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USRE47780E1 - Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus - Google Patents

Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
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USRE47780E1
USRE47780E1US15/651,187US201215651187AUSRE47780EUS RE47780 E1USRE47780 E1US RE47780E1US 201215651187 AUS201215651187 AUS 201215651187AUS RE47780 EUSRE47780 EUS RE47780E
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substrate
light
emitting elements
semiconductor light
sealing member
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Kenji Sugiura
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Abstract

A light-emitting apparatus according to the present invention includes: an elongated substrate; a plurality of LEDs arranged in a straight line on the substrate in a longitudinal direction of the substrate; and a sealing member that includes an optical wavelength converter and seals the LEDs, wherein the sealing member is formed in a straight line in a direction of arrangement of the LEDs and seals the LEDs collectively.

Description

TECHNICAL FIELD
The present invention relates to light-emitting apparatuses, backlight units, liquid crystal display apparatuses, and illumination apparatuses, and in particular, relates to a light-emitting apparatus using semiconductor light-emitting elements, for example.
BACKGROUND ART
Semiconductor light-emitting elements, such as light-emitting diodes (LEDs), are high efficiency, space-saving light sources, and in recent years have been widely used as light sources in backlights for liquid crystal display apparatuses, such as liquid crystal display televisions, and as illumination sources in illumination apparatuses.
LEDs are unitized as light-emitting apparatuses (light-emitting modules) in backlight light sources and illumination light sources.
Conventionally, a surface mount device (SMD) type light-emitting apparatus has been proposed as this sort of light-emitting apparatus. For example, Patent Literature (PTL) 1 discloses a SMD type light-emitting apparatus which uses an edge-light type backlight unit.
A conventional SMD type light-emitting apparatus1000 will be described usingFIG. 17A andFIG. 17B.FIG. 17A is a planar view of a conventional SMD type light-emitting apparatus. Moreover,FIG. 17B is a perspective view of a SMD type LED element used in a conventional SMD type light-emitting apparatus.
AsFIG. 17A shows, the conventional SMD type light-emitting apparatus1000 includes asubstrate1010 and a plurality of SMDtype LED elements1100 mounted in a line on thesubstrate1010. AsFIG. 17B shows, each SMDtype LED element1100 is a package type LED element and includes acavity1101 molded from, for example, resin, anLED1020 mounted in thecavity1101, and a sealingmember1030 made of a phosphor-containing resin injected in thecavity1101 to cover theLED1020.
CITATION LISTPatent Literature
  • [PTL 1] Japanese Unexamined Patent Application Publication No. 2006-13087
SUMMARY OF INVENTIONTechnical Problem
However, the SMD type light-emitting apparatus appears grainy when lit up as a result of the areas between neighboring SMD type LED elements being non light-emitting regions. As such, with SMD type light-emitting apparatuses, there is a problem of irregular luminance and irregular chromaticity within the light-emitting apparatus (module). It should be noted that in the present invention, “grainy” refers to an appearance, and is a degree that a plurality of LED light sources lined up can be individually identified by visual inspection.
The present invention was conceived to solve the above-described problem and aims to provide a light-emitting apparatus and such which can reduce a grainy appearance and suppress luminance irregularity while also suppressing chromatic irregularity.
Solution to Problem
In order to solve the above-described problem, an aspect of the light-emitting apparatus according to the present invention includes: an elongated substrate; a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate; and a sealing member that includes an optical wavelength converter and seals the semiconductor light-emitting elements, wherein the sealing member is formed in a straight line in a direction of arrangement of the semiconductor light-emitting elements and seals the semiconductor light-emitting elements collectively.
With this, since a portion of the light from the semiconductor light-emitting elements is reflected at the interface of the sealing member and air space in the line width direction, light in the straight line direction of the sealing member increases, and non light-emitting regions between neighboring semiconductor light-emitting elements are eliminated. This makes it possible to eliminate a grainy appearance and suppress luminance irregularity. Moreover, since the sealing member is continuously formed without break in the module, difference in chromaticity in the module due to internal diffusion can be suppressed.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that 10≤Ls/Ws, where Ls is a length of the sealing member in a straight line direction of the sealing member and Ws is a line width of the sealing member.
With this, since the line width of the sealing member can be made smaller, the light from the semiconductor light-emitting elements reflected at the interface of the sealing member and the airspace is allowed to pass between neighboring semiconductor light-emitting elements, even when the semiconductor light-emitting elements are spaced at a large pitch. This makes it possible to suppress a grainy appearance even more.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that Wc≤Lc, where Lc is a length of each of the semiconductor light-emitting elements in the straight line direction and Wc is a length of each of the semiconductor light-emitting elements in a direction perpendicular to the straight line direction.
With this, it is possible to increase the luminous flux of the light-emitting apparatus and increase the luminance.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that Wc≤Ws/4.
With this, since the sealing member is formed to have a substantially semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus (light source) is viewed from.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that 0.9≤Hs45/Hs≤1.1, where Hs is a height of the sealing member and Hs45is a length of the sealing member measured from a center of a cross section of the sealing member at 45 degree angle. Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that 0.4≤Hs/Ws≤0.6.
With this, since the sealing member is formed to have a semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus (light source) is viewed from.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the light-emitting apparatus further include two electrodes that are formed on the substrate and are for supplying power to the semiconductor light-emitting elements, wherein a first of the two electrodes is formed at a first end of the substrate in a longitudinal direction of the substrate, and a second of the two electrodes is formed at a second end of the substrate in the longitudinal direction of the substrate, and the two electrodes are formed laterally offset toward one longitudinal side of the substrate, based on the sealing member.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the sealing member be formed so that a straight line passing a center of a line width of the sealing member and a straight line passing a center of the substrate in a lateral direction of the substrate are different.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the sealing member be formed extending to both end edges of the substrate in the longitudinal direction of the substrate.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the semiconductor light-emitting elements be spaced at a uniform pitch, and two outermost semiconductor light-emitting elements among the semiconductor light-emitting elements be each positioned half the pitch length from a nearest one of the end edges of the substrate.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the semiconductor light-emitting elements be each bonded with a wire, at least a portion of each of the wires be sealed by the sealing member, and all of the wires sealed by the sealing member be provided in a same direction as a straight line direction of the sealing member.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the light-emitting apparatus further include a protective element for electrostatic protection of the semiconductor light-emitting elements, wherein the protective element is arranged in a straight line with the semiconductor light-emitting elements.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the protective element and all of the semiconductor light-emitting elements be spaced at a uniform pitch.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that a contour of an end of the sealing member have a curvature.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the protective element and each of the semiconductor light-emitting elements be bonded with a wire, at least a portion of each of the wires be sealed by the sealing member, and all of the wires sealed by the sealing member be provided in a same direction as a straight line direction of the sealing member.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the light-emitting apparatus further include a first line and a second line that are electrically connected to the semiconductor light-emitting elements, wherein the first line and the second line each have a straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate, and the sealing member is formed between the straight portion of the first line and the straight portion of the second line.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the straight portion of the first line and the straight portion of the second line be glass coated.
Furthermore, in one aspect of the light-emitting apparatus according to the present invention, it is preferable that the optical wavelength converter be a phosphor that excites light emitted by the semiconductor light-emitting elements.
Moreover, one aspect of the backlight unit according to the present invention includes the above-described light-emitting apparatus.
Furthermore, in one aspect of the backlight unit according to the present invention, it is preferable that the backlight unit further include a plurality of the light-emitting apparatuses, wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses abut each other.
Moreover, one aspect of the liquid crystal display apparatus according to the present invention includes the above-described backlight unit and a liquid crystal display panel positioned in a path of light emitted from the backlight unit.
Moreover, one aspect of the illumination apparatus according to the present invention includes the above-described light-emitting apparatus.
Furthermore, in one aspect of the illumination apparatus according to the present invention, it is preferable that the illumination apparatus further include a plurality of the light-emitting apparatuses, wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses are abutting each other.
Advantageous Effects of Invention
With the light-emitting apparatus according to the present invention, it is possible to reduce a grainy appearance and suppress chromatic irregularity while suppressing luminance irregularity.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a birds-eye view of the light-emitting apparatus according to the first embodiment of the present invention.
(a) inFIG. 2 is a planar view of the light-emitting apparatus according to the first embodiment of the present invention, (b) inFIG. 2 is a cross section along the line X-X′ in (a), and (c) inFIG. 2 is a cross section along the line Y-Y′ in (a).
FIG. 3 is an enlarged planar view of the light-emitting apparatus according to the first embodiment of the present invention.
FIG. 4A shows the luminance characteristics of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD).
FIG. 4B shows the chromatic characteristics (ax) of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD).
(a) inFIG. 5 is an enlarged planar view of a portion of the light-emitting apparatus according to the first embodiment of the present invention, and (b) inFIG. 5 is an enlarged cross sectional view of the same light-emitting apparatus.
FIG. 6 shows a plurality of the light-emitting apparatuses according to the first embodiment of the present invention lined up.
(a) inFIG. 7 is an enlarged planar view of the connecting portion of the light-emitting apparatuses according to the first embodiment of the present invention lined up in a row, and (b) inFIG. 7 is a side view thereof.
FIG. 8A is a planar view for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
FIG. 8B is a side view (a side view ofFIG. 8A) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
FIG. 8C is a cross section (a cross section ofFIG. 8A) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
(a) inFIG. 9 is a planar view of the light-emitting apparatus according to the second embodiment of the present invention, (b) inFIG. 9 is a cross section along the line X-X′ in (a), and (c) inFIG. 9 is a cross section along the line Y-Y′ in (a).
FIG. 10 shows the circuitry configuration of the light-emitting apparatus according to the second embodiment of the present invention.
FIG. 11 shows the line pattern on the light-emitting apparatus according to the second embodiment of the present invention.
FIG. 12A is a planar view for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
FIG. 12B is a side view (a side view ofFIG. 12A) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
FIG. 12C is a cross section (a cross section ofFIG. 12A) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
FIG. 13 is an exploded perspective view of the backlight unit according to the third embodiment of the present invention.
FIG. 14 is a cross section of the liquid crystal display apparatus according to the fourth embodiment of the present invention.
FIG. 15 is a perspective view of the illumination apparatus according to the fifth embodiment of the present invention with a portion thereof cut out.
FIG. 16 is a birds-eye view of the illumination apparatus according to the sixth embodiment of the present invention.
FIG. 17A is a planar view of a conventional SMD type light-emitting apparatus.
FIG. 17B is a perspective view of a SMD type LED element used in a conventional SMD type light-emitting apparatus.
DESCRIPTION OF EMBODIMENTS
Hereinafter, embodiments of the light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus according to the present invention will be described with reference to the drawings. It is to be noted that each of the embodiments described below shows a specific example of the present invention. The numerical values, shapes, materials, structural elements, the arrangement and connection of the structural elements etc. shown in the following exemplary embodiments are mere examples, and therefore do not limit the present invention, the scope of which is limited only by the appended Claims. Therefore, among the structural elements in the following exemplary embodiments, structural elements not recited in any one of the independent claims defining the most generic part of the inventive concept are described as preferred structural elements, and are not absolutely necessary to overcome the problem according to the present invention.
Moreover, in each of the drawings, the x, y, and z axes are mutually orthogonal, and in each of the embodiments, the x axis direction is the lengthwise direction of the substrate, the y axis direction a direction orthogonal to the x axis, and the z axis direction is a direction orthogonal to both the x axis and they axis. It should be noted that the dimensions and such in the drawings are not strictly accurate.
First Embodiment
First, the general structure of the light-emittingapparatus100 according to the first embodiment of the present invention will be described with reference toFIG. 1.FIG. 1 is a birds-eye view of the light-emitting apparatus according to the first embodiment of the present invention.
AsFIG. 1 shows, the light-emittingapparatus100 according to the first embodiment of the present invention is a line-shaped light source which emits light in the shape of a line, and includes a light-emittingunit110 formed in a line shape on asubstrate10 which emits a predetermined light. As will be described later, the light-emittingunit110 is made up of a plurality of LED chips arranged in a line (one dimension) and a sealing member including a phosphor.
It should be noted that the light-emittingapparatus100 according to the first embodiment is a COB (chip on board) type light-emitting apparatus in which the LED chips (bare chips) mounted directly on thesubstrate10 as sealed with a phosphor-containing resin.
Next, the structure of the light-emittingapparatus100 according to the first embodiment of the present invention will be described in detail with reference toFIG. 2.FIG. 2 is a planar view of the light-emitting apparatus according to the first embodiment of the present invention. Moreover, (b) inFIG. 2 shows a cross section (substrate longitudinal direction cross section) of the light-emitting apparatus according to the first embodiment of the present invention along the line X-X′, and (c) inFIG. 2 shows a cross section (substrate lateral direction cross section) of the light-emitting apparatus according to the first embodiment of the present invention along the line Y-Y′.
