The present application is a reissue application of U.S. Pat. No. 10,367,308, issued Jul. 30, 2019, filed as U.S. application Ser. No. 15/795,234 on Oct. 26, 2017. The Ser. No. 15/795,234 application claims the benefit of U.S. Provisional Application No. 62/412,841 filed Oct. 26, 2016.
BACKGROUND OF THE INVENTION1. Field of the InventionThe invention relates to an electrical receptacle, and particularly to the electrical receptacle adapted for transmitting high speed signal.
2. Description of Related ArtCurrently high speed electrical connector has a plurality of electrical lanes. Each of the electrical lanes may run at the rate of 25 Gbit/s or 50 Gbit/s. U.S. Pat. No. 8,764,464, issued to Buck et al., on Jul. 1, 2014, discloses example electrical connectors including a plurality of electrical contacts configured to communicate between electrical devices. The plurality of electrical contacts includes a plurality of ground contacts. A ground coupling assembly is configured to electrically connect ground contacts of an electrical connector to adjust a performance characteristic of the electrical connector as desired.
U.S. Pat. No. 7,798,820, issued on Sep. 21, 2010, discloses an optical transceiver module including an edge connector and a female host connector. The female host connector includes a row of first terminals having first contact sections, a row of second terminals having second contact sections, a row of third terminals having third contact sections and a row of the fourth terminal having fourth contact sections. The first contact section forwardly extends beyond the second contact section. The fourth terminal is in front of the third terminal. The edge connector includes a mating circuit board, the mating circuit board defines a number of contact pads on top of board and bottom of board. The contact pads includes a row of first pads and a row of second pads on the top of board, a row of third of pads and a row of fourth pads on the bottom of board. The first contact section connects with the first pad, the second contact section connects with the second pad, the third contact section connects with the third pad, and the fourth contact section connects with the fourth pad.
U.S. Pat. No. 8,727,793, issued on May 20, 2014, discloses a small SFP board with an end portion configured to be insert into a connector device. The SFP board has a first set of signal pads and a fourth set of signal pads on top surface, a second set of signal pads and a third set of signal pads on bottom surface. The fourth set of signal pads are offset in a longitudinal direction from the first set signal pads on the top surface. The third set of signal pads are offset in a longitudinal direction from the second set signal pads on the bottom surface.
An improved better high-frequency performance of the electrical receptacle is desired.
SUMMARY OF THE INVENTIONAn object of the present invention, is to provide an electrical receptacle having means to transmit high speed signal.
To achieve the above-mentioned object, an electrical receptacle mounted onto a host board and electrically connecting with a mating electrical circuit board, comprising an insulative housing; and a row of first terminals, a row of second terminals, a row of third terminals, and a row of fourth terminals arranged along a vertical direction and mounted in the insulative housing, the first terminals and the fourth terminals forming a first mating port, the second terminals and the third terminals forming a second mating port, the first mating port forwardly extending beyond the second mating port; wherein the row of first terminals align with the row of second terminals along a up-to-down direction, the row of third terminals align with the row of fourth terminals along an up-to-down direction, the first terminals and the second terminals are offset in a longitudinal direction from the third terminals and the fourth terminals.
Another object of the present invention, is to provide an electrical receptacle having means to transmit high speed signal.
