Movatterモバイル変換


[0]ホーム

URL:


USRE34615E - Video probe aligning of object to be acted upon - Google Patents

Video probe aligning of object to be acted upon
Download PDF

Info

Publication number
USRE34615E
USRE34615EUS07/829,727US82972792AUSRE34615EUS RE34615 EUSRE34615 EUS RE34615EUS 82972792 AUS82972792 AUS 82972792AUS RE34615 EUSRE34615 EUS RE34615E
Authority
US
United States
Prior art keywords
mirror
video
video probe
probe
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/829,727
Inventor
Gary T. Freeman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KPS SPECIAL SITUATIONS FUND II LP
Original Assignee
MPM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filedlitigationCriticalhttps://patents.darts-ip.com/?family=25672625&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=USRE34615(E)"Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by MPM CorpfiledCriticalMPM Corp
Priority to US07/829,727priorityCriticalpatent/USRE34615E/en
Application grantedgrantedCritical
Publication of USRE34615EpublicationCriticalpatent/USRE34615E/en
Assigned to SPEEDLINE TECHNOLOGIES, INC.reassignmentSPEEDLINE TECHNOLOGIES, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: MPM CORPORATION
Assigned to SPEEDLINE HOLDINGS I, LLCreassignmentSPEEDLINE HOLDINGS I, LLCNOTICE OF GRANT OF SECURITY INTEREST IN PATENTSAssignors: SPEEDLINE TECHNOLOGIES, INC.
Assigned to KPS SPECIAL SITUATIONS FUND II L.P.reassignmentKPS SPECIAL SITUATIONS FUND II L.P.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SPEEDLINE TECHNOLOGIES, INC.
Assigned to SPEEDLINE TECHNOLOGIES, INC.reassignmentSPEEDLINE TECHNOLOGIES, INC.RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).Assignors: SPEEDLINE HOLDINGS I, LLC
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

Links

Images

Classifications

Definitions

Landscapes

Abstract

An aligning system includes an object to be acted upon at predetermined locations, such as a circuit board to receive solder paste. There is a device, such as a stencil, characterized by the pattern for acting upon the object. A video probe is arranged to look at both the device and the object for providing image signals representative of both. A comparator compares the image signals to provide an error signal representative of misalignment between the device and object. A positioner responsive to the error signal relatively positions the device and object to reduce the error. An operator causes the device to operate upon the object at the predetermined locations.

