USRE48587E1 - Ultrasonic probe apparatus and ultrasonic imaging apparatus using the same - Google Patents

Abstract

An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No. 10-2014-0190566, filed on Dec. 26, 2014 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.

BACKGROUND

1. Field

Examplary embodiments relate to an ultrasonic probe apparatus and an ultrasonic imaging apparatus.

2. Description of the Related Art

An imaging apparatus captures an image of an object using visible light, infrared light, radiation, ultrasonic waves, microwaves, or Free Induction Decay (FID) signals derived from a magnetic resonance phenomenon, and generates an internal or external image of the object. Examples of the imaging apparatus may include a camera, an infrared camera, a radiation imaging apparatus, an ultrasonic imaging apparatus, etc.

The ultrasonic imaging apparatus obtains images by capturing an internal image of the object using ultrasonic waves, and displays the obtained images for user recognition. The ultrasonic imaging apparatus directly irradiates ultrasonic waves to a target site contained in the object, collects the ultrasonic waves reflected from the target site, and thus generates an ultrasound image using the collected ultrasonic waves. The ultrasonic imaging apparatus may collect ultrasonic waves generated from a target site contained in the object using laser beams or the like, and may thus generate an ultrasound image using the collected ultrasonic waves.

The ultrasonic imaging apparatus may irradiate ultrasonic waves to the inside of the object using an ultrasonic probe or may receive ultrasonic waves from the inside of the object using the ultrasonic probe. There are various kinds of ultrasonic probes according to categories of objects and categories of the image-captured parts of the objects or according to categories of target sites contained in the objects.

SUMMARY

Therefore, it is an aspect of the present invention to so provide an ultrasonic probe apparatus and an ultrasonic imaging apparatus, which can efficiently absorb ultrasonic waves emitted in a direction opposite to an object using ultrasonic elements.

Additional aspects of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

In accordance with one aspect of the present invention, an ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit.

The substrate connection unit may include a second electronic circuit configured to electrically interconnect the first electronic circuit and the sound absorption unit.

The second electronic circuit may include a substrate connection unit electrically connected to the first electronic circuit.

The substrate connection unit may include a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit.

The first substrate connection unit may be electrically connected to the ultrasonic transducer.

The sound absorption unit may include at least one first connection unit electrically connected to the ultrasonic transducer, wherein the first substrate connection unit contacts the first connection unit.

The second electronic circuit may include at least one output unit configured to output a signal processed by the first electronic circuit, wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit.

The substrate connection unit may include: a first opening configured to pass through a range from one surface to the other surface of the second electronic circuit; and a conductor installed at an inner lateral surface of the first opening and electrically coupled to the first electronic circuit.

The conductor may be configured to shield the first opening.

The substrate connection unit may further include a second opening formed to pass through the conductor.

The substrate connection unit may further include a filling material configured to shield the second opening.

The conductor may be deposited on an inner lateral surface of the first opening.

The conductor may be installed at one surface of the second electronic circuit located in a vicinity of the first opening.

The second electronic circuit may include a rigid flexible printed circuit board (PCB).

The second electronic circuit may include at least one of a first region that is not curved and a second region that is flexibly curved.

The second electronic circuit may include a substrate connection unit that is electrically connected to the first electronic circuit and is formed in the first region.

A second connection unit (a bump) may be mounted to the first electronic circuit, wherein the second connection unit is attached to the substrate connection unit of the second electronic circuit.

The ultrasonic probe may further include: a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit.

The second connection unit may be mounted to the first electronic circuit so as to pass through the separation unit.

The ultrasonic probe apparatus may further include: a heat conduction unit mounted to the other surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit.

The sound absorption unit may include: a sound absorption material for absorbing sound; and a first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit.

At least one first connection unit may be mounted to a single ultrasonic transducer.

The ultrasonic probe may further include: an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.

The sound absorption unit may be formed of a sound absorption material formed to absorb sound waves or ultrasonic waves.

A seating surface at which the ultrasonic transducer or an acoustic enhancer seated may be formed at one surface of the sound absorption unit, wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.

The first electronic circuit may include a processor configured to focus signals generated from the ultrasonic transducer.

The first electronic circuit may include at least one application specific integrated circuit (ASIC).

In accordance with another aspect of the present invention, an ultrasonic imaging apparatus includes: an ultrasonic probe configured to receive ultrasonic waves; and a main body configured to control operations of the ultrasonic probe, and to perform image processing of an ultrasound image corresponding to the received ultrasonic waves. The ultrasonic probe includes: an ultrasonic transducer configured to output an electrical signal upon receiving the ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit.

The substrate connection unit may include a second electronic circuit configured to electrically interconnect the first electronic circuit and the sound absorption unit.

The second electronic circuit may include a substrate connection unit electrically connected to the first electronic circuit.

The substrate connection unit may include a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit.

The first substrate connection unit may be electrically connected to the ultrasonic transducer.

The sound absorption unit may include at least one first connection unit electrically connected to the ultrasonic transducer, wherein the first substrate connection unit contacts the first connection unit.

The second electronic circuit may include at least one output unit configured to output a signal processed by the first electronic circuit, wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit.

The second electronic circuit may include a rigid flexible printed circuit board (PCB).

The second electronic circuit may include at least one of a first region that is not curved and a second region that is flexibly curved.

The second electronic circuit may include a substrate connection unit that is electrically connected to the first electronic circuit and is formed in the first region.

A second connection unit may be mounted to the first electronic circuit. The second connection unit may be attached to the substrate connection unit of the second electronic circuit.

The ultrasonic imaging apparatus may further include: a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit.

The second connection unit may be mounted to the first electronic circuit so as to pass through the separation unit.

The ultrasonic imaging apparatus may further include: a heat conduction unit mounted to the other surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit.

The sound absorption unit may include: a sound absorption material for absorbing sound; and a first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit.

At least one first connection unit may be mounted to a single ultrasonic transducer.

The ultrasonic imaging apparatus may further include: an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.

The sound absorption unit may be formed of a sound absorption material configured to absorb sound waves or ultrasonic waves.

A seating surface at which the ultrasonic transducer or an acoustic enhancer seated may be formed at one surface of the sound absorption unit, wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.

The first electronic circuit may include a processor configured to focus signals generated from the ultrasonic transducer.

The first electronic circuit may include at least one application specific integrated circuit (ASIC).

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects of the invention will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a perspective view illustrating an ultrasonic imaging apparatus according to an embodiment of the present invention.

FIG. 2A is a block diagram illustrating an ultrasonic imaging apparatus according to an embodiment of the present invention.

FIG. 2B is a conceptual diagram illustrating a beamforming process according to an embodiment of the present invention.

FIG. 3 illustrates the internal structure of an ultrasonic probe according to an embodiment of the present invention.

FIG. 4 is an exploded perspective view illustrating the internal structure of an ultrasonic probe according to a first embodiment of the present invention.

FIG. 5A is a conceptual diagram illustrating arrangement of an ultrasonic element unit according to a first embodiment of the present invention.

FIG. 5B is a conceptual diagram illustrating arrangement of an ultrasonic element unit according to a second embodiment of the present invention.

FIG. 6 is a conceptual diagram illustrating functions of a sound absorption unit.

FIG. 7 is a perspective view illustrating a sound absorption unit according to a first embodiment of the present invention.

FIG. 8 is a plan view illustrating a sound absorption unit according to a first embodiment of the present invention.

FIG. 9 is a lateral perspective view illustrating a sound absorption unit according to a first embodiment of the present invention.

FIG. 10 is a perspective view illustrating a sound absorption unit according to a second embodiment of the present invention.

FIG. 11 is a plan view illustrating a sound absorption unit according to a second embodiment of the present invention.

FIG. 12 is a lateral cross-sectional view illustrating a sound absorption unit according to a second embodiment of the present invention.

FIG. 13 is a view illustrating a sound absorption unit according to a second embodiment of the present invention.

FIG. 14 is a view illustrating a second electronic circuit according to a first embodiment of the present invention.

FIG. 15 illustrates a curved structure of a second electronic circuit.

FIG. 16 is a cross-sectional view illustrating a second electronic circuit.

FIG. 17A is a plan view illustrating a second electronic circuit including a substrate connection unit according to a first embodiment of the present invention.

FIG. 17B is an exploded side view illustrating a second electronic circuit including a substrate connection unit according to a first embodiment of the present invention.

FIG. 18A is a plan view illustrating a second electronic circuit including a substrate connection unit according to a second embodiment of the present invention.

FIG. 18B is an exploded side view illustrating a second electronic circuit including a substrate connection unit according to a second embodiment of the present invention.

FIG. 19A is a plan view illustrating a second electronic circuit including a substrate connection unit according to a third embodiment of the present invention.

FIG. 19B is an exploded side view illustrating a second electronic circuit including a substrate connection unit according to a third embodiment of the present invention.

FIG. 20A is a plan view illustrating a second electronic circuit including a substrate connection unit according to a fourth embodiment of the present invention.

FIG. 20B is a bottom view illustrating a second electronic circuit including a substrate connection unit according to a fourth embodiment of the present invention.

FIG. 20C is an exploded side view illustrating a second electronic circuit including a substrate connection unit according to a fourth embodiment of the present invention.

