USRE47237E1 - Lithographic apparatus, fluid handling structure for use in a lithographic apparatus and device manufacturing method - Google Patents

Abstract

A lithographic apparatus including a fluid handling structure configured to contain immersion fluid in a space adjacent to an upper surface of the substrate table and/or a substrate located in a recess of the substrate table, a cover having a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, and an immersion fluid film disruptor, configured to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.

Description

More than one reissue application has been filed for the reissue of Pat. No. 8,767,169. The reissue applications are continuation reissue application No. 16/203,799 and parent reissue application No. 15/182,514 (the present application), both of which are reissue applications of Pat. No. 8,767,169.

This application claims priority and benefit under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application No. 61/346,213, filed on May 19, 2010 and to U.S. Provisional Patent Application No. 61/388,972, filed on Oct, 1, 2010. The content of each of the foregoing applications is incorporated herein in its entirety by reference.

FIELD

The present invention relates to a lithographic apparatus, a fluid handling structure for use in a lithographic apparatus and a device manufacturing method.

BACKGROUND

A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g. comprising part of, one, or several dies) on a substrate (e.g. a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the “scanning”-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.

It has been proposed to immerse the substrate in the lithographic projection apparatus in a liquid having a relatively high refractive index, e.g. water, so as to fill a space between the final element of the projection system and the substrate. In an embodiment, the liquid is distilled water, although another liquid can be used. An embodiment of the present invention will be described with reference to liquid. However, another liquid may be suitable, particularly a wetting fluid, an incompressible fluid and/or a fluid with higher refractive index than air, desirably a higher refractive index than water. Fluids excluding gases are particularly desirable. The point of this is to enable imaging of smaller features since the exposure radiation will have a shorter wavelength in the liquid. (The effect of the liquid may also be regarded as increasing the effective numerical aperture (NA) of the system and also increasing the depth of focus.) Other immersion liquids have been proposed, including water with solid particles (e.g. quartz) suspended therein, or a liquid with a nano-particle suspension (e.g. particles with a maximum dimension of up to 10 nm). The suspended particles may or may not have a similar or the same refractive index as the liquid in which they are suspended. Other liquids which may be suitable include a hydrocarbon, such as an aromatic, a fluorohydrocarbon, and/or an aqueous solution.

Submersing the substrate or substrate and substrate table in a bath of liquid (see, for example, U.S. Pat. No. 4,509,852) means that there is a large body of liquid that should be accelerated during a scanning exposure. This may require additional or more powerful motors and turbulence in the liquid may lead to undesirable and unpredictable effects.

Other arrangements which have been proposed include a confined immersion system and an all wet immersion system. In a confined immersion system a liquid supply system provides liquid on only a localized area of the substrate and in between the final element of the projection system and the substrate using a liquid confinement system (the substrate generally has a larger surface area than the final element of the projection system). One way which has been proposed to arrange for this is disclosed in PCT patent application publication no. WO 99/49504.

In an all wet immersion system, as disclosed in PCT patent application publication WO 2005/064405 the immersion liquid is unconfined. In such a system the whole top surface of the substrate is covered in liquid. This may be advantageous because then the whole top surface of the substrate is exposed to the substantially same conditions. This may have an advantage for temperature control and processing of the substrate. In WO 2005/064405, a liquid supply system provides liquid to the gap between the final element of the projection system and the substrate. Liquid is allowed to leak over the remainder of the substrate. A barrier at the edge of a substrate table prevents the liquid from escaping so that it can be removed from the top surface of the substrate table in a controlled way.

The immersion system may be a fluid handling system or apparatus. In an immersion system, immersion fluid is handled by a fluid handling system, structure or apparatus. In an embodiment the fluid handling system may supply immersion fluid and therefore be a fluid supply system. In an embodiment the fluid handling system may at least partly confine immersion fluid and thereby be a fluid confinement system. In an embodiment the fluid handling system may provide a barrier to immersion fluid and thereby be a barrier member, such as a fluid confinement structure. In an embodiment the fluid handling system may create or use a flow of gas, for example to help in controlling the flow and/or the position of the immersion fluid. The flow of gas may form a seal to confine the immersion fluid so the fluid handling structure may be referred to as a seal member; such a seal member may be a fluid confinement structure. The fluid handling system may be located between the projection system and the substrate table. In an embodiment, immersion liquid is used as the immersion fluid. In that case the fluid handling system may be a liquid handling system. In reference to the aforementioned description, reference in this paragraph to a feature defined with respect to fluid may be understood to include a feature defined with respect to liquid.

In a fluid handling system or liquid confinement structure, liquid is confined to a space, for example within a confinement structure. The space may be defined by the body of the confinement structure, the underlying surface (e.g. a substrate table, a substrate supported on the substrate table, a shutter member and/or a measurement table) and, in the case of a localized area immersion system, a liquid meniscus between the fluid handling system or liquid confinement structure and the underlying structure i.e. in an immersion space. In the case of an all wet system, liquid is allowed to flow out of the immersion space onto the top surface of the substrate and/or substrate table.

In European patent application publication no. EP 1420300 and United States patent application publication no. US 2004-0136494, each hereby incorporated in their entirety by reference, the idea of a twin or dual stage immersion lithography apparatus is disclosed. Such an apparatus is provided with two tables for supporting a substrate. Leveling measurements are carried out with a table at a first position, without immersion liquid, and exposure is carried out with a table at a second position, where immersion liquid is present. Alternatively, the apparatus has only one table.

After exposure of a substrate in an immersion lithographic apparatus, the substrate table is moved away from its exposure position to a position in which the substrate may be removed and replaced by a different substrate. This is known as substrate swap. In a two stage lithographic apparatus, for example ASML's “Twinscan” lithographic apparatus, the substrate tables swap takes place under the projection system.

SUMMARY

In a lithographic apparatus, a substrate is supported on a substrate table by a substrate holder. The substrate holder may be located in a recess of the substrate table. The recess may be dimensioned so that when a substrate is supported by the substrate holder the top surface of the substrate is generally in the same plane as the surface of the substrate table surrounding the substrate. Around the substrate, there may be a gap between an edge of a substrate and an edge of the substrate table. Such a gap may be undesirable in an immersion system of a lithographic apparatus. As the gap moves under the immersion liquid in the space between the final element of the projection system and the underlying surface, the meniscus between the confinement structure and the underlying surface crosses the gap. Crossing the gap may increase the instability of the meniscus. The stability of the meniscus may decrease with increased relative speed, e.g. scanning or stepping speed, between the confinement structure and the substrate table. An increasingly unstable meniscus is a risk to increased defectivity. For example an unstable meniscus may enclose gas as a bubble in the immersion liquid, or may cause a droplet to escape from the immersion space. Such a bubble may be drawn into the space and result in imaging defects. A droplet may be a source of contaminants and a heat load as it evaporates and it may later collide with the meniscus causing a bubble to be drawn in to the space.

One or more problems of crossing the gap may be reduced by the provision of a two-phase extraction system. The two phase extraction system extracts fluid such as immersion liquid and gas (which may be present as a bubble in the liquid) from the gap. Sources of defectivity, such as releasing a bubble into the space or a droplet escaping from the space, may be reduced if not eliminated. However, the provision of such an extraction system may impart a heat load on the substrate table and the substrate. This may have a negative impact on the overlay accuracy of patterns formed on the substrate. The gap may implicitly limit the scan speed that may be used to achieve reliable imaging of a substrate.

It is therefore desirable to provide, for example, a system to increase the stability of the meniscus and reduce defectivity, for example the likelihood of creating a bubble or releasing a droplet.

In an aspect of an invention, there is provided a lithographic apparatus comprising:

• • a substrate table having an upper surface and a recess in the upper surface that is configured to receive and support a substrate;
  • a fluid handling structure configured to contain immersion fluid in a space adjacent to the upper surface of the substrate table and/or a substrate located in the recess;
  • a cover comprising a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate; and
  • an immersion fluid film disruptor, configured to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure, the immersion fluid film disruptor comprising a plurality of discrete gas jets formed on a surface of the fluid handling structure opposite the upper surface of the substrate and/or substrate table.

In an aspect of an invention, there is provided a fluid handling structure for a lithographic apparatus that includes a substrate table having a substantially planar upper surface in which is formed a recess that is configured to receive and support a substrate and a cover comprising a substantially planar main body that, in use, extends around the substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, the fluid handling structure comprising a plurality of apertures configured to provide a corresponding plurality of discrete gas jets to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.

In an aspect of an invention, there is provided a device manufacturing method, comprising:

• • providing a substrate to a substrate table having an upper surface and a recess in the upper surface that is configured to receive and support the substrate;
  • providing a cover comprising a planar main body such that it extends around the substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate;
  • providing an immersion fluid to a space between a final element of a projection system and the substrate and/or a substrate table using a fluid handling structure; and
  • providing a plurality of discrete gas jets from a surface of the fluid handling structure that is opposite the upper surface of the substrate and/or substrate table in order to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

FIG. 1 depicts a lithographic apparatus according to an embodiment of the invention;

FIGS. 2 and 3 depict a fluid handling structure as a liquid supply system for use in a lithographic projection apparatus;

FIG. 4 depicts a further liquid supply system for use in a lithographic projection apparatus;

FIG. 5 depicts, in cross-section, a liquid confinement structure which may be used in an embodiment of the present invention as a liquid supply system;

FIG. 6 depicts, in plan view, a substrate receiving section according to an aspect of the invention;

FIGS. 7 and 8 depict, in plan view, a cover according to an aspect of the invention in open and closed positions, respectively;

FIGS. 9 and 10 depict, in plan view, a cover according to an aspect of the invention in closed and open positions, respectively;

FIGS. 11, 12 and 13 depict, in cross-section, an actuator system for a cover according to an aspect of the invention in, respectively, the closed position, an intermediate position and the open position;

FIGS. 14 and 15 depict, in cross-section, an arrangement of movement guides that may be used in an actuator system of an aspect of the invention;

FIGS. 16, 17 and 18 depict an actuator system for a cover according to an aspect of the invention in, respectively, a closed position, an intermediate position and an open position;

FIGS. 19 and 20 depict, in cross-section, a cover according to an aspect of the invention;

FIG. 21 depicts, in cross-section, an arrangement of a cover according to an aspect of the invention;

FIGS. 22 to 25 schematically depict possible configurations of the edge of a cover according to an aspect of the invention;

FIGS. 26 to 32 schematically depict, in cross section, arrangements of covers according to an aspect of the invention;

FIG. 33 depicts an arrangement of a cover in use;

FIG. 34 depicts an arrangement of a cover in a system including an immersion fluid film disruptor according to an aspect of the invention;

FIG. 35 depicts an arrangement of a cover in a system including an immersion fluid film disruptor according to an aspect of the invention;

FIG. 36 depicts an arrangement of a cover in a system including an immersion fluid film disruptor according to an aspect of the invention;

FIG. 37 depicts in greater detail a portion of an arrangement as depicted inFIG. 36;

FIG. 38 depicts a relationship between the jet pitch of an arrangement as depicted inFIG. 36 and the resulting droplet diameter;

FIG. 39 depicts, in cross-section, an arrangement of an immersion fluid film disruptor as depicted inFIG. 36; and

FIG. 40 depicts a variation of the arrangement depicted inFIG. 39.