Description

.Iadd.A computer program listing is set forth in a microfiche appendix. .Iaddend.
The present invention relates in general to aligning and more particularly concerns novel apparatus and techniques for aligning an object to be acted upon at particular locations with a device that performs the specific operations on the specified points. A specific embodiment of the invention facilitates aligning circuit boards for receiving surface mounted components with a stencil for applying solder paste to a pattern on the circuit board while facilitating rapid reorientation for applying solder paste to a different pattern.
A typical screen printer is the commercially available ASP-24 automated screen printer available from MPM Corp., 71 West Street, Medfield, Mass. 02052 incorporated herein by reference. This screen printer includes a replaceable screen for printing solder paste on a footprint of pads on a surface mount circuit board. This system may also deposit other materials, such as epoxy, polymer, cermet and most other screen printable materials. This system includes a programmable controller for positioning each circuit board beneath the screen or stencil above that deposits the screen printable materials.
Prior art screen printers with vision require printing solder paste on the circuit board, driving a table out beneath the cameras and the cameras look at the solder paste. The solder paste in then wiped off, the board enters beneath the stencil, and the board is printed a second time, and reciprocates back out for examination by the camera.
A prior art screen printer includes a camera that looks between the board and the screen, but it does not look at an image on the screen, only at the board. The camera on that device does not reciprocate. It uses a fixed mounted camera that just looks down at the board, and it requires that the board be outside of the stencil which comes down upon it by a certain amount such that the camera does not get in the way.
It is an important object of this invention to provide improved apparatus and techniques for optically aligning an object to be acted upon at one or more points with a device for repeatedly acting upon like objects at like points.
According to the invention, at least one, and preferably two, movable video probes are located between the acting device, such as the screen or stencil, typically above, and the object to be acted upon, such as a circuit board, typically below. The one or two probes, first look at and locate a pattern, such as on the object device, such as a circuit board, store information on features in this pattern, such as x, y and θ information on key features in the pattern. Associated data processing apparatus processes and stores this information. The one or both video probes then rotate downward while still in the region between the object to be acted upon and the device to act, examine the other pattern such as on the acting device, such as the screen or stencil, for a matching pattern and relatively position the object and device so that the two patterns are in alignment. The one or both video probes then retract, and the device, such as the stencil or screen engages the object, such as the circuit board, to deposit solder paste or other screen printable material on selected points in registration with corresponding points on the device, such as the screen or stencil. Once a specific pattern is learned, the invention may repeatedly relatively position by looking at only the object to be acted upon.
According to a specific aspect of the invention, a positionable base supports a video probe.[.,.]. .Iadd.. .Iaddend.This base is formed with at least one and preferably two slots having a generally horizontal leaning portion with a depending angled trailing portion for guiding elements that carry the video probe as it moves between the extended position at the leading end of the slots, with the video probe between object and device, and the retracted position at the trailing end of the slot, with the video probe retracted from the region between object and device.
Numerous other features, objects and advantages of the invention will become apparent from the following specification when read in connection with the accompanying drawings in which:
FIG. 1 is a perspective view of a fully automated screen printer with vision system according to the invention;
FIGS. 2 and 3 are perspective views of the video probe assembly in retracted and extended positions, respectively;
FIG. 4 is an exploded view of the video probe and portions of the supporting assembly;
FIG. 5 is an exploded view of the video probe support assembly; and
FIG. 6 is a diagram illustrating the relationship among target points and the center of rotation helpful in understanding principles of the invention.
With reference now to the drawing and more particularly FIG. 1 thereof, there is shown a perspective view of an exemplary embodiment of the invention comprising the commercially available ASP-24 fully automated screen printer available from MPM Corp. with movable video probes according to the invention. The apparatus includes a base 11 for supporting a circuit board to be printed upon, left and rightvideo probe assemblies 12 and 13, acontroller 14 and video monitor assembly 15. The system also includes a positionable screen/stencil support assembly that may be moved to align the screen or stencil with the circuit board to be printed upon. Alower platform 16 supports various packages for containing hardware used in the system.
