


| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/829,727USRE34615E (en) | 1987-11-02 | 1992-01-31 | Video probe aligning of object to be acted upon |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/116,490US4924304A (en) | 1987-11-02 | 1987-11-02 | Video probe aligning of object to be acted upon |
| CA000596903ACA1320828C (en) | 1987-11-02 | 1989-04-17 | Aligning |
| US07/829,727USRE34615E (en) | 1987-11-02 | 1992-01-31 | Video probe aligning of object to be acted upon |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/116,490ReissueUS4924304A (en) | 1987-11-02 | 1987-11-02 | Video probe aligning of object to be acted upon |
| Publication Number | Publication Date |
|---|---|
| USRE34615Etrue USRE34615E (en) | 1994-05-24 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/116,490CeasedUS4924304A (en) | 1987-11-02 | 1987-11-02 | Video probe aligning of object to be acted upon |
| US07/829,727Expired - LifetimeUSRE34615E (en) | 1987-11-02 | 1992-01-31 | Video probe aligning of object to be acted upon |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/116,490CeasedUS4924304A (en) | 1987-11-02 | 1987-11-02 | Video probe aligning of object to be acted upon |
| Country | Link |
|---|---|
| US (2) | US4924304A (en) |
| EP (1) | EP0394568B1 (en) |
| CA (1) | CA1320828C (en) |
| ES (1) | ES2058512T3 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5669970A (en)* | 1995-06-02 | 1997-09-23 | Mpm Corporation | Stencil apparatus for applying solder paste |
| US5794329A (en)* | 1995-02-27 | 1998-08-18 | Mpm Corporation | Support apparatus for circuit board |
| US5883663A (en)* | 1996-12-02 | 1999-03-16 | Siwko; Robert P. | Multiple image camera for measuring the alignment of objects in different planes |
| US5943089A (en) | 1996-08-23 | 1999-08-24 | Speedline Technologies, Inc. | Method and apparatus for viewing an object and for viewing a device that acts upon the object |
| US6031242A (en) | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
| US6077022A (en) | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
| US6129040A (en) | 1997-09-05 | 2000-10-10 | Esec Sa | Semi-conductor mounting apparatus for applying adhesive to a substrate |
| US6135339A (en) | 1998-01-26 | 2000-10-24 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder |
| US6157870A (en) | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
| US6179938B1 (en) | 1997-10-30 | 2001-01-30 | Esec Sa | Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder |
| US6185815B1 (en) | 1997-12-07 | 2001-02-13 | Esec Sa | Semiconductor mounting apparatus with a chip gripper travelling back and forth |
| WO2001035703A1 (en)* | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
| US20030021886A1 (en)* | 2000-02-23 | 2003-01-30 | Baele Stephen James | Method of printing and printing machine |
| US6663712B2 (en) | 1997-02-21 | 2003-12-16 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
| US20040060963A1 (en)* | 2002-09-30 | 2004-04-01 | Eric Ludwig | Selective wave solder system |
| US20040089413A1 (en)* | 2002-08-08 | 2004-05-13 | Michael Murphy | System and method for modifying electronic design data |
| US20040175030A1 (en)* | 1999-05-04 | 2004-09-09 | Prince David P. | Systems and methods for detecting defects in printed solder paste |
| US20040187716A1 (en)* | 2003-03-28 | 2004-09-30 | Pham-Van-Diep Gerald C. | Pressure control system for printing a viscous material |
| US20040218808A1 (en)* | 1999-05-04 | 2004-11-04 | Prince David P. | Systems and methods for detecting defects in printed solder paste |
| US20060048655A1 (en)* | 2004-02-19 | 2006-03-09 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US20060081138A1 (en)* | 2004-10-18 | 2006-04-20 | Perault Joseph A | Method and apparatus for supporting and clamping a substrate |
| US20070102477A1 (en)* | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
| US20070102478A1 (en)* | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
| US7270478B2 (en) | 2002-08-13 | 2007-09-18 | International Business Machines Corporation | X-ray alignment system for fabricating electronic chips |
| US7293691B2 (en) | 2003-01-17 | 2007-11-13 | Speedline Technologies, Inc. | Electronic substrate printing |
| US20080006162A1 (en)* | 2006-07-10 | 2008-01-10 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
| US20080197170A1 (en)* | 2007-02-16 | 2008-08-21 | Prince David P | Single and multi-spectral illumination system and method |