FIG. 21 is a view illustrating a second electronic circuit according to a second embodiment of the present invention.

FIG. 22A is a perspective view illustrating a first electronic circuit according to an embodiment of the present invention.

FIG. 22B is a view illustrating a first electronic circuit according to an embodiment of the present invention.

FIG. 22C is a view illustrating a heat conduction unit installed at a back surface of the first electronic circuit.

FIG. 23A is a conceptual diagram illustrating a process for transmitting a control signal to a first processor mounted to an ultrasonic probe.

FIG. 23B is a conceptual diagram illustrating a process for transmitting a control signal to a first processor mounted to an ultrasonic probe.

FIG. 23C is a conceptual diagram illustrating a process for transmitting a control signal to an ultrasonic element.

FIG. 24 is a conceptual diagram illustrating a process for irradiating ultrasonic waves using an ultrasonic element.

FIG. 25 is a conceptual diagram illustrating a process for receiving ultrasonic waves using an ultrasonic element.

FIG. 26 is a conceptual diagram illustrating a transmission process of an electrical signal corresponding to ultrasonic waves received by the ultrasonic element

FIG. 27 is a conceptual diagram illustrating a process for transmitting processed signals to a main body.

FIG. 28 is a conceptual diagram illustrating a process for transmitting processed signals to a main body.

FIG. 29 is a conceptual diagram illustrating a process for fabricating a sound absorption unit.

FIG. 30 is a conceptual diagram illustrating a process for fabricating a sound absorption unit.

DETAILED DESCRIPTION

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

FIG. 1 is a perspective view illustrating an ultrasonic imaging apparatus according to an embodiment of the present invention.FIG. 2A is a block diagram illustrating an ultrasonic imaging apparatus according to an embodiment of the present invention.

Referring toFIGS. 1 and 2A, theultrasonic imaging apparatus1 may include anultrasonic probe100 and amain body200.

Theultrasonic probe100 may collect ultrasonic waves, and may transmit an electrical signal corresponding to the collected ultrasonic waves to themain body200. In accordance with the embodiment, theultrasonic probe100 may perform beamforming of ultrasonic waves of the collected channels, and may also transmit the beamformed signals to themain body200.

Themain body200 may control overall operations of theultrasonic imaging apparatus1. In addition, themain body200 may generate an ultrasound image such as a B-mode image by performing either beamforming or image processing using electrical signals received from theultrasonic probe100, and may display the generated ultrasound image on thedisplay unit280 for user recognition. In addition, various electronic components for controlling overall operations of either theultrasonic probe100 or themain body200 may be contained in themain body200. Themain body200 may receive various commands from the user who uses aninput unit290, generate a control signal corresponding to the user command, and thus control theultrasonic imaging apparatus1.

Theultrasonic probe100 may transmit/receive data to/from themain body200 through acable93 or a wireless communication module.

In accordance with one embodiment, theultrasonic probe100 and themain body200 may communicate with each other using theconnection cable93 shown inFIG. 1. The electrical signal generated from theultrasonic probe100 may be transmitted to themain body200 through theconnection cable93. In addition, a control command generated from themain body200 may also be transmitted to theultrasonic probe100 through theconnection cable93.

Aconnector94 may be provided at one end of theconnection cable93. Theconnector94 may be detachably coupled to theport95 provided at theexternal frame201 of themain body200. If theconnector94 is coupled to theport95, theultrasonic probe100 and themain body200 may be interconnected to communicate with each other. In the meantime, according to one embodiment, theultrasonic probe100 may be fixed to the other end of theconnection cable93. That is, theultrasonic probe100 and the connection cable may be integrated. In accordance with another embodiment, the connector (not shown) capable of being coupled to or detached from the port contained in theultrasonic probe100 may also be provided at the other end of theconnection cable93.

In accordance with another embodiment, theultrasonic probe100 and themain body200 may transmit electrical signals generated from theultrasonic probe100 to themain body200 over a wireless communication network or may also transmit the electrical signal generated from themain body200 to theultrasonic probe100. In this case, a wireless communication module including an antenna and a wireless communication chip may be installed in each of the ultrasonic probe and themain body200. The wireless communication module may be a short-range wireless communication module based on various short-range communication technologies, for example, Bluetooth, Bluetooth low energy, infrared data association (IrDA), Wireless Fidelity (Wi-Fi), Wi-Fi Direct, Ultra Wideband (UWB), Near Field Communication (NFC), etc. Alternatively, the wireless communication module may be a mobile communication module supporting 3GPP, 3GPP2 or IEEE wireless communication networks defined by the International Telecommunication Union (ITU).

Theultrasonic probe100 will hereinafter be described in detail.

Theultrasonic probe100 may receive ultrasonic waves generated from the object, and may convert the received ultrasonic waves into an electrical signal. For convenience of description and better understanding of the present invention, the electrical signal obtained by conversion of the received ultrasonic waves will hereinafter be referred to as an ultrasonic signal.

Theultrasonic probe100 may include anultrasonic element unit110 for generating or receiving ultrasonic waves; and afirst processor130. Thefirst processor130 may be electrically connected to theultrasonic element unit110, may control operations of theultrasonic element unit110, or may perform signal processing using the electrical signal generated from the ultrasonic element unit.

Theultrasonic element unit110 may include an ultrasonic transducer for generating ultrasonic waves or generating an electrical signal corresponding to the ultrasonic waves. The ultrasonic transducer may convert AC (Alternating Current) energy having a predetermined frequency into mechanical vibration having the same frequency, may generate ultrasonic waves, or may convert mechanical vibration having a predetermined frequency based on ultrasound into AC energy. Therefore, the ultrasonic transducer may generate ultrasonic waves or may output electrical signals corresponding to the received ultrasonic waves. In more detail, upon receiving AC power from a battery or the like, a piezoelectric vibrator or a thin film of the ultrasonic transducer vibrates according to the AC power, such that a plurality of ultrasonic waves is generated.

Here, the ultrasonic transducer may be one of, for example, a magnetostrictive ultrasonic transducer using the magnetostrictive effect of a magnetic body, a piezoelectric ultrasonic transducer using the piezoelectric effect of a piezoelectric material, and a capacitive micromachined ultrasonic transducer (cMUT) transmitting/receiving ultrasonic waves using vibration of hundreds or thousands of micromachined thin films. Further, the ultrasonic transducer may be one of other kinds of transducers which may generate ultrasonic waves according to an electrical signal or generate an electrical signal according to ultrasonic waves.

Referring toFIG. 2A, theultrasonic element unit110 may include anultrasonic transmission element110a and anultrasonic reception element110b. Theultrasonic transmission element110a may generate ultrasonic waves having a frequency corresponding to a frequency of a pulse signal according to a pulse signal received from thefirst processor130 or thesecond processor220. The generated ultrasonic waves may be irradiated to atarget site98 of theobject99. The generated ultrasonic waves may be focused on at least onetarget site98 contained in theobject99. In this case, the irradiated ultrasonic waves may be focused on a single target site98 (i.e., single focusing), and may also be focused on a plurality of target sites98 (i.e., multi-focusing).

Theultrasonic reception element110b may receive ultrasonic waves reflected from thetarget site98 or may receive ultrasonic waves generated from thetarget site98 according to laser or the like, and may convert the received signals into an ultrasonic signal. Theultrasonic reception element110b may include a plurality of ultrasonic transducers, each of which outputs an ultrasonic signal, so that theultrasonic reception element110b may output ultrasonic signals of a plurality of channels.

In accordance with the embodiment, theultrasonic element unit110 may include ultrasonic transmission/reception (Tx/Rx) elements (not shown) capable of generating and receiving ultrasonic waves. In this case, theultrasonic transmission element110a and theultrasonic reception element110b may be omitted as necessary.

Theultrasonic element unit110 may be mounted to one surface of thesound absorption unit120. Afirst connection unit121 corresponding to eachultrasonic element unit110 may be mounted to thesound absorption unit120. In accordance with one embodiment, thefirst connection unit121 may be mounted to thesound absorption unit120 after passing through thesound absorption unit120. In this case, thefirst connection unit121 may be installed to pass through the range from one surface to the other surface of thesound absorption unit120. In this case, one surface may indicate a surface to which theultrasonic element unit110 is mounted, and the other surface may indicate a surface to which the substrate connection unit (e.g., a second electronic circuit) is mounted. A detailed description of thesound absorption unit120 and thefirst connection unit121 will be given below.

Thefirst processor130 may generate and output the electrical signal for controlling theultrasonic element unit110, or may perform various kinds of signal processing using an ultrasonic signal received from theultrasonic element unit110.

The electrical signal generated from thefirst processor130 may be transferred to the ultrasonic element unit110 (e.g., theultrasonic transmission element110a) through thefirst connection unit121. Theultrasonic transmission element110a may be driven in response to the received electrical signal. In addition, thefirst processor130 may receive the electrical signal corresponding to ultrasonic waves received by the ultrasonic element unit110 (e.g., theultrasonic reception element110b) through thefirst connection unit121.

Thefirst processor130 may be implemented by at least one semiconductor chip and associated electronic components. In accordance with the embodiment, thefirst processor130 may also be implemented by at least one Application Specific Integrated Circuit (ASIC).