To achieve the above-mentioned object, an electrical receptacle for mating with a plug connector, comprising an insulative housing defining a front card receiving space and a rear module receiving space; a terminal module received within the module receiving space and comprising an upper half module and a lower half module stacked with each other in a vertical direction; said upper half module including an upper front part and an upper rear part cooperating with each other to sandwich an upper shielding plate therebetween in the vertical direction, the upper front part including a plurality of upper front terminals integrally formed with an upper front insulator via insert-molding, the upper rear part including a plurality of upper rear terminals integrally formed with an upper rear insulator via insert-molding, said upper shielding plate forming a plurality of upper springs extending upwardly through corresponding holes in the upper front insulator to mechanically and electrically connect corresponding upper front terminals for grounding, and a plurality of lower springs extending downwardly through corresponding holes to mechanically and electrically connect corresponding upper rear terminals for grounding; wherein front contacting sections of the upper front terminals and those of the upper rear terminals are located on a same upper side of the card receiving space.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGSFIG.1 is a perspective view of an electrical connector assembly according to the present invention;
FIG.2 is a part of exploded view of the electrical connector assembly as shown inFIG.1;
FIG.3 is another part of exploded view of the electrical connector assembly as shown inFIG.1;
FIG.4 is an exploded view of the electrical connector assembly as shown inFIG.1;
FIG.5 is a perspective view of a first embodiment of the electrical receptacle according to the present invention;
FIG.6 is a part of exploded view of the electrical receptacle as shown inFIG.5;
FIG.7 is another part of exploded view of the electrical receptacle as shown inFIG.5;
FIG.8 is a left view of the terminal modules;
FIG.9 is a perspective view of second contact section of second terminal receiving in second guide groove and third contact section of third terminal receiving in third guide groove;
FIG.10 is another perspective view of the second contact section of the second terminal receiving in the second guide groove and the third contact section of the third terminal receiving in the third guide groove as shown inFIG.9;
FIG.11 is an exploded view of the four terminal modules;
FIG.12 is another exploded view of the four terminal modules as shown inFIG.11;
FIG.13 is an upward view of the terminal modules mounted in the insulative housing;
FIG.14 is a cross-section view of the electrical receptacle tacked along line14-14 ofFIG.5;
FIG.15 is a cross-section view of the electrical receptacle tacked along line15-15 ofFIG.5;
FIG.16 is a top view of the terminals;
FIG.17(A) is a downward perspective view of the electrical receptacle according to a second embodiment of the invention;
FIG.17(B) is an upward perspective view of the electrical receptacle ofFIG.17;
FIG.18(A) is a downward exploded perspective view of the electrical receptacle ofFIG.17(A);
FIG.18(B) is an upward exploded perspective view of the electrical receptacle ofFIG.18(A);
FIG.19(A) is a downward exploded perspective view of the terminal module of the electrical receptacle ofFIG.18(A);
FIG.19(B) is an upward exploded perspective view of the terminal module of the electric receptacle ofFIG.19(A);
FIG.20 is a side view of the terminal module ofFIG.19A);
FIG.21(A) is a downward further exploded perspective view of the terminal module of the electrical receptacle ofFIG.19(A);
FIG.21(B) is an upward further exploded perspective view of the terminal module of the electrical receptacle ofFIG.19(B);
FIG.22(A) is a downward further exploded perspective view of the terminal module of the electrical receptacle ofFIG.21(A);
FIG.22(B) is an upward further exploded perspective view of the terminal module of the electrical receptacle ofFIG.22(A);
FIG.23 is a bottom view of the electrical receptacle ofFIG.17(A);
FIG.24(A) is a cross-sectional view of the unassembled electrical receptacle ofFIG.17(A), taken in a vertical plane extending in a front-to-back direction where the terminals of the upper part of the terminal module are located;
FIG.24(B) is a cross-sectional view of the unassembled electrical receptacle ofFIG.17(A), taken in another vertical plane extending in a front-to-back direction where the terminals of the lower part of the terminal module are located;
FIG.25(A) is a cross-sectional view of the assembled electrical receptacle ofFIG.17(A), taken in a vertical plane extending in a front-to-back direction where the terminals of the upper part of the terminal module are located;
FIG.25(B) is a cross-sectional view of the assembled electrical receptacle ofFIG.17(A), taken in another vertical plane extending in a front-to-back direction where the terminals of the lower part of the terminal module are located;
FIG.26(A) is a perspective view of an electrical connector assembly named QSFP-DD according to the invention, including the electrical receptacle ofFIG.5, and the corresponding plug connector similar to what is disclosed in the previously filed provisional applications mentioned in this disclosure;
FIG.26(B) is another perspective view of the electrical connector assembly ofFIG.26(A);
FIG.27 is a perspective view the plug connector ofFIG.26(A);
FIG.28 is an exploded perspective view of the plug connector ofFIG.27;
FIG.29(A) is a further exploded perspective view of the plug connector ofFIG.28;
FIG.29(B) is another further exploded perspective view of the plug connector ofFIG.28;
FIG.30(A) is a top view of the internal printed circuit board of the plug connector ofFIG.27;
FIG.30(B) is a bottom view of the internal printed circuit board of the plug connector ofFIG.27; and
FIG.31 is a cross-sectional view of the assembled plug connector and receptacle ofFIG.26(A).