DETAILED DESCRIPTION

FIG. 1 schematically depicts a lithographic apparatus according to one embodiment of the invention. The apparatus comprises:

• • an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or DUV radiation);
  • a support structure (e.g. a mask table) MT constructed to support a patterning device (e.g. a mask) MA and connected to a first positioner P^Mconfigured to accurately position the patterning device MA in accordance with certain parameters;
  • a substrate table (e.g. a wafer table) WT constructed to hold a substrate (e.g. a resist-coated wafer) W and connected to a second positioner PW configured to accurately position the substrate W in accordance with certain parameters; and
  • a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. comprising one or more dies) of the substrate W.

The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

The support structure MT holds the patterning device MA. The support structure MT holds the patterning device MA in a manner that depends on the orientation of the patterning device MA, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure MT can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The support structure MT may be a frame or a table, for example, which may be fixed or movable as desired. The support structure MT may ensure that the patterning device MA is at a desired position, for example with respect to the projection system PS. Any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.”

The term “patterning device” used herein should be broadly interpreted as referring to any device that can be used to impart a radiation beam with a pattern in its cross-section such as to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit.

The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography, and include mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the mirror matrix.

The term “projection system” used herein should be broadly interpreted as encompassing any type of projection system. The types of projection system may include: refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof. The selection or combination of the projection system is as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.

As here depicted, the apparatus is of a transmissive type (e.g. employing a transmissive mask). Alternatively, the apparatus may be of a reflective type (e.g. employing a programmable mirror array of a type as referred to above, or employing a reflective mask).

The lithographic apparatus may be of a type having two (dual stage) or more substrate tables (and/or two or more patterning device tables). In such “multiple stage” machines the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure.

Referring to FIG,1, the illuminator IL receives a radiation beam from a radiation source SO. The source SO and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source SO is not considered to form part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising, for example, suitable directing mirrors and/or a beam expander. In other cases the source SO may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system.

The illuminator IL may comprise an adjuster AD for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and/or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in a pupil plane of the illuminator IL can be adjusted. In addition, the illuminator IL may comprise various other components, such as an integrator IN and a condenser CO. The illuminator IL may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross-section. Similar to the source SO, the illuminator IL may or may not be considered to form part of the lithographic apparatus. For example, the illuminator IL may be an integral part of the lithographic apparatus or may be a separate entity from the lithographic apparatus. In the latter case, the lithographic apparatus may be configured to allow the illuminator IL to be mounted thereon. Optionally, the illuminator IL is detachable and may be separately provided (for example, by the lithographic apparatus manufacturer or another supplier).

The radiation beam B is incident on the patterning device (e.g., mask) MA, which is held on the support structure (e.g., mask table) MT, and is patterned by the patterning device MA. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS. The projection system PS focuses the beam B onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF (e.g. an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, e.g. so as to position different target portions C in the path of the radiation beam B. Similarly, the first positioner PM and another position sensor (which is not explicitly depicted inFIG. 1) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B, e.g. after mechanical retrieval from a mask library, or during a scan. In general, movement of the support structure MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioner PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner) the support structure MT may be connected to a short-stroke actuator only, or may be fixed. Patterning device MA and substrate W may be aligned using patterning device alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the patterning device MA, the patterning device alignment marks may be located between the dies.

The depicted apparatus could be used in at least one of the following modes:

In step mode, the support structure MT and the substrate table WT are kept essentially stationary, while an entire pattern imparted to the radiation beam B is projected onto a target portion C at one time (i.e. a single static exposure). The substrate table WT is then shifted in the X and/or Y direction so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure.

In scan mode, the support structure MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam B is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT relative to the support structure MT may be determined by the (de-)magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion C in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion C.

In another mode, the support structure MT is kept essentially stationary holding a programmable patterning device, and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam B is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as desired after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to mask-less lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above.

Combinations and/or variations on the above described modes of use or entirely different modes of use may also be employed.

An arrangement to provide liquid between a final element of the projection system PS and the substrate is the so called localized immersion system IH. In this system a liquid handling system is used in which liquid is only provided to a localized area of the substrate. The space filled by liquid is smaller in plan than the top surface of the substrate and the area filled with liquid remains substantially stationary relative to the projection system PS while the substrate W moves underneath that area. Four different types of localized liquid supply systems are illustrated inFIGS. 2-5.

As illustrated inFIGS. 2 and 3, liquid is supplied by at least one inlet onto the substrate, preferably along the direction of movement of the substrate relative to the final element. Liquid is removed by at least one outlet after having passed under the projection system. That is, as the substrate is scanned beneath the element in a −X direction, liquid is supplied at the +X side of the element and taken up at the −X side.FIG. 2 shows the arrangement schematically in which liquid is supplied via inlet and is taken up on the other side of the element by outlet which is connected to a low pressure source. In the illustration ofFIG. 2 the liquid is supplied along the direction of movement of the substrate relative to the final element, though this does not need to be the case. Various orientations and numbers of in- and out-lets positioned around the final element are possible; one example is illustrated inFIG. 3 in which four sets of an inlet with an outlet on either side are provided in a regular pattern around the final element. Arrows in liquid supply and liquid recovery devices indicate the direction of liquid flow.

A further immersion lithography solution with a localized liquid supply system is shown inFIG. 4. Liquid is supplied by two groove inlets on either side of the projection system PS and is removed by a plurality of discrete outlets arranged radially outwardly of the inlets. The inlets can be arranged in a plate with a hole in its centre and through which the projection beam is projected. Liquid is supplied by one groove inlet on one side of the projection system PS and removed by a plurality of discrete outlets on the other side of the projection system PS, causing a flow of a thin film of liquid between the projection system PS and the substrate W. The choice of which combination of inlet and outlets to use can depend on the direction of movement of the substrate W (the other combination of inlet and outlets being inactive). In the cross-sectional view ofFIG. 4, arrows illustrate the direction of liquid flow in inlets and out of outlets.

Another arrangement which has been proposed is to provide the liquid supply system with a liquid confinement member which extends along at least a part of a boundary of the space between the final element of the projection system and the substrate table. Such an arrangement is illustrated inFIG. 5. The liquid confinement member is substantially stationary relative to the projection system in the XY plane though there may be some relative movement in the Z direction (in the direction of the optical axis). A seal is formed between the liquid confinement and the surface of the substrate. In an embodiment, a seal is formed between the liquid confinement structure and the surface of the substrate and may be a contactless seal such as a gas seal. Such a system is disclosed in United States patent application publication no. US 2004-0207824, hereby incorporated in its entirety by reference.

FIG. 5 schematically depicts a localized liquid supply system with aliquid confinement structure12. Theliquid confinement structure12 extends along at least a part of a boundary of thespace11 between the final element of the projection system PS and the substrate table WT or substrate W. (Please note that reference in the following text to surface of the substrate W also refers in addition or in the alternative to a surface of the substrate table WT, unless expressly stated otherwise.) Theliquid confinement structure12 is substantially stationary relative to the projection system PS in the XY plane though there may be some relative movement in the Z direction (in the direction of the optical axis). In an embodiment, a seal is formed between theliquid confinement structure12 and the surface of the substrate W and may be a contactless seal such as fluid seal, desirably a gas seal.

Theliquid confinement structure12 at least partly contains liquid in theimmersion space11 between a final element of the projection system PS and the substrate W. Acontactless seal16 to the substrate W may be formed around the image field of the projection system PS so that liquid is confined within thespace11 between the substrate W surface and the final element of the projection system PS. Theimmersion space11 is at least partly formed by theliquid confinement structure12 positioned below and surrounding the final element of the projection system PS. Liquid is brought into thespace11 below the projection system PS and within theliquid confinement structure12 byliquid inlet13. The liquid may be removed byliquid outlet13. Theliquid confinement structure12 may extend a little above the final element of the projection system PS. The liquid level rises above the final element so that a buffer of liquid is provided. In an embodiment, theliquid confinement structure12 has an inner periphery that at the upper end closely conforms to the shape of the projection system PS or the final element thereof and may, e.g., be round. At the bottom, the inner periphery closely conforms to the shape of the image field, e.g., rectangular, though this need not be the case.

In an embodiment, the liquid is contained in theimmersion space11 by agas seal16 which, during use, is formed between the bottom of theliquid confinement structure12 and the surface of the substrate W. Other types of seal are possible, as is no seal (for example in an all wet embodiment) or a seal achieved by capillary forces between the undersurface of theliquid confinement structure12 and a facing surface, such as the surface of a substrate W, a substrate table WT or a combination of both.

Thegas seal16 is formed by gas, e.g. air or synthetic air but, in an embodiment, N₂or another inert gas. The gas in thegas seal16 is provided under pressure via inlet15 to the gap betweenliquid confinement structure12 and substrate W. The gas is extracted viaoutlet14. The overpressure on the gas inlet15, vacuum level on theoutlet14 and geometry of the gap are arranged so that there is a high-velocity gas flow inwardly that confines the liquid. The force of the gas on the liquid between theliquid confinement structure12 and the substrate W contains the liquid in animmersion space11. The inlets/outlets may be annular grooves which surround thespace11. The annular grooves may be continuous or discontinuous. The flow of gas is effective to contain the liquid in thespace11. Such a system is disclosed in United States patent application publication no. US 2004-0207824.