In accordance with the embodiment shown inFIG. 2A, thefirst processor130 may include at least one of apulser131, anamplifier132, an analog-to-digital converter (ADC)133, and abeamformer134.

Thepulser131 may generate a voltage having a predetermined frequency for driving theultrasonic element unit110, and may transmit the generated voltage to theultrasonic element unit110. Theultrasonic element unit110 may be vibrated according to an amplitude and frequency of the output voltage of thepulser131, and thus generate ultrasonic waves. The frequency and intensity of ultrasonic waves generated from theultrasonic element unit110 may be determined according to the amplitude and frequency of the voltage generated from thepulser131. The output voltage of thepulser131 may be applied to theultrasonic element unit110 at intervals of a predetermined time, so that ultrasonic waves generated from theultrasonic element unit110 may be focused on thetarget site98 or may be steered in a specific direction.

In accordance with the embodiment, thepulser131 may be mounted to thesecond processor221. In this case, thefirst processor130 may not include thepulser131.

The amplifier (AMP)132 may amplify ultrasonic signals generated from theultrasonic reception element110b of theultrasonic element unit110. A gain of theamplifier132 may be arbitrarily determined by a system designer or a user. Theamplifier132 may differently amplify multi-channel ultrasonic signals generated from the plurality ofultrasonic element units110 according to the embodiment, so that a difference in intensity between multi-channel ultrasonic signals can be compensated for.

If the amplified ultrasonic signals are analog signals, theADC132 may convert the analog signals into digital signals. TheADC132 may perform sampling of ultrasonic signals acting as analog signals according to a predetermined sampling rate, so that it may output a digital signal.

A beamformer (B.F)134 may focus ultrasonic signals input to a plurality of channels. Thebeamformer134 may focus signals received from theultrasonic element unit110, theamplifier132 or theADC133, and thus generate the beamformed signal. Thebeamformer134 may perform various functions of multi-channel signals, for example, electronic beam scanning-, steering-, focusing-, apodizing-, and aperture-functions of multi-channel signals.

FIG. 2B is a conceptual diagram illustrating a beamforming process according to an embodiment of the present invention.

In accordance with the embodiment, thebeamformer134 may include a time-difference correction unit135 and areceiver focusing unit136 as shown inFIG. 2B.

The time-difference correction unit135 may correct a time difference between multi-channel ultrasonic signals. There may arise a time difference between multi-channel ultrasonic signals generated from severalultrasonic element units110 according to a distance from thetarget98 to eachultrasonic element unit110 or characteristics of theultrasonic element unit110. The time-difference correction unit135 may delay transmission of some parts of multi-channel signals, so that it may correct a time difference between multi-channel signals. The time-difference correction unit135 may be mounted to each channel of ultrasonic signals generated from theultrasonic element unit110.

Thereceiver focusing unit136 may synthesize multi-channel ultrasonic signals, a time difference of which is corrected by the time-difference correction unit135. Thereceiver focusing unit136 may synthesize multi-channel ultrasonic signals by applying a predetermined weight to ultrasonic signals of respective channels. The predetermined weight may be determined irrespective of the ultrasonic signals, and may also be determined according to the ultrasonic signals. According to the synthesizing result of multi-channel ultrasonic signals, thereceiver focusing unit136 may output the beamformed signal. The beamformed signal may be transferred to themain body200.

If thebeamformer134 is mounted to thefirst processor130, it is necessary for theultrasonic probe100 to transmit only the beamformed signal to themain body200. Accordingly, since theultrasonic probe100 need not transmit ultrasonic signals of all channels to themain body200, system complexity can be reduced whereas system reliability can be increased.

Thepulser131, theamplifier132, theADC133, and thebeamformer134 of thefirst processor130 may be logically separated from each other. In this case, thefirst processor130 may be implemented by one semiconductor chip and associated electronic components. In accordance with another embodiment, thepulser131, theamplifier132, and theADC133, and thebeamformer134 of thefirst processor130 may also be physically separated from each other. If thepulser131, theamplifier132, and theADC133, and thebeamformer134 of thefirst processor130 are physically separated from each other, each thereof may be implemented by one or at least two semiconductor chips and associated electronic components.

In accordance with the embodiment, at least one of theamplifier132, theADC134, and thebeamformer134 of thefirst processor130 may also be mounted to themain body200. In this case, at least one of theamplifier132, theADC134, and thebeamformer134 may be implemented by a Central Processing Unit (CPU) mounted to themain body200 or a Graphics Processing Unit (GPU). If theamplifier132, theADC134, and thebeamformer134 are mounted to themain body200, signals generated from theultrasonic element unit110 may also be transferred to themain body200 without conversion.

For example, theultrasonic probe100 may be a linear array probe, a convex array probe, or a sector phased array probe. In addition, theultrasonic probe100 may be a mechanical sector array probe.

A detailed internal structure of theultrasonic probe100 will hereinafter be described in detail.

Themain body200 will hereinafter be described with reference toFIG. 2A.

Referring toFIG. 2A, themain body200 may include asignal processing unit210, animage processing unit211, a volumedata generation unit212, astorage unit213, and acontroller220.

Thesignal processing unit210 may perform signal processing of the beamformed signal in various ways. For example, thesignal processor210 may perform at least one of a filtering process, a detection process, and a compression process. The filtering process includes applying a filter to the beamformed signal so as to remove signals other than signals of a specific bandwidth. The filtering process may include a harmonic imaging process for removing a basic frequency component and passing harmonic signals. A detection process may convert a radio frequency (RF) format of a voltage of an ultrasonic signal into a video signal format. The compression process may reduce a difference in amplitude between ultrasonic signals. Thesignal processing unit210 may be omitted as necessary.

Theimage processing unit211 may convert the beamformed signal or signals processed by thesignal processing unit210 into an ultrasound image based on a still image or an ultrasound image based on a moving image. In addition, theimage processing unit211 may perform predetermined image processing of a still image or moving image.

Theimage processing unit211 may generate an ultrasound image using scan conversion. The generated ultrasound image may include an A-mode ultrasound image, a B-mode ultrasound image, or an M-mode ultrasound image. The A-mode ultrasound image may indicate an ultrasound image obtained when reflection intensity is amplitude-imaged on the basis of the distance or time from thetarget site98 to theultrasonic probe100. The B-mode ultrasound image may indicate an ultrasound image obtained when the ultrasonic intensity is represented using brightness. The M-mode ultrasound image may indicate an ultrasound image obtained when a variation of the operations of the object is imaged. The ultrasound image may include a Doppler image based on the Doppler effect.

Theimage processing unit211 may correct the generated ultrasound image. For example, theimage processing unit211 may correct brightness, luminance, sharpness, contrast, or color of all or some regions of the ultrasound image in such a manner that a user can definitely view tissues contained in the ultrasound image. Theimage processing unit211 may remove noise from the ultrasound image or may perform pixel interpolation of the ultrasound image.

Theimage processing unit211 may transmit the generated or corrected ultrasound image to thestorage unit213 or may display the generated or corrected ultrasound image on thedisplay unit280. In addition, theimage processing unit211 may transmit the generated or corrected ultrasound image to the volumedata generation unit212, so that it can obtain ultrasonic volume data.

The volumedata generation unit212 may obtain ultrasonic volume data that indicates a three-dimensional (3D) volume using a two-dimensional (2D) ultrasound image generated or corrected by theimage processing unit211.

Thesignal processing unit210, theimage processing unit211, or the volumedata generation unit212 may be implemented by a CPU or GPU. The CPU or GPU may be implemented by one or at least two semiconductor chips and associated electronic components.

Thestorage unit213 may store various programs associated with functions of thecontroller200, data, ultrasound images, and various kinds of information associated with the ultrasound images. Thestorage unit213 may be implemented using a semiconductor storage unit, a magnetic disc storage unit, a magnetic tape storage unit, or the like.

Thecontroller220 may control overall operations of theultrasonic imaging apparatus1 according to a user command or a predefined configuration. For example, after thecontroller220 generates a predetermined control command according to a frequency of ultrasonic waves to be irradiated, thecontroller220 may transmit the generated control command to thepulser131 of thefirst processor130. Thepulser131 may apply a voltage having a predetermined frequency to theultrasonic element unit110 according to a control command. Accordingly, theultrasonic element unit110 may generate ultrasonic waves having a predetermined frequency, and thus apply the ultrasonic waves to thetarget site98 of theobject99.

Thecontroller220 may include asecond processor221; and astorage unit222, such as ROM or RAM, to assist the operations of thesecond processor221. Thesecond processor221 may be implemented by a CPU. The CPU may be implemented by one or at least two semiconductor chips and associated electronic elements.

Thedisplay unit280 may display an ultrasound image for user recognition. Thedisplay unit280 may use a plasma display panel (PDP), a light emitting diode (LED), a liquid crystal display (LCD), or the like. The LED may include an organic light emitting diode (OLED). In addition, thedisplay unit280 may use a 3D display configured to represent a 3D image.

Theinput unit290 may receive various commands related to control of theultrasonic imaging apparatus1 from the user. Theinput unit290 may output an electrical signal in response to user manipulation, and may transmit the electrical signal to thesecond processor220.

Theinput unit290 may include amanipulation panel291 to which various input devices are installed. For example, the input devices may include at least one of a keyboard, a mouse, a track ball, a knob, a touchpad, a paddle, various levers, a handle, a joystick, and various input devices.

