
structure including
flip chip
silicon semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US05/693,385
Inventor
Lawrence V. Gregor
Robert G. Shepheard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines CorpfiledCriticalInternational Business Machines Corp
Priority to US05/693,385priorityCriticalpatent/UST955008I4/en
Application grantedgrantedCritical
Publication of UST955008I4publicationCriticalpatent/UST955008I4/en
Pendinglegal-statusCriticalCurrent

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Abstract

A semiconductor device and carrier assembly package having a silicon integrated circuit semiconductor device provided with at least three raised electrical contacts on a first surface, a device support substrate of Si3 N4 provided with a conductive metallurgy pattern on at least one surface, the conductive pattern including an electrical contact configuration matching the raised electrical contacts on the device, metallurgical bonds between the raised electrical contacts on the device and the electrical contact pattern on the support substrate, and an electrically conductive means for electrically connecting elements of the conductive metallurgy pattern to coacting elements off the support substrate.
US05/693,3851974-08-191976-06-07Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substratePendingUST955008I4 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US05/693,385UST955008I4 (en)1974-08-191976-06-07Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US49848774A1974-08-191974-08-19
US05/693,385UST955008I4 (en)1974-08-191976-06-07Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US49848774AContinuation1974-08-191974-08-19

Publications (1)

Publication NumberPublication Date
UST955008I4true UST955008I4 (en)1977-02-01

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ID=27052844

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US05/693,385PendingUST955008I4 (en)1974-08-191976-06-07Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate

Country Status (1)

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US (1)UST955008I4 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4225900A (en)1978-10-251980-09-30Raytheon CompanyIntegrated circuit device package interconnect means
US4367513A (en)1979-12-261983-01-04Lockheed CorporationQuick attach/detach instrument panel and method
US4493146A (en)1979-12-261985-01-15Lockheed CorporationQuick attach detach instrument panel method
US4661192A (en)1985-08-221987-04-28Motorola, Inc.Low cost integrated circuit bonding process
US4774630A (en)*1985-09-301988-09-27Microelectronics Center Of North CarolinaApparatus for mounting a semiconductor chip and making electrical connections thereto
US5368217A (en)*1993-08-251994-11-29Microelectronics And Computer Technology CorporationHigh force compression flip chip bonding method and system
US5379191A (en)*1991-02-261995-01-03Microelectronics And Computer Technology CorporationCompact adapter package providing peripheral to area translation for an integrated circuit chip
US5679977A (en)*1990-09-241997-10-21Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US5682061A (en)*1990-09-241997-10-28Tessera, Inc.Component for connecting a semiconductor chip to a substrate
US6133627A (en)*1990-09-242000-10-17Tessera, Inc.Semiconductor chip package with center contacts
US20010030370A1 (en)*1990-09-242001-10-18Khandros Igor Y.Microelectronic assembly having encapsulated wire bonding leads
US20020155728A1 (en)*1990-09-242002-10-24Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US20050045697A1 (en)*2003-08-262005-03-03Lacap Efren M.Wafer-level chip scale package

Cited By (27)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4225900A (en)1978-10-251980-09-30Raytheon CompanyIntegrated circuit device package interconnect means
US4367513A (en)1979-12-261983-01-04Lockheed CorporationQuick attach/detach instrument panel and method
US4493146A (en)1979-12-261985-01-15Lockheed CorporationQuick attach detach instrument panel method
US4661192A (en)1985-08-221987-04-28Motorola, Inc.Low cost integrated circuit bonding process
US4774630A (en)*1985-09-301988-09-27Microelectronics Center Of North CarolinaApparatus for mounting a semiconductor chip and making electrical connections thereto
EP0218438A3 (en)*1985-09-301989-03-01McncApparatus for mounting a semiconductor chip and making electrical connections thereto
US6465893B1 (en)1990-09-242002-10-15Tessera, Inc.Stacked chip assembly
US6433419B2 (en)1990-09-242002-08-13Tessera, Inc.Face-up semiconductor chip assemblies
US7291910B2 (en)1990-09-242007-11-06Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US5679977A (en)*1990-09-241997-10-21Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US5682061A (en)*1990-09-241997-10-28Tessera, Inc.Component for connecting a semiconductor chip to a substrate
US5685885A (en)*1990-09-241997-11-11Tessera, Inc.Wafer-scale techniques for fabrication of semiconductor chip assemblies
US5848467A (en)*1990-09-241998-12-15Tessera, Inc.Methods of making semiconductor chip assemblies
US5950304A (en)*1990-09-241999-09-14Tessera, Inc.Methods of making semiconductor chip assemblies
US6133627A (en)*1990-09-242000-10-17Tessera, Inc.Semiconductor chip package with center contacts
US20010030370A1 (en)*1990-09-242001-10-18Khandros Igor Y.Microelectronic assembly having encapsulated wire bonding leads
US6372527B1 (en)1990-09-242002-04-16Tessera, Inc.Methods of making semiconductor chip assemblies
US7198969B1 (en)1990-09-242007-04-03Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US20050218495A1 (en)*1990-09-242005-10-06Tessera, Inc.Microelectronic assembly having encapsulated wire bonding leads
US20020155728A1 (en)*1990-09-242002-10-24Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US20050087855A1 (en)*1990-09-242005-04-28Tessera, Inc.Microelectronic component and assembly having leads with offset portions
US5379191A (en)*1991-02-261995-01-03Microelectronics And Computer Technology CorporationCompact adapter package providing peripheral to area translation for an integrated circuit chip
US5368217A (en)*1993-08-251994-11-29Microelectronics And Computer Technology CorporationHigh force compression flip chip bonding method and system
US5462217A (en)*1993-08-251995-10-31Microelectronics And Computer Technology CorporationHigh force compression flip chip bonding system
US20050045697A1 (en)*2003-08-262005-03-03Lacap Efren M.Wafer-level chip scale package
US8106516B1 (en)2003-08-262012-01-31Volterra Semiconductor CorporationWafer-level chip scale package
US8710664B2 (en)2003-08-262014-04-29Volterra Semiconductor CorporationWafer-level chip scale package

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