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTReference will now be made in detail to the preferred embodiment of the present invention. Referring toFIGS.1-6, anelectrical connector assembly100 includes a shielding shell orcage10, a number of first embodiment ofelectrical receptacles200 mounted onto ahost board300 and electrically connecting with mating electrical circuit boards. Theelectrical receptacle200 includes aninsulative housing20, and a number of terminal modules mounted in theinsulative housing20. The terminal modules include afirst terminal module30, asecond terminal module40, a thirdterminal module50, and afourth terminal module60 arranging along an up-to-down direction. A shieldingplate12 is set between twoadjacent insulative housings20. The shieldingshell10 definesholes11 on top face. Theelectrical connector assembly100 further includesheat sinks70 mounted in theholes11, aretainer80 fastening the whole heat sinks70 on the shieldingshell10, and a number oflight pipe90 mounted on the heat sinks70.
Referring toFIGS.5-8, thefirst terminal module30 includes a top row offirst terminals31, a firstinsulative body32 over-molded on thefirst terminal31, and afirst position part33 over-molded on thefirst terminal31. Thesecond terminal module40 includes a row ofsecond terminal41 under thefirst terminal31, a secondinsulative body42 over-molded on thesecond terminal41, and asecond position part43 over-molded on thesecond terminal42. Thethird terminal module50 includes a row ofthird terminals51 under thesecond terminal41, a thirdinsulative body52 over-molded on thethird terminal51, and athird position part53 over-molded on thethird terminal51. Thefourth terminal module60 includes a row offourth terminals61 under thethird terminal51, a fourthinsulative body62 over-molded on thefourth terminals61. The first andsecond terminals31,41 electrically connect to a top surface of the mating electrical circuit board, the third andfourth terminals51,61 electrically connect to a bottom surface of the mating electrical circuit board.
Referring toFIG.12,FIGS.14-15, thefirst terminal31 includes afirst contact section310 forwardly extending from the firstinsulative body32, a firsthorizontal section311 connecting with thecontact section310, a firstvertical section312 perpendicular to the firsthorizontal section311, and afirst soldering portion313 perpendicular to the firstvertical section312. The firsthorizontal section 311 and the firstvertical section 312 are commonly formed as a first body portion integrally connected between thefirst contact section 310 and thefirst soldering portion 313. The firstinsulative body32 is over-molded on the firsthorizontal section311, thefirst position part33 over-molded on the firstvertical section312. Thesecond terminal41 includes asecond contact section410 forwardly extending from the secondinsulative body42, a secondhorizontal section411 connecting with thesecond contact section410, a secondvertical section412 perpendicular to the secondhorizontal section411, and asecond soldering portion413 perpendicular to the secondvertical section412. The secondhorizontal section 411 and the secondvertical section 412 are commonly formed as a second body portion integrally connected between thesecond contact section 410 and thesecond soldering portion 413. The secondinsulative body42 is over-molded on the secondhorizontal section411, thesecond position part43 over-molded on the secondvertical section412. Thethird terminal51 includes athird contact section510 forwardly extending from the thirdinsulative body52, a thirdhorizontal section511 connecting with thethird contact section510, a thirdvertical section512 perpendicular to the thirdhorizontal section511, and athird soldering portion513 perpendicular to the thirdvertical section512. The thirdhorizontal section 511 and the thirdvertical section 512 are commonly formed as a third body portion integrally connected between thethird contact section 510 and thethird soldering portion 513. The thirdinsulative body52 is over-molded on the thirdhorizontal section511, thethird position part53 over-molded on the thirdvertical section512. Thefourth terminal61 includes afourth contact section610 forwardly extending from the fourthinsulative body62, a fourthhorizontal section611 connecting with thefourth contact section610, a fourthvertical section612 perpendicular to the fourthhorizontal section611, and afourth soldering portion613 perpendicular to the fourthvertical section612. The fourthhorizontal section 611 and the fourthvertical section 612 are commonly formed as a fourth body portion integrated connected between thefourth contact section 610 and thefourth soldering portion 613. The fourthinsulative body62 is over-molded on the fourthhorizontal section611.