Theinput unit290 may include atouchscreen unit292. The user may input various commands by touching a touch panel using a touch tool, such as a finger or a touch pen, of thetouchscreen unit292.

Thetouchscreen unit292 may be implemented by a resistive touchscreen panel or a capacitive touchscreen panel. In addition, thetouchscreen unit292 may also use ultrasonic waves or infrared light.

The internal structure of theultrasonic probe100 will hereinafter be described in detail.

FIG. 3 illustrates the internal structure of an ultrasonic probe according to an embodiment of the present invention.FIG. 4 is an exploded perspective view illustrating the internal structure of an ultrasonic probe according to a first embodiment of the present invention.

Referring toFIGS. 3 and 4, theultrasonic probe100 may include anacoustic lens109 installed at one end of theprobe housing107; anultrasonic element unit110 located close to theacoustic lens109; asound absorption unit120, one surface of which contacts theultrasonic element unit110 seated therein; a second electronic circuit acting as a substrate connection unit installed at the other surface of thesound absorption unit120; a firstelectrical circuit150 electrically connected to the second electronic circuit and disposed at the other surface of the secondelectronic circuit140; aheat conduction unit160 configured to absorb heat generated from the firstelectronic circuit150; and a conductive line (or a conductive wire)108 configured to transmit the electrical signal generated from the firstelectronic circuit150 to themain body200.

Theultrasonic element unit110, thesound absorption unit120, the secondelectronic circuit140, the firstelectronic circuit150, theheat conduction unit160, and the conductive line180 may be installed in theprobe housing107. Acable93 may be fixed to the other end of theprobe housing107 or may be detached from the other end of theprobe housing107.

Thehousing107 may allow various electronic components of theultrasonic probe100 to be stably fixed, or may protect the electronic components from external impact. Thehousing107 may be implemented by various metals or synthetic resins, and may be formed in various shapes according to a use purpose of theultrasonic probe100 or according to categories of objects or target sites.

Theacoustic lens109 may focus or emit sound waves or ultrasonic waves. Theacoustic lens109 may focus ultrasonic waves generated from theultrasonic element unit110 on thetarget site98. Theacoustic lens109 may be formed of glass or synthetic fibers.

Theultrasonic element unit110 may be mounted to one surface of thesound absorption unit120. Theultrasonic element unit110 may contact theacoustic lens109 or may be disposed close to theacoustic lens109.

FIG. 5A is a conceptual diagram illustrating arrangement of an ultrasonic element unit according to a first embodiment of the present invention.

Referring toFIG. 5A, theultrasonic element unit110 may include amatching layer111 capable of being implemented as one or at least two layers, anultrasonic transducer113, and anacoustic enhancer114.

Thematching layer111 may maintain straightness or intensity of the ultrasonic waves generated from theultrasonic transducer113, or may minimize the problem in that the emitted ultrasonic waves do not reach thetarget site98 and are reflected from a surface of the object99 (e.g., the skin of a human being).

Thematching layer111 may include a plurality of matching layers, i.e., afirst matching layer111a and asecond matching layer111b. Each of thefirst matching layer111a and thesecond matching layer111b may be formed of a material having medium impedance between impedance of eachtransducer113 and tissue impedance. If thematching layer111 includes a plurality of matching layers (111a,111b), the respective matching layers (111a,111b) may contact each other.

One surface of thefirst matching layer111a may contact theacoustic lens109 or may be disposed close to theacoustic lens109. The other surface of thefirst matching layer111a may be attached to one surface of thesecond matching layer111b. Theultrasonic transducer113 may be attached to the other surface of thesecond matching layer111b. In this case, oneultrasonic element unit110 may also be attached to the other surface of thesecond matching layer111b, and a plurality of ultrasonic element units may also be attached thereto.

In accordance with the embodiment, theacoustic matching layer111 may include only one matching layer or may also include three or more matching layers.

As described above, theultrasonic transducer113 may convert the ultrasonic waves into electrical signals or vice versa. One surface of theultrasonic transducer113 may be attached to thesecond matching layer111b.

Theacoustic enhancer114 may be attached to the other surface of theultrasonic transducer113. Theacoustic enhancer114 may amplify signals received from thefirst connection unit121 so that theultrasonic transducer113 may generate the amplified ultrasonic waves. Theultrasonic transducer113 may be attached to one surface of theacoustic enhancer114. The other surface facing one surface of theacoustic enhancer114 may contact thesound absorption unit120 and thefirst connection unit121. Theacoustic enhancer114 may be formed of a conductive material through which electricity flows.

FIG. 5B is a conceptual diagram illustrating arrangement of an ultrasonic element unit according to a second embodiment of the present invention.

Referring toFIG. 5B, theacoustic enhancer114 may be omitted, and only thematching layer111 and theultrasonic transducer113 may be installed. In this case, thesound absorption unit120 and thefirst connection unit121 may be directly mounted to theultrasonic transducer113. Thematching layer111 and theultrasonic transducer113 are identical to those ofFIG. 5A, and as such a detailed description thereof will herein be omitted for convenience of description.

Embodiments of thesound absorption unit120 in which theultrasonic element unit110 is seated will hereinafter be described in detail.

FIG. 6 is a conceptual diagram illustrating functions of the sound absorption unit.FIG. 7 is a perspective view illustrating the sound absorption unit according to a first embodiment of the present invention.FIG. 8 is a plan view illustrating the sound absorption unit according to a first embodiment of the present invention.FIG. 9 is a lateral perspective view illustrating the sound absorption unit according to a first embodiment of the present invention.

As shown inFIG. 4, theultrasonic element unit110 may be attached to one surface of thesound absorption unit120 according to the first embodiment, and the secondelectronic circuit140 acting as the substrate connection unit may be attached to the other surface facing one surface.

Referring toFIG. 6, if theultrasonic transducer113 of theultrasonic element unit110 generates ultrasonic waves in response to a reception voltage, the generated ultrasonic waves may be emitted in the direction (u1) of the object, and may also be emitted in the direction (u2) of the sound absorption unit. As described above, the ultrasonic waves (u2) emitted in the direction of the sound absorption unit may cause noise in the ultrasound image. In order to prevent the occurrence of noise, thesound absorption unit120 may be formed of asound absorption material122. Thesound absorption material122 may be a material capable of absorbing sound waves or ultrasonic waves. Thesound absorption material112 may absorb ultrasonic waves emitted in the direction from theultrasonic transducer113 to the sound absorption unit, and may reduce intensity of ultrasonic waves proceeding in an undesired direction. As a result, noise capable of being generated in the ultrasound image can be reduced.

Thesound absorption material122 of thesound absorption unit120 may be formed of epoxy resin or a hafnium oxide material such as hafnium oxide metal powder. In addition, thesound absorption material122 may be a mixture of epoxy resins, metals, and various synthetic resins. In addition, various materials capable of providing a function of absorbing sound waves or ultrasonic waves may be used as thesound absorption material122.

In accordance with one embodiment, thesound absorption material122 may be formed in a hexahedral shape as shown inFIGS. 7 to 9. Thesound absorption material122 may be formed in any of various columns or spheres. The external appearance of thesound absorption material122 may be arbitrarily determined according to selection of a system designer.

Referring toFIGS. 4 to 9, at least onefirst connection unit121 configured to pass through the range from onesurface122a to the other surface of thesound absorption material122 may be mounted to thesound absorption material122. Here, the other surface may be a surface facing onesurface122a of thesound absorption material120. Thefirst connection unit121 may be provided to pass through thesound absorption material122, so that thefirst connection unit121 may be exposed to the outside at both of onesurface122a and the other surface of thesound absorption material122.

Thefirst connection unit121 may be formed of a conductive material through which electricity flows. In this case, the conductive material may be any one of various metals through which electricity flows, for example, copper (Cu), gold (Au), or the like. Therefore, thefirst connection unit121 may transmit an electrical signal generated from theultrasonic element unit110 to either the firstelectronic circuit150 or the secondelectronic circuit140, or may transmit an electrical signal generated from the firstelectronic circuit150 or the secondelectronic circuit140 to theultrasonic element unit110.

Thefirst connection unit121 may be formed in a hexahedral shape as shown inFIGS. 7 to 9. However, the shape of thefirst connection unit121 is not limited thereto. In accordance with the embodiment, thefirst connection unit121 may be formed in a cylindrical shape or various polygonal shapes. The shape of thefirst connection unit121 may also be arbitrarily determined according to selection of a system designer.

Theultrasonic element unit110 may be mounted to onesurface122a of thesound absorption material122. In this case, onesurface122a of thesound absorption material122 may also be formed in a planar shape. In addition, onesurface122a of thesound absorption material122 may be formed as a curved surface having a predetermined curvature.

Referring toFIGS. 7 and 8, one or at least two seatingunits125 in which theultrasonic element unit110 is seated may be mounted to onesurface122a of thesound absorption material122. Theseating unit125 may include aseating surface124 and agroove123 formed in the vicinity of theseating surface124. Theultrasonic element unit110 may be disposed on theseating surface124. In accordance with the embodiment, theultrasonic transducer113 may be disposed on theseating surface124, or theacoustic enhancer124 may be disposed thereon. Thegroove123 may separate theseating surface124 and other parts of onesurface122a from each other.