The base components added to the ASP-24 automated screen printer include the twovideo probe assemblies 12 and 13, a fiberoptic light source for illuminating the screen and board during pattern recognition, thetrackball teaching module 14, and a vision processor unit comprising a commercially available Cognex Type 2000 with suitable software, an example of which is set forth in Appendix A.
The invention utilizes a user-friendly operator interface. Menu-driven software, such as set forth in Appendix A, produces a display on video monitor 15 that prompts the operator through each phase of the four-step setup process. Help screens are accessible at each step, outlining in detail the instructions for performing that step. At the completion of each step, the system automatically displays the next prompt on monitor 15. Setup errors may be quickly corrected through the push-button editing feature withtrackball teaching module 14.
The operator uses the independenttrackball teaching module 14 to select a pattern on the PC board within each probe's field of view of left and right probe assemblies 12 and 13.Teaching module 14 capture these two select patterns and then recognizes and locates the matching patterns on the screen or stencil. Without further operator involvement, the system implements the program by calculating the pixel representation in x and y coordinates of significant features and angular orientation in azimuth, conveniently referred to a θ geometry. The apparatus then determines an accurate "home" position for the screen/stencil in relation to the circuit board then positioned on base .Iadd.11.Iaddend.. The offset data corresponding to the difference in x, y and θ positions of the observed circuit board features and corresponding screen/stencil features is automatically downloaded into the screen printer stepper motor programmable indexes. These indexes activate the screen printer stepper motor assembly to reposition the screen/stencil relative to each stationary board for subsequent print cycles with screen/stencil in horizontal alignment with each circuit board below. This automatic positioning adjustment accommodates variations in board tolerances. Between print cycles, the left andright video probes 12 and 13 automatically move in, look at the next board in place, move out again, screen/stencil is positioned if necessary, and printing occurs without operator intervention.
As an alternative feature the use may verify alignment with a post-print inspection feature. As part of the setup menu, the operator may choose how often to do post inspection. Then a choice may be made from three tolerance threshold menu selections for alignment error detection.
Printed circuit boards having patterns outside these parameters produce an error message on video monitor 15. This error signal may be used to activate a diverter to reroute that board for reworking. The error signal may also be used to pause automatic operation so that the operator can correct the problem before any more material is wasted. To begin the setup process, the operator presses a "video attention" button onteaching module 14. Actuating this button produces the setup menu on video monitor 15. Then the operator completes four steps, pressing asingle button 14 onteaching module 14 to signal completion of each step. First, the operator clamps left and right video probe assemblies 12 and 13 in place so that each probe when in the extended position may observe two different patterns of significant features of the circuit board and corresponding screen/stencil. The operator then teaches these board patterns. Usingtrackball teaching module 14, the operator moves joy stick 14A to define the windows within the .[.probes,.]. .Iadd.probes' .Iaddend.fields of view embracing significant features, typically a pattern of pads for receiving solder paste, and then pushes a single button onteaching module 14 to teach the pattern to the apparatus which then captures the patterns. The operator positions the probes of left and right probe assemblies 12 and 13 to view upward to learn the screen or stencil pattern above. The associated data processing system automatically locates the matching pattern on the screen or stencil, determines the pixel representation of it in x, y and θ geometry; automatically downloads offset data for x, y and θ for alignment purposes. The operator then rotates the video probes downward toward the circuit board, and the apparatus is now ready to print automatically. As each board is positioned onbase 16, the video probes on left andright assemblies 12 and 13 extend above the positioned circuit board, determine x, y and θ differences between the positioned circuit board and the screen or stencil above and operate stepper motors to reposition, if necessary, the stencil or screen for alignment with the circuit board below.
Referring to FIGS. 2 and 3, there are shown perspective views of the video probe assemblies in extended and retracted positions, respectively. Each assembly includes abase 21 withvertical walls 22 and 23, each formed with front andrear slots 24 and 25, respectively, having horizontal leadingportions 24A and 25A, respectively, and depending angled trailing portions 24B and 25B, respectively. Avertical bracket 26 rests uponside walls 22 and 23. Themovable probe support 27 is formed with elements, such as 31 for riding inslots 24 and 25. Themovable base 27 supports 90°mirror tube 32 that provides an image tocamera 33 in housing 34 and furnishes illuminating light to illuminate the screen or stencil and the circuit board. FIG. 2 shows the video probe in the extended position between circuit board and screen or stencil.Arrow 35 illustrates the 180° rotational range ofmirror tube 32 for looking above and below. FIG. 3 shows the video probe in the retracted position outside the region between circuit board and screen or stencil.Arrows 36 indicate the path traveled by the probe up and forward to the extended position and rearward and down to the retracted position.