Referring toFIGS.5-7,FIGS.9-12, theinsulative housing20 includes amating face21, atop surface22 and abottom surface23. Thetop surface22 defines a row offirst guide grooves34 for received receiving thefirst contact section310. Thebottom surface23 defines a row offourth guide grooves64 for received receiving thefourth contact section610. The firstinsulative body32 defines a row ofsecond guide grooves44 for received receiving thesecond contact section410 in bottom face. The fourthinsulative body62 defines a row ofthird guide groove54 for received receiving thethird contact section510. Thefirst contact section310 and thefourth contact section610 forwardly extend beyond thesecond contact section410 and thethird contact section510. Thefirst contact sections310 of thefirst terminals31 and thefourth contact sections610 of thefourth terminals61 form afirst mating port24. Thesecond contact sections410 of thesecond terminals41 and thethird contact sections510 of thethird terminals51 form asecond mating port25. Thefirst mating port24 forwardly extends beyond thesecond mating port25. Theinsulative housing20 defines a number of fixedslots29 at rear face of thebottom surface23, the fourthvertical section612 received in the fixedslot29. The first, second, thirdvertical section312,412,512 are respectively insert-molded in the first, second,third position part33,43,53 in a whole row. These designs are in order to that the first, second, third,fourth soldering portion313,413,513,613 are respectively surface welded on thehost circuit board300 easily. Theinsulative housing20 also includes twoside walls26 connecting thetop surface22 and thebottom surface23. Both of theside walls26 respectively define aposition slot27 on opposite faces. All of the first, the second, and thethird position parts33,43,53 define abump28 at both ends. Thebump28 is received in theposition slot27 to position the first, the second, and thethird soldering portion313,413,513. As clearly shown in FIGS. 14 and 15, thehousing 20 forms acard receiving space 201 between adownward face 221 and anupward face 231 which are opposite to each other in the vertical direction. The firstinsulative body 32 forms a downward/bottom face 321 horizontally coplanar with thedownward face 221, and the fourthinsulative body 62 forms an upward/top face 621 horizontally coplanar with theupward face 231. Furthermore, the firstinsulative body 32 forms a forward chamferedstructure 32a directly and intimately downwardly facing thecard receiving space 201; thehousing 20 forms a rearwardchamfered structure 22a, opposite to the forward chamferedstructure 32a in the front-to-back direction, directly and intimately downwardly facing thecard receiving space 201 too. Similarly, the fourthinsulative body 62 forms a forward chamferedstructure 62a directly and intimately upwardly facing thecard receiving space 201; thehousing 20 forms a rearwardchamfered structure 23a, opposite to the forward chamferedstructure 62a in the front-to-back direction, directly and intimately upwardly facing thecard receiving space 201 too.
The firstinsulative body32 defines a number offirst slits320 on top face for exposing the firsthorizontal sections311 in air. Thefirst position part33 defines a number offirst openings330 on rear face for exposing the firstvertical sections312 in air. The secondinsulative body42 defines a number ofsecond slits420 on top face for exposing the secondhorizontal sections411 in air. Thesecond position parts43 defines a number ofsecond openings430 on rear face for exposing the secondvertical sections412 in air. The thirdinsulative body52 defines a number ofthird slits520 on bottom face for exposing the thirdhorizontal sections511 in air. Thethird position parts53 defines a number ofthird openings530 on rear face for exposing the thirdvertical sections512 in air. The fourthinsulative body62 defines a number offourth slits620 on bottom face for exposing the fourthhorizontal sections611 in air.