One end of thefirst connection unit121 may be exposed on theseating surface124. As described above, thefirst connection unit121 may be formed to pass through the range from onesurface122a to the other surface of thesound absorption material120. In this case, onefirst connection unit121 may be exposed on thesingle seating surface124. Thefirst connection unit121 may be exposed to the outside either at the center part of theseating surface124 or in the vicinity of the center part of theseating surface124. If theultrasonic element unit110 is seated on theseating surface124, thefirst connection unit121 may contact one end of theultrasonic element unit110. Therefore, thefirst connection unit121 may be electrically coupled to theultrasonic element unit110.

The secondelectronic circuit140 may be mounted to the other surface of thesound absorption material122.

FIG. 10 is a perspective view illustrating the sound absorption unit according to a second embodiment of the present invention.FIG. 11 is a plan view illustrating the sound absorption unit according to a second embodiment of the present invention.FIG. 12 is a lateral cross-sectional view illustrating the sound absorption unit according to a second embodiment of the present invention.FIG. 13 is a view illustrating the sound absorption unit according to a second embodiment of the present invention.

Referring toFIGS. 10 to 12, thesound absorption unit120a of the second embodiment may include asound absorption material122, onesurface122a of which contacts theultrasonic element unit110 in the same manner as in thesound absorption unit120 of the first embodiment. Thefirst connection unit121 may be configured to pass through the range from onesurface122a to the other surface of thesound absorption material122.

One or at least two seatingunits125 may be provided at onesurface122a of thesound absorption unit120a of the second embodiment. Theseating unit125 may include aseating surface124 and agroove124 formed in the vicinity of theseating surface124.

A plurality of first connection units (121a to121d) may be exposed on theseating surface124. As can be seen fromFIGS. 10 to 13, each of the first connection units (121a to121d) may be exposed to the outside at the corners of theseating surface124. As can be seen fromFIG. 13, if theultrasonic element unit110 is seated on theseating surface124, the first connection units (121a to121d) may contact one end of theultrasonic element unit110, and may contact, for example, one surface of theacoustic enhancer114. In other words, the first connection units (121a to121d) may support oneultrasonic element unit110. Therefore, the first connection units (121a to121d) may be electrically connected to theultrasonic element unit110.

The first connection units (121a to121d) may have various shapes according to embodiments. For example, each of the first connection units (121a to121d) may be formed in a prismatic or cylindrical shape. Besides, the first connection units (121a to121d) may be selected by the system designer. An exposed surface of each first connection unit (121a to121d) of thesound absorption unit120a of the second embodiment may be identical in width to or be smaller or larger in width than thefirst connection unit121 of thesound absorption unit120 of the first embodiment.

The secondelectronic circuit140 will hereinafter be described as an example of the substrate connection unit.

In accordance with the embodiment, the substrate connection unit may include the secondelectronic circuit140.

FIG. 14 is a view illustrating the second electronic circuit according to a first embodiment of the present invention.FIG. 15 illustrates a curved structure of the second electronic circuit.FIG. 16 is a cross-sectional view illustrating the second electronic circuit.

In accordance with the embodiment, the secondelectronic circuit140 may include a substrate, various circuits formed on the substrate, and a semiconductor chip or other electronic components connected to the various circuits. In accordance with the embodiment, at least one of the substrate, the various circuits formed on the substrate, the semiconductor chip or other electronic components connected to the various circuits may be omitted as necessary.

Referring toFIG. 14, the substrate of the secondelectrical circuit140 may be a rigid flexible PCB. The rigid flexible PCB may be a multi-layered substrate composed of aflexible PCB144 and arigid PCB145. In more detail, the rigid flexible PCB may be implemented by overlapping therigid substrate145 with some parts of theflexible substrate144.

Theflexible substrate144 may be easily bent, and therigid substrate145 may not be easily bent. Therefore, as shown in144a and144b ofFIG. 15, one region (e.g., a first region) of the secondelectronic circuit140 may be flexibly curved in various directions. The other region, for example, the second region, may not be curved. In this case, the statement that the above region is not curved does not indicate that the above region is not curved at all, but indicates that the above region is not generally used as a curved form.

Anoutput unit146 for communicating with the external part and its associated various circuits and electronic components may be mounted to theflexible substrate144. A port coupled to the connector provided at the end of the externalconductive line147 may be included in theoutput unit146.

For example, theflexible substrate144 may have a multi-layered structure as shown inFIG. 16. In more detail, theflexible substrate144 may include a plurality of polyimide cover layers (1441,1447), a plurality of polyimide substrate layers (1443,1445), and an adhesive layer to which the polyimide cover layers and the polyimide substrate layers are adhered.

Various electronic components related to control of theultrasonic probe100 may be mounted to therigid substrate145. Therigid substrate145 may be formed of arigid material1451. Therigid material1451 may be attached to the polyimide cover layers (1441,1447) of theflexible substrate144 through an adhesive. Thesubstrate connection unit141 may be formed on therigid substrate145.

As shown inFIGS. 4 and 16, thesubstrate connection unit141 may pass through the secondelectronic circuit140. In this case, thesubstrate connection unit141 may pass through theflexible substrate144 and therigid substrate145. Thesubstrate connection unit141 may be electrically coupled to the firstelectronic circuit150.

Referring toFIG. 4, thesubstrate connection unit141 may include a firstsubstrate connection unit142 configured to electrically interconnect thefirst connection unit121 and the firstelectronic circuit150; and a secondsubstrate connection unit143 configured to electrically interconnect theoutput unit146 of the secondelectronic circuit140 and the firstelectronic circuit150.

One end of the firstsubstrate connection unit142 may contact athird connection unit153 of the firstelectronic circuit150, and the other end thereof may contact thefirst connection unit121 of thesound absorption unit120. Therefore, the firstsubstrate connection unit142 may be electrically coupled to thethird connection unit153 and thefirst connection unit121. Therefore, the firstsubstrate connection unit142 may transmit the electrical signal generated from thethird connection unit153 of the firstelectronic circuit150 to thefirst connection unit121 of thesound absorption unit120. The firstsubstrate connection unit142 may be provided at a specific part to which theflexible substrate144 and therigid substrate145 are attached. In this case, the firstsubstrate connection unit142 may pass through both substrates (144,145). The firstsubstrate connection unit142 may be concentrated at a specific position (see ‘A’ ofFIG. 4) in such a manner that the firstsubstrate connection unit142 can contact thefirst connection unit121 of thesound absorption unit120.

One end of the secondsubstrate connection unit143 may be coupled to afourth connection unit154 of the firstelectronic circuit150, and the other end or the center part of the secondsubstrate connection unit143 may be electrically coupled to theoutput unit146. In this case, the secondsubstrate connection unit143 may be electrically connected to theoutput unit146 through the second electronic circuit140 (e.g., a circuit provided at a flexible substrate144). The electrical signal generated from thefourth connection unit154 of the firstelectronic circuit150 may be applied to theoutput unit146 through the secondsubstrate connection unit143. The secondsubstrate connection unit143 may pass through both substrates (144,145) at a specific part to which theflexible substrate144 and therigid substrate145 are attached. The secondsubstrate connection unit143 may be provided at a specific position (see ‘B’ ofFIG. 4) at which the secondsubstrate connection unit143 does not contact thefirst connection unit121 of thesound absorption unit120. For example, the secondsubstrate connection unit143 may be installed at a specific position of therigid substrate145, where the specific position corresponds to the outer wall of thesound absorption unit120.

Although only the mutual connection parts of the firstsubstrate connection unit142 and the secondsubstrate connection unit143 are different from each other, the firstsubstrate connection unit142 and the secondsubstrate connection unit143 may be identical in shape. Of course, according to some embodiments, the firstsubstrate connection unit142 may be different in shape from the secondsubstrate connection unit143 may be different from each other.

Various embodiments of thesubstrate connection unit141 will hereinafter be described in detail.

FIG. 17A is a plan view illustrating the second electronic circuit including the substrate connection unit according to a first embodiment of the present invention.FIG. 17B is an exploded side view illustrating the second electronic circuit including the substrate connection unit according to a first embodiment of the present invention.

Thesubstrate connection unit141 may include a via hole. As shown inFIGS. 17A and 17B, thesubstrate connection unit1420 of the first embodiment may include a via hole. The via hole may include a first opening (also called a first aperture)1421 that passes through the range from one surface to the other surface of the secondelectronic circuit140, and aconductive material1422 mounted to the inner lateral surface of thefirst opening1421.

Thefirst opening1421 may have a circular shape from the viewpoint of a vertical upward direction of the secondelectronic circuit140. In accordance with the embodiment, thefirst opening1421 may have a polygonal shape such as a triangular or rectangular shape. In addition, thefirst opening1421 may also have an elliptical shape. Thefirst opening1421 may be formed in the secondelectronic circuit140 by puncturing the secondelectronic circuit140 using a puncturing machine such as an electric drill.