| US20080250951A1 (en)* | 2007-04-13 | 2008-10-16 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
| US20080257179A1 (en)* | 2007-04-17 | 2008-10-23 | Patsy Anthony Mattero | Multiplexed control of multi-axis machine with distributed control amplifier |
| US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
| US20090169054A1 (en)* | 2007-12-26 | 2009-07-02 | Altek Corporation | Method of adjusting selected window size of image object |
| US20090255426A1 (en)* | 2008-02-14 | 2009-10-15 | Illinois Tool Works Inc. | Method and apparatus for placing substrate support components |
| US20110115899A1 (en)* | 2008-07-14 | 2011-05-19 | Panasonic Corporation | Component mount system |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2561166B2 (en)* | 1990-03-26 | 1996-12-04 | 株式会社精工舎 | Method and device for punching printed circuit board |
| US5060063A (en)* | 1990-07-30 | 1991-10-22 | Mpm Corporation | Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis |
| US5216804A (en)* | 1991-05-21 | 1993-06-08 | U.S. Philips Corp. | Method and device for placing a component on a printed circuit board |
| JPH10128951A (en)* | 1996-10-31 | 1998-05-19 | Sakurai Graphic Syst:Kk | Screen printing apparatus and printing position adjusting method |
| DE19728144C2 (en) | 1997-07-02 | 2001-02-01 | Ekra Eduard Kraft Gmbh | Method and device for generating test patterns |
| GB2359515B (en)* | 2000-02-23 | 2003-12-03 | Kistech Ltd | Method of printing and printing machine |
| US6569248B1 (en) | 2000-09-11 | 2003-05-27 | Allen David Hertz | Apparatus for selectively applying solder mask |
| US6626106B2 (en) | 2001-04-17 | 2003-09-30 | Speedline Technologies, Inc. | Cleaning apparatus in a stencil printer |
| KR100428510B1 (en)* | 2002-04-10 | 2004-04-29 | 삼성전자주식회사 | Apparatus and method of precise positioning control using optical system |
| US20080156207A1 (en)* | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
| CN101229711B (en)* | 2007-01-25 | 2010-06-02 | 东莞市凯格精密机械有限公司 | Method and Mechanism of Single Optical Axis Detection in Vision Printing Machine |
| IT1398427B1 (en)* | 2009-09-03 | 2013-02-22 | Applied Materials Inc | PROCEDURE AND ALIGNMENT OF A SUBSTRATE |
| CN102001242B (en)* | 2010-10-14 | 2012-06-20 | 吴江迈为技术有限公司 | Printing deviation measuring method, printing method and printing device for solar cell plate |
| CN102092179B (en)* | 2010-12-30 | 2012-07-04 | 东莞市科隆威自动化设备有限公司 | Full-automatic solder paste printing machine |
| CN102706302B (en)* | 2011-07-04 | 2014-12-10 | 东莞市卓安精机自动化设备有限公司 | Automatic detecting device for printing steel mesh |
| US9299118B1 (en)* | 2012-04-18 | 2016-03-29 | The Boeing Company | Method and apparatus for inspecting countersinks using composite images from different light sources |
| EP3735807B1 (en)* | 2018-01-02 | 2023-09-13 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer and method and system therefor |
| US20200391530A1 (en) | 2019-06-13 | 2020-12-17 | Illinois Tool Works Inc. | Multi-functional print head for a stencil printer |
| US11247286B2 (en) | 2019-06-13 | 2022-02-15 | Illinois Tool Works Inc. | Paste dispensing transfer system and method for a stencil printer |
| US11318549B2 (en) | 2019-06-13 | 2022-05-03 | Illinois Tool Works Inc. | Solder paste bead recovery system and method |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4608494A (en)* | 1983-11-11 | 1986-08-26 | Hitachi, Ltd. | Component alignment apparatus |
| US4672437A (en)* | 1985-07-08 | 1987-06-09 | Honeywell Inc. | Fiber optic inspection system |
| US4686565A (en)* | 1984-05-22 | 1987-08-11 | Fujitsu Limited | Method and apparatus for visually examining an array of objects disposed in a narrow gap |
| US4737845A (en)* | 1985-10-11 | 1988-04-12 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4608494A (en)* | 1983-11-11 | 1986-08-26 | Hitachi, Ltd. | Component alignment apparatus |
| US4686565A (en)* | 1984-05-22 | 1987-08-11 | Fujitsu Limited | Method and apparatus for visually examining an array of objects disposed in a narrow gap |
| US4672437A (en)* | 1985-07-08 | 1987-06-09 | Honeywell Inc. | Fiber optic inspection system |
| US4737845A (en)* | 1985-10-11 | 1988-04-12 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5794329A (en)* | 1995-02-27 | 1998-08-18 | Mpm Corporation | Support apparatus for circuit board |
| US5669970A (en)* | 1995-06-02 | 1997-09-23 | Mpm Corporation | Stencil apparatus for applying solder paste |