Referring toFIGS.13-16, when the first, second, third, fourthterminal modules30,40,50,60 are mounted on theinsulative housing20, thefirst soldering portions313 are at finial side near to the rear face of theinsulative housing20. At the same time, thesecond soldering portion413 is in front of thefirst soldering portion313, thethird soldering portion513 is in front of thesecond soldering portion413, and thefourth soldering portion613 is in front of thethird soldering portion513. The row offirst soldering portions313 align with the row ofsecond soldering portions413 along a front-to-back direction. The row ofthird soldering portions513 align with the row offourth soldering portions613 along a front-to-back direction. Thesecond soldering portion413 aligns to a space of two adjacentthird soldering portions513. The row offirst terminals31 align with the row ofsecond terminals41 along an up-to-down direction, the row ofthird terminals51 align with the row offourth terminals61 along an up-to-down direction. Thefirst terminals31 and thesecond terminals41 are offset in a longitudinal direction perpendicular to the up-to-down direction and the front-to-back direction from thethird terminals51 and thefourth terminals61. A center line of thefirst terminal31 along a front-to-back direction and a center line of thesecond terminal41 along a front-to-back direction are in a same first vertical plane C-C, and a center line of thethird terminal51 along a front-to-back direction and a center line of thefourth terminal61 along a front-to-back direction are in a same second vertical plane D-D. A distance of adjacent the first vertical plane C-C and the second vertical plane D-D is 0.4 mm. This design of the QSFP-DD makes high-frequency performance of the wholeelectrical receptacle200 to be better.
Referring toFIGS.17(A)-25(B), a second embodiment of theelectrical receptacle700, which is essentially similar to theelectrical receptacle200 in the first embodiment except that a metallic shielding plate is disposed between the first terminal module and the second terminal module with the corresponding first sprint tangs and second spring tangs extending therefrom to contact the corresponding first terminals and second terminals, respectively, for grounding, and similarly another metallic shielding plate is disposed between the third terminal module and the fourth terminal module in the same way. The details are illustrated below.
Theelectrical receptacle700 includes aninsulative housing702 forming a frontcard receiving space704 and a rearmodule receiving space706. Theinsulative housing702 defines acard receiving space704, with a plurality ofupper passageways708 above thecard receiving space704, and a plurality oflower passageways710 below thecard receiving space704. Aterminal module712 is disposed in themodule receiving space706 and includes anupper half module714 and alower half module734 stacked with each other in the vertical direction. Theupper half module714 includes an upperfront part716 having a plurality of upperfront terminals718 integrally formed with an upperfront insulator720 via an insert-molding process, and an upperrear part722 having a plurality of upperrear terminals724 integrally formed with an upperrear insulator726 via another insert-molding process, and further with a metallicupper shielding plate728 sandwiched between the upperfront insulator720 and the upperrear insulator726 in the vertical direction, wherein theupper shielding plate728 includes a plurality of upper spring tangs730 extending upwardly throughcorresponding holes721 in the upperfront insulator720 to mechanically and electrically connect to the corresponding selected grounding terminals of the upperfront terminals718, and a plurality oflower spring tangs732 extending downwardly throughcorresponding holes727 of the upperrear insulator726 to mechanically and electrically connect to the corresponding selected grounding terminals of the upperrear terminals724. Notably, during mating thefront contacting section717 of the upperfront terminals718 extend into the correspondingupper passageways708 while the front contactingsection723 of the upperrear terminal724 extend into the correspondingupper grooves719 formed in the upperfront insulator720.