Theconductor1422 may be provided at an inner lateral surface of thefirst opening1421. In more detail, a conductive material such as metal is deposited on the inner lateral surface of thefirst opening1421, so that theconductor1422 may be provided at the inner lateral surface of thefirst opening1421. Asecond opening1423 may further be formed at the center part of theconductor1422. Thesecond opening1423 may have a circular or polygonal shape. In addition, theconductor1422 may protrude in the opposite direction from the center part of thesecond opening1423 at both surfaces of the secondelectronic circuit140, and some parts of both surfaces of the secondelectronic circuit140 may be deposited as shown in1422a and1422b.

FIG. 18A is a plan view illustrating the second electronic circuit including the substrate connection unit according to a second embodiment of the present invention.FIG. 18B is an exploded side view illustrating the second electronic circuit including the substrate connection unit according to a second embodiment of the present invention.

Referring toFIGS. 18A and 18B, thesubstrate connection unit1430 of the second embodiment may include afirst opening1431 configured to pass through the range from one surface to the other surface of the secondelectronic circuit140; aconductor1432 formed at the inner lateral surface of thefirst opening1431 and including asecond opening1433 formed at an inner surface; and afilter1434 configured to shield thesecond opening1433.

In the same manner as described above, thefirst opening1431 may have a polygonal shape such as a circular, triangular, or rectangular shape or other shapes such as an elliptical shape from the viewpoint of a vertical upward direction of the secondelectronic circuit140. Thefirst opening1431 may be formed in the secondelectronic circuit140 by puncturing the secondelectronic circuit140.

Theconductor1432 may be provided at the inner lateral surface of thefirst opening1431 by depositing a conductive material on the inner lateral surface of thefirst opening1431. Thesecond opening1433 provided at theconductor1432 may have a circular or polygonal shape.

The fillingmaterial1434 is inserted into thesecond opening1433 so as to shield thesecond opening1433. The fillingmaterial1434 may be formed of a material having no conductivity. The fillingmaterial1434 may also be formed of any of various synthetic resins.

In the case of thesubstrate connection unit1430 of the second embodiment, theconductor1432 protrudes in the opposite direction from the center part of thesecond opening1433 at both surfaces of the secondelectronic circuit140, and some parts of both surfaces of the secondelectronic circuit140 may be deposited as shown in1432a and1432b.

FIG. 19A is a plan view illustrating the second electronic circuit including the substrate connection unit according to a third embodiment of the present invention.FIG. 19B is an exploded side view illustrating the second electronic circuit including the substrate connection unit according to a third embodiment of the present invention.

Referring toFIGS. 19A and 19B, thesubstrate connection unit1440 of the third embodiment may include afirst opening1441 configured to pass through the range from one surface to the other surface of the secondelectronic circuit140; and aconductor1442 provided at the inner surface of thefirst opening1441. Theconductor1442 may completely shield thefirst opening1441. In other words, theconductor1442 may not form the second openings (1423,1433) as described above.

In the same manner as described above. thefirst opening1441 may have various shapes, and may be formed in the secondelectronic circuit140 using a puncturing machine.

FIG. 20A is a plan view illustrating the second electronic circuit including the substrate connection unit according to a fourth embodiment of the present invention.FIG. 20B is a bottom view illustrating the second electronic circuit including the substrate connection unit according to a fourth embodiment of the present invention.FIG. 20C is an exploded side view illustrating the second electronic circuit including the substrate connection unit according to a fourth embodiment of the present invention.

Referring toFIGS. 20A to 20C, thesubstrate connection unit1450 of the fourth embodiment may include afirst opening1451 configured to pass through the range from one surface to the other surface of the secondelectronic circuit140; and aconductor1452 installed at the inner lateral surface of thefirst opening unit1451.

In the same manner as described above, thefirst opening1451 may have various shapes, and may be formed in the secondelectronic circuit140 using the puncturing machine.

Theconductor1452 may be provided at the inner lateral surface of thefirst opening1451 by depositing a metal material or the like on the inner lateral surface of thefirst opening1451. The second openings (1423,1433) may be formed at a center part of theconductor1452, or may not be formed at the center part of theconductor1452.

Meanwhile, theconductor1452 may protrude in the opposite direction form the center part of thesecond opening1423 at only one surface of the second electronic circuit140 (see1452b). In other words, theconductor1452 may not be deposited on any one surface of the secondelectronic circuit140, or may be deposited only on the other surface of the secondelectronic circuit140.

FIG. 21 is a view illustrating a second electronic circuit according to a second embodiment of the present invention.

Referring toFIG. 21, the secondelectronic circuit140 may include a plurality of output units (146,148). The output units (146,148) may be provided at theflexible substrate145. The output units (146,148) may output different electrical signals, and may transmit the different electrical signals to themain body200. The respective output units (146,148) may be connected to different secondsubstrate connection units143. The different secondsubstrate connection units143 may transmit the electrical signals generated from the firstelectronic circuit150 to the respective output units (146,148).

The first electronic circuit will hereinafter be described in detail.

FIG. 22A is a perspective view illustrating a first electronic circuit according to an embodiment of the present invention.FIG. 22B is a view illustrating the first electronic circuit according to an embodiment of the present invention.

In accordance with the embodiment, the firstelectronic circuit150 may include a substrate, various circuits formed on the substrate, and a semiconductor chip and various electronic components connected to the various circuits. For example, the firstelectronic circuit150 may include at least one Application Specific Integrated Circuit (ASIC). In accordance with the embodiment, at least one of the substrate of the firstelectronic circuit150, various circuits formed on the substrate, and a semiconductor chip and various electronic components connected to the various circuits may be omitted for convenience of description.

Referring toFIGS. 4, 22A and 22B, one surface of the firstelectronic circuit150 may contact one surface of the secondelectronic circuit140. In more detail, the firstelectronic circuit150 may be mounted to a surface at which asupport120 of the secondelectronic circuit140 is not installed.

One or at least twosecond connection units152 may be provided at the firstelectronic circuit150. Thesecond connection unit152 may be formed of a conductive metal material such as gold (Au) or lead (Pb). Thesecond connection unit152 may be implemented as a bump. Thesecond connection unit152 implemented as a bump may be, for example, a solder ball. A thin electrode may also be provided at one end of thesecond connection unit152.

Thesecond connection unit152 may electrically contact thesubstrate connection unit141 of the secondelectronic circuit140. In this case, the thin electrode may also contact thesubstrate connection unit141. Since thesecond connection unit152 contacts thesubstrate connection unit141 of the secondelectronic circuit140, the firstelectronic circuit150 and the secondelectronic circuit140 may be electrically interconnected by thesubstrate connection unit141 and thesecond connection unit152. Thesecond connection unit152 contained in the firstelectronic circuit150 may have a position corresponding to thesubstrate connection unit141 of the secondelectronic circuit140, and the number ofsecond connection units152 contained in the firstelectronic circuit150 may correspond to the number of thesubstrate connection units141 of the secondelectronic circuit140.

Referring toFIG. 22B, the firstelectronic circuit150 and the secondelectronic circuit140 may be adjacent to each other on the basis of a predetermined gap. Aseparation unit151 may be disposed between the firstelectronic circuit150 and the secondelectronic circuit140. Theseparation unit151 may prevent the firstelectronic circuit150 from directly contacting the secondelectronic circuit140. Theseparation unit151 may be formed of a nonconductive material. For example, theseparation unit151 may also be formed of epoxy resin. The epoxy resin may provide an adhesive function, and the secondelectronic circuit140 and the firstelectronic circuit150 may be adhered to each other using theseparation unit151 formed of epoxy resin.

Referring toFIG. 22B, thesecond connection unit152 may pass through theseparation unit151 so that it may protrude toward the outside of theseparation unit151. In other words, the firstelectronic circuit150 and various electronic components mounted to the firstelectronic circuit150 may be shielded by theseparation unit151 formed of epoxy resin, so that they are not exposed to the outside. However, only thesecond connection unit152 may be exposed to the outside of theseparation unit151. Thesecond connection unit152 protruding toward the outside may contact thesubstrate connection unit141.

Theseparation unit151 may be disposed between the firstelectronic circuit150 and the secondelectronic circuit140 using various methods.

For example, the firstelectronic circuit150 and the second electronic circuit are located close to each other in such a manner that thesecond connection unit152 contacts thesubstrate connection unit141, and a gap formed between the firstelectronic circuit150 and the second electronic circuit is filled with epoxy resin, so that theseparation unit151 may be disposed between the firstelectronic circuit150 and the second electronic circuit.

In another example, after the epoxy resin is deposited on the firstelectronic circuit150 having thesecond connection unit152 in such a manner that some parts of thesecond connection unit152 are exposed to the outside, the secondelectronic circuit140 is installed on the epoxy resin, so that theseparation unit151 may be disposed between the firstelectronic circuit150 and the second electronic circuit.

Thesecond connection unit152 may include athird connection unit153 contacting a firstsubstrate connection unit142 and afourth connection unit154 contacting a secondsubstrate connection unit143. Thesecond connection unit153 may be provided at a specific position at which thesecond connection unit153 can contact the firstsubstrate connection unit142. Thesecond connection unit154 may be provided at a specific position at which thesecond connection unit154 can contact the secondsubstrate connection unit143.