Other arrangements are possible and, as will be clear from the description below, an embodiment of the present invention may use any type of localized immersion system.

In a localized immersion system a seal is formed between a part of the liquid confinement structure and an underlying surface, such as a surface of a substrate W and/or substrate table WT. The seal may be defined by a meniscus of liquid between the liquid confinement structure and the underlying surface. Relative movement between the underlying surface and the liquid confinement structure may lead to breakdown of the seal, for example the meniscus, above a critical speed. Above the critical speed, the seal may break down allowing liquid, e.g. in the form of a droplet, to escape from the liquid confinement structure, or gas, i.e. in the form of a bubble, to be enclosed in the immersion liquid within the immersion space.

A droplet may be a source of defectivity. The droplet may apply a thermal load on the surface which it is located as it evaporates. The droplet may be a source of contamination, in leaving a drying stain after it has evaporated. If the droplet lies in the path on the underlying surface which moves under the projection system, the droplet may contact the meniscus. The resulting collision between the meniscus and the droplet may cause a bubble to form in the liquid. A bubble may be a source of defectivity. A bubble in the immersion liquid may be drawn in to the space between the projection system and the substrate where it may interfere with an imaging projection beam.

Critical speed may be determined by the properties of the underlying surface. The critical speed of a gap relative to the confinement structure may be less than the critical speed for the surface of a relatively planar surface such as a substrate. On increasing the scan velocity above the lowest critical speed for a part of the undersurface, the scan velocity will exceed the critical speed for more of the underlying surface. The problem may be more significant at high scan velocities. However, an increased scan velocity is desirable because throughput increases.

FIG. 6 depicts, in plan view, a substrate table WT that may be used to support a substrate W. The substrate table may have a substantially planarupper surface21. In theupper surface21 is arecess22 that is configured to receive and support a substrate W.

In the recess may be a substrate support which may be a surface of the recess. The surface of therecess22 may include a plurality of protrusions on which a lower surface of the substrate is supported. The surface of the recess may include a barrier. In the surface of the recess may be formed a plurality of openings. The barrier surrounds the protrusions to define a space beneath the lower surface of the substrate W. The openings are connected to an under-pressure source. When a substrate is located above the openings a space is formed beneath the substrate W. The space may be evacuated by operation of the underpressure. This arrangement may be used in order to secure the substrate W to the substrate table WT.

In an arrangement, the recess may be configured such that the major faces of the substrate, namely the upper face and the lower face, are substantially parallel to theupper surface21 of the substrate table. In an arrangement, the upper face of the substrate W may be arranged to be substantially coplanar withupper surface21 of the substrate table.

It should be appreciated that in the present application, terms such as upper and lower may be used in order to define the relative positions of components within the systems described. However, these terms are used for convenience in order to describe the relative positions of the components when the apparatus is used at a particular orientation. They are not intended to specify the orientation in which the apparatus may be used.

As depicted inFIG. 6, agap23 may be present between an edge of the substrate W and an edge of therecess22. According to an aspect of the invention, acover25 is provided that extends around the substrate W. Thecover25 extends from a peripheral section of the upper surface of the substrate W (which in an embodiment may be an edge of the substrate) to theupper surface21 of the substrate table WT. Thecover25 may entirely cover thegap23 between the edge of the substrate W and the edge of therecess22. In addition, an opencentral section26 of thecover25 may be defined by an inner edge of the cover. The opencentral section26 may be arranged such that, in use, thecover25 does not cover portions of the substrate W on which it is intended to project a patterned beam of radiation. The inner edge of the cover may cover portions of the substrate which neighbor the surface of the substrate which is imaged by the patterned projection beam. The cover is located away from those portions of the substrate which are exposed by the patterned projection beam.

As shown inFIG. 6, when thecover25 is placed on the substrate W, the size of the opencentral section26 may be slightly smaller than the size of the upper surface of the substrate W. As shown inFIG. 6, if the substrate W is circular in shape, thecover25 may be generally annular in shape when viewed in plan view.

Thecover25 may be in the form of a thin cover plate. The cover plate may, for example, be formed from stainless steel. Other material may be used. The cover plate may be coated with Lipocer coating of the type offered by Plasma Electronic GmbH. Lipocer is a coating which may be lyophobic (e.g. hydrophobic) and is relatively resistant to damage from exposure to radiation and immersion liquid (which may be highly corrosive). More information on Lipocer may be found in U.S. Patent Application Publication No. US 2009-0206304, which is hereby incorporated by reference in its entirety.

As schematically depicted inFIG. 21, alyophobic coating141, such as a layer of Lipocer, may be applied to thelower surface25a of thecover25, namely the surface, that in use, may extend from a peripheral section of the upper surface of the substrate W to theupper surface21 of the substrate table WT. The provision of such acoating141 on thelower surface25a may minimize or reduce the leakage of immersion liquid below thecover25. For example, thecoating141 may reduce the leakage of immersion liquid between thecover25 and the upper surface of the substrate W Minimizing or reducing such immersion liquid leakage may in turn reduce the likelihood of immersion liquid being passed to the underside of the substrate W. This may reduce defects that may be introduced as a result of the so-called back side contamination. Minimizing or reducing immersion liquid leakage may reduce a thermal load on the substrate W.

Thecoating141 on thelower surface25a of thecover25 may be selected to be an anti-sticking layer. In other words, thecoating141 may be selected to prevent, minimize or reduce adhesion of thecover25 to the upper surface of the substrate W and/or theupper surface21 of the substrate table WT. This may prevent or reduce damage to thecover25, the substrate W and/or the substrate table WT when thecover25 is removed from the substrate W and the substrate table WT.

The use of acoating141 on thelower surface25a of thecover25 that is lyophobic and/or anti-sticking may prevent or reduce the accumulation of contamination particles on the lower surface of thecover25. Such contaminant particles could result in damage to any of thecover25, the substrate W and/or the substrate table WT or provide a source of subsequent defects on the substrate W. Alternatively or additionally, such contaminant particles may prevent a sufficient seal being formed between thecover25 and the upper surface of the substrate W and/or theupper surface21 of the substrate table WT, resulting in leakage of the immersion liquid, which may be undesirable. Accordingly, it may be desirable to prevent the accumulation of such contaminant particles.

Thelower surface25a of thecover25 and/or thelower surface141a of acoating141 applied to thelower surface25a of thecover25 may be configured to have low surface roughness. For example, for a spray coating, the surface roughness R_Amay be less than 1 μm. For a deposited coating the surface roughness R_Amay be less than 200 nm. In general, reducing the surface roughness of thelower surface25a of the cover and/or thelower surface141a of acoating141 applied to thelower surface25a of thecover25 may reduce stress concentrations on the surface of the substrate W. The surface roughness R_Aof parts of thecover25 in contact with the substrate in use may desirably be less than 200 nm, desirably less than 50 nm, or desirably less than 10 nm.

Ensuring that the surface roughness of thelower surface25a of thecover25 and/or thelower surface141a of acoating141 applied to thelower surface25a of thecover25 is low may also assist in reducing or minimizing leakage of immersion liquid below thecover25. Thecover25 may be arranged such that the flatness of thelower surface25a of thecover25 and/or thelower surface141a of acoating141 applied to thelower surface25a of thecover25 is maximized. This may provide optimized contact between thecover25 and the substrate W and/or the substrate table WT, reducing or minimizing immersion liquid leakage.

As schematically depicted inFIG. 21, acoating142 may alternatively or additionally be provided on theupper surface25b of thecover25. Theupper surface25b of thecover25 or theupper surface142b of acoating142 on theupper surface25b of the cover may be selected for smoothness. This may reduce the likelihood of the meniscus being pinned. For example, theupper surface25b of thecover25 or theupper surface142b of acoating142 on the upper suffice25b of the cover may be smooth such that the peak to valley distance of the surface is less than 10 μm, desirably less than 5 μm.

Thecoating142 on theupper surface25b of thecover25 may be selected to be resistant to damage from exposure to radiation and immersion liquid. This may help ensure that the working life of the cover is sufficiently long to prevent unnecessary costs associated with replacing thecover25, including downtime for the lithographic apparatus. Thecoating142 on theupper surface25b of thecover25 may be selected to be lyophobic, as discussed above. Such a coating may provide a higher receding contact angle for the immersion liquid. This in turn may permit a higher scan speed to be used without, for example, the loss of immersion liquid from the meniscus, as discussed above. As noted above, thecoating142 on theupper surface25b of thecover25 may be formed from Lipocer.

It should be appreciated that thecoatings141,142 on the lower andupper surface25a,25b of thecover25 may be formed from the single layer of material. Alternatively, one or both of thecoatings141,142 may be formed from a plurality of layers. For example, the layers may be formed from different materials, providing different benefits to thecoating141,142. It should also be appreciated that thecoatings141,142 on the lower andupper surfaces25a,25b of thecover25 may be the same or different from each other.

The cover plate may, for example, be 25 μm thick. It may be etched to be locally reduced in thickness, for example at one or more of the edges. In a locally reduced area it may be 10 μm thick. The thickness of part of the cover may be reduced by other processes such as laser ablation, milling and polishing.

As depicted inFIG. 21, theedges25c,25d of thecover25, namely the edges separating the lower andupper surfaces25a,25b of thecover25 may be substantially perpendicular to the lower andupper surfaces25a,25b of thecover25. Such an arrangement may be relatively simple to manufacture.

However, in an arrangement as depicted inFIG. 21, theedges25c,25d of thecover25 may form a step on the surface of the substrate W and theupper surface21 of the substrate table WT. Such a step may be undesirable. In particular, as discussed above, when the substrate W and substrate table WT move relative to the liquid confinement structure, care must be taken to ensure that the seal formed by a meniscus of liquid between the liquid confinement structure and the substrate W and/or substrate table WT does not break down. The introduction of a step on the surface may reduce the critical speed between the liquid confinement structure and the substrate W and/or substrate table WT up to which the liquid confinement structure and/or the substrate W/substrate table WT may move without the seal, for example the meniscus, breaking down.