Referring to FIG. 4, there is shown an exploded view of a number of elements forming the video probe with some portions cut away. The Volpie 90°mirror tube 32 includes amirror 32A mounted at 45° angle relative to the axis ofmirror tube 32 with a Volpie intrascope approximately 12 inches long mounted insidemirror tube 32. A rotate clamp mechanism is shown inside brokenline 42 with the parts exploded and functions to positionmirror tube 32 in one of two positions 180° apart, looking up as shown for viewing the bottom of the screen or stencil, or looking down for viewing the top of the printed circuit board.Focus knob 43 allows for focusing the image ofcamera 33 by observing the image on video monitor 15.
Themain probe clamp 44 carries twoshock absorbers 45 and 46 above the left andright arms 47 and 48, respectively.Main clamp 44 also carries three ball-and-cone pieces, two of which 51 and 52 are visible in FIG. 4.
Referring to FIG. 5, there is shown an exploded view of a video probe support assembly with the housing cut away and the video probes omitted to better illustrate certain structural features.Main clamp 44 supports the vision probe at the center of the camera 30 andVolpie intrascope unit 44. By supporting this assembly at the center of gravity, when the ball-and-cone pieces 51, 52 and 61 engage reference balls, there is very low energy movement to achieve precise reference position very quickly.
A linkage allows the center of effort to be aligned along the axis ofmirror tube 32 andVolpie intrascope unit 41. This linkage includes aleft link 62 andright link 63.Air cylinder 64 drives the leading ends of these links withpin 65 seated inclevis 66 secured to the leading edge ofair cylinder rod 64A.Main clamp 44 is formed withvertical recesses 44A and 44B that engage the left andright arms 71 and 72, respectively. These arms accommodate four rollers, a trailing pair in openings 71A and 72A, and a leading pair in vertical slots 71B and 72B. Left andright side plates 22 are cammed as shown. Left andright angle brackets 73 and 74 are attached to the top leading portions of left andright side plates 22 and 23, respectively, that rollers on the link system engage. These angled brackets provided horizontal surfaces for insuring thatair cylinder 64 pulls the probe itself horizontally without a vertical component of force.Rollers 75 and 76 ride on left and right angled brackets 74 and 75, respectively. A pair of flow controls 81 and 82 mount on the trailing portion ofleft side plate 22 and have a needle valve which allows re-exhaust in each direction for aiding in providing smooth motion upon operatingair cylinder 64 for extension and retraction free of binding or violet motion.Shock absorbers 45 and 46 also help allow smooth action when the vision probe approaches a final location against the ball and cone.Shock absorbers 45 and 46 provide damping that prevents theCCD cameras 33 from being subjected to violet movements.
Main clamp 44 clamps the vision probe firmly to the tooling bed 11 of the machine, while allowing some relative adjustment on the probe to position themirror tube 32 between the stencil and circuit board that may vary depending on the thickness of the circuit board. Clamping screws may be loosened and two jacking set screws 94A may be adjusted to control this position.
There is a right ball mount support 83 for supportingballs 83A and 83B and a leftball mount support 84 for supporting ball 84A.Balls 84A, 83A and 83B engage ball-and-cone pieces 51, 52, and 61, respectively. Ball mounts 83C, 83D and 84B are independently adjustable. Whenair cylinder 64 urges the probes to the extended position, ball mounts 83C, 83D and 84B are tightened so thatballs 83A, 83B and 84B are exactly seated in ball-and-cone pieces 52, 61 and 51, respectively. This position is then readily repeatable.
Left and right fiberoptic supports 85 and 86 are connected to left andright links 62 and 63, respectively, and carry fibers optics (not shown) in parallel to the Volpie intrascope. This arrangement with fiber optics along and parallel to the Volpie intrascope provides back lighting. That is to say, this structure provides a very shallow light illuminating the object being viewed. The shallow angle light reduces glare, and the image of the object being viewed appears more clearly with back lighting.
Pins 85A and 86A pivotally support left and right fiber optic supports 85 and 86 to slots 71B and 72B in left andright arms 71 and 72, respectively. This structural arrangement allows free vertical rotation of these supports so that whenair cylinder 64 extends and retracts the assembled slide unit, it prevents significant free floating. Stated in other words, because the left and right links are referenced on left andright angle brackets 73 and 74, respectively, at the extended end of the stroke for precise horizontal actuation, the structural arrangement contains when not actually contacting the angle brackets.Pins 85A and 86A in slots 71B and 72B provide this containment.Pin 65 pulls left andright links 62 and 63 up and outward toward the extended end untilrollers 75 and 76 engage the underside of left andright brackets 73 and 74. Onretraction pin 65 moves down and toward the retracted position.
Afocus hold bar 91 is secured to the top ofmain clamp 44 and carries a piece of felt on the bottom for engagement byfocus knob 43. This holding function helps preventfocus knob 43 from rotating in the presence of repeated changes in position of the probe assembly.