AsFIG. 2 shows, the light-emittingapparatus100 according to the first embodiment of the present invention is a LED module (light-emitting module) of a plurality of modularized LED chips, and includes asubstrate10, a plurality ofLEDs20, a sealingmember30, aline40, aprotective element50, afirst electrode61, asecond electrode62, andwiring70. Hereinafter, each structural element of the light-emittingapparatus100 will be described in detail.
First thesubstrate10 will be described. Thesubstrate10 is an elongated rectangular substrate for mounting theLEDs20. The aspect ratio L1/L2 of theelongated substrate10 preferably satisfies 10≤L1/L2, where L1 is the length of thesubstrate10 in the longitudinal direction (lengthwise direction) (longitudinal length) and L2 is the length of thesubstrate10 in the lateral direction (lateral length).
For example, a ceramic substrate made from alumina or a translucent aluminum nitride, an aluminum substrate made from aluminum alloy, a transparent glass substrate, or a flexible substrate (FPC) made from resin may be used as thesubstrate10. It should be noted that when a metal based substrate such as an aluminum substrate is used, an insulating film made from an organic material such as polyimide is formed on thesubstrate10. Additionally, in order to improve the reflectivity of the entire surface of the substrate, a white resist material (reflective film) may be formed on thesubstrate10.
In the first embodiment, a ceramic substrate made from alumina having a rectangular shape is used as thesubstrate10, where L1 is 140 mm, L2 is 5.5 mm, and the thickness thereof is 1.0 mm. Moreover, it is possible to increase L1 to 280 mm and use an even further elongated substrate.
Next, theLEDs20 will be described. The plurality ofLEDs20 are an example of the semiconductor light-emitting elements, and are mounted directly on thesubstrate10. The plurality ofLEDs20 are arranged in a single line (in a straight line shape) along the longitudinal direction of thesubstrate10. It should be noted that in the first embodiment, 24LEDs20 are arranged in a single line.
A bare chip which emits monochromatic visible light can be used for each of the LED20s, and the LED20s can be die-bonded to thesubstrate10 with a die attaching material (die bonding material). A blue LED chip which emits blue light may be used for each of the LED20s, for example. A gallium nitride semiconductor light-emitting element formed from InGaN material, for example, and having a central wavelength of 440 nm to 470 nm, can be used as the blue LED chip. It should be noted that in the first embodiment, a square blue LED chip with a side length of 346 μm is used as theLED20, but a rectangular LED chip can be used.
Furthermore, in the first embodiment, the 24LEDs20 are spaced at a uniform pitch so that the distance between neighboringLEDs20 is uniform throughout. Moreover, the twooutermost LEDs20 among theLEDs20 arranged in line are each positioned half the pitch length of theLEDs20 from the nearest lateral side edge of thesubstrate10. In other words, the distance between thefirst LED20 in the line and the nearest lateral side edge of the substrate and the distance between thelast LED20 in the line and the nearest lateral side edge of the substrate is half the pitch of the LEDs20 (½ pitch). It should be noted that in the first embodiment, the pitch of theLEDs20 is 5.85 mm.
Next, the sealingmember30 will be described. The sealingmember30 is a phosphor-containing resin which contains a phosphor that is an optical wavelength converter, and converts the wavelength of the light from theLEDs20 while sealing and protecting all of theLEDs20 on thesubstrate10 collectively The sealingmember30 is formed on thesubstrate10 in a straight line along the direction of arrangement of theLEDs20.
Furthermore, in the first embodiment, the straight line (stripe) sealingmember30 is formed so that a straight line running in the straight line direction (stripe direction) through the center of the line width (stripe width) of the sealingmember30 and a straight line running through the center of the substrate in the lateral direction (a line that connects the center of the two opposing lateral sides) are different. More specifically, as (a) inFIG. 2 shows, the sealingmember30 is formed laterally offset from a straight line running through the center of the lateral direction of thesubstrate10, toward one longitudinal side of thesubstrate10.
Moreover, the sealingmember30 extends to the vicinity of both end edges of thesubstrate10 in the longitudinal direction. In other words, the sealingmember30 is formed continuously from one end surface of the lateral side of thesubstrate10 to another end surface of the opposite lateral side of the substrate10 (seeFIG. 1).
It should be noted that when blue LEDs are used for theLEDs20, a phosphor-containing resin that is a silicon resin dispersed with yttrium aluminum garnet (YAG) yellow phosphor particles may be used as the sealingmember30 in order to achieve a white light. Moreover, in the first embodiment, the sealingmember30 is formed to have a straight line direction length of 140 mm, a line width of 1.5 mm, and a center maximum height of 0.6 mm.
As described, in the first embodiment, blue LED chips are used as theLEDs20, and a phosphor-containing resin containing yellow phosphor particles is used as the sealingmember30. With this, since the yellow phosphor particles are excited by the blue light from the LED chips and radiate a yellow light, a white light is radiated from the sealing member30 (the light-emitting unit110) due to the excited yellow light and the blue light from the LED chip.
Next, theline40 will be described. Theline40 is a conductive member and is patterned in a predetermined shape for electrically connecting each of theLEDs20. Furthermore, theline40 is patterned in a predetermined shape for electrically connecting theLEDs20 and theprotective element50. It should be noted that theline40 is electrically connected to thefirst electrode61 and thesecond electrode62.
In the first embodiment, theline40 is formed to connect all of theLEDs20 in series. Moreover, a metal line such as a tungsten (W) or copper (Cu) line having a surface plated with gold (Au), for example, can be used as theline40.
Next, theprotective element50 will be described. Theprotective element50 is an electrostatic protection element for electrostatic protection of theLEDs20. One or more of theprotective elements50 are mounted on thesubstrate10. Theprotective element50 prevents theLEDs20, which have a low reverse breakdown voltage, from being destroyed by static electricity of an opposite polarity which generates on thesubstrate10. For this reason, theprotective element50 is provided connected in parallel, in a polarity opposite that of theLEDs20. A zener diode, for example, is used as theprotective element50, and in the first embodiment, one zener diode is provided on thesubstrate10.
Next, thefirst electrode61 and thesecond electrode62 will be described. Thefirst electrode61 and thesecond electrode62 are electrode terminals (power feeding units) for connection to a power source external to the light-emittingapparatus100, and are electrically connected to theline40. Power is supplied to eachLED20 via theline40 and thewiring70 as a result of power being supplied from the external power source to thefirst electrode61 and thesecond electrode62. For example, by connecting a DC power source to thefirst electrode61 and thesecond electrode62, it is possible to supply DC electricity to eachLED20. This allows theLEDs20 to emit light, whereby a desired light is radiated from theLEDs20. It should be noted that in the first embodiment, thefirst electrode61 and thesecond electrode62 are made of gold (Au).
Furthermore, in the first embodiment, thefirst electrode61 and thesecond electrode62 are positioned opposite each other at both lateral sides. In other words, thefirst electrode61 is formed at one end of thesubstrate10 in the longitudinal direction (one lateral side end), and thesecond electrode62 is formed at the other end of thesubstrate10 in the longitudinal direction (the other lateral side end).
Moreover, thefirst electrode61 and thesecond electrode62 are formed laterally offset toward one longitudinal side of thesubstrate10 based on the sealingmember30. In other words, thefirst electrode61 and the sealingmember30 are formed aligned in the lateral direction of thesubstrate10, and thesecond electrode62 is formed, based on the sealingmember30, toward a side of the sealingmember30 on which thefirst electrode61 is formed.
Next, thewiring70 will be described. Thewiring70 is electrical wiring for electrically connecting theLEDs20 and theline40, and is, for example, gold wiring. A p-side electrode and an n-side electrode are formed on the chip of eachLED20 for supplying current, and the p-side electrode and the n-side electrode are wire-bonded to theline40 by thewiring70.
The entirety of thewiring70 is embedded in the sealingmember30, but when the size of the sealingmember30 is reduced to improve light extraction efficiency, there are cases when a portion of thewiring70 is exposed from the sealingmember30. As such, at least a portion of thewiring70 is sealed by the sealingmember30.
Moreover, in the first embodiment, all of thewiring70 sealed by the sealingmember30 is provided in a same direction as the straight line direction of the sealingmember30. In other words, all of thewiring70 connected to theLEDs20 is provided positioned in a straight line in a planar view.
Next, the functionality of the light-emittingapparatus100 according to the first embodiment of the present invention will be described in detail with reference toFIG. 3.FIG. 3 is an enlarged planar view of the light-emitting apparatus according to the first embodiment of the present invention.
As described above, the light-emittingapparatus100 according to the first embodiment of the present invention includes a sealing member30 (phosphor-containing resin) which seals theLEDs20 collectively and is formed in a straight line along the direction of arrangement of theLEDs20.
With this, the sealingmember30 is present between neighboringLEDs20 as well, which eliminates non light-emitting regions between neighboringLEDs20. In other words, asFIG. 3 shows, since a portion of the light emitted from theLEDs20 is reflected at the interface of the sealingmember30 and airspace in the direction of the line width of the sealingmember30 and continues in the sealingmember30, it is possible to increase light in the straight line direction of the sealing member30 (the longitudinal direction of the substrate10). As such, regions between neighboringLEDs20 can be made light-emitting regions, thereby eliminating a grainy appearance, and making it possible to achieve the advantageous effect of suppressing luminance irregularity.
In this case, assuming Ls is the length of the sealingmember30 in the straight line direction (length in the longitudinal direction of thesubstrate10 in the sealing member30) and Ws is the line width of the sealing member30 (length of thesubstrate10 in the lateral direction in the sealing member30), it is acceptable if Ls and Ws are appropriately set in accordance with the desired size and shape of the light-emitting apparatus, but it is preferable that 10≤Ls/Ws. It is even more preferable that 30≤Ls/Ws. For example, when Ws is in a range of 0.8 mm≤Ws 3.0 mm, by adjusting Ls to a range of 3.0 mm≤Ls≤300.0 mm, it is possible to achieve a long, thin, line-shaped sealingmember30, a stripe shape of which is long in length and narrow in width. More specifically, when L1 of thesubstrate10 is 140 mm, Ls=140 and Ws=1.4 is possible. Moreover, when L1 of thesubstrate10 is 280 mm, Ls=280 and Ws=1.4 is possible.
In this way, by making Ls and Ws satisfy 10≤Ls/Ws, it is possible to achieve an elongated sealingmember30 having a narrow line width, and as such, even when the pitch of theLEDs20 is large, the light reflected at the interface of the sealingmember30 and airspace can pass between neighboringLEDs20. This makes it possible to reduce a grainy appearance even further.
In other words, even if the sealingmember30 is formed in a straight line, a large line width and/or a large LED pitch results in a grainy appearance. Conversely, by appropriately adjusting the straight line shape of the sealingmember30 within the above-described ranges, it is possible to suppress a grainy appearance. It should be noted that in order to visually eliminate a grainy appearance, the pitch P of theLEDs20 is preferably 1.0 mm≤P≤3.0 mm. This makes it possible to improve luminance uniformity between pitches of theLEDs20.
Moreover, as described above, since the sealingmember30 which covers theLEDs20 in whole is formed in a straight line in the direction of arrangement of theLEDs20, the sealingmember30 is continuous within the module. This provides the advantageous effect that it is possible suppress difference in chromaticity in the module due to internal diffusion. In particular, it is possible to suppress chromatic unevenness in the center, which serves the most function in emitting light.
With the light-emittingapparatus100 according to the first embodiment of the present invention, it is possible to reduce a grainy appearance and suppress luminance unevenness (irregularity) while suppressing chromatic unevenness (irregularity).
Actual tests pertaining to the advantageous effects of the light-emittingapparatus100 according to the first embodiment were conducted. Hereinafter results of those tests will be described with reference toFIG. 4A andFIG. 4B.FIG. 4A shows the luminance characteristics of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD). Moreover,FIG. 4B shows the chromatic characteristics (Δx) of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD). It should be noted that inFIG. 4A andFIG. 4B, the characteristics shown in (a1) and (b1), the characteristics shown in (a2) and (b2), and the characteristics shown in (a3) and (b3) are results of measurements taken in the direction A, direction B, and direction C. Moreover, in these tests, the LED chips used in the light-emitting apparatus according to the first embodiment (COB) and the conventional light-emitting apparatus (SMD) are substantially the same.
As the bottom portion ofFIG. 4A shows, in the conventional light-emitting apparatus (SMD), luminance irregularity in each of directions A, B, and C is great. Particularly in direction C, when compared to direction A and direction B, it can be seen that luminance is uniformly low.