One or more of theedges25c,25d of thecover25 may be configured to provide a reduced step. For example, as discussed above, the thickness of the cover may be locally reduced at one or more of the edges. For example, one or more of theedges25c,25d of the cover may be configured to have a profile as schematically depicted in any one ofFIGS. 22 to 25.

As depicted inFIG. 22, an edge of thecover25 may be configured to have asection143 in which thecover25 tapers to a point. Accordingly, such a cover may have no step. However, the extreme edge of thecover25 may be susceptible to damage.

In an alternative arrangement, as depicted inFIG. 23, thecover25 may have anedge section145 that includes astep146 that is smaller than the thickness of thecover25 and a tapered section between thestep146 and the main body of thecover25 that has the full thickness. For example, the main body of thecover25 may be 25 μm thick and thestep146 may be 10 μm thick. Such an arrangement has a smaller step than a cover that has aperpendicular edge25c,25d but may be less susceptible to edge damage than an arrangement as depicted inFIG. 22.

As depicted inFIGS. 22 and 23, the taperedsection143,145 of the edge of acover25 may be configured to linearly increase in thickness relative to the distance from the edge. However, this is not essential. As depicted inFIGS. 24 and 25, which correspond toFIGS. 22 and 23, respectively, thetapered sections147,148 may be curved instead. This may avoid the provision of sharp corners, for example between the tapered section and the remainder of thecover25 or between the tapered section and a reduced step at the edge of thecover25. Such sharp corners may be a source of instability in the seal, for example the meniscus, between the liquid confinement structure and the underlying surface. Accordingly, avoiding such sharp corners may reduce the likelihood of droplets being lost from the meniscus, reducing possible defectivity as discussed above.

As shown inFIGS. 22 to 25, the lower corner of thecover25, namely the corner that in use may be in contact with the upper surface of the substrate W and/or the substrate table WT, may be a relatively sharp corner. This may provide a relatively good seal between thecover25 and the substrate W and/or substrate table WT. However, it should be appreciated that the lower corner may be curved instead. This may reduce the likelihood of damage to the substrate W.

In general avoiding sharp corners on the cover may facilitate the provision of a coating on thecover25, if desired.

It should be appreciated that, althoughFIGS. 22 to 25 depict one edge of acover25 with a tapered section and/or a rounded, one or more the edges of thecover25 may be tapered and/or have one or more rounded corners as discussed above. Furthermore, the edges of acover25 may have a different respective arrangements of a tapered section and/or rounded corners.

A further issue that may affect the selection of the arrangement of one or both of theedges25c,25d of thecover25 is the behavior of the immersion liquid when theliquid confinement structure12 crosses thecover25. This behavior may also be affected by the configuration of theliquid confinement structure12 and one or more materials used for the substrate table WT and thecover25.

For example, when using a liquid confinement structure that does not include a gas knife and a lyophilic (e.g., hydrophilic) substrate table WT and cover25, liquid film pulling may be present. Liquid film pulling may also occur in other arrangements. Liquid film pulling may lead to liquid loss on the substrate, which is undesirable. In particular, such lost droplets may subsequently collide with the meniscus during further relative movement between theliquid confinement structure12 and the substrate table WT. These collisions may result in the formation of bubbles in the immersion liquid.

The liquid film pulling may be caused by the movement of the edge of thecover25 under the meniscus (or vice versa). When a meniscus crosses over a 90° height step, the meniscus velocity would have to be infinite during the step. Such a step occurs at aperpendicular edge25c,25d of acover25 such as shown inFIG. 21. Infinite meniscus velocity is not actually possible so the meniscus is stretched, resulting in liquid film pulling as depicted inFIG. 33. Subsequently, theliquid film201 will break up, resulting in liquid loss on the substrate W and/or substrate table WT.

The liquid film pulling may be reduced by use of a tapered edge, for example as depicted inFIG. 22. However, although the liquid film is depinned earlier than in the case of a perpendicular edge, a liquid film may still be pulled. Accordingly, although liquid loss on the substrate and/or substrate table may be reduced, it may remain above a desired level. This may be because it is not possible to form an infinitely sharp tip at the edge of thecover25. Therefore, there may remain a small edge that is effectively perpendicular at the end of the tip of the edge of thecover25.

In an embodiment, an immersion liquid film disruptor is provided to stimulate fast break up of the liquid film. This may reduce the liquid loss.

In an embodiment, the immersion liquid film disruptor includes one or more structures that may be applied onto the upper surface and/or edge of thecover25. This structure causes film instability, resulting in film break up. Such a surface profile may be combined with acover25 having a perpendicular edge or any arrangement of tapered edge, as described above.

The structure applied to the upper surface and/or edge of thecover25 may be in the form of any kind of plural local variations of the surface. For example, elongate features such as ridges and/or channels may be provided. The cross section of such ridges and/or channels may be any appropriate shape. Alternatively or additionally, relatively short features such as pimples and/or dimples may be provided. Such pimples and/or dimples may have any appropriate shape.

FIG. 34 depicts an embodiment, in which a plurality ofridges202 are provided on the upper surface of thecover25. As shown, such an arrangement promotes the break up of theliquid film203. Such an arrangement may reduce the likelihood of the meniscus being pinned.

FIG. 35 depicts an embodiment, in which a plurality ofchannels204 are provided on the edge of thecover25. As shown, such an arrangement promotes the break up of theliquid film204. Such an arrangement may reduce the likelihood of the meniscus being pinned.

In an embodiment, depicted inFIG. 36 and, in more detail,FIG. 37, the immersion liquid film disruptor includes a plurality ofdiscrete gas jets210 provided by theliquid confinement structure12. Thegas jets210 are directed onto the liquid film as it starts to form, promoting fast break up of thefilm212. Such an arrangement may reduce the likelihood of the meniscus being pinned.

Thegas jets210 may be provided, for example, by a row ofapertures213 formed in the surface of theliquid confinement structure12 and connected to a gas supply. The apertures may be provided outward of a line ofopenings211 that are formed in the surface of the liquid confinement structure and used to extract immersion liquid in order to contain the immersion liquid. In other words, theapertures213 providing thegas jets210 may be on the opposite side of a line ofopenings211 to the space in which the immersion liquid is contained. For example, the row ofapertures213 may be provided in a line that is substantially parallel to the line ofopenings211 used to extract immersion liquid.

Although as depicted in, for example,FIG. 37, an equal number ofapertures213 andopenings211 may be provided for a given section of a line ofopenings211, this may not necessarily be the case. The factors determining the appropriate separation of theopenings211 will generally be different from the factors determining the appropriate separation between theapertures213, resulting in a difference in the number ofopenings211 andapertures213.

In addition, althoughFIG. 36 depicts an arrangement in which theliquid confinement structure12 is generally square in plan view, this need not be the case. Furthermore, although as depicted inFIG. 36, the line ofopenings211 may either be parallel to, or perpendicular to, the scanning direction of the substrate table WT (and therefore the substrate W and cover25) relative to theliquid confinement structure12, this need not be the case. For example, each of the lines ofopenings211 may be arranged to be at an angle of 45 degrees to the scanning direction, or any desirable angle. Furthermore, although as depicted inFIG. 36, the lines ofopenings211 may be straight, it will be appreciated that this need not be the case. Accordingly, for example, the region of theliquid confinement structure12 bounded by theopenings211 may be bounded by a plurality of concave lines ofopenings211.

In an embodiment, the row ofapertures213 may be provided in a shape that matches the shape of the lines ofopenings211. However, this need not be the case and it may be desirable for the line ofopenings211 to define a different shape from the line ofapertures213. In particular, at corners of the space bounded by the line ofopenings211, a different layout ofapertures213 may be provided than the layout ofopenings211.

Although the arrangement depicted inFIGS. 36 and 37 depicts a system to extract the immersion liquid at the edge of theliquid confinement structure12 as being a plurality ofdiscrete openings211, in an embodiments, a different arrangement of liquid extraction may be provided. For example, in place of a line ofopenings211, a continuous opening may be provided. Furthermore, a continuous opening may be provided in which the surface of the opening in contact with the immersion liquid is covered by a micro-sieve, such as a porous material.

An advantage of using a plurality ofdiscrete gas jets210, rather than a gas knife for example, is that liquid droplets may not be collected between a line ofgas jets210 and a line ofopenings211. Collection of liquid droplets in such an area may be a problem during movement of the substrate table WT relative to the liquid confinement structure. For example, liquid droplets collected in such an area during movement may combine to form large droplets. Such large droplets may, for example, collide with the meniscus, for example when the movement of the substrate table WT relative to theliquid confinement structure12 reverses direction. Such collisions of droplets with the meniscus may result in the formation of bubbles within the immersion liquid, resulting in image defects.

As explained above, the provision of the plurality ofdiscrete gas jets210 may break up thefilm212 into a plurality of relatively small droplets. The droplets may be small enough not to create bubbles when in collision with the meniscus. It will be appreciated that the film of immersion liquid is drawn from the edge of thecover25 as thecover25 relatively moves away from theliquid confinement structure12 and the meniscus formed between theliquid confinement structure12 and the top of the substrate W, cover25 and substrate table WT.

The liquid contained in the film has a volume proportional to the thickness of the film. This in turn may depend on various parameters, including the “fly” height of theliquid confinement structure12 above the surface of the substrate W and/or substrate table WT and the relative speed of the substrate and/or substrate table WT relative to theliquid confinement structure12. The film thickness may depend on various settings of theliquid confinement structure12 such as one or more flow rates within theliquid confinement structure12. In an example, the film thickness may be between approximately 10 μm and 30 μm.

Thefilm212 of liquid may then be broken up intorivulets214 by thegas jets210. For example, arivulet214 may be formed betweenadjacent gas jets210 corresponding toadjacent apertures213. As depicted inFIG. 37, therivulets214 will subsequently break up to form individual droplets.

As will be appreciated, the width of therivulets214 will be related to the volume of thefilm212 that corresponds to eachrivulet214. In turn, this is dependent on the film thickness, as discussed above, and the pitch of thegas jets210, namely the separation between the center ofadjacent apertures213.