Aproximity switch 92 is fastened toside plate 23 for providing a signal indicating that the probe is in a safe retracted position to allow the apparatus to print on the circuit board then below the aligned screen or stencil.
There is a left clamp piece 93, left set screw adjust bar 94 and leftclamp nut plate 95 secured to the extended end ofleft side plate 22. Similarly, there is aright clamp piece 96, right set screw adjustbar 97 and rightclamp nut plate 98 secured to the extended end ofright side plate 23. Set screws such as 94A and 97A, allow adjustment of set screw adjustbars 94 and 97.
Other components of the vision system include the vision processor, a commercially available type.Iadd.. .Iaddend.
Cognex unit and monitor having Cognex commercially available software for image searching for matching a stored image with an observed image to permit alignment of the screen or stencil with a circuit board below together with software for controlling the menu-driven functions relative to the specific screen printer application of the vision processor.
An operator communicates with the processor for aligning a particular board through atrackball teaching module 14. This teaching module has three buttons 14A, 14B and 14C and a ball 14D. Rotating or pushing the ball with fingers allows the operator to move the window within the field of view on monitor 15, and actuating the buttons allows the operator to select a menu item or move the cursor down through the menu. Operating button 14C selects a help menu.
It may be advantageous to include a monitor mounted on an arm on the side of the screen printer for observing what each vision probe inassemblies 12 and 13 observes. Two vision probes are used to detect rotational movement θ in addition to rectilinear movement in x and y directions.
The light source is preferably a high intensity light coupled to the fiber optics. These fiber optics carry light where needed on each side of each vision probe, a total of four light sources. There is also a source of illumination above the stencil for backlighting the stencil to permit observation of features, such as holes, in the stencil for identifying the image for capturing.
We turn now to a description of the process from the beginning when an operator sets up the vision system to operate upon a specific run of circuit boards to operation in an automatic cycle.
First, the operator adjusts the mechanisms on the screen printer to handle the particular board size in conventional manner. That involves adjusting the tracks and board stop, and inserting the stencil needed to print on that board inside the screen printer. These mechanical steps are the same as with the ASP-24 fully automated screen printer without the vision features according to the invention.
The operator then applies power to the apparatus to provide the main menu on display. This main menu allows the operator to select setup, edit setup, autoprint or address a help menu. First the operator selects setup. After selecting setup, a menu prompt on the screen instructs the operator to locate each vision probe over the particular object on the circuit board which the operator feels is unique and will be trained upon, such as a configuration of surface mount circuit board footprint pads. The apparatus will then look for this same unique pattern on subsequent boards in an automated production run.
The operator manually positions a first vision probe, such as the one inleft assembly 12, over the board centered over the particular unique object. The operator then clamps this vision probe assembly in place. The operator then pushes button 14A on the teaching track ball module to select the next prompt on the menu. That prompt directs alignment of the second vision probe, such as the one onright assembly 13. The operator aligns this second vision probe in substantially the same manner as the first and again presses button 14A to produce the next prompt. The board patterns are taught and then the apparatus .[.loos.]. .Iadd.looks .Iaddend.at the stencil. This next prompt instructs the operator to rotate the vision probes .[.throu.]. .Iadd.through .Iaddend.180° to look at the stencil. The operator then rotatesmirror tubes 32 through the 180° established by the rotateclamps 42. The operator then drives the screen into position above the board with joy stick and θ push button controls on the ASP-24 machine. The operator positions the overhead structure in x, y and θ into a position such that the vision probes observe the pattern on the screen or stencil that matches the pattern on the circuit board previously aligned centered within the field of view of the probes. In response to each actuation of button 14A the menu prompts the operator to teach the pattern that is desirable after manually locating the stencil. The operator may be required to make fine adjustments in the window by moving trackball 14D and changing the window size until the object is clearly defined and boxed in a square on monitor 15. The operator then depresses push-button 14B and thereby teaches the system the pattern it is looking for with the first probe. The operator follows the same procedure for the second probe. Then the operator pushes button 14C to indicate teaching is complete.
The screen printer then makes a number of automatic moves to learn the geometry associated with this particular setup and this particular type board.