On the other hand, as the upper portion ofFIG. 4A shows, in the light-emitting apparatus according to the first embodiment (COB), luminance irregularity in each of the directions A, B, and C is low, and compared to the conventional light-emitting apparatus (SMD), luminance irregularity is suppressed.
In particular, with the conventional light-emitting apparatus (SMD), luminance irregularity of light emitted from the side walls increases since mounting the LEDs (SMDs) at an angle or singularity irregularity causes unevenness in wall surface thickness of the cavity unit, but with the light-emitting apparatus according to the first embodiment (COB), luminance of the light emitted from the side walls is even, not irregular. In other words, compared to the conventional light-emitting apparatus (SMD), the light-emitting apparatus according to the first embodiment (COB) is capable of reducing a grainy appearance in angles at which the light-emitting apparatus (light source) is viewed.
Moreover, as the bottom portion ofFIG. 4B shows, in the conventional light-emitting apparatus (SMD), difference in chromaticity and chromatic unevenness in each of the directions A, B, and C is large.
On the other hand, as the upper portion ofFIG. 4B shows, in the light-emitting apparatus according to the first embodiment (COB), difference in chromaticity in each of the directions A, B, and C is low, and compared to the conventional light-emitting apparatus (SMD), chromatic irregularity is suppressed.
In this way, with the light-emittingapparatus100 according to the first embodiment, it is possible to suppress luminance unevenness (irregularity) while suppressing chromatic unevenness (irregularity).
Here, luminance unevenness and chromatic unevenness is also affected by the cross-sectional shape of the sealingmember30 and the shape of theLEDs20. This point will be described with reference toFIG. 5. (a) inFIG. 5 is an enlarged planar view of a portion of the light-emitting apparatus according to the first embodiment of the present invention, and (b) inFIG. 5 is an enlarged cross sectional view of the same light-emitting apparatus.
It is preferable that We Lc, where Lc is the length (length of the LED chip) in the x axis direction (lengthwise direction of the substrate10) of the LED20 (LED chip) and Wc is the length of the LED20 (LED chip) (width of the LED chip) in they axis direction of thesubstrate10, as (a) inFIG. 5 shows. With this, it is possible to increase the luminous flux of the light-emittingapparatus100 and increases the luminance of the light-emittingapparatus100. It should be noted that luminous flux was found to increase 3% when Wc≤Lc compared to when Wc>Lc.
Furthermore, it is preferable that Wc≤Ws/4, where Ws is the length of the sealingmember30 in they axis direction of thesubstrate10. With this, it is possible to make it appear like there are no LED20s in the sealingmember30, and form the sealingmember30 to have a substantially semicircle cross sectional shape. As a result, it is possible to suppress luminance unevenness and chromatic unevenness regardless of from which angle the light-emitting apparatus100 (light source) is viewed at.
It should be noted that in order to facilitate emission of light in they axis direction and the z axis direction, it is preferable that the distance from center to center of the chips of neighboringLEDs20 be 6 mm or less. Additionally, the distance between the edges of the chips of neighboring LED20s is preferably 5.5 mm or less.
Moreover, it is preferable that 0.9≤Hs45/Hs≤1.1, where Ws is the line width of the sealingmember30, Hs is the height of the sealingmember30, and Hs45is the length (thickness) of the sealingmember30 from the center of the sealingmember30 in a yz cross section of the sealingmember30 measured at 45 degree angle, as (b) inFIG. 5 shows. Moreover, it is preferable that 0.4≤Hs/Ws≤0.6. With this, since the sealingmember30 can be formed to have a substantially semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus100 (light source) is viewed from. In particular, it is preferable that Hs45/Hs=1.0, Hs/Ws=0.5.
Moreover, in the light-emittingapparatus100 according to the first embodiment of the present invention, the sealingmember30 is formed in a straight line relative to theLEDs20 arranged in a straight line. With this, the state of the sealingmember30 formed to encompass theLEDs20 is balanced since the configuration centered around any given one of theLEDs20 is the same throughout. As such, even if a chromatic unevenness were to develop, the unevenness would be cyclic, and would not stand out, meaning it is possible to achieve a steady emission of light. It should be noted that in the case where the sealing member in a single module is formed discontinuously, when the modules are used lined up in a row, difference in chromaticity arises between the modules, and chromatic unevenness arises in the side wall direction.
Moreover, in the light-emittingapparatus100 according to the first embodiment of the present invention, thefirst electrode61 and thesecond electrode62 are formed laterally offset toward one longitudinal side of thesubstrate10 based on the sealingmember30. In this way, by positioning thefirst electrode61 and thesecond electrode62 to be offset to one side of the substrate in the lateral direction, it is possible to reduce the width of the substrate10 (lateral length) compared to when thefirst electrode61 and thesecond electrode62 are positioned on both sides. This makes it possible to realize a long, thin, line-shaped light-emitting module while keeping cost down.
Moreover, in the light-emittingapparatus100 according to the first embodiment of the present invention, all of thewiring70 sealed by the sealingmember30 is provided in a same direction as the straight line direction of the sealingmember30. With this, it is possible to form the sealingmember30 to have a stable shape.
In other words, when forming the sealingmember30, when the sealing member material is applied, the sealing member material is pulled in the line direction of thewiring70. As such, when the line direction of thewiring70 is different from the straight line direction of the sealingmember30, there are cases when the sealingmember30 cannot be made in the preferable straight line shape (stripe shape). For example, there are cases when sections of the sealingmember30 have different line widths, meaning the line width is not constant throughout. In light of this, by making the line direction of thewiring70 the same as the straight line direction of the sealingmember30, the sealing member material is only pulled in the straight line direction in the application of the sealing member material. With this, it is possible to easily form the sealingmember30 having a uniform line width.
Moreover, the light-emittingapparatus100 according to the first embodiment is very useful when extremely long light source is required, such as in roughly 1200 mm long straight tube LED lamps. This is because in the light-emittingapparatus100 according to the first embodiment, the sealingmember30 is formed all the way to both edges of thesubstrate10 in the longitudinal direction, as the light-emittingunit110 in the previously describedFIG. 1 shows. For this reason, when a number of the light-emittingapparatuses100 are connected together, the sealingmembers30 of neighboring light-emittingapparatuses100 can be connected seamlessly. As such, with this configuration, since a line-shaped light source configured of a plurality of the light-emitting units connected together can be realized, it is possible to realize a line-shaped light source greater than 1000 mm.
Here, the method of connecting the plurality of light-emittingapparatuses100 is not particularly limited. For example, possible methods include: a method of preparing a plurality of light-emittingapparatuses100 provided with fitting locations at the ends of the substrate as connecting units and fixing the substrates with fasteners while the fitting locations are overlapping, for example; a method of laying lines in a region in which the sealingmember30 is not formed from among substrates of neighboring light-emittingapparatuses100 and connecting them together with a line bridge structure; or a method of preparing a single elongated board shaped member and adhering or fastening thereon a plurality of the light-emittingapparatuses100 to form one line-shaped light source.
As described above, the method of connecting a plurality of the light-emittingapparatuses100 is not particularly limited, and may be any method which allows for the mechanical and electrical connection between the plurality of light-emitting apparatuses, and for example, when a line having the same thickness as the sealing member is used to fix the light-emitting apparatuses, there is concern that a shadowed area will develop as a result of the line and reduce the line-shaped light source properties. For this reason, when a plurality of the light-emittingapparatuses100 are connected, it is preferable to use a method which connects them without forming a shadowed area in the connection portion. More specifically, this includes a method of mechanically connecting the light-emittingapparatuses100 together using a wire substantially thinner (for example, 0.5 mm or less) than the width of the lateral direction of the sealing member, a method of forming the end portions of the light-emittingapparatuses100 so that the end portions of the substrates of neighboring light-emittingapparatuses100 overlap, and riveting the overlapping end portions thereof, and a method of fixing the substrates of the light-emittingapparatuses100 lined up together with latches such as clips.
It should be noted that it is preferable that the sealingmember30 is formed only in a single straight line without any bends. When there is a bend in the sealing member, chromatic unevenness arise in this area, but by forming the sealingmember30 into a single straight line, it is possible to suppress such chromatic unevenness. Moreover, when the sealing member is configured in a plurality of lines, re-excitation occurs between neighboring lines and chromatic irregularities develop, multiple coating processes are required to form the sealing member and difference in chromaticity develops in the module, but by forming the sealingmember30 only in a single line, it is possible to suppress the development of such chromatic irregularities and difference in chromaticity.
Next, the operational advantages of using a plurality of the light-emittingapparatuses100 according to the first embodiment of the present invention lined up in a row will be described with reference toFIG. 6.FIG. 6 shows (a portion of) a plurality of the light-emitting apparatuses according to the first embodiment of the present invention lined up. It should be noted that inFIG. 6, light-emittingapparatuses100A and100B have the same configuration as the light-emittingapparatus100 according to the first embodiment of the present invention.
When a plurality of the light-emitting apparatuses according to the first embodiment of the present invention are provided line up in a row, the plurality of light-emitting apparatuses are arranged to connect together in a lengthwise direction. For example, asFIG. 6 shows, the light-emittingapparatuses100A and100B are arranged connected together in the lengthwise direction of the light-emittingapparatuses100A and100B. In other words, a lateral side of asubstrate10A of the light-emittingapparatus100A and a lateral side of asubstrate10B of the light-emittingapparatus100B are arranged facing each other and connected to each other.
In this case, in the two neighboring light-emittingapparatuses100A and100B, afirst electrode61A of the light-emittingapparatus100A, which is a first one of the light-emitting apparatuses, and a second electrode62B of the light-emittingapparatus100B, which is a second one of the light-emitting apparatuses, are electrically connected together. In other words, the light-emittingapparatus100A and the light-emittingapparatus100B are connected in series.
Here, in the light-emittingapparatus100A (100B) according to the first embodiment, thefirst electrode61A (61B) and thesecond electrode62A (62B) are formed laterally offset toward one longitudinal side of thesubstrate10A (10B) based on the sealingmember30A (30B).
With this, since thefirst electrode61A of the light-emittingapparatus100A and the second electrode62B of the light-emittingapparatus100B are next to each other on the same side, thefirst electrode61A and the second electrode62B can easily be connected together with a desired conductive member.
Moreover, when the first electrode and the second electrode are arranged diagonally on the substrate, the positional relationship of the first electrode and the second electrode will not change even if the substrate is rotated 180 degrees. In other words, the directionality of the substrate cannot be identified by the first electrode and the second electrode alone. In this case, one of the first electrode and the second electrode is the positive electrode and the other is the negative electrode, so when the light-emitting apparatuses are aligned in a row, there are times when the alignment of the negative electrodes and the positive electrodes is off. In contrast, by arranging thefirst electrode61A (first electrode61B) and thesecond electrode62A (second electrode62B) offset to one side, like in the first embodiment, the positional relationship between thefirst electrode61A (61B) and thesecond electrode62A (62B) changes when the substrate is rotated 180 degrees. In other words, with the present embodiment, it is possible to identify the directionality of thesubstrate10A (10B) by the first electrode61 (61B) and thesecond electrode62A (62B) alone. This eliminates the chance of erroneously positioning the positive electrode and the negative electrode when lining up the light-emitting apparatuses in a row.
Moreover, in the light-emittingapparatus100A (100B) according to the first embodiment, the sealingmember30A (30B) is formed reaching both edges of thesubstrate10A (10B).
With this, when the light-emittingapparatus100A and100B are arranged next to each other like is shown inFIG. 6, the sealingmember30A and the sealingmember30B are continuously connected without break in the location where the light-emittingapparatus100A and the light-emittingapparatus100B are connected together. With this, since a non light-emitting region is eliminated in the connecting region of the light-emittingapparatus100A and the light-emittingapparatus100B, it is possible to suppress illuminance and chromatic unevenness which appears when a non light-emitting region exists between light-emitting apparatuses.
Moreover, in the first embodiment, it is preferable that the distance between the first or last LED in the row and thesubstrate10A (10B) is half the length of the pitch (½ pitch) of the LEDs in the light-emittingapparatus100A (the LEDs in the light-emittingapparatus100B).
With this, when the light-emittingapparatus100A and100B are arranged next to each other, likeFIG. 6 shows, the distance between the LED on the light-emittingapparatus100A closest to the light-emittingapparatus100B and the LED on the light-emittingapparatus100B closest to the light-emittingapparatus100A is the same as the pitch between the LEDs. Accordingly, it is possible to make the pitch uniform between all LEDs on all light-emitting apparatuses including the light-emittingapparatus100A and the light-emittingapparatus100B. This makes it possible to further suppress illuminance and chromatic unevenness between the light-emitting apparatuses.