Similarly, thelower half module734 includes alower front piece736 having a plurality of lowerfront terminals738 integrally formed with a lowerfront insulator740 via an insert-molding process, and a lowerrear piece742 having a plurality of lowerrear terminals744 integrally formed with a lowerrear insulator746 via another insert-molding process, and further with a metalliclower shielding plate748 sandwiched between the lowerfront insulator740 and the lowerrear insulator746 in the vertical direction wherein thelower shielding plate748 includes a plurality oflower spring fingers750 extending downwardly through the correspondingholes741 in the lowerfront insulator740 to mechanically and electrically connect to the corresponding selected grounding terminals of the lowerfront terminals738, and a plurality ofupper spring fingers752 extending upwardly through the correspondingholes747 of the lowerrear insulator746 to mechanically and electrically connect to the corresponding selected grounding terminals of the lowerrear terminals744. Notably, during mating thefront contacting section737 of the lowerfront terminals738 extend into the correspondinglower passageways710 while the front contactingsection743 of the upper lowerrear terminal744 extend into the correspondinglower grooves739 formed in the lowerfront insulator740.
Notably, each of theupper shielding plate728 and thelower shielding plate748 forms theopening729,749 corresponding to the corresponding high speed terminals in the vertical direction for reduction of resonance. Understandably, the layout of the upperfront terminals718 and the upperrear terminals724, and the lowerfront terminals738 and the lowerrear terminals744 are arranged same with those in the first embodiment. The posts-holes structure may be applied to the insulators and shielding plate so as to have the shielding plate retained between the stacked insulator without relative movement both vertically and horizontally. Similar to the first embodiment, in this embodiment the terminals of the same part/piece of the module is equipped with aninsulative spacer760 to secure the tails of the terminals in position without relative movements, and two opposite ends of thespacer760 is retained in the correspondingslots703 in an interior surfaces of thehousing702. It is also noted that because the terminals are molded within the corresponding part/piece of the module, theholes721,727,741 and747 extend through at least one corresponding surface of the insulator of the corresponding part/piece in at least one vertical direction. It is also noted that means for securing theterminal module712 and thehousing702, e.g., protrusions vs. steps, may be applied thereon optimally. Similar to the first embodiment, even though a rear card received slot orspace766 is formed between the upperfront insulator720 and the lowerfront insulator740 in the vertical direction and communicatively aligned with the frontcard receiving space 704 in the front-to-back direction to commonly form a full card receiving space, in this embodiments, a pair ofslots705 are optimally formed in opposite interior surfaces of thehousing702 to additionally hold two opposite lateral side edges of the inserted mating tongue, i.e., the printed circuit board of the plug connector, during mating. Similar to what is disclosed in the first embodiment, thehousing 702 forms adownward face 702a and an upward face 702b by two sides of the frontcard receiving space 704 in the vertical direction. The upperfront insulator 720 includes a downward/bottom face 720a directly and intimately downwardly facing the rearcard receiving slot 766 and being horizontally coplanar with thedownward face 702a, and the lowerfront insulator 740 forms an upward/top face 740a directly and intimately upwardly facing the rearcard receiving slot 766 and being horizontally coplanar with theupward face 704b. Furthermore, the upperfront insulator 720 forms aforward chamfered structure 7201 directly and intimately downwardly facing the rearcard receiving space 766, and the lowerfront insulator 740 forms aforward chamfered structure 7401 directly and intimately upwardly facing the rearcard receiving space 766. In addition, as shown in FIGS. 25(A) and 25(B), when no plug connector is mated, thefront contacting section 723 downwardly abuts against the upperfront insulator 720, and the front contactingsection 743 upwardly abuts against the lowerfront insulator 740.
Referring toFIGS.26(A) to31, anelectrical connector assembly800 belonging to the QSFP-DD specification, includes aplug connector830, anelectrical receptacle850, ametallic cage810 with thecorresponding retainer880, theheat sink870 and thelight pipe890 thereon, wherein theelectrical receptacle850 is essentially same with theelectrical receptacle200 in the first embodiment. Theplug connector830 includes ametallic base831, ametallic cover832 commonly forming a cavity to receive apaddle card834 therein. Acable836 includes a plurality ofwires838 soldered upon thepaddle card834. Anactuator840 is moveable along a front-to-back direction for releasing the plug connector from thecage810 so as to un-mate theplug connector830 from theelectrical receptacle850.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the members in which the appended claims are expressed.