The x stepper motor first moves the screen printer a predetermined number of steps in the x direction. This movement defines the world coordinate system for thecameras 33. Because of this feature the cameras may be placed at any angle anywhere along the front of the circuit board. The y stepper motors then move the screen printer a predetermined number of steps in the orthogonal y direction to confirm the world coordinate system. The system also recognizes the number of steps per pixel during these x-y moves. These moves enable recognition of how much the image moves for every step of the stepper drive system. Then the stepper motors move the screen printer through pure rotation a predetermined number of steps to determine how the object translates in x and y coordinates during a pure rotation. The printer repeats these translational and rotational movements.
The system has thus recognized how the object moves in x and y and how it translates in x and y during a rotational move. This information on these moves allows the system to learn trigonometric solutions of several triangles.
Referring to FIG. 6, there is shown a diagrammatic representation of moves in x, y and θ helpful in understanding the principles of the invention involved in learning the geometry of the circuit boards and stencils. The pattern is characterized by a center of rotation 111. The apparatus may learn from looking at the stencil or screen driven by the stepping motors with reference to two points, such as 112 and 113, that are some vector distance away from the center of rotation 111. First performing a move in the x direction facilitates learning the world coordinate system and steps per pixel confirmed by a movement in the y direction. The following rotational moves involves taking a picture of the objects, such as 112 and 113, after an incremental move in one direction, typically counterclockwise, followed by a move from the initial position in the opposite direction by the same increment from the initial position, typically clockwise. The moves in the x and y direction basically define right triangles having a hypotenuse of magnitude corresponding to the square root of the sum of the squares of the incremental displacements in the x and y directions. The angular displacements effectively create two isosceles triangles from the shifts aboutpoints 112 and 113 with the center of rotation 111 being the common vertex for both isosceles triangles. The invention facilitates learning the geometry of the board by looking at only two points and making moves in x, y and θ directions for each of these points.
An operator may select any target point that appears unique on the board such that it may be distinguished from other target points around it, choose a second target point similarly distinguishable from other surrounding targets, and teach the apparatus the geometry of the board such that when any circuit board enters the apparatus out of line with the stencil, the video probes looking at the board automatically download the proper x, y and θ moves for the stencil to bring stencil and board into alignment.
The operator then rotates both probes to look down at the board. Looking now at the board, the system learns the pattern on the board which correlates with a pattern on the screen. The operator has then completed the automatic setup.
It may be desirable to modify this procedure slightly. For example, it may be desirable to rotate the probes to look up again after the system has learned the circuit board pattern to better correlate circuit board and screen or stencil images.
With the probes then looking at the board, the operator may then select auto print on the main menu, and the apparatus is then ready for a production run. During a production run, both probe assemblies index into position after the board has been brought in, recognize the patterns that is learned on each of the probes and automatically moves the screen relative to the board to align the stencil very accurately with the board. The probes then moves into the retracted position, printing occurs and the board just properly printed exits the machine. A new board enters, set down against the vacuum stop, the probes move to the extended position, the apparatus recognizes the patterns, downloads to the stepper motors the proper movements to align the stencil with the circuit board, print, exits, and the process repeats.
As an alternative, the operator may edit a setup. If an operator notices that the screen printer is printing consistently off the pad in one direction or other, the operator may select edit setup from the menu and modify where the screen printer is printing by selecting a predetermined direction and distance of correction. Thereafter, the apparatus will automatically print consistently in the new location and continue to print in that location until modified again.
A feature of the invention is the lighting arrangement for back lighting the stencil. Stencils and screens are usually shiny or have objects on the bottom which may be confused with object features to be taught. By laying the translucent material on the stencil and providing a light behind it, back lighting occurs which prevents this problem. This arrangement disperses the light in a manner that clearly defines each hole in the stencil relative to any type of reflective background that might occur.
The invention has a number of features. The vision probes enter between circuit board and stencil and perform the alignment as distinguished from looking at the board outside the screen printer.
There has been described novel apparatus and techniques for aligning. It is evident that those skilled in the art may now make numerous other uses and modifications of and departures from the apparatus and techniques herein disclosed without departing from the inventive concepts. Consequently, the invention is to be construed as embracing each and every novel feature and novel combination of features present in or possessed by the apparatus and techniques herein disclosed and limited solely by the spirit and scope of the appended claims. ##SPC1##