Moreover, when the light-emittingapparatus100A and the light-emittingapparatus100B are arranged next to each other, the ends of the sealingmember30A and the sealingmember30B facing each other are preferably shaped so that a contour thereof has a curvature. This point will be described with reference toFIG. 7. (a) inFIG. 7 is an enlarged planar view of the connecting portion of the light-emitting apparatuses according to the first embodiment of the present invention lined up in a row, and (b) inFIG. 7 is a side view thereof. It should be noted that the arrows inFIG. 7 indicate the direction in which the light radiated from the end portions of the sealing member travels.
As (a) inFIG. 7 shows, when the sealingmember30A and30B are viewed in a planar view, the contour of the end of each sealing member has a curvature, which facilitates light emission in a diagonal direction. With this, it is possible to suppress a break in light when viewing the connecting portion of the light-emittingapparatus100A and100B, and possible to make the connection point of the light-emittingapparatus100A and light-emittingapparatus100B appear less visible. In this case, the contour of the ends of the sealingmember30A and30B in the planar view is preferably a circular arch, and with respect to the line width Ws of the sealingmember30, the radius R1of the curvature of the circular arc is preferably R1=Ws/2.
Moreover, as (b) inFIG. 7 shows, when the sealingmember30A and30B are viewed from the side, the contour of the end of each sealing member has a curvature, which facilitates light emission in an upward, diagonal direction. With this, it is possible to suppress a break in light when viewing the connecting portion of the light-emittingapparatus100A and100B, and possible to make the connection point of the light-emittingapparatus100A and light-emittingapparatus100B appear less visible. In this case, the contour of the ends of the sealingmember30A and30B in the side view is preferably a circular arch, and with respect to the height Hs of the sealingmember30, the radius R2of the curvature of the circular arc is preferably R2=Hs.
In this way, by making the ends of the sealingmember30A and30B into a semispherical shape, it is possible to prevent a discontinuity in light between neighboring light-emittingapparatuses100A and100B from occurring. It should be noted that the sealing members may be formed using a dispenser in order to provide each of the ends of the sealing members with a contour having a curvature like described above. In other words, a dispenser may be used to deposit the resin material for the sealing member in a straight line in order to easily give the edges of the sealing members a contour having a curvature.
Next, the method of forming the sealing member in the light-emittingapparatus100 according to the first embodiment of the present invention will be described with reference toFIG. 8A throughFIG. 8C.FIG. 8A throughFIG. 8C illustrate the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention, whereFIG. 8A is a planar view,FIG. 8B is a side view, andFIG. 8C is a cross sectional view.
The sealingmember30 can be applied using a dispenser. AsFIG. 8A throughFIG. 8C show, adischarge nozzle600 of the dispenser is positioned facing a given position on thesubstrate10 and is driven to move in the longitudinal direction of thesubstrate10 while dispensing the sealing member material (phosphor-containing resin). At this time, the sealing member material is dispensed to cover theLEDs20, theline40, and thewiring70.
In the first embodiment, the sealing member material is applied in a single application operation from one lateral side end of thesubstrate10 to the other lateral side end. By applying the sealing member material in one application operation, it is possible to suppress the occurrence of difference in chromaticity, for example, within the module, as described above.
It should be noted that after the sealing member material is applied, the sealing member material is hardened according to a given method. With this, it is possible to form the sealingmember30 to have a given shape.
Second Embodiment
Next, the light-emitting apparatus200 according to the second embodiment of the present invention will be described in detail with reference toFIG. 9. (a) inFIG. 9 is a planar view of the light-emitting apparatus according to the second embodiment of the present invention. Moreover, (b) inFIG. 9 shows a cross section (substrate longitudinal direction cross section) of the light-emitting apparatus according to the second embodiment of the present invention along the line X-X′, and (c) inFIG. 9 shows a cross section (substrate lateral direction cross section) of the light-emitting apparatus according to the second embodiment of the present invention along the line Y-Y′.
The basic structure of the light-emitting apparatus200 according to the second embodiment of the present invention is the same as the light-emittingapparatus100 according to the first embodiment of the present invention. The line pattern and positioning of the protective element in the light-emitting apparatus200 according to the second embodiment is different from the light-emittingapparatus100 according to the first embodiment of the present invention. All other structures are basically the same. Accordingly, inFIG. 9, structural elements that are the same as the structural elements shown inFIG. 2 share the same reference numbers. Additionally, detailed description thereof will be omitted.
As (a) through (c) inFIG. 9 show, compared to the light-emittingapparatus100 according to the first embodiment of the present invention, the light-emitting apparatus200 according to the second embodiment of the present invention additionally includes afirst line41 and asecond line42.
Similar to theline40, thefirst line41 and thesecond line42 are electrically connected to the plurality ofLEDs20 and theprotective element50, and are patterned into a given shape on thesubstrate10. Here, theline40 is a line for connecting the LEDs in series, and similar to the first embodiment, is patterned to connect a plurality of the LEDs20 (3LEDs20 in the second embodiment) in series. On the other hand, thefirst line41 and thesecond line42 are lines for connecting LEDs in parallel, and are patterned to connect, in parallel, theLEDs20 connected in series by theline40. Moreover, thefirst line41 and thesecond line42 are patterned to also connect theLEDs20 and theprotective element50 in parallel.
Here, the configuration of the circuitry for theLEDs20 and theprotective element50 connected by theline40, thefirst line41, and thesecond line42 will be discussed with reference toFIG. 10.FIG. 10 shows the circuitry configuration of the light-emitting apparatus according to the second embodiment of the present invention.
The configuration of the circuitry for theLEDs20 and theprotective element50 in the light-emitting apparatus200 according to the second embodiment of the present invention is such that, asFIG. 10 shows, groups of three of theLEDs20 connected in series are connected together in parallel, and the groups of threeLEDs20 connected in series are connected in parallel to theprotective element50.
Next, the line pattern of theline40, thefirst line41, and thesecond line42 will be described with reference toFIG. 11.FIG. 11 shows the line pattern on the light-emitting apparatus according to the second embodiment of the present invention.
AsFIG. 11 shows, thefirst line41 and thesecond line42 include astraight portion41a and42a, respectively, which have a straight line shape and are the main lines running along the longitudinal direction of thesubstrate10.
Furthermore, thefirst line41 includes an extendingportion41b which extends from thestraight portion41a toward thestraight portion42a of thesecond line42, that is to say, extends in the lateral direction of thesubstrate10. Moreover, thesecond line42 includes an extendingportion42b which extends from thestraight portion42a toward thestraight portion41a of thefirst line41, that is to say, extends in the lateral direction of thesubstrate10.
Thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42 are formed to be substantially parallel to the longitudinal direction of thesubstrate10. Theline40 patterned in a given shape is formed along the longitudinal direction of thesubstrate10 between thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42. The extendingportion41b of thefirst line41 and the extendingportion42b of thesecond line42 are formed to connect three of theLEDs20 in series along with theline40, and also function as bonding pads.
Moreover, in the second embodiment, regions on thesubstrate10 excluding thefirst electrode61, thesecond electrode62, and the wire boding region are glass coated. Consequently, at least thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42 are glass coated. It should be noted that in the second embodiment, a glass coat film having a film thickness of approximately 40 μm is deposited.
Returning toFIG. 9, the sealingmember30 is formed between thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42. Since the distance (separation width) between thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42 is approximately the same as the line width of the sealingmember30, the sealingmember30 is formed by being applied along thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42. In this way, thefirst line41 and thesecond line42 are patterned on thesubstrate10 so that the line width of the sealingmember30 is a predetermined width.
TheLEDs20 are positioned between eachline40, between theline40 and the extendingportion41b, and between theline40 and the extendingportion42b. TheLEDs20, theline40, and the extendingportion41b or the extendingportion42b are bonded by thewiring70.
In the second embodiment, theprotective element50 is positioned between thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42, and positioned between the extendingportion41b and the extendingportion42b formed in the center of thesubstrate10. Theprotective element50 and the extendingportion41b or the extendingportion42b are bonded by thewiring70.
It should be noted that in the second embodiment, theprotective element50 is arranged in a straight line with theLEDs20. In other words, theprotective element50 and all of theLEDs20 are arranged in a single line. All of the wiring bonded to theprotective element50 and theLEDs20 is provided in a same direction as the straight line direction of the sealingmember30.
With this, the light-emitting apparatus200 according to the second embodiment of the present invention is capable of achieving the same functionality as the first embodiment.
Furthermore, in the second embodiment, theprotective element50 is arranged in a single line along with theLEDs20, and theprotective element50, along with theLEDs20, is sealed by the sealingmember30 collectively.
With this, it is possible to protect both theLEDs20 and theprotective element50 by sealing them with resin at the same time.
Moreover, in the second embodiment, all of the wiring bonded to theprotective element50 and theLEDs20 is provided in a same direction as the straight line direction of the sealingmember30.
With this, it is possible to easily form the sealingmember30 having a uniform line width, and possible to form the sealingmember30 having a stable shape, similar to the first embodiment.
It should be noted that in the second embodiment, it is preferable that these elements, including theprotective element50 and all of theLEDs20, are spaced at the same pitch.
With this, since it is possible to make the changes in wettability of the sealingmember30, which is made from resin, occur in regular intervals in the straight line direction of the sealingmember30, it is possible maintain an even shape, such as the thickness, of the sealingmember30 in the straight line direction when applying the sealing member material. With this, it is possible to suppress chromatic unevenness even in long, thin, line-shaped light sources that are elongated.
Next, the method of forming the sealing member in the light-emitting apparatus200 according to the second embodiment of the present invention will be described with reference toFIG. 12A throughFIG. 12C.FIG. 12A throughFIG. 12C illustrate the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention, whereFIG. 12A is a planar view,FIG. 12B is a side view, andFIG. 12C is a cross sectional view.
Similar to the first embodiment, the sealingmember30 can be applied using a dispenser in the second embodiment as well. In other words, asFIG. 12A throughFIG. 12C show, thedischarge nozzle600 of the dispenser is positioned facing a given position on thesubstrate10 and is driven to move in the longitudinal direction of thesubstrate10 while dispensing the sealing member material (phosphor-containing resin). It should be noted that in the second embodiment, the sealing member material is applied in a single application operation from one lateral side end of thesubstrate10 to the other lateral side end.
In the second embodiment, the sealing member material is applied on the region between thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42. At this time, the lateral spread of thesubstrate10 is restricted by thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42, and the sealing member material can be kept from overflowing beyond thestraight portion41a and thestraight portion42a. In this way, with the second embodiment, it is possible to easily form the sealingmember30 having an even line width since it is possible to determine the application shape of the sealing member material with thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42, which are substantially parallel. With this, it is possible to suppress difference in chromaticity in the light-emitting apparatus. Moreover, when a plurality of the light-emitting apparatuses are used lined up in a row, it is possible to suppress chromatic irregularity between the light-emitting apparatuses.
Moreover, since the lateral spread of the sealing member material on thesubstrate10 can be restricted by thestraight portion41a and thestraight portion42a, it is possible to easily form the sealingmember30 having a narrow line width. Consequently, even when the pitch between theLEDs20 is large, it is possible to further suppress a grainy appearance.
Moreover, since the lateral spread of the sealing member material on thesubstrate10 can be restricted by thestraight portion41a and thestraight portion42a, it is possible to easily form the sealingmember30 having a narrow line width even when the sealing member material is not very thixotropic and highly fluid. In this way, there is a wide selection of options for the sealing member material.
Moreover, by restricting the lateral spread of the sealing member material on thesubstrate10 with thestraight portion41a and thestraight portion42a, asFIG. 12C shows, it is possible to form the surface of the sealingmember30 to have a desired curved surface, and possible to configure the sealingmember30 to have a curved contour in a cross section in the lateral direction. For example, it is possible to configure the sealingmember30 to have a circular arch curved contour in a cross section in the lateral direction. With this, it is possible to increase the light extraction efficiency from the sealingmember sealing member30 and improve the dissipation of heat generated by theLEDs20. In this case, by restricting the lateral spread of the sealing member material on thesubstrate10, it is possible to obtain a sealingmember30 of a desired height without increasing the amount of sealing member material applied.
It should be noted that like in the second embodiment, it is possible to increase the thickness of thestraight portion41a and thestraight portion42a by glass coating thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42. With this, the sealing member material can be even more effectively kept from overflowing beyond thestraight portion41a and thestraight portion42a.
Moreover, in the second embodiment, thestraight portion41a of thefirst line41 and thestraight portion42a of thesecond line42 are glass coated, but the coating is not limited thereto. For example, a plating process may be performed on thestraight portion41a and thestraight portion42a to form a plating layer thereon and thicken thestraight portion41a and thestraight portion42a.
Third Embodiment
Hereinafter, application of the light-emitting apparatus according to the first and second embodiments will be discussed based on the third through fifth embodiments.