| US5943089A (en) | 1996-08-23 | 1999-08-24 | Speedline Technologies, Inc. | Method and apparatus for viewing an object and for viewing a device that acts upon the object |
| US5883663A (en)* | 1996-12-02 | 1999-03-16 | Siwko; Robert P. | Multiple image camera for measuring the alignment of objects in different planes |
| US6077022A (en) | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
| US6157870A (en) | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
| US6663712B2 (en) | 1997-02-21 | 2003-12-16 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
| US6129040A (en) | 1997-09-05 | 2000-10-10 | Esec Sa | Semi-conductor mounting apparatus for applying adhesive to a substrate |
| US6179938B1 (en) | 1997-10-30 | 2001-01-30 | Esec Sa | Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder |
| US6185815B1 (en) | 1997-12-07 | 2001-02-13 | Esec Sa | Semiconductor mounting apparatus with a chip gripper travelling back and forth |
| US6031242A (en) | 1998-01-23 | 2000-02-29 | Zevatech, Inc. | Semiconductor die in-flight registration and orientation method and apparatus |
| US6135339A (en) | 1998-01-26 | 2000-10-24 | Esec Sa | Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder |
| US20040175030A1 (en)* | 1999-05-04 | 2004-09-09 | Prince David P. | Systems and methods for detecting defects in printed solder paste |
| US7310438B2 (en) | 1999-05-04 | 2007-12-18 | Speedline Technologies, Inc. | Systems for detecting defects in printed solder paste |
| US7149344B2 (en) | 1999-05-04 | 2006-12-12 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US20060245637A1 (en)* | 1999-05-04 | 2006-11-02 | Speedline Technologies, Inc. | Systems for detecting defects in printed solder paste |
| US7072503B2 (en) | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US20050169514A1 (en)* | 1999-05-04 | 2005-08-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US6891967B2 (en) | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US20040218808A1 (en)* | 1999-05-04 | 2004-11-04 | Prince David P. | Systems and methods for detecting defects in printed solder paste |
| WO2001035703A1 (en)* | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
| US20030021886A1 (en)* | 2000-02-23 | 2003-01-30 | Baele Stephen James | Method of printing and printing machine |
| US6938227B2 (en) | 2002-08-08 | 2005-08-30 | Fry's Metals, Inc. | System and method for modifying electronic design data |
| US20040089413A1 (en)* | 2002-08-08 | 2004-05-13 | Michael Murphy | System and method for modifying electronic design data |
| US20080043909A1 (en)* | 2002-08-13 | 2008-02-21 | International Business Machines Corporation | X-Ray Alignment System For Fabricating Electronic Chips |
| US7270478B2 (en) | 2002-08-13 | 2007-09-18 | International Business Machines Corporation | X-ray alignment system for fabricating electronic chips |
| US7213738B2 (en) | 2002-09-30 | 2007-05-08 | Speedline Technologies, Inc. | Selective wave solder system |
| US20040060963A1 (en)* | 2002-09-30 | 2004-04-01 | Eric Ludwig | Selective wave solder system |
| US7293691B2 (en) | 2003-01-17 | 2007-11-13 | Speedline Technologies, Inc. | Electronic substrate printing |
| WO2004087421A1 (en) | 2003-03-28 | 2004-10-14 | Speedline Technologies, Inc. | Pressure control system for printing a viscous material |
| US20040187716A1 (en)* | 2003-03-28 | 2004-09-30 | Pham-Van-Diep Gerald C. | Pressure control system for printing a viscous material |
| US6955120B2 (en) | 2003-03-28 | 2005-10-18 | Speedline Technologies, Inc. | Pressure control system for printing a viscous material |
| US7171898B2 (en) | 2004-02-19 | 2007-02-06 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US7013802B2 (en) | 2004-02-19 | 2006-03-21 | Speedline Technologies, Inc. | Method and apparatus for simultaneous inspection and cleaning of a stencil |
| US20070051253A1 (en)* | 2004-02-19 | 2007-03-08 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US7322288B2 (en) | 2004-02-19 | 2008-01-29 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US20060048655A1 (en)* | 2004-02-19 | 2006-03-09 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US20080066635A1 (en)* | 2004-02-19 | 2008-03-20 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US7469635B2 (en) | 2004-02-19 | 2008-12-30 | Speedline Technologies, Inc. | Method and apparatus for performing operations within a stencil printer |