The firstelectronic circuit150 may include a semiconductor chip acting as thefirst processor130 and electronic components associated with the semiconductor chip. Thefirst processor130 may be installed at a substrate of the firstelectronic circuit150. Thesecond connection unit152 may be provided at the firstelectronic circuit150, and may be disposed on the circuit electrically connected to thefirst processor130, so that thesecond connection unit152 may be electrically connected to thefirst processor130. The electrical signals generated from not only the semiconductor chip acting as thefirst processor130 but also the associated components may be applied to thesubstrate connection unit141 or theoutput unit146 through thesecond connection unit152. For example, the electrical signals (e.g., ultrasonic signals) transferred through thesubstrate connection unit141 may be applied to thefirst processor130 through thesecond connection unit152.

FIG. 22C is a view illustrating a heat conduction unit installed at a back surface of the first electronic circuit.

Referring toFIG. 4, the secondelectronic circuit140 may be attached to one surface of the firstelectronic circuit150, and theheat conduction unit160 may be installed at the other surface of the firstelectronic circuit150. Theheat conduction unit160 may be attached to the other surface of the firstelectronic circuit150 using an adhesive or the like. Referring toFIG. 22C, if thefirst processor130 or the like installed at the firstelectronic circuit150 performs data calculation processing, heat may occur in the firstelectronic circuit150. The generated heat may cause malfunction of the firstelectronic circuit150 or may cause malfunction of other electronic components (e.g., the second electronic circuit140) disposed in the vicinity of the firstelectronic circuit150.

Theheat conduction unit160 may emit the heat generated from the firstelectronic circuit150 to the outside. In more detail, after heat generated from the firstelectronic circuit150 is transferred to theheat conduction unit160, the heat may emit in the air along theheat conduction unit160.

Theheat conduction unit160 may be implemented using various heat conductive materials. For example, theheat conduction unit160 may be formed of graphite, tungsten, tungsten oxide, silicon, aluminum oxide, glass microballoon filling material, or the like.

A process of radiating ultrasonic waves using the above-mentionedultrasonic probe100, a process for receiving ultrasonic waves and converting the received ultrasonic waves into an electrical signal, and a process for transferring the electrical signal to themain body200 will hereinafter be described in detail.

FIG. 23A is a conceptual diagram illustrating a process for transmitting a control signal to the first processor mounted to the ultrasonic probe.FIG. 23B is a conceptual diagram illustrating the process for transmitting a control signal to the first processor mounted to the ultrasonic probe.FIG. 23C is a conceptual diagram illustrating a process for transmitting a control signal to the ultrasonic element.FIG. 24 is a conceptual diagram illustrating a process of radiating ultrasonic waves using the ultrasonic element.

Referring toFIG. 23A, if thecontroller220 of themain body200 outputs a control signal, the control signal may be applied to thecircuit149 contained in the secondelectronic circuit140 through thecable93 and the conductive line147 (S1). Referring toFIG. 23B, the control signal received through theconductive line147 may be applied to thefirst processor130 contained in the firstelectronic circuit150 through not only the secondsubstrate connection unit143 connected to thecircuit149 but also the fourth connection unit electrically connected to the second substrate connection unit143 (S2).

Referring toFIG. 23C, thefirst processor130 contained in the firstelectronic circuit150 may output a control command related to ultrasonic irradiation as an electrical signal format. The electrical signal may be a pulse having a predetermined frequency. The output control command may be applied to one or at least twothird connection units153 through the circuit of the firstelectronic circuit150.

Referring toFIG. 23C, the electrical signals received by thethird connection unit153 may pass through the secondelectronic circuit140 through thesubstrate connection unit141 attached to thethird connection unit153, for example, through the firstsubstrate connection unit142. After the electrical signal passes through the secondelectronic circuit140, the electrical signal may be applied to thefirst connection unit121 provided at thesound absorption unit120. The electrical signal applied to thefirst connection unit121 may be transmitted to theultrasonic element unit110 along the first connection unit121 (S3).

Referring toFIG. 24, if the electrical signal is applied to theultrasonic element unit110, the ultrasonic transducer113 (e.g., a piezoelectric element) of theultrasonic element unit110 may be vibrated according to the received electrical signal so as to generate ultrasonic waves (S4). The generated ultrasonic waves are emitted to the outside. The generated ultrasonic waves may be emitted in the direction of theobject99. Meanwhile, the generated ultrasonic waves may also be emitted in the direction of thesound absorption unit120. In this case, thesound absorption unit120 may absorb ultrasonic waves emitted in the direction of thesound absorption unit120.

FIGS. 25 and 26 are conceptual diagrams illustrating a process for receiving ultrasonic waves using the ultrasonic element.

Referring toFIGS. 25 and 26, theultrasonic element unit110 may receive ultrasonic waves from the external part (S5). The ultrasonic waves received from the external part may be obtained when ultrasonic waves generated from theultrasonic element unit110 are reflected from thetarget site98 contained in theobject99. In accordance with the embodiment, the ultrasonic waves received from the external part may be generated from thetarget site98 by irradiating laser or the like to thetarget site98.

Theultrasonic transducer113 of theultrasonic element unit110 may be vibrated with a frequency corresponding to a frequency of the received ultrasonic waves. so as to output the alternating current (AC) electrical signal. The electrical signal may be transmitted to theprocessor130 along an opposite path of the ultrasonic irradiation case (S6). In more detail, the electrical signal generated from theultrasonic element unit110 may be applied to thefirst processor130 through thefirst connector121 provided at thesound absorption unit120, the firstsubstrate connection unit142, thethird connection unit153, and a circuit contained in the firstelectronic circuit150.

Thefirst processor130 may amplify the received electrical signal, perform analog-to-digital conversion (ADC) of the amplified signal, and perform beamforming for focusing multi-channel electric signals generated from the respectiveultrasonic element units110. The beamformed signals may be temporarily stored in a storage unit (e.g., RAM) for assisting thefirst processor130.

FIGS. 27 and 28 are conceptual diagrams illustrating a process for transmitting processed signals to the main body.

Thefirst processor130 may output the beamformed signal, and the beamformed signal may be applied to thefourth connection unit143 along the circuit provided in the firstelectronic circuit150. The beamformed signal applied to thefourth connection unit143 may be transmitted to the secondsubstrate connection unit143 contacting the fourth connection unit143 (S7). The beamformed signal may be applied to theoutput unit146 through thecircuit149 coupled to the secondsubstrate connection unit143.

The beamformed signal is output through theoutput unit146, and may be applied to themain body200 through theconductive line147 and thecable93 connected to the output unit146 (S8). Themain body200 may perform signal processing and image processing of the received beamformed signal, may generate an ultrasound image corresponding to the beamformed signal, and may display the ultrasound image on thedisplay unit280 for user recognition.

A process for fabricating the sound absorption unit will hereinafter be described with reference toFIGS. 29 and 30.

FIGS. 29 and 30 are conceptual diagrams illustrating the process for fabricating the sound absorption unit.FIG. 29 is a plan view illustrating thesound absorption material10 in which theconductor11 is inserted.FIG. 30 is a lateral cross-sectional view illustrating thesound absorption material10 in which theconductor11 is inserted. For convenience of description and better understanding of the present invention, an upper part ofFIG. 30 will hereinafter be referred to as an upward direction, and a direction from the upper part to the lower part ofFIG. 30 will hereinafter be referred to as a vertical direction. In addition, a specific direction orthogonal to the vertical direction will hereinafter be referred to as a horizontal direction.

As can be seen fromFIG. 29, theconductor11 may be inserted into thesound absorption material10, and theconductor11 may be diced as necessary. The insertedconductor11 may be used as the above-mentionedsupport connection unit121.

From the viewpoint of the upward direction, theconductor12 may be diced to have a square shape. The width (w1) or the height (h1) of theconductor11 may be designed in various ways according to selection of the system designer. For example, the width (w1) of theconductor11 may be 50 micrometers (μm), and the height (h1) of theconductor11 may be 50 micrometers (μm). In addition, theconductor13 may be diced to have a rectangular shape. In this case, theconductor13 may have various widths (w2) and heights (h2) according to selection of the system designer. For example, the width (w2) of theconductor12 may be 60 micrometers (μm), and the height (h2) of theconductor12 may be 50 micrometers (μm).

If theconductor11 is inserted into thesound absorption material10, thesound absorption material10 is severed in a horizontal direction so that both ends of theconductor11 are exposed to the outside, as shown inFIG. 30. In more detail, thesound absorption material10 is cut along the first sectional surface (c1) and the second sectional surface (c2) shown inFIG. 30. As a result, thesound absorption material10 formed when theconductor11 is exposed at the upper and lower parts can be obtained. The obtainedsound absorption material10 may be used as the above-mentionedsound absorption unit120.

As is apparent from the above description, the ultrasonic probe apparatus and the ultrasonic imaging apparatus according to the embodiments can efficiently absorb ultrasonic waves emitted in the direction from the ultrasonic elements to the ultrasonic probe, resulting in implementation of improved acoustic throughput.

According to the ultrasonic probe apparatus and the ultrasonic imaging apparatus, a processor of the ultrasonic probe apparatus can be connected to a main body thereof without exposing the conductive lines to the outside, so that product durability, such as mechanical stability, electrical deterioration, corrosiveness, and heat-resistance, can be improved, resulting in increased product reliability.