First, an example of the light-emitting apparatus according to the first and second embodiments of the present invention applied to a backlight unit for liquid crystal display apparatuses will be described with reference toFIG. 13.FIG. 13 is an exploded perspective view of the backlight unit according to the third embodiment of the present invention.
AsFIG. 13 shows, thebacklight unit300 according to the third embodiment of the present invention is an edge light type backlight unit with the light source positioned to the sides of the light guide plate, and includes achassis310, a reflective sheet320, alight guide plate330, a light-emittingapparatus340, anoptical sheet group350, and afront frame360.
Thechassis310 has a flat, box shape, and is formed by pressing a steel plate made from stainless steel, for example. Thechassis310 has anopening311 on the bottom surface, and aflange portion312 is formed around the edge of the opening of thechassis310. Fastener holes313 are formed on theflange portion312 for fastening to thefront frame360.
The reflective sheet320 is a sheet made from polyethylene terephthalate (PET), for example, and passes white light from the light-emittingapparatus340 to the inside of thelight guide plate330 while reflecting the white light.
Thelight guide plate330 is a sheet made from polycarbonate (PC) or acryl, for example, and printed on the main surface (rear surface) thereof on the side facing the reflective sheet320 and opposite the light exiting surface (front surface) thereof is a dot pattern, which includes lighting elements for diffusing light entering thelight guide plate330 and emitting the light from the light exiting surface. Prism shapes or light scattering elements such as light scattering structures formed by being printed or applied on the rear surface of thelight guide plate330, or light scatting elements formed inside thelight guide plate330, for example, are used as the lighting elements.
Theoptical sheet group350 is configured of a diffusion sheet351, aprism sheet352, and apolarized sheet353, all having the same size and the same planar shape (rectangular shape). The diffusion sheet351 is a film made from PET or a film made from PC, for example. Theprism sheet352 is a sheet made from polyester, for example, and a restrictive prism pattern is formed from acryl resin on one side. A film made from polyethylene naphthalate, for example, is used as thepolarized sheet353.
Thefront frame360 is fixed to theflange portion312 of thechassis310 byfastening fasteners361 through the fastener holes313 on thechassis310. Thefront frame360 holds thelight guide plate330 and theoptical sheet group350 to thechassis310.
The light-emittingapparatus340 is the light-emitting apparatus according to the above-described first and second embodiments. In the third embodiment, four of the light-emitting apparatuses are used, and each are equipped with aheat sink370. The four light-emitting apparatuses are arranged such that the substrates of the light-emitting apparatuses are abutting each other, asFIG. 6 shows. It should be noted that the light-emittingapparatuses340 equipped with theheat sinks370 are arranged so that the light exiting surfaces thereof face the side of thelight guide plate330.
Theheat sink370 holds the light-emittingapparatus340 and is aluminum drawn into an L shape (angle material), for example. Theheat sink370 is fixed to thechassis310 with a fastener, for example.
Since thebacklight unit300 according to the third embodiment of the present invention uses the light-emitting apparatus according to the first and second embodiments of the present invention, it is possible to realize a backlight unit having a highly uniform luminance wherein luminance irregularity is suppressed.
Fourth Embodiment
Next, an example of the light-emitting apparatus according to the first and second embodiments of the present invention applied to a liquid crystal display apparatus will be described with reference toFIG. 14.FIG. 14 is a cross section of the liquid crystal display apparatus according to the fourth embodiment of the present invention.
AsFIG. 14 shows, the liquidcrystal display apparatus400 according to the fourth embodiment of the present invention is, for example, a liquid crystal television or liquid crystal monitor, and includes a liquidcrystal display panel410, abacklight unit420 positioned behind the liquidcrystal display panel410, and ahousing430 which houses the liquidcrystal display panel410 and thebacklight unit420.
In the fourth embodiment, the above-described backlight unit according to the third embodiment of the present invention is used as thebacklight unit420. Moreover, thebacklight unit420 is equipped with a light-emittingapparatus421, which is a line-shaped light source. The light-emittingapparatuses100 and200 according to the first and second embodiments of the present invention can be used as the light-emittingapparatus421.
Since the liquidcrystal display apparatus400 according to the fourth embodiment of the present invention uses thebacklight unit420 in which chromatic and luminance irregularities are suppressed, it is possible to realize a high contrast, high luminance liquid crystal display apparatus with superior display properties.
Fifth Embodiment
Next, an example of the light-emitting apparatus according to the first and second embodiments of the present invention applied to an illumination apparatus will be described with reference toFIG. 15.FIG. 15 is a perspective view of the illumination apparatus according to the fifth embodiment of the present invention with a portion thereof cut out.
Theillumination apparatus500 according to the fifth embodiment of the present invention is an LED lamp provided with the light-emitting apparatus according to the first and second embodiments of the present invention, and asFIG. 15 shows, is comparable to a straight tube fluorescent lamp used for general purpose lighting.
Theillumination apparatus500 according to the fifth embodiment includes astraight tube510 formed of an elongated glass tube, a light-emittingapparatus520 located inside thestraight tube510, a base540 attached to both ends of thestraight tube510 and including a pair of base pins530, an adhesive (not pictured) for adhering (fixing) the light-emittingapparatus520 fitted to thestraight tube510, and light circuitry (not pictured) which receives power via thebase540 and causes the LED chips on the light-emittingapparatus520 to emit light. It should be noted that the light circuitry may be provided in the lighting fixture external to the LED lamp. The light-emittingapparatuses100 and200 according to the first and second embodiments of the present invention can be used as the light-emittingapparatus520. Moreover, in the fifth embodiment, a plurality of the light-emittingapparatuses520 are used, and asFIG. 6 shows, are arranged such that the substrates of the light-emitting apparatuses abut each other.
Since theillumination apparatus500 according to the fifth embodiment of the present invention uses the light-emitting apparatus according to the first and second embodiments of the present invention, it is possible to realize an illumination apparatus void of luminance irregularities.
Sixth Embodiment
Next, the sixth embodiment of the present invention will be described with reference toFIG. 16.FIG. 16 is a birds-eye view of the illumination apparatus according to the sixth embodiment of the present invention. The sixth embodiment is an example of the light-emittingapparatus100 according to the previously described first embodiment applied as an illumination light source for the illumination apparatus. It should be noted that the light-emitting apparatus200 according to the second embodiment may also be applied to the sixth embodiment.
AsFIG. 16 shows, theillumination apparatus1 according to the sixth embodiment is a base light and includes: the light-emittingapparatus100, alighting fixture2, and a fixingmember3 for fixing the light-emittingapparatus100 to thelighting fixture2. The light-emittingapparatus100 is directly mounted to both the fixingmember3 and thelighting fixture2.
Thelighting fixture2 is equipped with light circuitry and such for controlling the lighting of the light-emittingapparatus100. Moreover, thelighting fixture2 includes fastener holes which correspond to the through-holes in the fixingmember3. In other words, the positions of the through-holes in the fixingmember3 match with the positions of the fastener holes in thelighting fixture2. Thelighting fixture2 can be shaped by press forming, for example, a sheet of aluminum or steel, and is directly mounted to a ceiling, for example.
The fixingmember3 is an elongated substrate. For example, an elongated metal based substrate such as an aluminum substrate can be used for the fixingmember3. The fixingmember3 is provided with a plurality of through-holes, and when the fixingmember3 and thelighting fixture2 are to be fixed together, the through-holes of the fixingmember3 and the fastener holes of thelighting fixture2 line up,fasteners4 are placed in the through-holes, and thefasteners4, the through-holes, and the fastener holes are fastened together.
In the sixth embodiment, the through-holes are alternately provided on the longitudinal sides of the fixingmember3. For example, asFIG. 16 shows, it is possible to provide four through-holes on one longitudinal side of the fixingmember3, and provide three through-holes on the other longitudinal side of the fixingmember3 in locations not directly across from the through-holes provided on the other side. The fixing method of the fixingmember3 and the light-emittingapparatus100 is not particularly limited to a single method. For example, the fixingmember3 and the light-emittingapparatus100 may be fixed together with an adhesive, for example.
While it is not pictured in the Drawings, it should be noted that a transparent cover may be provided to cover the light-emittingapparatus100. Moreover, a plurality of the light-emittingapparatuses100 may be provided in one illumination apparatus. In this case, a plurality of the light-emittingapparatuses100 may be fixed to one fixingmember3, or one fixingmember3 to which one light-emittingapparatus100 is fixed may be provided in plurality on thelighting fixture2. Moreover, in the sixth embodiment, the through-holes on the fixingmember3 are provided on both longitudinal sides of the substrate, but the through-holes may be provided on just one longitudinal side. Moreover, in the sixth embodiment, fastener holes are formed by providing through-holes in the fixingmember3, but cut-out portions instead of throughholes may be provided as a structure for allowing the passage of thefasteners4. For example, it is possible to provide semicircle cut-outs along a longitudinal side of the fixingmember3 and fasten the fasteners using these cut-outs. Moreover, a standardized member may be used as the fixingmember3.
Furthermore, in the sixth embodiment, the light-emittingapparatus100 is fixed to the fixingmember3, and this is attached to thelighting fixture2 as a module, but the fixingmember3 itself may be used as thesubstrate10 of the light-emittingapparatus100. In other words, thesubstrate10 of the light-emittingapparatus100 may be configured to function as the fixingmember3 as well, and the light-emittingapparatus100 may be directly attached to thelighting fixture2 without the use of the fixingmember3. In this case, thesubstrate10 of the light-emittingapparatus100 may be provided with fastening through-holes or cut-outs for fixing with fasteners.
Heretofore, the light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus according to the present invention has been described based on the first through sixth exemplary embodiments, but the scope of the present invention is not limited thereto. For example, the present invention also includes embodiment variants conceived by those skilled in the art unless they depart from the spirit and scope of the present invention. Moreover, embodiments resulting from arbitrary combinations of constituent elements of different exemplary embodiments are intended to be included within the scope of the present invention as long as these do not depart from the essence of the present invention.
Moreover, in the above exemplary embodiments, as an application example of the light-emitting apparatus, application to a backlight unit, liquid crystal display apparatus, or illumination apparatus is described, but application of the light-emitting apparatus is not limited to these examples. Other applications include, for example, a lamp source in a photocopier, an emergency exit light, or a light in a billboard apparatus. Furthermore, the light-emitting apparatus can also be used as a light source in industrial applications such as a line light source for inspection purposes.
Moreover, in the above exemplary embodiments, each light-emitting apparatus is configured of blue light LEDs and yellow phosphors in order to radiate a white light, but this configuration is not limiting. For example, a phosphor-containing resin containing red phosphors or green phosphors may be used in conjunction with blue light LEDs to radiate a white light. Moreover, LEDs which emit a light other than blue light may be used.
Moreover, in the above exemplary embodiments, the semiconductor light-emitting elements used in each light-emitting apparatus are LEDs, but the semiconductor light-emitting elements used may be semiconductor lasers, organic electro luminescence (EL) or inorganic EL light-emitting elements.
INDUSTRIAL APPLICABILITY
The present invention can be widely applied to light-emitting apparatuses using semiconductor light-emitting elements such as LEDs as a light source, backlight units, liquid crystal display apparatuses, illumination apparatuses such as straight tube fluorescent lamps, emergency exit lamps, or electronic devices such as photocopiers, or in industrial applications such as line light sources for inspection purposes.
REFERENCE SIGNS LIST
  • 1 illumination apparatus
  • 2 lighting fixture
  • 3 fixing member
  • 4 fastener
  • 10,10A,10B,1010 substrate
  • 20,1020 LED
  • 30,30A,30B,1030 sealing member
  • 40 line
  • 41 first line
  • 41a,42a straight portion
  • 41b,42b extending portion
  • 42 second line
  • 50 protective element
  • 61,61A,61B first electrode
  • 62,62A,62B second electrode
  • 70 wiring
  • 100,200,100A,100B,340,421,520,1000 light-emitting apparatus
  • 110 light-emitting unit
  • 300,420 backlight unit
  • 310 chassis
  • 311 opening
  • 312 flange portion
  • 313 fastener hole
  • 320 reflective sheet
  • 330 light guide plate
  • 350 optical sheet group
  • 351 diffusion sheet
  • 352 prism sheet
  • 353 polarized sheet
  • 360 front frame
  • 361 fastener
  • 370 heat sink
  • 400 liquid crystal display apparatus
  • 410 liquid crystal display panel
  • 430 housing
  • 500 illumination apparatus
  • 510 straight tube
  • 530 base pin
  • 540 base
  • 600 discharge nozzle
  • 1100 SMD type LED element
  • 1101 cavity

Claims (30)

The invention claimed is:
1. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate;
two electrodes provided on the substrate on a same side of the substrate as the semiconductor light-emitting elements and that supply power to the plurality of semiconductor light-emitting elements; and
a sealing member that includes an optical wavelength converter and that seals the semiconductor light-emitting elements, the electrodes being disposed externally of the sealing member,
wherein the sealing member extends along a straight line in a direction of arrangement of the semiconductor light-emitting elements, extends in the longitudinal direction of the substrate, to both end edges of the substrate, is spaced from each longitudinal edge of the substrate and seals the semiconductor light-emitting elements collectively,
wherein the semiconductor light-emitting elements are spaced at a uniform pitch length, and
wherein two outermost semiconductor light-emitting elements, among the semiconductor light-emitting elements, are each positioned half the pitch length from a nearest one of the end edges of the substrate.