Claims (14)

What is claimed is:
1. Aligning apparatus comprising,
an object to be acted upon at predetermined locations defining a pattern,
a device characterized by said pattern for acting upon said object,
a video probe arranged to look at both said device and said object for providing image signals representative of both,
means for comparing both image signals to obtain an error signal representative of misalignment between the device and object,
means responsive to said error signal for .[.relatively positioning.]. .Iadd.translating and rotating .Iaddend.said device .[.and said object.]. to reduce said error,
and means for operating upon said object with said device upon said predetermined locations.
2. Aligning apparatus is accordance with claim 1 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
3. Aligning apparatus .[.in accordance with claim 1 and further.]. comprising,
.Iadd.an object to be acted upon at predetermined locations defining a pattern,
a device characterized by said pattern for acting upon said object,
a video probe arranged to look at said device and said object for providing image signals representative of both,
means for comparing both image signals to obtain an error signal representative of misalignment between the device and object,
means responsive to said error signal for relatively positioning said device and said object to reduce said error,
and means for operating upon said object with said device upon said predetermined locations, .Iaddend.
a second of said video probes spaced from the first-mentioned video probe arranged to look at both said device and said object for providing image signals representative of both at areas thereof different from the areas viewed by said first-mentioned video probe,
and means for relatively displacing said video probes while in fixed relative relation and one of said object and device predetermined incremental distances in first and second orthogonal directions and a rotational directional to provide a reference image signal characterizing said pattern.
4. Aligning apparatus is accordance with claim 3 and further comprising:
for each of said video probes video probe support means for selectively moving the associated video probe between a first position located between said device and said object and a second position outside the region between said object and said device,
and means for locating the associated video probe in said first position before acting upon said object and then displacing said video probe to said second position after relatively positioning said device and said object to reduce said error and operating upon said object with said device upon said predetermined locations with the associated video probe in said second position.
5. Aligning apparatus in accordance with claim 4 wherein each of said video probe support means comprises,
a movable probe support carrying said video probe,
a fixed base having vertical walls each formed with front and rear slots with each slot having a horizontal leading portion and a depending angled trailing portion,
said movable probe support having elements for riding in said slots to allow said video probe to move between said first position with said video probe extended and said second position with said video probe retracted.
6. Aligning apparatus in accordance with claim .[.8.]. .Iadd.5 .Iaddend.wherein said movable probe support comprises a main clamp supporting said video probe substantially at its center of gravity and further comprising,
ball-and-cone pieces and reference balls,
said fixed base comprising a vertical bracket carrying one of said reference balls and said ball-and-cone pieces,
said main clamp carrying the other of said reference balls and ball-and-cone pieces arranged so that engagement of said ball-and-cone pieces with mating reference balls defines a reference position of said video probe.
7. Aligning apparatus in accordance with claim 1 and further comprising,
video probe support means for selectively moving said video probe between a first position located between said device and said object and a second position outside the region between said object and said device,
and means for locating said video probe in said first position before acting upon said object and then displacing said video probe to said second position after relatively positioning said device and said object to reduce said error and operating upon said object with said device upon said predetermined locations with said video probe in said second position.
8. Aligning apparatus in accordance with claim 7 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
9. Aligning apparatus in accordance with claim 7 wherein each of said video probes comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
10. Aligning apparatus in accordance with claim 7 wherein said video probe support means comprises,
a movable probe support carrying said video probe,
a fixed base having vertical walls each formed with front and rear slots with each slot having a horizontal leading portion and a depending angled trailing portion,
said movable probe support having elements for riding in said slots to allow said video probe to move between said first position with said video probe extended and said second position with said video probe retracted.
11. Aligning apparatus in accordance with claim 2 wherein said video probe comprises a mirror tube having a mirror at one end intersecting the mirror tube axis at an angle of substantially 45° and exposed through an opening in the wall of said mirror tube,
a video camera located at the other end of said mirror tube for receiving images reflected from said mirror,
said mirror tube being rotatable about the mirror axis between at least a first position exposing said mirror to said device and a second position exposing said mirror to said object.
12. A method of aligning an object to be acted upon at predetermined locations defining a pattern with a device characterized by said pattern for acting upon said object which method includes the steps of,
positioning a video probe to look at first one of said device and said object and then the other for providing image signals representative of both,
comparing both said image signals to provide an error signal representative of misalignment between said device and object,
.[.relatively positioning.]. .Iadd.translating and rotating .Iaddend.said device .[.and said object.]. while sensing said error signal to reduce said error,
and operating upon said object with said device upon said predetermined locations with said object and said device then being in alignment.
13. A method in accordance with claim 12 and further including the steps of moving said video probe between an inside position located between said device and said object,
then locating said video probe in an outside position outside the region between said object and said device,
and operating upon said object with said device only with said video probe in said outside position.
14. A method .[.in accordance with claim 13 and further including the steps of.]. .Iadd.of aligning an object to be acted upon at predetermined locations defining a pattern with a device characterized by said pattern for acting upon said object which method includes the steps of,
positioning a video probe to look at first one of said device and said object and then the other for providing image signals representative of both,
comparing both said image signals to provide an error signal representative of misalignment between said device and object,
relatively positioning said device and said object while sensing said error signal to reduce said error,
operating upon said object with said device upon said predetermined locations with said object and said device then being in alignment, .Iaddend.
looking first at one of said device and said object and then the other with a second video probe spaced from the first-mentioned video probe to provide a second set of image signals representative of said device and said object different from the image signals provided by said first-mentioned video and the areas representative thereof,
and relatively displacing said video probes while in fixed relative relation with respect to one of said object and device predetermined incremental distances in first and second orthogonal directions and a rotational direction to provide a reference image signal characterizing said pattern.
US07/829,7271987-11-021992-01-31Video probe aligning of object to be acted uponExpired - LifetimeUSRE34615E (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US07/829,727USRE34615E (en)1987-11-021992-01-31Video probe aligning of object to be acted upon