According to the ultrasonic probe apparatus and the ultrasonic imaging apparatus, the accuracy of impedance matching of signal lines of a low volume dissemination system of semiconductors and a time error between two signals needed for constructing one pair of patterns, resulting in reduction of signal loss.

According to the ultrasonic probe apparatus and the ultrasonic imaging apparatus, heat generated from the processor contained in the ultrasonic probe and a substrate on which the processor is disposed can be easily and quickly emitted to the outside.

According to the ultrasonic probe apparatus and the ultrasonic imaging apparatus, the ultrasonic probe is reduced in weight, resulting in greater convenience.

Although a few embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.

Claims (46)

What is claimed is:

1. An ultrasonic probe apparatus comprising:

an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves;

a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer, and being electrically connected to the ultrasonic transducer;

a first electronic circuit electrically connected to the sound absorption unit; and

a second electronic circuit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit,

wherein one surface of the second electronic circuit faces another surface of the sound absorption unit, and another surface of the second electronic circuit faces one surface of the first electronic circuit

wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,

wherein the second electronic circuit includes:

a first substrate connection unit provided to pass through from the one surface of the second electronic circuit to the another surface of the second electronic circuit, connected to the at least one first connection unit and configured to electrically connect the sound absorption unit and the first electronic circuit; and

a second substrate connection unit provided at a position not in contact with the at least one first connection unit of the sound absorption unit and configured to electrically connect the first electronic circuit and an output unit of the second electronic circuit.

2. The ultrasonic probe apparatus according toclaim 1, wherein the second electronic circuit includes a substrate connection unit electrically connected to the first electronic circuit.

3. The ultrasonic probe apparatus according toclaim 2, wherein the substrate connection unit includes a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit.

4. The ultrasonic probe apparatus according toclaim 3, wherein the first substrate connection unit is electrically connected to the ultrasonic transducer.

5. The ultrasonic probe apparatus according toclaim 4, wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,

wherein the first substrate connection unit contacts the first connection unit.

6. The ultrasonic probe apparatus according to claim2 1, wherein the second electronic circuit includes at least one output unit is configured to output a signal processed by the first electronic circuit,

wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit.

7. The ultrasonic probe apparatus according to claim2 1, wherein the first substrate connection unit includes and the second substrate connection unit include:

a first opening configured to pass through a range from the one surface to the another surface of the second electronic circuit; and

a conductor installed at an inner lateral surface of the first opening and electrically coupled to the first electronic circuit.

8. The ultrasonic probe apparatus according toclaim 7, wherein the conductor is configured to shield the first opening.

9. The ultrasonic probe apparatus according toclaim 7, wherein the first substrate connection unit and the second substrate connection unit further includes include a second opening formed to pass through the conductor.

10. The ultrasonic probe apparatus according toclaim 9, wherein the first substrate connection unit and the second substrate connection unit further includes include a filling material configured to shield the second opening.

11. The ultrasonic probe apparatus according toclaim 7, wherein the conductor is deposited on the inner lateral surface of the first opening.

12. The ultrasonic probe apparatus according toclaim 7, wherein the conductor is installed at the one surface of the second electronic circuit located in a vicinity of the first opening.

13. The ultrasonic probe apparatus according toclaim 1, wherein the second electronic circuit includes a rigid flexible printed circuit board (PCB).

14. The ultrasonic probe apparatus according toclaim 13, wherein the second electronic circuit includes at least one of a first region that is not curved and a second region that is flexibly curved.

15. The ultrasonic probe apparatus according toclaim 14, wherein the second electronic circuit includes a substrate connection unit that is electrically connected to the first electronic circuit and is the first substrate connection unit and the second substrate connection unit are formed in the first region.

16. The ultrasonic probe apparatus according to claim2 1, wherein:

a second connection unit is mounted to on the first electronic circuit and includes a third connection unit and a fourth connection unit, the second third connection unit being attached to the first substrate connection unit of the second electronic circuit and the fourth connection unit, being attached to the second substrate connection unit, of the second electronic circuit.

17. The ultrasonic probe apparatus according toclaim 16, further comprising:

a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit.

18. The ultrasonic probe apparatus according toclaim 17, wherein the second connection unit is mounted to the first electronic circuit so as to pass passes through the separation unit.

19. The ultrasonic probe apparatus according toclaim 1, further comprising:

a heat conduction unit mounted to another surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit.

20. The ultrasonic probe apparatus according toclaim 1, wherein the sound absorption unit includes:

a sound absorption material for absorbing sound; and

a firstthe at least one first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit.

21. The ultrasonic probe apparatus according toclaim 20, wherein the at least one first connection unit is mounted to a single ultrasonic transducer.

22. The ultrasonic probe apparatus according toclaim 1, further comprising:

an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.

23. The ultrasonic probe apparatus according toclaim 1, wherein the sound absorption unit is formed of a sound absorption material configured to absorb sound waves or ultrasonic waves.

24. The ultrasonic probe apparatus according toclaim 1, wherein:

a seating surface at which the ultrasonic transducer or an acoustic enhancer is seated is formed at the one surface of the sound absorption unit,

wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.

25. The ultrasonic probe apparatus according toclaim 1, wherein the first electronic circuit includes a processor configured to focus signals generated from the ultrasonic transducer.

26. The ultrasonic probe apparatus according toclaim 1, wherein the first electronic circuit includes at least one application specific integrated circuit (ASIC).

27. An ultrasonic imaging apparatus comprising:

an ultrasonic probe configured to receive ultrasonic waves; and

a main body configured to control operations of the ultrasonic probe, and to perform image processing of an ultrasound image corresponding to the received ultrasonic waves,

wherein the ultrasonic probe includes:

an ultrasonic transducer configured to output an electrical signal upon receiving the ultrasonic waves;

a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer;

a first electronic circuit electrically connected to the sound absorption unit; and a second electronic circuit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit,

wherein one surface of the second electronic circuit faces another surface of the sound absorption unit, and another surface of the second electronic circuit faces one surface of the first electronic circuit

wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,

wherein the second electronic circuit includes:

a first substrate connection unit provided to pass through from the one surface of the second electronic circuit to the another surface of the second electronic circuit, connected to the at least one first connection unit, and configured to electrically connect the sound absorption unit and the first electronic circuit; and

a second substrate connection unit provided a position not in contact with the at least one first connection unit of the sound absorption unit, and configured to electrically connect the first electronic circuit and an output unit of the second electronic circuit.

28. The ultrasonic imaging apparatus according toclaim 27, wherein the second electronic circuit includes a substrate connection unit electrically connected to the first electronic circuit.

29. The ultrasonic imaging apparatus according toclaim 28, wherein the substrate connection unit includes a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit.

30. The ultrasonic imaging apparatus according toclaim 29, wherein the first substrate connection unit is electrically connected to the ultrasonic transducer.

31. The ultrasonic imaging apparatus according toclaim 30, wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,

wherein the first substrate connection unit contacts the first connection unit.

32. The ultrasonic imaging apparatus according to claim28 27, wherein the second electronic circuit includes at least one output unit is configured to output a signal processed by the first electronic circuit, wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit.

33. The ultrasonic imaging apparatus according toclaim 27, wherein the second electronic circuit includes a rigid flexible printed circuit board (PCB).

34. The ultrasonic imaging apparatus according toclaim 33, wherein the second electronic circuit includes at least one of a first region that is not curved and a second region that is flexibly curved.

35. The ultrasonic imaging apparatus according toclaim 34, wherein the second electronic circuit includes a substrate connection unit that is electrically connected to the first electronic circuit and is the first substrate connection unit and the second substrate connection unit are formed in the first region.

36. The ultrasonic imaging apparatus according to claim29 27, wherein: a second connection unit is mounted to on the first electronic circuit and includes a third connection unit and a fourth connection unit, the second third connection unit being attached to the first substrate connection unit of the second electronic circuit and the fourth connection unit being attached to the second substrate connection unit of the second electronic circuit.

37. The ultrasonic imaging apparatus according toclaim 36, further comprising:

a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit.

38. The ultrasonic imaging apparatus according toclaim 37, wherein the second connection unit is mounted to the first electronic circuit so as to pass passes through the separation unit.

39. The ultrasonic imaging apparatus according toclaim 27, further comprising:

a heat conduction unit mounted to another surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit.

40. The ultrasonic imaging apparatus according toclaim 27, wherein the sound absorption unit includes:

a sound absorption material for absorbing sound; and

a firstthe at least one first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit.

41. The ultrasonic imaging apparatus according toclaim 40, wherein the at least one first connection unit is mounted to a single ultrasonic transducer.

42. The ultrasonic imaging apparatus according toclaim 27, further comprising:

an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.

43. The ultrasonic imaging apparatus according toclaim 27, wherein the sound absorption unit is formed of a sound absorption material configured to absorb sound waves or ultrasonic waves.

44. The ultrasonic imaging apparatus according toclaim 27, wherein:

a seating surface at which the ultrasonic transducer or an acoustic enhancer is seated is formed at the one surface of the sound absorption unit,

wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.

45. The ultrasonic imaging apparatus according toclaim 27, wherein the first electronic circuit includes a processor configured to focus signals generated from the ultrasonic transducer.

46. The ultrasonic imaging apparatus according toclaim 27, wherein the first electronic circuit includes at least one application specific integrated circuit (ASIC).

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