The size of the resultingdroplets215 in turn is dependent on the width of therivulets214. Accordingly, the size of the droplets may be minimized by minimizing the width of therivulet214 which, for a given film thickness, may in turn be minimized by minimizing the pitch of thegas jets210, namely the separation of theapertures213.

FIG. 38 depicts the results of a theoretical analysis of the relationship between the jet pitch and the droplet diameter for different film thicknesses, together with the results of two experiments. The vertical axis represents the droplet diameter in μm and the horizontal axis represents the jet pitch in μm. The two experimental results are depicted by the large squares, the results of the analysis for films with a thickness of 10 μm are depicted by the small diamond markers, the results of the analysis for films with a thickness of 20 μm are depicted by the small square markers and the results of the analysis for films with a thickness of 30 μm are depicted by the small triangular markers. This confirms that it is desirable to minimize the jet pitch.

However, one may not simply minimize the jet pitch to the smallest size that may be machined. This is because it is desirable to ensure that thegas jets210 remain as discrete gas jets and may therefore break up theliquid film212.

As the gas jet pitch decreases, there is an increasing tendency for thegas jets210 to merge and, effectively, form a gas knife. The minimum usable gas jet pitch, namely the gas jet pitch at which thegas jets210 remain sufficiently discrete that they may break up theliquid film212, may depend upon the “fly” height of theliquid confinement structure12, the diameter of theapertures213 and the velocity of thegas jets210. In particular, the ratio of the “fly” height to the diameter of the apertures may be a significant factor.

As the “fly” height increases relative to the diameter of theapertures213, the greater the tendency for thegas jets210 to merge together for a given gas jet pitch. For an arrangement in which the “fly” height is 1.5 to 2 times the diameter of theapertures213, the gas jets may remain sufficiently separate to function to break up theliquid film212 when the ratio of the gas jet pitch to the diameter of theapertures213 is approximately 1.5.

For example, the centers of adjacent apertures may be in the range from approximately 100 μm to 1 mm, for example approximately 750 μm. The diameter of theapertures213 may, for example, be in the range of from approximately 50 μm to 150 μm, for example 100 μm.

As noted above, the speed of gas flow in thegas jets210 may affect the performance of the gas jets in breaking up theliquid film212. In addition to affecting the gas jet pitch that may be used without thegas jets210 merging, the velocity of the gas flow in the gas jets may also directly affect the size of the resulting droplets.

In an embodiment, the gas speed may be in the range of from approximately Ma 0.3 to Ma 0.6, for example approximately Ma 0.5.

Although as discussed above, it may be desirable to arrange thegas jets210 in order to prevent them from merging to form a gas knife, it may be desirable to provide a gas knife in addition. In an embodiment, a gas knife may be provided, for example along a line parallel to the line ofapertures213 and on the opposite side of line ofapertures213 from the line ofopenings211.

In an embodiment, the separation between a line ofopenings211, that are formed in the surface of the liquid confinement structure and used to extract immersion liquid, and a line ofapertures213 providinggas jets210 may be, for example, approximately 0.5 mm to 3 mm, for example approximately 1.5 mm.

FIG. 39 schematically depicts in cross section a plurality ofgas jets210 provided by a row ofapertures213. As shown, eachaperture213 may be connected by agas conduit220 to agas supply221 including a gas source. The gas source may, for example, provide a supply of clean air or nitrogen.

The gas supply may be controlled, for example, by acontroller222. Thecontroller222, by means of thegas supply221, may control the gas flow to each of theapertures213. Thecontroller222 may be used to turn on thegas jets210 only when required. For example, during normal use of a lithographic apparatus, thegas jets210 may be not provided but when theliquid confinement structure12 crosses thecover25, when liquid pulling may occur, thegas jets210 are provided. Alternatively or additionally, for example, thecontroller222 may be able, by use of one or more appropriate control valves and/or control of the gas source, to control the gas velocity in thegas jets210.

Furthermore, thecontroller222 may be able, by use of one or more appropriate control valves and/or appropriate control of the gas source, to select one ormore apertures213 to be used to formgas jets210. Accordingly, for example, in use,gas jets210 may be provided by one set ofapertures213 and not provided by a second set ofapertures213. For example, when theliquid confinement structure12 crosses thecover25, only theapertures213 on one side of theliquid confinement structure12 may be used to providegas jets210.

FIG. 40 depicts a variation of the embodiment depicted inFIG. 39. Only the differences are discussed. As shown, the embodiment depicted inFIG. 40 includes a plurality ofopenings230, each provided between an adjacent pair ofapertures213. Theopenings230 may be connected by asuitable gas conduit231 to anunderpressure source232. The underpressure source may be controlled by thecontroller222, as shown, or may be provided with a separate controller.

Theunderpressure source232 may be controlled in order to provide extraction through theopenings230 when theadjacent apertures213 are used to providegas jets210. Provision of such an arrangement may enable the gas jet pitch to be reduced without increasing the likelihood of thegas jets210 merging together.

In an embodiment, theupper surface25b of thecover25 or theupper surface142b of acoating142 on theupper surface25b of thecover25 may be configured to be as flat as possible. This may further reduce any instabilities of the meniscus discussed above, reducing the likelihood of droplets being lost from the meniscus and subsequent defects as discussed above.

In an embodiment, the cover may be a part of the substrate table. An actuator system may be provided to move the cover between at least closed and open positions. In the closed position, thecover25 may be in contact with the upper surface of a substrate W within therecess22. In the closed position, thecover25 may be in contact with theupper surface21 of the substrate table WT. In the closed position, thecover25 may cover thegap23 between the edge of the substrate W and the edge of therecess22.

Thecover25 may be configured so that, as the gap passes underneath theimmersion space11, with respect to the immersion liquid in the space, the gap is closed. By closing the gap, the stability of the meniscus in crossing the gap may be improved. In an embodiment, the cover forms a seal with one or both of the upper surface of a substrate W within therecess22 and theupper surface21 of the substrate table WT. Acover25 that provides a seal with both the upper surface of the substrate W and theupper surface21 of the substrate table WT may prevent immersion liquid from passing into thegap23. The cover may reduce the inflow of immersion liquid into thegap23. The cover may help reduce, if not prevent, the flow of bubbles into thespace11 as a consequence of the gap passing underneath thespace11.

In the open position, thecover25 may be moved away from its location at the closed position relative to the surface of therecess22. When a substrate is supported by the surface of therecess22, thecover25 may be set apart from the substrate W. The open position may be arranged such that, when thecover25 is in the open position, the substrate W may be unloaded from the substrate table WT. If a substrate W is not present in therecess22, a substrate W may be loaded onto the substrate table WT.

In an embodiment, the actuator system may be configured such that, in moving thecover25 from the closed position to the open position, it enlarges the opencentral section26 of thecover25, as depicted inFIG. 8. In such a process, the opencentral section26 of thecover25 may be enlarged sufficiently that the opencentral section26 is larger than the upper surface of the substrate W in the open position. The opencentral section26 of thecover25 may be enlarged sufficiently for the substrate W to be able to pass through the centralopen section26 of thecover25.

In an embodiment, a substrate W may be loaded onto, or unloaded from, a substrate table by moving thecover25 to the open position and passing the substrate W through the centralopen portion26 of thecover25. In the case of loading a substrate W to a substrate table WT, once the substrate W has passed through the opencentral section26 of thecover25, the substrate W may be received in therecess22 of the substrate table WT. Subsequently, thecover25 may be moved by the actuator system to the closed position, in which it covers thegap23 between the edge of the substrate W and the edge of therecess22 in which the substrate W is supported.

The actuator system may be configured such that, in moving thecover25 to the open position, a plurality of portions of thecover25 are moved in different respective directions relative to each other. This arrangement may be used in order to enlarge the opencentral section26 of thecover25 in moving to the open position.

In an embodiment, the actuator system may be configured to elastically deform at least a part of thecover25. For example, the actuator system may elastically deform at least part of thecover25 when the actuator moves the plurality of portions of thecover25 in respective different directions in order to enlarge the opencentral section26.

FIGS. 7 and 8 depict, in plan view, acover25 according to an embodiment of the invention in the closed and open positions, respectively. As shown, thecover25 may be generally annular in shape in plan view. Theinner periphery31, e.g. circumference, of thecover25 may define the opencentral section26 of thecover25 when it is in the closed position. A break in the generally annular shape of thecover25 may be provided between the inner periphery, e.g., circumference,31 and the outer periphery, e.g., circumference,32 of thecover25.

In an arrangement such as that depicted inFIGS. 7 and 8, thecover25 has a plurality ofportions35 each of which are moveable by the actuator system in respective different directions. In moving the plurality ofportions35 the opencentral section26 of thecover25 may be enlarged or reduced. The plurality of portions may be combined together to form a single integral cover. However, as depicted in FIG,8, the provision of thebreak30 across the periphery, e.g., circumference, of thecover25 may facilitate the elastic deformation of thecover25 in order to enlarge the centralopen section26.

Although the arrangement ofFIGS. 7 and 8 includes abreak30 from theinner periphery31 to theouter periphery32 of thecover25, this is not essential.

Additional breaks may be provided in order to facilitate the enlargement, e.g., by elastic deformation, of thecover25 in order to enlarge the opencentral section26 of thecover25 according to this aspect of the invention.

The provision of any of the covers disclosed herein may have a variety of additional benefits for a substrate table within a lithographic apparatus in addition to the reduction of defects caused by bubbles and/or the reduction of bubbles, as described above.

The cleaning of the substrate table WT and the immersion system may be reduced. This, in turn, may reduce the down time of the lithographic apparatus.

A cover may reduce the transfer of contaminants from the upper surface of the substrate W to the lower surface of the substrate W. This may reduce defects that may be introduced as a result of the so-called back side contamination.

The provision of a cover covering the gap between the edge of the substrate W and the edge of therecess22 may enable the edge of the substrate W to traverse the projection system and immersion system at a higher speed than is otherwise possible. This may increase the throughput of the lithographic apparatus.