2. The light-emitting apparatus according toclaim 1,
wherein a first of the two electrodes is provided at a first end of the substrate in a longitudinal direction of the substrate, and a second of the two electrodes is provided at a second end of the substrate in the longitudinal direction of the substrate, and the two electrodes are laterally offset toward one longitudinal side of the substrate with respect to a longitudinal centerline of the substrate.
3. The light-emitting apparatus according toclaim 2, A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate;
two electrodes provided on the substrate on a same side of the substrate as the semiconductor light-emitting elements and that supply power to the plurality of semiconductor light-emitting elements; and
a sealing member that includes an optical wavelength converter and that seals the semiconductor light-emitting elements, the electrodes being disposed externally of the sealing member,
wherein the sealing member extends along a straight line in a direction of arrangement of the semiconductor light-emitting elements, extends in the longitudinal direction of the substrate, to both end edges of the substrate, is spaced from each longitudinal edge of the substrate and seals the semiconductor light-emitting elements collectively, and
wherein the sealing member is configured so that a longitudinal centerline of the sealing member does not overlap the longitudinal centerline of the substrate.
4. The light-emitting apparatus according toclaim 1,
wherein the semiconductor light-emitting elements are spaced at a uniform pitch length, and
two outermost semiconductor light-emitting elements, among the semiconductor light-emitting elements, are each positioned half the pitch length from a nearest one of the end edges of the substrate.
5. The light-emitting apparatus according toclaim 1,
wherein the semiconductor light-emitting elements are each bonded with a wire, at least a portion of each of the wires is sealed by the sealing member, and all of the wires sealed by the sealing member are provided in a same direction as a straight line direction of the sealing member.
6. The light-emitting apparatus according toclaim 1, further comprising A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate;
two electrodes provided on the substrate on a same side of the substrate as the semiconductor light-emitting elements and that supply power to the plurality of semiconductor light-emitting elements;
a sealing member that includes an optical wavelength converter and that seals the semiconductor light-emitting elements, the electrodes being disposed externally of the sealing member, and
a protective element for electrostatic protection of the semiconductor light-emitting elements,
wherein the sealing member extends along a straight line in a direction of arrangement of the semiconductor light-emitting elements, extends in the longitudinal direction of the substrate, to both end edges of the substrate, is spaced from each longitudinal edge of the substrate and seals the semiconductor light-emitting elements collectively, and
wherein the protective element is arranged in a straight line with the semiconductor light-emitting elements.
7. The light-emitting apparatus according toclaim 6,
wherein the protective element and the semiconductor light-emitting elements are spaced at a uniform pitch.
8. The light-emitting apparatus according toclaim 6,
wherein the protective element and each of the semiconductor light-emitting elements are bonded with a wire, at least a portion of each of the wires is sealed by the sealing member, and
all of the wires sealed by the sealing member are provided in a same direction as a straight line direction of the sealing member.
9. The light-emitting apparatus according toclaim 1,
wherein the optical wavelength converter is a phosphor that excites light emitted by the semiconductor light-emitting elements.
10. An illumination apparatus comprising the light-emitting apparatus according toclaim 1.
11. The illumination apparatus according toclaim 10, further comprising:
a plurality of the light-emitting apparatuses,
wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses abut each other.
12. The light-emitting apparatus according toclaim 1,
wherein a contour of an end of the sealing member has a curvature in a planar view.
13. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate; and
a sealing member that includes an optical wavelength converter and that seals the semiconductor light-emitting elements collectively,; and
a first line and a second line that are electrically connected to the semiconductor light-emitting elements,
wherein the semiconductor light-emitting elements are each bonded with a wire, at least a portion of each of the wires is sealed by the sealing member, and all of the wires sealed by the sealing member extend in a same direction as a straight line direction of the sealing member,
wherein the first line and the second line each have a straight portion on the substrate extending substantially parallel to the longitudinal direction of the substrate, and the sealing member extends between and is restricted in width by the straight portion of the first line and the straight portion of the second line.
14. The light-emitting apparatus according toclaim 13,
wherein the straight portion of the first line and the straight portion of the second line are glass coated.
15. The light-emitting apparatus according toclaim 13,
wherein the sealing member extends to both end edges of the substrate in the longitudinal direction of the substrate.
16. The light-emitting apparatus according toclaim 15,
wherein a contour of an end of the sealing member has a curvature in a planar view.
17. The light-emitting apparatus according toclaim 13,
further comprising:
two electrodes that are provided on the substrate on the same side as the semiconductor light-emitting elements, are external of the sealing member and supply power to the plurality of semiconductor light-emitting elements.
18. The light-emitting apparatus according toclaim 17,
wherein a first of the two electrodes is provided at a first end of the substrate in a longitudinal direction of the substrate, and a second of the two electrodes is provided at a second end of the substrate in the longitudinal direction of the substrate, and the two electrodes are laterally offset toward one longitudinal side of the substrate with respect to a longitudinal centerline of the substrate.
19. An illumination apparatus comprising the light-emitting apparatus according toclaim 13.
20. The illumination apparatus according toclaim 19, further comprising:
a plurality of the light-emitting apparatuses,
wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses abut each other.
21. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged on the substrate in a longitudinal direction of the substrate;
two electrodes provided on the substrate on a same side of the substrate as the plurality of semiconductor light-emitting elements and that supply power to the plurality of semiconductor light-emitting elements;
a conductor line disposed on the substrate in the longitudinal direction of the substrate for connecting the plurality of semiconductor light-emitting elements in series;
a first conductor line disposed on the substrate for connecting the plurality of semiconductor light-emitting elements in parallel, the first conductor line including a first straight portion in the longitudinal direction of the substrate;
a second conductor line disposed on the substrate for connecting the plurality of semiconductor light-emitting elements in parallel, the second conductor line including a second straight portion in the longitudinal direction of the substrate; and
sealing material that includes an optical wavelength converter and that seals the plurality of semiconductor light-emitting elements, the two electrodes being disposed externally of the sealing material,
wherein the sealing material extends along a straight line in a direction of arrangement of the plurality of semiconductor light-emitting elements, extends in the longitudinal direction of the substrate, towards both end edges of the substrate, is spaced from each longitudinal edge of the substrate and seals the plurality of semiconductor light-emitting elements, and
wherein the plurality of semiconductor light-emitting elements and the conductor line are disposed between the first straight portion and the second straight portion.
22. The light-emitting apparatus according to claim 21,
wherein the sealing material comprises a sealing member.
23. The light-emitting apparatus according to claim 21,
wherein the plurality of semiconductor light-emitting elements are arranged in a straight line.
24. The light-emitting apparatus according to claim 21,
wherein the first conductor line includes a first extending portion which extends from the first straight portion toward the second straight portion of the second line, and
the second conductor line includes a second extending portion which extends from the second straight portion toward the first straight portion of the first line.
25. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged on the substrate in a longitudinal direction of the substrate;
two electrodes provided on the substrate on a same side of the substrate as the plurality of semiconductor light-emitting elements and that supply power to the plurality of semiconductor light-emitting elements;
a conductor line disposed on the substrate in the longitudinal direction of the substrate for connecting the plurality of semiconductor light-emitting elements in series;
a first conductor line disposed on the substrate for connecting the plurality of semiconductor light-emitting elements in parallel, the first conductor line including a first straight portion in the longitudinal direction of the substrate;
a second conductor line disposed on the substrate for connecting the plurality of semiconductor light-emitting elements in parallel, the second conductor line including a second straight portion in the longitudinal direction of the substrate; and
a sealing member that includes an optical wavelength converter and that seals the plurality of semiconductor light-emitting elements, the two electrodes being disposed externally of the sealing member,
wherein the sealing member extends along a straight line in a direction of arrangement of the plurality of semiconductor light-emitting elements, extends in the longitudinal direction of the substrate, towards both end edges of the substrate, is spaced from each longitudinal edge of the substrate and seals the plurality of semiconductor light-emitting elements, and
wherein the plurality of semi-conductor light-emitting elements and the conductor line are disposed between the first straight portion and the second straight portion.
26. The light-emitting apparatus according to claim 25,
wherein the sealing member extends continuously along the straight line.
27. The light-emitting apparatus according to claim 25,
wherein the plurality of semiconductor light-emitting elements are arranged in a straight line.
28. The light-emitting apparatus according claim 25,
wherein the first conductor line includes a first extending portion which extends from the first straight portion toward the second straight portion of the second line, and
the second conductor line includes a second extending portion which extends from the second straight portion toward the first straight portion of the first line.
29. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged on the substrate in a longitudinal direction of the substrate;
a conductor line disposed on the substrate in the longitudinal direction of the substrate for electrically connecting the plurality of semiconductor light-emitting elements in series;
a first conductor line disposed on the substrate for electrically connecting the plurality of semiconductor light-emitting elements in parallel, the first conductor line including a first straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate;
a second conductor line disposed on the substrate for electrically connecting the plurality of semiconductor light-emitting elements in parallel, the second conductor line including a second straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate;
sealing material that includes an optical wavelength converter and that seals the plurality of semiconductor light-emitting elements, wherein the sealing material extends between and is restricted in width by the first straight portion of the first line and the second straight portion of the second line,
wherein the plurality of semiconductor light-emitting elements and the conductor line are disposed between the first straight portion and the second straight portion.
30. A light-emitting apparatus comprising:
an elongated substrate;
a plurality of semiconductor light-emitting elements arranged on the substrate in a longitudinal direction of the substrate;
a conductor line disposed on the substrate in the longitudinal direction of the substrate for electrically connecting the plurality of semiconductor light-emitting elements in series;
a first conductor line disposed on the substrate for electrically connecting the plurality of semiconductor light-emitting elements in parallel, the first conductor line including a first straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate;
a second conductor line disposed on the substrate for electrically connecting the plurality of semiconductor light-emitting elements in parallel, the second conductor line including a second straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate;
a sealing member that includes an optical wavelength converter and that seals the plurality of semiconductor light-emitting elements, wherein the sealing member extends between and is restricted in width by the first straight portion of the first line and the second straight portion of the second line,
wherein the plurality of semiconductor light-emitting elements and the conductor line are disposed between the first straight portion and the second straight portion.