| US7121199B2 (en) | 2004-10-18 | 2006-10-17 | Speedline Technologies, Inc. | Method and apparatus for supporting and clamping a substrate |
| US20060081138A1 (en)* | 2004-10-18 | 2006-04-20 | Perault Joseph A | Method and apparatus for supporting and clamping a substrate |
| US20070102477A1 (en)* | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
| US20070102478A1 (en)* | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
| US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
| US7549371B2 (en) | 2006-07-10 | 2009-06-23 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
| US20080006162A1 (en)* | 2006-07-10 | 2008-01-10 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
| US20080197170A1 (en)* | 2007-02-16 | 2008-08-21 | Prince David P | Single and multi-spectral illumination system and method |
| US7710611B2 (en) | 2007-02-16 | 2010-05-04 | Illinois Tool Works, Inc. | Single and multi-spectral illumination system and method |
| US20080250951A1 (en)* | 2007-04-13 | 2008-10-16 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
| US20110120325A1 (en)* | 2007-04-13 | 2011-05-26 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
| US7861650B2 (en) | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
| US8230783B2 (en) | 2007-04-13 | 2012-07-31 | Illinois Tool Works Inc. | Method and apparatus for adjusting a substrate support |
| US20080257179A1 (en)* | 2007-04-17 | 2008-10-23 | Patsy Anthony Mattero | Multiplexed control of multi-axis machine with distributed control amplifier |
| US8253355B2 (en) | 2007-04-17 | 2012-08-28 | Illinois Tool Works Inc. | Multiplexed control of multi-axis machine with distributed control amplifier |
| US7827909B2 (en) | 2007-04-17 | 2010-11-09 | Illinois Tool Works Inc. | Stencil printer with multiplexed control of multi-axis machine having distributed control motor amplifier |
| US20110023735A1 (en)* | 2007-04-17 | 2011-02-03 | Illinois Tool Works Inc. | Multiplexed control of multi-axis machine with distributed control amplifier |
| US20090169054A1 (en)* | 2007-12-26 | 2009-07-02 | Altek Corporation | Method of adjusting selected window size of image object |
| US8085983B2 (en)* | 2007-12-26 | 2011-12-27 | Altek Corporation | Method of adjusting selected window size of image object |
| US20090255426A1 (en)* | 2008-02-14 | 2009-10-15 | Illinois Tool Works Inc. | Method and apparatus for placing substrate support components |
| US20110115899A1 (en)* | 2008-07-14 | 2011-05-19 | Panasonic Corporation | Component mount system |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US9868278B2 (en) | 2015-04-07 | 2018-01-16 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| Publication number | Publication date |
|---|---|
| US4924304A (en) | 1990-05-08 |
| ES2058512T3 (en) | 1994-11-01 |
| CA1320828C (en) | 1993-08-03 |
| EP0394568B1 (en) | 1994-09-07 |
| EP0394568A1 (en) | 1990-10-31 |
| Publication | Publication Date | Title |
|---|---|---|
| USRE34615E (en) | Video probe aligning of object to be acted upon | |
| US5471310A (en) | System for placement and mounting of fine pitch integrated circuit devices | |
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| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY | |
| REFU | Refund | Free format text:REFUND - PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: R284); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY | |
| FEPP | Fee payment procedure | Free format text:PAT HLDR NO LONGER CLAIMS SMALL ENT STAT AS SMALL BUSINESS (ORIGINAL EVENT CODE: LSM2); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY | |
| FPAY | Fee payment | Year of fee payment:8 | |
| AS | Assignment | Owner name:SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MPM CORPORATION;REEL/FRAME:009719/0352 Effective date:19981231 | |
| FPAY | Fee payment | Year of fee payment:12 | |
| SULP | Surcharge for late payment | Year of fee payment:11 | |
| AS | Assignment | Owner name:SPEEDLINE HOLDINGS I, LLC, NEW YORK Free format text:NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:014943/0593 Effective date:20040105 | |
| AS | Assignment | Owner name:KPS SPECIAL SITUATIONS FUND II L.P., NEW YORK Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:015460/0737 Effective date:20040521 | |
| AS | Assignment | Owner name:SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS Free format text:RELEASE BY SECURED PARTY;ASSIGNOR:SPEEDLINE HOLDINGS I, LLC;REEL/FRAME:018480/0775 Effective date:20061106 |