The provision of a cover may obviate the need for an extraction system in order to remove immersion liquid and bubbles from the gap between the edge of the substrate W and the edge of therecess22. This may reduce the heat load applied to the substrate table WT. The thermal stability of the substrate table WT may improve. The overlay accuracy of patterns formed on the substrate W may consequently improve.

An extraction system for the gap between the edge of the substrate W and the edge of therecess22 may be a two-phase extractor. This type of extractor may produce flow induced vibrations. Therefore, the provision of a cover, which may result in such an extractor being obsolete (not being required), may reduce the vibrations within the substrate table WT.

The provision of a cover may result in a simpler system overall than a system that uses an extractor for the gap between the edge of the substrate W and the edge of therecess22, as disclosed above. The provision of a cover over thegap23 may reduce the cost of goods of the apparatus as a whole.

It should be appreciated that the provision of a cover according to an aspect of the invention may eliminate the need for an extraction system at the gap between the edge of the substrate W and the edge of therecess22, as discussed above. However, a cover according to an aspect of the present invention may be used in conjunction with an extraction system. The benefits discussed above may still apply because the requirements of the extraction system may be reduced.

FIGS. 9 and 10 depict, in plan view, an arrangement of acover25 according to an embodiment of the invention. The cover depicted inFIGS. 9 and 10 is similar to the cover depicted inFIGS. 7 and 8 and, for brevity, only the differences will be discussed in detail.

As shown, thecover25 is formed from a plurality ofdiscrete sections40. In the closed position, thesections40 are arranged to abutadjacent sections40 of thecover25 in order to form asingle cover25. For example, as shown in FIG,9, for a circular substrate W, when each of thediscrete sections40 of thecover25 abut each other in the closed position, the combination of thediscrete sections40 provides acover25 having a generally annular shape.

The actuator system is configured such that it can move portions of thecover25 in different directions in order to move the cover from the closed position to the open position. In the case of acover25 such as that depicted inFIGS. 9 and 10, each such portion of thecover25 is one of thediscrete sections40. The actuator system moves each of thediscrete sections40 of thecover25 in a respective different direction.

When thecover25 is in the open position, thediscrete sections40 of thecover25 may be set apart from each other, providing the enlarged opencentral section26 through which the substrate W may pass as described above.

FIGS. 11, 12 and 13 depict, in cross-section, an actuator system that may be used in an aspect of the invention in, respectively, the closed position, an intermediate position and the open position.

As shownFIG. 11, in the closed position, each portion of thecover25 is positioned on, and extends between, aperipheral portion45 of the upper surface of the substrate W and theupper surface21 of the substrate table WT. In moving thecover25 from the closed position to the open position, theactuator system50 may be configured such that each portion of thecover25 is first moved in a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT.

FIG. 12 depicts a portion of thecover25 in an intermediate position between the closed and open positions after an initial movement, as described above.

In moving from the open position to the closed position, thecover25 may be moved to the intermediate position shown inFIG. 12 such that thecover25 may subsequently be moved to the closed position only by a movement in a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT.

Such an arrangement may beneficially ensure that, when thecover25 is in contact with the substrate W or close to the substrate W, the relative movement of thecover25 to the substrate W is only in a direction that is substantially perpendicular to the upper surface of the substrate W. This may prevent or reduce the generation of contaminant particles at the edge of the substrate W. This may prevent or reduce the movement of pre-existing contaminant particles at the edge of the substrate W towards the upper surface of the substrate W on which a pattern is to be formed. On contacting the substrate by moving the cover in a direction substantially perpendicular to the surface of the substrate W, a force applied to the substrate W is applied in a direction substantially perpendicular to the substrate W. As the force is applied around the periphery of the substrate W, the force applied is substantially uniform. Distortions in the substrate W caused by the application of the force are thereby reduced, if not minimized. Forces in the plane of the substrate W by application of thecover25 are reduced or minimized, limiting the movement of the substrate W in the recess. Position errors by applying thecover25 to the edge of the substrate W may be reduced, if not prevented.

Theactuator system50 may be configured such that it can move each of the portions of thecover25 between the intermediate position depicted inFIG. 12 and the open position depicted inFIG. 13 by moving each of the portions of thecover25 in a direction that is substantially parallel to the upper surface of the substrate W and theupper surface21 of the substrate table WT.

As shown inFIGS. 11, 12 and 13, theactuator system50 may include anactuator stage51 that is configured to provide movement of thecover25 in a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT, for example in a vertical direction. Theactuator stage51 may be referred to as a transverse actuator stage.

Theactuator system50 may include anactuator stage52 configured to provide movement of thecover25 in a direction substantially parallel to the upper surface of the substrate W and theupper surface21 of the substrate table WT, for example in a horizontal direction. Theactuator stage52 may be referred to as a lateral actuator stage.

It will be appreciated that, although the use of pneumatic actuators as depicted may be beneficial, alternative actuators may be used for one or both of the actuator stages51,52. For example, an electrostatic actuator and/or an electromagnetic actuator may be used.

Theactuator stage51 may be configured in order to ensure that substantially the only movement provided is in the direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT. Theactuator stage51 may include one or more movement guides. The one or more movement guides are configured to permit relative movement of the components of theactuator stage51 in the direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT. However, the movement guide reduces or minimizes the movement of the component of theactuator stage51 in a direction substantially parallel to the upper surface of the substrate W and theupper surface21 of the substrate table WT.

FIGS. 14 and 15 depict, in cross-section, an arrangement of movement guides that may be used in order to help ensure that theactuator stage51 only provides movement in a particular direction. Such a direction may be a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT.FIG. 14 depicts amovement guide60 when thecover25 is in the closed position.FIG. 15 depicts themovement guide60 when thecover25 is in the open position.

As shown, theactuator stage51 includes first andsecond components61,62. The first andsecond components61,62 may be moved relative to one another in the direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT by means of the actuator provided as described above. Elastic hinges63 are provided between the first andsecond components61,62 of theactuator stage51. The elastic hinges permit movement of the first andsecond components61,62 in a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT. The elastic hinges are configured to restrict movement in a direction substantially perpendicular to this desired direction of movement.

It will be appreciated that an alternative or additional movement guide may be used. However, the use of one or more such elastic hinges as described above may be beneficial because this form of movement guide does not have, or desirably minimizes, frictional forces. Frictional forces may reduce the reproducibility of the force that is applied on the upper surface of the substrate W when thecover25 is moved to the closed position.

FIGS. 16, 17 and 18 depict a further actuator system that may be used with an aspect of the present invention.FIG. 16 depicts theactuator system70 when thecover25 is in the closed position.FIG. 17 depicts theactuator system70 in an intermediate position.FIG. 18 depicts theactuator system70 when thecover25 is in the open position.

Theactuator system70 depicted inFIGS. 16, 17 and 18 may provide a simpler actuation system than that depicted inFIGS. 11, 12 and 13. Separate actuator stages are not required. Instead, each portion of thecover25 is connected to apiston71 that is mounted within a system of movement guides72,73 within the substrate table WT.

Amovement guide72 may, in cooperation with thepiston71, be used to move thecover25 from the closed position in a direction substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT to the intermediate position. Amovement guide73 may be arranged such that, in conjunction with thepiston71, it moves thecover25 in a direction substantially parallel to the upper surface of the substrate W and theupper surface21 of the substrate table WT. In order to move thecover25 between the closed and open positions, the gas pressure on one or both sides of thepiston71 may be changed by connecting one or both of the movement guides72,73 to an appropriate under-pressure orover-pressure source74,75.

Thecover25 may be configured such that in the closed position it not only covers thegap23 between the edge of the substrate W and the edge of therecess22 in the substrate table but it covers afurther gap77. For example, an additional gap may exist between the actuator system and a part of the substrate table further away from the substrate holder such as anadditional component78. Theadditional component78 may be a component of a sensor system used in order to monitor the position and/or displacement of the substrate table WT relative to the projection system.

FIGS. 19 and 20 depict, in cross-section, an embodiment of the invention in which a different arrangement ofcover125 is provided to cover thegap23 between the edge of the substrate W and the edge of therecess22 in the substrate table WT in which the substrate W is supported. In particular, acover125 of an embodiment of the invention may be configured to be moved away from the substrate table WT to permit loading/unloading a substrate W to/from therecess22 in the substrate table WT. In such an arrangement it is not necessary to enlarge an open central section of thecover125 in moving thecover125 to the open position.

In common with the arrangements discussed above, thecover125 is arranged in the form of a thin plate of material that surrounds the edge of the substrate W. Thecover125 extends from aperipheral area45 of the upper surface of the substrate W to theupper surface21 of the substrate receiving section.Openings127 for gas outlets may be provided that are connected to an under-pressure source128. The pressure in a space on thelower side125a of thecover125 may be lower than the gas pressure on theupper side125b of thecover125. The pressure difference may be used in order to secure thecover125 and substantially prevent any movement of thecover125 during use.

In order to prevent or reduce deformation of thecover125, the cover may include one ormore supports126 that extend from thelower surface125a of thecover125 to the bottom of therecess22 when thecover125 is located on top of a substrate W in therecess22.

In order to move thecover125 in order to permit loading and unloading of a substrate W, acover handling system130 such as a robot arm may be provided. Thecover handling system130 may be specifically configured such that the movement of thecover125 when thecover125 is in contact with the substrate W or close to the substrate W is only in a direction that is substantially perpendicular to the upper surface of the substrate W and theupper surface21 of the substrate table WT.

As discussed above, in embodiments of the invention, for example those depicted inFIGS. 11 to 18, an actuator system may be provided that moves thecover25 from an open position, in which a substrate W may be loaded to the substrate table WT and/or a substrate W may be unloaded from a substrate WT, to a closed position, in which thecover25 extends from theupper surface21 of the substrate table WT to the periphery of the substrate W. In the closed position, thecover25 may be in physical contact with the peripheral section of the substrate W and theupper surface21 of the substrate table WT, in particular if thecover25 is to form a seal. Such physical contact could result in damage of one or more of thecover25, the substrate W and/or theupper surface21 of the substrate table WT. Accordingly, an appropriate control system for the actuator system may be provided.