US15/651,1872011-04-202012-03-12Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatusActiveUSRE47780E1 (en)

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US15/651,187USRE47780E1 (en)2011-04-202012-03-12Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
PCT/JP2012/001698WO2012144126A1 (en)2011-04-202012-03-12Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US14/112,079US9299743B2 (en)2011-04-202012-03-12Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus

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Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
WO2013172040A1 (en)2012-05-182013-11-21パナソニック株式会社Display panel and display panel manufacturing method
JP2014135471A (en)*2012-12-102014-07-24Nitto Denko CorpLight emitting device, light emitting device assembly, and substrate with electrode
JP6116560B2 (en)*2012-06-152017-04-19シャープ株式会社 Light emitting device
JP6229261B2 (en)*2012-11-222017-11-15岩崎電気株式会社 Light emitting element unit
JP6111494B2 (en)*2012-12-052017-04-12パナソニックIpマネジメント株式会社 lighting equipment
JP6145917B2 (en)*2013-01-172017-06-14パナソニックIpマネジメント株式会社 Light source device and lighting apparatus using the same
KR101658396B1 (en)*2013-03-212016-09-21엘지디스플레이 주식회사Display device
JP6344689B2 (en)*2013-07-162018-06-20パナソニックIpマネジメント株式会社 Substrate, light emitting device, light source for illumination, and illumination device
KR102067420B1 (en)*2013-08-302020-01-17엘지디스플레이 주식회사Light emitting diode assembly and liquid crystal display device having the same
TWI611722B (en)*2013-09-062018-01-11Leadtrend Technology CorporationLed controllers for dimming at least one led string
TWI599745B (en)*2013-09-112017-09-21晶元光電股份有限公司 Flexible LED assembly and LED bulb
JP6311364B2 (en)2014-03-102018-04-18セイコーエプソン株式会社 Print server, print system, print management program, and print management method
JP6316045B2 (en)*2014-03-202018-04-25三菱電機株式会社 lighting equipment
JP6443751B2 (en)*2015-02-122018-12-26パナソニックIpマネジメント株式会社 LIGHTING DEVICE, LIGHTING SYSTEM, AND MOBILE BODY
US9467190B1 (en)2015-04-232016-10-11Connor Sport Court International, LlcMobile electronic device covering
KR102373025B1 (en)*2015-06-122022-03-10엘지전자 주식회사Light source module and plane light source device
JP2017009725A (en)*2015-06-192017-01-12ソニー株式会社Display device
CN105068313A (en)*2015-08-062015-11-18北京工业大学Blue-ray LD backlight module and display device
KR101683771B1 (en)*2016-03-222016-12-21지스마트 주식회사Transparent display board to expand the light-emmiting area
JP6704182B2 (en)*2016-03-242020-06-03パナソニックIpマネジメント株式会社 Lighting equipment
KR102555407B1 (en)*2016-06-302023-07-14엘지디스플레이 주식회사Flexible organic light emitting diode display
JP6408516B2 (en)*2016-07-012018-10-17ミネベアミツミ株式会社 Surface illumination device and substrate
CN111720760A (en)*2016-08-262020-09-29美蓓亚三美株式会社Planar lighting device and substrate
CN109644584B (en)*2016-08-302020-10-02株式会社富士Splicing device
US11307434B2 (en)*2016-09-012022-04-193D Live, Inc.Stereoscopic display apparatus employing light emitting diodes with polarizing film/lens materials
CN206558500U (en)*2016-09-302017-10-13深圳市玲涛光电科技有限公司Light-emitting component, backlight source module and electronic equipment
JP6928823B2 (en)*2016-10-172021-09-01パナソニックIpマネジメント株式会社 Light emitting module and lighting equipment
JP2018073950A (en)*2016-10-272018-05-10パナソニックIpマネジメント株式会社Light-emitting module and lighting appliance
TWI606172B (en)*2016-10-282017-11-21林 招慶 Backlight display structure of electronic lock
FR3058778B1 (en)*2016-11-152020-07-31Areva Np UNDERWATER LIGHTING DEVICE FOR THE VISUAL INSPECTION OF A NUCLEAR REACTOR EQUIPMENT AND ASSOCIATED PROCESS
JP7399849B2 (en)*2017-09-152023-12-18ルミレッズ ホールディング ベーフェー flexible light strip
CN109841165B (en)*2017-11-292021-11-16利亚德光电股份有限公司Small-spacing LED display module and manufacturing method thereof
JP7135316B2 (en)*2017-12-212022-09-13東芝ライテック株式会社 Light irradiation device
KR102253007B1 (en)*2019-07-192021-05-18(주)티디엘Led film display, and method of manufacturing the same
CN110925635A (en)*2019-11-292020-03-27广东华辉煌光电科技有限公司Lamp strip sealing adhesive structure
KR20210079898A (en)*2019-12-202021-06-30엘지디스플레이 주식회사Display device
TWI723921B (en)*2020-07-172021-04-01聯嘉光電股份有限公司Surface light source led device
JP7502141B2 (en)*2020-10-072024-06-18伊東電機株式会社 Light emitting element module, explosion-proof lighting device, and method for manufacturing the light emitting element module
FR3121308B1 (en)2021-03-232023-12-22Appleton Grp Llc IEC ZONE 1 rated LED light engine using pre-molded optics
US11906133B2 (en)2022-03-312024-02-20Alliance Sports Group, L.P.Outdoor lighting apparatus
FR3135511B1 (en)2022-05-162024-07-19Appleton Grp Llc IEC ZONE certified LED light engine using pre-molded encapsulation layer and metal foil
CN115158156B (en)*2022-07-142024-08-30重庆睿博光电股份有限公司Stereoscopic effect thick-wall light guide suitable for stereoscopic linear atmosphere lamp

Citations (64)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5257731A (en)1975-11-061977-05-12Matsushita Electric Ind Co LtdLight source for information reading element
JPS52120552U (en)1976-03-021977-09-13
JPH05299702A (en)1992-04-171993-11-12Stanley Electric Co LtdLed array
JPH06120565A (en)1992-10-081994-04-28Rohm Co LtdLight emission diode light source
JPH06314858A (en)1993-04-301994-11-08Toshiba Lighting & Technol CorpWiring board, light emitting diode array, illuminator, and pointer
JPH07226537A (en)1994-02-091995-08-22Matsushita Electron CorpLight-emitting diode array light source
WO2000045589A1 (en)1999-01-262000-08-03Rohm Co., Ltd.Linear light source and image reading device provided with this
US20040061220A1 (en)1996-03-222004-04-01Chuichi MiyazakiSemiconductor device and manufacturing method thereof
JP2005026619A (en)2003-07-032005-01-27Matsushita Electric Works LtdLight emitting device
US20050285926A1 (en)*2004-06-292005-12-29Fuji Photo Film Co., Ltd.Light source assembly, method of producing light source assembly, and color thermal printer
JP2006013087A (en)2004-06-252006-01-12Nichia Chem Ind Ltd Semiconductor light emitting device
JP2006179544A (en)2004-12-212006-07-06Matsushita Electric Ind Co Ltd LED light source
US20070114555A1 (en)2005-11-222007-05-24Sharp Kabushiki KaishaLight emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
JP2007288200A (en)2006-04-182007-11-01Harvatek Corp Light emitting diode chip sealing structure and light emitting diode chip structure packaging method
JP2008047851A (en)2006-07-182008-02-28Nichia Chem Ind Ltd Linear light-emitting device and planar light-emitting device using the same
US20080074884A1 (en)2006-09-252008-03-27Thye Linn MokCompact high-intensty LED-based light source and method for making the same
JP2008071954A (en)2006-09-142008-03-27Mimaki Denshi Buhin Kk Light source device
JP2008078401A (en)2006-09-212008-04-03Toshiba Lighting & Technology Corp Lighting device
US20080137332A1 (en)2006-09-122008-06-12Paul LoIntegrally formed single piece light emitting diode light wire
US20080258169A1 (en)*2005-06-132008-10-23Fujikura Ltd.Substrate for mounting light emitting element, light emitting module and lighting apparatus
US20080296592A1 (en)2007-05-292008-12-04Iwatani International Corporation And Iwatani Electronics CorporationSemiconductor Light-Emitting Device
JP2009010308A (en)2007-05-312009-01-15Toshiba Lighting & Technology Corp Light emitting device
JP2009009898A (en)2007-06-292009-01-15Toshiba Lighting & Technology Corp Lighting device and lighting fixture
JP2009032746A (en)2007-07-242009-02-12Harison Toshiba Lighting Corp Light emitting device and light emitting unit
JP2009038202A (en)2007-08-012009-02-19Fujikura Ltd Light-emitting element mounting substrate, light-emitting element module, lighting device, display device, and traffic signal device
JP2009038315A (en)2007-08-032009-02-19Sharp Corp Method for manufacturing light emitting device
JP2009059966A (en)2007-08-312009-03-19Panasonic Corp Mounting board and light emitting module
JP2009081194A (en)2007-09-252009-04-16Sanyo Electric Co Ltd Light emitting module and manufacturing method thereof
US20090122541A1 (en)2007-10-252009-05-14Toyoda Gosei Co., Ltd.Light source unit
US20090140271A1 (en)*2007-11-302009-06-04Wen-Jyh SahLight emitting unit
US20090154156A1 (en)2006-09-122009-06-18Paul LoIntegrally Formed Single Piece Light Emitting Diode Light Wire and Uses Thereof
US20090166657A1 (en)2007-12-282009-07-02Nichia CorporationLight emitting device
JP2009164157A (en)2007-12-282009-07-23Nichia CorpLight-emitting device
JP2009182307A (en)2008-02-012009-08-13Nichia Corp LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
US20090244921A1 (en)2008-02-202009-10-01Takahiro SaidaLight source and vehicle lamp
WO2009141982A1 (en)2008-05-192009-11-26株式会社 東芝Linear white light source, and backlight and liquid crystal display device using linear white light source
US20090315054A1 (en)2008-06-242009-12-24Yu-Sik KimLight emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or devices
JP2010092670A (en)2008-10-062010-04-22Panasonic CorpIlluminating device and image display
JP2010118531A (en)2008-11-132010-05-27Stanley Electric Co LtdWhite lighting system and lighting fixture for vehicle
US20100164409A1 (en)2006-09-122010-07-01Paul LoIntegrally formed light emitting diode light wire and uses thereof
JP3161182U (en)2010-05-122010-07-22雷徳光股▲分▼有限公司 Light emitting diode package structure
KR100973330B1 (en)2010-01-222010-07-30주식회사 비에스엘Led package module for straight pipe type led lamp and process for producing the same
US20100195322A1 (en)2007-07-302010-08-05Sharp Kabushiki KaishaLight emitting device, illuminating apparatus and clean room equipped with illuminating apparatus
US20100201248A1 (en)2008-10-102010-08-12Mitsunori HaradaVehicle light and road illumination device
US20100220479A1 (en)*2009-02-272010-09-02Atsushi YamashitaLed module and led light source apparatus
JP2010199513A (en)2009-02-272010-09-09Panasonic CorpLighting emitting device and lighting system including the light emitting device
US20100265693A1 (en)2009-03-312010-10-21Seoul Semiconductor Co., Ltd.Tube-type or channel-type led lighting apparatus
JP2010283152A (en)2009-06-042010-12-16Showa Denko KkLuminaire and light emitting device
US20110031524A1 (en)2009-08-062011-02-10Everlight Electronics., Ltd.Light emitting diode
US20110051043A1 (en)2009-08-272011-03-03Kim SungwooBacklight unit and display device
JP2011061056A (en)2009-09-112011-03-24Stanley Electric Co LtdLinear light-emitting device, method of manufacturing the same, and surface light source device
US20110075438A1 (en)2009-09-302011-03-31Shirai SachioLed light source and vehicle light
JP3167034U (en)2011-01-202011-03-31睿騰光電科技股▲ふん▼有限公司 Light emitting diode module structure
CN201788969U (en)2009-12-302011-04-06宏齐科技股份有限公司 A light-emitting module and application device with high heat conduction and light conduction functions
US20110108851A1 (en)2009-11-062011-05-12Semileds Optoelectronics Co., Ltd., a Taiwan CorporationVertical light emitting diode having an outwardly disposed electrode
US20110222264A1 (en)2010-03-122011-09-15Toshiba Lighting & Technology CorporationLight emitting device and illumination apparatus
WO2011111399A1 (en)2010-03-112011-09-15パナソニック株式会社Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module
WO2012001938A1 (en)2010-06-282012-01-05パナソニック株式会社Light emitting device, backlight unit, liquid crystal display device, and lighting device
US20120106125A1 (en)*2010-07-052012-05-03Ryoji YokotaniLighting device topology for reducing unevenness in led luminance and color
US20120326634A1 (en)2006-09-122012-12-27Eddie Ping Kuen LiIntegrally formed light emitting diode light wire and uses thereof
US8421111B2 (en)2010-12-272013-04-16Panasonic CorporationLight-emitting device and lamp
US20140054628A1 (en)*2012-03-132014-02-27Panasonic CorporationSubstrate, light-emitting device, and lighting apparatus
US20140078738A1 (en)2011-11-152014-03-20Panasonic CorporationLight-emitting module and lamp using same
US20140321109A1 (en)*2013-04-272014-10-30GEM Weltronics TWN CorporationLight emitting diode (led) light tube

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPH0545812U (en)*1991-11-221993-06-18株式会社小糸製作所 Vehicle lighting
JP2002299697A (en)*2001-03-292002-10-11Mitsubishi Electric Lighting CorpLed light-source device and illuminator
TWI352419B (en)*2007-11-302011-11-11Gigno Technology Co LtdLight emitting unit
TW200939869A (en)*2008-03-052009-09-16Harvatek CorpAn LED chip package structure with a high-efficiency heat-dissipating substrate and packaging method thereof

Patent Citations (87)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS5257731A (en)1975-11-061977-05-12Matsushita Electric Ind Co LtdLight source for information reading element