In an embodiment of the invention, a controller is provided in order to control the actuator system that positions thecover25. In order to help ensure that the cover is accurately moved relative to the substrate W and/or substrate table WT, the controller may use data that represents the height of the upper surface of at least the peripheral section of the substrate W relative to theupper surface21 of the substrate table WT (or vice versa). Such data may, for example, be previously acquired in a metrology station, which may be part of the lithographic apparatus or part of a lithography system including the lithographic apparatus.

Based on the data representing the height of the upper surface of the peripheral section of the substrate W relative to theupper surface21 of the substrate table WT (or vice versa), the controller may determine the position to which thecover25 should be moved in order to provide a desired contact between thecover25 and the upper surface of the substrate W and theupper surface21 of the substrate table WT.

An appropriate feedback mechanism may be provided for the controller to control the actuator system to move thecover25 to the desired position determined by the controller.

The controller may be configured, for example, to help ensure that the position of thecover25 in the closed position is sufficiently close to or in contact with the upper surface of the peripheral section of the substrate W to prevent, reduce or minimize leakage of the immersion liquid. Alternatively or additionally, the controller may be configured to help ensure that, when thecover25 is in the closed position, the force exerted on the upper surface of the peripheral section of the substrate W by the lower surface of thecover25 is within a given range. For example, it may be desirable to ensure that the force is less than a certain value in order to prevent or reduce the likelihood of damage to the substrate W. Alternatively or additionally, it may be desirable to ensure that the force exerted on the upper surface of the peripheral section of the substrate W by the lower surface of thecover25 exceeds a certain value in order to ensure that sufficient contact is made in order to control the leakage of immersion liquid below thecover25.

In an embodiment of the invention, the data representing the height of the upper surface of the peripheral section of the substrate W relative to theupper surface21 of the substrate table WT (or vice versa) may provide data for the relative height at a plurality of locations around the peripheral section of the substrate W. From such data, the controller may be able to determine the desired position of respective portions of thecover25 at a plurality of locations around the edge of the substrate W.

In an embodiment of the invention, the actuator system may be correspondingly configured to be able to adjust the height of thecover25 independently at a plurality of locations around thecover25. In such an arrangement, local variations of the height of the upper surface of the substrate W and/or substrate table WT may be taken into account in controlling the positioning of thecover25 in the closed position. This may in turn assist in preventing or reducing immersion liquid leakage and/or damage to the substrate W, the substrate table WT and/or thecover25.

As identified above, when thecover25 is moved to the closed position, it may exert a force on the upper surface of the peripheral section of the substrate W. It should be appreciated that this force may be exerted regardless of the arrangement of the control system for the actuator system used to move thecover25. The force exerted on the substrate W may be sufficient to cause a movement of the upper surface of the substrate W, for example due to deformation of the substrate and/or due to deformation of the support section of the substrate table WT that supports the substrate W. Such movement of the upper surface of the substrate W may be undesirable because it may result in errors in the pattern formed on the substrate W.

In an embodiment of the invention, thecover25 may be provided with a region that is relatively flexible, namely has a lower stiffness than the remainder of the cover. Such a relatively flexible section may be configured such that, when thecover25 is moved to the closed position, any forces exerted on the cover and/or any inaccuracies in the positioning of the cover relative to the substrate W and/or substrate table WT results in a deformation of the relatively flexible section of the cover rather than a deformation of the substrate W or the support section of the substrate table WT that supports the substrate.

FIGS. 26 to 30 depict schematically, in cross-section, arrangements ofcovers25 of an embodiment of the present invention having relatively flexible sections. As shown inFIGS. 26 to 28, acover25 may be formed from a single section of material and one or more relatively flexible sections may be provided in which the thickness of the cover is reduced. For example, as depicted inFIG. 26, one or more of theedge sections161,162 of thecover25 may have smaller thickness than the thickness of theremainder163 of the main body of thecover25. Thesections161,162 of reduced thickness will accordingly be less stiff than theremainder163 of the main body of thecover25.

Thesections161,162 of reduced thickness of thecover25 may extend around thecover25, for example along the entirety of the inside and/or outside edge of thecover25. It will also be appreciated that in some arrangements, only one edge of thecover25 will have a section of reduced thickness in order to provide a relatively flexible section.

It will be appreciated that such arrangements may be combined with embodiments discussed above in which the edge of thecover25 is tapered. In this case, it will be appreciated that theedges161a,162a of the reducedthickness sections161,162 may be tapered. Similarly, the edges of the covers depicted inFIGS. 27 to 32, described below may be tapered. However, for brevity, this is not discussed in detail for each embodiment discussed below.

As depicted inFIG. 27, a relatively flexible section of thecover25 may be provided by the formation of agroove165 in the lower surface of thecover25. Thegroove165 results in an associatedportion166 of thecover25 that has a reduced thickness and therefore reduced stiffness. It will be appreciated that thegroove165 may extend around thecover25. Accordingly, in use, thegroove165 may be positioned above the gap between the edge of the substrate W and the edge of the recess in the substrate table WT, extending around the full periphery of the substrate.

AlthoughFIG. 27 depicts an arrangement in which asingle groove165 is provided in the lower surface of thecover25, it will be appreciated that a plurality of grooves may be provided in order to increase the flexibility of a section of thecover25. However, in general, it is desirable to retain sufficient sections of the main body of thecover25 with relatively high stiffness, namely sections of the cover having the full thickness, in order to help ensure that thecover25 does not deform excessively in use.

As depicted inFIG. 28, the arrangements depicted inFIGS. 26 and 27 may be combined. In other words, acover25 may have a section of reducedthickness161,162 at one or more of the edges of thecover25 and may also be provided with one ormore grooves165 on the lower surface of thecover25.

In corresponding further arrangements, as depicted inFIGS. 29 to 31 respectively, the main body of thecover25 may be formed from a planar section ofmaterial170 attached to at least one support section ofmaterial171. The combination of the planar section ofmaterial170 and the support section ofmaterial171 provides sections of the main body of thecover25 having full thickness and, accordingly, relatively high stiffness. Sections of the main body of thecover25 that are formed from theplanar material170 that is not supported by support sections ofmaterial171 provide sections of thecover25 of reducedthickness161,162 that have relatively low stiffness. Likewise, gaps between two support sections ofmaterial171 providegrooves165 that provide relatively flexible sections of thecover25.

Although not depicted inFIGS. 20 to 31, it will be appreciated that thecovers25 of this aspect of the invention may include supports such as those discussed above, including supports to connect thecover25 to an actuator system.

FIG. 32 depicts an embodiment of the present invention, in which the main body of thecover25 is supported by one ormore supports172. As shown, thecover25 has a reducedthickness section161,162 at either edge of thecover25, providing relatively flexible sections of thecover25. In addition,grooves165 are provided in the lower surface of thecover25. Thegrooves165 are positioned such that they each extend around thecover25 in a position between a respective edge of thecover25 and the position of the one ormore supports172. Accordingly, thegrooves165 provide additional relatively flexible sections of thecover25. It will be appreciated that in variations of this arrangement, one or more of the relatively flexible sections of thecover25 may be omitted.

Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications in manufacturing components with microscale, or even nanoscale features, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion”, respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may refer to a substrate that already contains multiple processed layers.

The terms “radiation” and “beam” used herein encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation (e.g. having a wavelength of or about 365, 248, 193, 157 or 126 nm).

The term “lens”, where the context allows, may refer to any one or combination of various types of optical components, including refractive and reflective optical components.

To operate one or more movements of a component of the present invention, such as an actuator, there may be one or controllers. The controllers may have any suitable configuration for receiving, processing, and sending signals. For example, each controller may include one or more processors for executing the computer programs that include machine-readable instructions for the methods described above. The controllers may include data storage medium for storing such computer programs, and/or hardware to receive such medium.

While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as explicitly described. For example, the embodiments of the invention may take the form of a computer program containing one or more sequences of machine-readable instructions describing a method as disclosed above, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein. Further, the machine readable instruction may be embodied in two or more computer programs. The two or more computer programs may be stored on one or more different memories and/or data storage media. The computer programs may be suitable for controlling a controller referred to herein.

One or more embodiments of the invention may be applied to any immersion lithography apparatus, in particular, but not exclusively, those types mentioned above, whether the immersion liquid is provided in the form of a bath, only on a localized surface area of the substrate, or is unconfined on the substrate and/or substrate table. In an unconfined arrangement, the immersion liquid may flow over the surface of the substrate and/or substrate table so that substantially the entire uncovered surface of the substrate table and/or substrate is wetted. In such an unconfined immersion system, the liquid supply system may not confine the immersion liquid or it may provide a proportion of immersion liquid confinement, but not substantially complete confinement of the immersion liquid.

A liquid supply system as contemplated herein should be broadly construed. In certain embodiments, it may be a mechanism or combination of structures that provides a liquid to a space between the projection system and the substrate and/or substrate table. It may comprise a combination of one or more structures, one or more liquid inlets, one or more gas inlets, one or more gas outlets, and/or one or more liquid outlets that provide liquid to the space. In an embodiment, a surface of the space may be a portion of the substrate and/or substrate table, or a surface of the space may completely cover a surface of the substrate and/or substrate table, or the space may envelop the substrate and/or substrate table. The liquid supply system may optionally further include one or more elements to control the position, quantity, quality, shape, flow rate or any other features of the liquid.

Moreover, although this invention has been disclosed in the context of certain embodiments and examples, it will be understood by those skilled in the art that the present invention extends beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the invention and obvious modifications and equivalents thereof. In addition, while a number of variations of the invention have been shown and described in detail, other modifications, which are within the scope of this invention, will be readily apparent to those of skill in the art based upon this disclosure. For example, it is contemplated that various combination or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the invention. Accordingly, it should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another in order to form varying modes of the disclosed invention. Thus, it is intended that the scope of the present invention herein disclosed should not be limited by the particular disclosed embodiments described above, but should be determined only by a fair reading of the claims that follow.

The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below.

Claims (40)

The invention claimed is:

1. A lithographic apparatus comprising:

a substrate table having an upper surface and a recess in the upper surface that is configured to receive and support a substrate;

a fluid handling structure configured to contain immersion fluid in a space adjacent to the upper surface of the substrate table and/or a substrate located in the recess;

a cover comprising a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate;

an immersion fluid film disruptor, configured to disrupt the formation of a film of immersion fluid between an edge of the cover substrate and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure, the immersion fluid film disruptor comprising a structure in or on a surface of the fluid handling structure opposite the upper major surface of the substrate and/or the upper surface of the substrate table, to form a plurality of discrete gas jets; and

a controller control system, configured to control supply of gas to the structure of the immersion fluid film disruptor such that the jets of gas are provided when at least part of the structure of the immersion fluid film disruptor is in the region of the cover edge of the substrate and the lets jets of gas are not provided when the at least part of the structure of the immersion fluid film disruptor is not in the region of the cover edge of the substrate.

2. The lithographic apparatus according toclaim 1, wherein the structure of the immersion fluid film disruptor comprises a plurality of apertures, formed in the surface of the fluid handling structure, to provide the gas jets.

3. The lithographic apparatus according toclaim 2, wherein the apertures are each configured to provide a jet of gas onto the film of immersion liquid as it forms.

4. The lithographic apparatus according toclaim 2, wherein the surface of the fluid handling structure comprises a line of openings, surrounding the space in which immersion fluid is contained, configured to extract immersion fluid in order to contain the immersion fluid in the space; and the plurality of gas jets are provided outwardly of the line of openings.

5. The lithographic apparatus according toclaim 4, wherein the plurality of apertures providing the gas jets are arranged along a second line, parallel to the line of openings.

6. The lithographic apparatus according toclaim 2, wherein the controller control system is configured such that it can control the supply of gas to a first group of one or more apertures independently from a second group of one or more apertures.

7. The lithographic apparatus according toclaim 2, wherein the control system is configured to control the supply the gas is supplied to the apertures such that the maximum velocity of the gas is in the range of from approximately Ma 0.3 to Ma 0.6.

8. The lithographic apparatus according toclaim 2, wherein the separation between the center of one aperture of the plurality of apertures and the center of an adjacent aperture of the plurality of apertures is in the range of from approximately 100 μm to 1 mm.

9. The lithographic apparatus according toclaim 2, wherein the width of the apertures is in the range of from approximately 50 μm to 150 μm.

10. The lithographic apparatus according toclaim 2, wherein the fluid handling structure comprises a plurality of openings, each provided between two adjacent apertures, wherein the openings are connected to an underpressure source.

11. A fluid handling structure for a lithographic apparatus that includes a substrate table having a substantially planar upper surface in which is formed a recess that is configured to receive and support a substrate and a cover comprising a substantially planar main body that, in use, extends around the substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, the fluid handling structure comprising a plurality of apertures configured to provide a corresponding plurality of discrete gas jets to disrupt the formation of a film of immersion fluid between an edge of the cover substrate and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure, and a controller control system configured to control supply of gas to the apertures such that the jets of gas are provided when the apertures are in the region of the cover edge of the substrate and the jets of gas are not provided when the apertures are not in the region of the cover edge of the substrate.

12. The fluid handling structure according toclaim 11, wherein the plurality of gas jets are provided by a corresponding plurality of apertures formed in a surface of the fluid handling structure opposite the an upper major surface of the substrate and/or the upper surface of the substrate table.

13. The fluid handling structure according toclaim 12, wherein the surface of the fluid handling structure comprises a line of openings, surrounding the space in which immersion fluid is contained, configured to extract immersion fluid in order to contain the immersion fluid in the space; and the plurality of gas jets are provided outwardly of the line of openings.

14. The fluid handling structure according toclaim 11, wherein further comprising a control system configured to control supply of the gas is supplied to the apertures such that the maximum velocity of the gas is in the range of from approximately Ma 0.3 to Ma 0.6.

15. The fluid handling structure according toclaim 11, wherein the separation between the center of one aperture of the plurality of apertures and the center of an adjacent aperture of the plurality of apertures is in the range of from approximately 100 μm to 1 mm.

16. The fluid handling structure according toclaim 11, wherein the width of the apertures is in the range of from approximately 50 μm to 150 μm.

17. The fluid handling structure according toclaim 11, wherein the fluid handling structure comprises a plurality of openings, each provided between two adjacent apertures, wherein the openings are connected to an underpressure source.

18. A device manufacturing method, comprising:

providing a substrate to a substrate table having an upper surface and a recess in the upper surface that is configured to receive and support the substrate;

providing a cover comprising a planar main body such that it extends around the substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate;

providing an immersion fluid to a space between a final element of a projection system and the substrate and/or a substrate table using a fluid handling structure;

providing a plurality of discrete gas jets from a structure in or on a surface of the fluid handling structure that is opposite the an upper major surface of the substrate and/or the upper surface of the substrate table in order to disrupt the formation of a film of immersion fluid between an edge of the cover substrate and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure; and

controlling supply of gas to the gas lets jets such that the jets of gas are provided when at least part of the structure of the discrete gas jets is in the region of the cover edge of the substrate and the jets of gas are not provided when the at least part of the structure of the discrete gas jets is not in the region of the cover edge of the substrate.

19. The method ofclaim 18, wherein the plurality of gas jets are provided by a corresponding plurality of apertures formed in the surface of the fluid handling structure and the controlling comprises controlling supply of gas to a first group of one or more apertures independently from a second group of one or more apertures.

20. The method ofclaim 18, further comprising exhausting gas through a plurality of openings, each opening provided between two adjacent apertures providing a respective gas jet.

21. A liquid handling structure for a lithographic apparatus, the liquid handling structure configured to contain liquid in a space between a projection system of the lithographic apparatus and an upper major surface of a substrate table of the lithographic apparatus and/or of a substrate when located on the substrate table, the liquid handling structure comprising:

an outlet configured to remove liquid from the space;

a plurality of openings located outward, relative to the space, of the outlet, the openings configured to provide respective flows of gas incident on the upper major surface that are spaced apart at the upper major surface;

a gas knife located outward, relative to the space, of the plurality of openings, the gas knife configured to provide a flow of gas incident on the upper major surface; and

a control system, configured to control supply of gas to the plurality of openings so as to provide the respective flows of gas from the plurality of openings when at least part of the plurality of openings is in the region of an edge of the substrate and to provide the respective flows of gas from the plurality of openings so as to divide liquid on the upper major surface while intentionally allowing liquid to pass between adjacent respective flows, and control supply of gas to the gas knife to provide the flow of gas from the gas knife to block liquid that passes between the adjacent respective flows from the plurality of openings.

22. The liquid handling structure according to claim 21, wherein the outlet comprises a line of apertures configured to surround the space in which liquid is contained, the apertures configured to extract liquid in order to contain liquid in the space.

23. The liquid handling structure according to claim 22, wherein the plurality of openings are arranged along a second line, substantially parallel to the line of apertures of the outlet.

24. The liquid handling structure according to claim 21, wherein the control system is further configured to control the supply of gas to a first group of the plurality of openings independently from a second group of the plurality of openings.

25. The liquid handling structure according to claim 21, wherein the control system is further configured to control the supply of gas to the plurality of openings such that the maximum velocity of the gas is in the range of from about Ma 0.3 to about Ma 0.6.

26. The liquid handling structure according to claim 21, wherein a separation between a center of one opening of the plurality of openings and a center of an adjacent opening of the plurality of openings is selected from the range of about 100 μm to about 1 mm.

27. The liquid handling structure according to claim 21, wherein a cross-sectional width of each of the plurality of openings is selected from the range of about 50 μm to about 150 μm.

28. The liquid handling structure according to claim 21, further comprising a plurality of apertures configured to exhaust gas, each aperture provided between two adjacent openings of the plurality of openings.

29. A lithographic apparatus comprising:

the substrate table;

the projection system; and

the liquid handling structure of claim 21.

30. The lithographic apparatus according to claim 29, wherein the substrate table has a recess in the major upper surface of the substrate, the recess configured to receive and support the substrate.

31. The liquid handling structure according to claim 21, wherein a gap between an edge of one opening of the plurality of openings and an edge of an adjacent opening of the plurality of openings is at least 50 μm.

32. A device manufacturing method, comprising:

providing a liquid to a space between a projection system of a lithographic apparatus and an upper major surface of a substrate table of the lithographic apparatus and/or of a substrate when located on the substrate table;

containing liquid in the space by removing liquid from the space using an outlet of a liquid handling structure of the lithographic apparatus;

providing a respective flow of gas incident on the upper major surface from each opening of a plurality of openings of the liquid handling structure, the openings located outward, relative to the space, of the outlet;

providing a flow of gas incident on the upper major surface from a gas knife of the liquid handling structure, the gas knife located outward, relative to the space, of the plurality of openings; and

controlling supply of gas to the plurality of openings so as to provide the respective flows of gas from the plurality of openings when at least part of the plurality of openings is in the region of an edge of the substrate and to provide the respective flows of gas from the plurality of openings so as to divide liquid on the upper major surface while intentionally allowing liquid to pass between adjacent respective flows, and controlling supply of gas to the gas knife such that the flow of gas therefrom blocks liquid that passes between the adjacent respective flows from the plurality of openings.

33. The method according to claim 32, wherein the outlet comprises a line of apertures surrounding the space in which liquid is contained, the apertures extracting liquid in order to contain liquid in the space.

34. The method according to claim 33, wherein the plurality of openings are arranged along a second line, substantially parallel to the line of apertures of the outlet.

35. The method according to claim 32, further comprising controlling the supply of gas to a first group of the plurality of openings independently from a second group of the plurality of openings.

36. The method according to claim 32, further comprising controlling the supply of gas to the plurality of openings such that the maximum velocity of the gas is in the range of from about Ma 0.3 to about Ma 0.6.

37. The method according to claim 32, wherein a separation between a center of one opening of the plurality of openings and a center of an adjacent opening of the plurality of openings is selected from the range of about 100 μm to about 1 mm.

38. The method according to claim 32, wherein a cross-sectional width of each of the plurality of openings is selected from the range of about 50 μm to about 150 μm.

39. The method according to claim 32, further comprising exhausting gas using a plurality of apertures, each aperture provided between two adjacent openings of the plurality of openings.

40. The method according to claim 32, wherein a gap between an edge of one opening of the plurality of openings and an edge of an adjacent opening of the plurality of openings is at least 50 μm.

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