JPS52120552U (en)1976-03-021977-09-13
JPH05299702A (en)1992-04-171993-11-12Stanley Electric Co LtdLed array
JPH06120565A (en)1992-10-081994-04-28Rohm Co LtdLight emission diode light source
JPH06314858A (en)1993-04-301994-11-08Toshiba Lighting & Technol CorpWiring board, light emitting diode array, illuminator, and pointer
JPH07226537A (en)1994-02-091995-08-22Matsushita Electron CorpLight-emitting diode array light source
US20040061220A1 (en)1996-03-222004-04-01Chuichi MiyazakiSemiconductor device and manufacturing method thereof
US6953263B1 (en)1999-01-262005-10-11Rohm Co., Ltd.Linear light source and image reading device provided with this
WO2000045589A1 (en)1999-01-262000-08-03Rohm Co., Ltd.Linear light source and image reading device provided with this
JP2005026619A (en)2003-07-032005-01-27Matsushita Electric Works LtdLight emitting device
JP2006013087A (en)2004-06-252006-01-12Nichia Chem Ind Ltd Semiconductor light emitting device
US20050285926A1 (en)*2004-06-292005-12-29Fuji Photo Film Co., Ltd.Light source assembly, method of producing light source assembly, and color thermal printer
JP2006179544A (en)2004-12-212006-07-06Matsushita Electric Ind Co Ltd LED light source
US20080258169A1 (en)*2005-06-132008-10-23Fujikura Ltd.Substrate for mounting light emitting element, light emitting module and lighting apparatus
US20070114555A1 (en)2005-11-222007-05-24Sharp Kabushiki KaishaLight emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
JP2008091354A (en)2005-11-222008-04-17Sharp Corp LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD, BACKLIGHT UNIT HAVING LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD
US20090194783A1 (en)2005-11-222009-08-06Sharp Kabushiki KaishaLight emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
JP2007288200A (en)2006-04-182007-11-01Harvatek Corp Light emitting diode chip sealing structure and light emitting diode chip structure packaging method
JP2008047851A (en)2006-07-182008-02-28Nichia Chem Ind Ltd Linear light-emitting device and planar light-emitting device using the same
US20090154156A1 (en)2006-09-122009-06-18Paul LoIntegrally Formed Single Piece Light Emitting Diode Light Wire and Uses Thereof
US20080137332A1 (en)2006-09-122008-06-12Paul LoIntegrally formed single piece light emitting diode light wire
US20120326634A1 (en)2006-09-122012-12-27Eddie Ping Kuen LiIntegrally formed light emitting diode light wire and uses thereof
US8496351B2 (en)2006-09-122013-07-30Huizhou Light Engine Ltd.Integrally formed single piece light emitting diode light wire and uses thereof
US20100164409A1 (en)2006-09-122010-07-01Paul LoIntegrally formed light emitting diode light wire and uses thereof
US8052303B2 (en)2006-09-122011-11-08Huizhou Light Engine Ltd.Integrally formed single piece light emitting diode light wire and uses thereof
US20110297970A1 (en)2006-09-122011-12-08Paul LoIntegrally formed single piece light emitting diode light wire and uses thereof
US20110305011A1 (en)2006-09-122011-12-15Paul LoIntegrally formed single piece light emitting diode light wire
JP2008071954A (en)2006-09-142008-03-27Mimaki Denshi Buhin Kk Light source device
JP2008078401A (en)2006-09-212008-04-03Toshiba Lighting & Technology Corp Lighting device
US20080074884A1 (en)2006-09-252008-03-27Thye Linn MokCompact high-intensty LED-based light source and method for making the same
JP2008118115A (en)2006-09-252008-05-22Avago Technologies Ecbu Ip (Singapore) Pte LtdCompact high-luminance led-based illumination source, and method for fabricating illumination source
JP2008300386A (en)2007-05-292008-12-11Iwatani Internatl Corp Semiconductor light emitting device
US20080296592A1 (en)2007-05-292008-12-04Iwatani International Corporation And Iwatani Electronics CorporationSemiconductor Light-Emitting Device
JP2009010308A (en)2007-05-312009-01-15Toshiba Lighting & Technology Corp Light emitting device
JP2009009898A (en)2007-06-292009-01-15Toshiba Lighting & Technology Corp Lighting device and lighting fixture
JP2009032746A (en)2007-07-242009-02-12Harison Toshiba Lighting Corp Light emitting device and light emitting unit
US20100195322A1 (en)2007-07-302010-08-05Sharp Kabushiki KaishaLight emitting device, illuminating apparatus and clean room equipped with illuminating apparatus
JP2009038202A (en)2007-08-012009-02-19Fujikura Ltd Light-emitting element mounting substrate, light-emitting element module, lighting device, display device, and traffic signal device
JP2009038315A (en)2007-08-032009-02-19Sharp Corp Method for manufacturing light emitting device
JP2009059966A (en)2007-08-312009-03-19Panasonic Corp Mounting board and light emitting module
JP2009081194A (en)2007-09-252009-04-16Sanyo Electric Co Ltd Light emitting module and manufacturing method thereof
US20090122541A1 (en)2007-10-252009-05-14Toyoda Gosei Co., Ltd.Light source unit
US20090140271A1 (en)*2007-11-302009-06-04Wen-Jyh SahLight emitting unit
US20120007112A1 (en)2007-12-282012-01-12Nichia CorporationLight emitting device
US20090166657A1 (en)2007-12-282009-07-02Nichia CorporationLight emitting device
JP2009164157A (en)2007-12-282009-07-23Nichia CorpLight-emitting device
US8049237B2 (en)2007-12-282011-11-01Nichia CorporationLight emitting device
JP2009182307A (en)2008-02-012009-08-13Nichia Corp LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
US20090244921A1 (en)2008-02-202009-10-01Takahiro SaidaLight source and vehicle lamp
US8461756B2 (en)2008-05-192013-06-11Kabushiki Kaisha ToshibaLinear white light source, and backlight and liquid crystal display device using the same
WO2009141982A1 (en)2008-05-192009-11-26株式会社 東芝Linear white light source, and backlight and liquid crystal display device using linear white light source
US20110116005A1 (en)2008-05-192011-05-19Kabushiki Kaisha ToshibaLinear white light source, and backlight and liquid crystal display device using the same
US20090315054A1 (en)2008-06-242009-12-24Yu-Sik KimLight emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or devices
JP2010092670A (en)2008-10-062010-04-22Panasonic CorpIlluminating device and image display
US20100201248A1 (en)2008-10-102010-08-12Mitsunori HaradaVehicle light and road illumination device
JP2010118531A (en)2008-11-132010-05-27Stanley Electric Co LtdWhite lighting system and lighting fixture for vehicle
WO2010081559A1 (en)2009-01-162010-07-22United Luminous International (Holdings) LimitedIntegrally formed single piece light emitting diode light wire and uses thereof
US20100220479A1 (en)*2009-02-272010-09-02Atsushi YamashitaLed module and led light source apparatus
JP2010199513A (en)2009-02-272010-09-09Panasonic CorpLighting emitting device and lighting system including the light emitting device
US8403532B2 (en)*2009-02-272013-03-26Sharp Kabushiki KaishaLED module and LED light source apparatus
US20100265693A1 (en)2009-03-312010-10-21Seoul Semiconductor Co., Ltd.Tube-type or channel-type led lighting apparatus
JP2010283152A (en)2009-06-042010-12-16Showa Denko KkLuminaire and light emitting device
US20110031524A1 (en)2009-08-062011-02-10Everlight Electronics., Ltd.Light emitting diode
US20110254028A1 (en)2009-08-062011-10-20Everlight Electronics Co., Ltd.Light Emitting Diode
JP2011040714A (en)2009-08-062011-02-24Everlight Electronics Co LtdLight emitting diode
US20110051043A1 (en)2009-08-272011-03-03Kim SungwooBacklight unit and display device
JP2011061056A (en)2009-09-112011-03-24Stanley Electric Co LtdLinear light-emitting device, method of manufacturing the same, and surface light source device
JP2011077263A (en)2009-09-302011-04-14Stanley Electric Co LtdOptical semiconductor device module
US20110075438A1 (en)2009-09-302011-03-31Shirai SachioLed light source and vehicle light
US20110108851A1 (en)2009-11-062011-05-12Semileds Optoelectronics Co., Ltd., a Taiwan CorporationVertical light emitting diode having an outwardly disposed electrode
CN201788969U (en)2009-12-302011-04-06宏齐科技股份有限公司 A light-emitting module and application device with high heat conduction and light conduction functions
KR100973330B1 (en)2010-01-222010-07-30주식회사 비에스엘Led package module for straight pipe type led lamp and process for producing the same
US9261246B2 (en)2010-03-112016-02-16Panasonic Intellectual Property Management Co., Ltd.Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module
US20120044669A1 (en)*2010-03-112012-02-23Toshifumi OgataLight-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module
WO2011111399A1 (en)2010-03-112011-09-15パナソニック株式会社Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module
US20110222264A1 (en)2010-03-122011-09-15Toshiba Lighting & Technology CorporationLight emitting device and illumination apparatus
JP3161182U (en)2010-05-122010-07-22雷徳光股▲分▼有限公司 Light emitting diode package structure
WO2012001938A1 (en)2010-06-282012-01-05パナソニック株式会社Light emitting device, backlight unit, liquid crystal display device, and lighting device
US20120169968A1 (en)2010-06-282012-07-05Panasonic CorporationLight emitting device, backlight unit, liquid crystal display apparatus, and lighting apparatus
US8450929B2 (en)2010-06-282013-05-28Panasonic CorporationLight emitting device, backlight unit, liquid crystal display apparatus, and lighting apparatus
US20120106125A1 (en)*2010-07-052012-05-03Ryoji YokotaniLighting device topology for reducing unevenness in led luminance and color
US8421111B2 (en)2010-12-272013-04-16Panasonic CorporationLight-emitting device and lamp
JP3167034U (en)2011-01-202011-03-31睿騰光電科技股▲ふん▼有限公司 Light emitting diode module structure
US20140078738A1 (en)2011-11-152014-03-20Panasonic CorporationLight-emitting module and lamp using same
US9423118B2 (en)2011-11-152016-08-23Panasonic Intellectual Property Management Co., Ltd.Light-emitting module and lamp using same
US20140054628A1 (en)*2012-03-132014-02-27Panasonic CorporationSubstrate, light-emitting device, and lighting apparatus
US20140321109A1 (en)*2013-04-272014-10-30GEM Weltronics TWN CorporationLight emitting diode (led) light tube

Non-Patent Citations (25)

* Cited by examiner, † Cited by third party
Title
2nd Office Action in JP2014-189426, dated Mar. 15, 2016.
Decision to Dismissal of Amendment from corresponding JP Application No. 2012-519648, dated Jan. 22, 2013.
Decision to Dismissal of Amendment from corresponding JP Application No. 2012-519648, mail date is Jan. 22, 2013.
Extended European Search Report in European Patent Application No. 12774596 6, mail date is Aug. 4, 2014.
Extended European Search Report in European Patent Application No. 12774596.6, dated Aug. 4, 2014.
Hearing from corresponding JP Application No. 2012-519648, dated Jun. 11, 2013.
Hearing from corresponding JP Application No. 2012-519648, mail date is Jun. 11, 2013.
International Search report and Written Opinion for PCT/JP2012/001698, dated Apr. 3, 2012, along with an English language translation of ISR.
International Search report and Written Opinion for PCT/JP2012/001698, mail date is Apr. 3, 2012, along with an English language translation of ISR.
Japan Office Action in Japan Patent Application No. 2013-76098, dated Jun. 17, 2014.
Japan Office action in Japan Patent Application No. 2013-76098, mail date is Jun. 17, 2014.
Japan Office action, dated Jan. 28, 2014.
Japan Office action, mail date is Jan. 28, 2014.
Japanese Office Action dated May 31, 2016 with respect to Japanese Patent Application No. 2014-189426.
Office Action and Search Report (English language translation), dated Aug. 16, 2018, from the State Intellectual Property Office (SIPO) of the People's Republic of China in the corresponding Chinese Patent Application No. 201610213194.2.
Office Action from corresponding JP Application No. 2012-519648, dated Jun. 12, 2012.
Office Action from corresponding JP Application No. 2012-519648, mail date is Jun. 12, 2012.
Office Action issued in European Patent Office (EPO) Counterpart Patent Appl. No. 12774596.6, dated Sep. 30, 2016.
Office Action issued in Japan Counterpart Patent Appl. No. 2014-189427, dated Dec. 13, 2016.
Office Action issued in JAPAN Counterpart Patent Appl. No. 2014-189427, dated Jan. 5, 2016.
Office Action issued in Japan Counterpart Patent Appl. No. 2014-189427, dated Sep. 8, 2015.
Office Action issued in Japan Counterpart Patent Appl. No. 2015-162297, dated Jun. 14, 2016.
Office Action, dated Aug. 21, 2018, by the Japan Patent Office (JPO) for the corresponding Japanese Patent Application No. 2017-208172.
Office Action, dated Mar. 26, 2019, by the Japan Patent Office (JPO) for the corresponding Japanese Patent Application No. 2017-208172.
U.S. Appl. No. 13/980,960, to Toshio Mori et al., filed Jul. 22, 2013.

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