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US07/116,490US4924304A (en)1987-11-021987-11-02Video probe aligning of object to be acted upon
CA000596903ACA1320828C (en)1987-11-021989-04-17Aligning
US07/829,727USRE34615E (en)1987-11-021992-01-31Video probe aligning of object to be acted upon

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US07/116,490ReissueUS4924304A (en)1987-11-021987-11-02Video probe aligning of object to be acted upon

Publications (1)

Publication NumberPublication Date
USRE34615Etrue USRE34615E (en)1994-05-24

Family

ID=25672625

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US07/116,490CeasedUS4924304A (en)1987-11-021987-11-02Video probe aligning of object to be acted upon
US07/829,727Expired - LifetimeUSRE34615E (en)1987-11-021992-01-31Video probe aligning of object to be acted upon

Family Applications Before (1)

Application NumberTitlePriority DateFiling Date
US07/116,490CeasedUS4924304A (en)1987-11-021987-11-02Video probe aligning of object to be acted upon

Country Status (4)

CountryLink
US (2)US4924304A (en)
EP (1)EP0394568B1 (en)
CA (1)CA1320828C (en)
ES (1)ES2058512T3 (en)

Cited By (38)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5669970A (en)*1995-06-021997-09-23Mpm CorporationStencil apparatus for applying solder paste
US5794329A (en)*1995-02-271998-08-18Mpm CorporationSupport apparatus for circuit board
US5883663A (en)*1996-12-021999-03-16Siwko; Robert P.Multiple image camera for measuring the alignment of objects in different planes
US5943089A (en)1996-08-231999-08-24Speedline Technologies, Inc.Method and apparatus for viewing an object and for viewing a device that acts upon the object
US6031242A (en)1998-01-232000-02-29Zevatech, Inc.Semiconductor die in-flight registration and orientation method and apparatus
US6077022A (en)1997-02-182000-06-20Zevatech Trading AgPlacement machine and a method to control a placement machine
US6129040A (en)1997-09-052000-10-10Esec SaSemi-conductor mounting apparatus for applying adhesive to a substrate
US6135339A (en)1998-01-262000-10-24Esec SaUltrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
US6157870A (en)1997-02-182000-12-05Zevatech Trading AgApparatus supplying components to a placement machine with splice sensor
US6179938B1 (en)1997-10-302001-01-30Esec SaMethod and apparatus for aligning the bonding head of a bonder, in particular a die bonder
US6185815B1 (en)1997-12-072001-02-13Esec SaSemiconductor mounting apparatus with a chip gripper travelling back and forth
WO2001035703A1 (en)*1999-11-082001-05-17Speedline Technologies, Inc.Improvements in solder printers
US20030021886A1 (en)*2000-02-232003-01-30Baele Stephen JamesMethod of printing and printing machine
US6663712B2 (en)1997-02-212003-12-16Speedline Technologies, Inc.Dual track stenciling system with solder gathering head
US20040060963A1 (en)*2002-09-302004-04-01Eric LudwigSelective wave solder system
US20040089413A1 (en)*2002-08-082004-05-13Michael MurphySystem and method for modifying electronic design data
US20040175030A1 (en)*1999-05-042004-09-09Prince David P.Systems and methods for detecting defects in printed solder paste
US20040187716A1 (en)*2003-03-282004-09-30Pham-Van-Diep Gerald C.Pressure control system for printing a viscous material
US20040218808A1 (en)*1999-05-042004-11-04Prince David P.Systems and methods for detecting defects in printed solder paste
US20060048655A1 (en)*2004-02-192006-03-09Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US20060081138A1 (en)*2004-10-182006-04-20Perault Joseph AMethod and apparatus for supporting and clamping a substrate
US20070102477A1 (en)*2005-11-102007-05-10Speedline Technologies, Inc.Imaging system and method for a stencil printer
US20070102478A1 (en)*2005-11-102007-05-10Speedline Technologies, Inc.Optimal imaging system and method for a stencil printer
US7270478B2 (en)2002-08-132007-09-18International Business Machines CorporationX-ray alignment system for fabricating electronic chips
US7293691B2 (en)2003-01-172007-11-13Speedline Technologies, Inc.Electronic substrate printing
US20080006162A1 (en)*2006-07-102008-01-10Speedline Technologies, Inc.Method and apparatus for clamping a substrate
US20080197170A1 (en)*2007-02-162008-08-21Prince David PSingle and multi-spectral illumination system and method
US20080250951A1 (en)*2007-04-132008-10-16Illinois Tool Works, Inc.Method and apparatus for adjusting a substrate support
US20080257179A1 (en)*2007-04-172008-10-23Patsy Anthony MatteroMultiplexed control of multi-axis machine with distributed control amplifier
US7458318B2 (en)2006-02-012008-12-02Speedline Technologies, Inc.Off-axis illumination assembly and method
US20090169054A1 (en)*2007-12-262009-07-02Altek CorporationMethod of adjusting selected window size of image object
US20090255426A1 (en)*2008-02-142009-10-15Illinois Tool Works Inc.Method and apparatus for placing substrate support components
US20110115899A1 (en)*2008-07-142011-05-19Panasonic CorporationComponent mount system
US9370925B1 (en)2015-03-252016-06-21Illinois Tool Works Inc.Stencil printer having stencil shuttle assembly
US9370923B1 (en)2015-04-072016-06-21Illinois Tool Works Inc.Lift tool assembly for stencil printer
US9370924B1 (en)2015-03-252016-06-21Illinois Tool Works Inc.Dual action stencil wiper assembly for stencil printer
US10703089B2 (en)2015-04-072020-07-07Illinois Tool Works Inc.Edge lock assembly for a stencil printer
US10723117B2 (en)2015-04-072020-07-28Illinois Tool Works Inc.Lift tool assembly for stencil printer

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2561166B2 (en)*1990-03-261996-12-04株式会社精工舎 Method and device for punching printed circuit board
US5060063A (en)*1990-07-301991-10-22Mpm CorporationViewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
US5216804A (en)*1991-05-211993-06-08U.S. Philips Corp.Method and device for placing a component on a printed circuit board
JPH10128951A (en)*1996-10-311998-05-19Sakurai Graphic Syst:KkScreen printing apparatus and printing position adjusting method
DE19728144C2 (en)1997-07-022001-02-01Ekra Eduard Kraft Gmbh Method and device for generating test patterns
GB2359515B (en)*2000-02-232003-12-03Kistech LtdMethod of printing and printing machine
US6569248B1 (en)2000-09-112003-05-27Allen David HertzApparatus for selectively applying solder mask
US6626106B2 (en)2001-04-172003-09-30Speedline Technologies, Inc.Cleaning apparatus in a stencil printer
KR100428510B1 (en)*2002-04-102004-04-29삼성전자주식회사Apparatus and method of precise positioning control using optical system
US20080156207A1 (en)*2006-12-282008-07-03Dan EllenbogenStencil printers and the like, optical systems therefor, and methods of printing and inspection
CN101229711B (en)*2007-01-252010-06-02东莞市凯格精密机械有限公司 Method and Mechanism of Single Optical Axis Detection in Vision Printing Machine
IT1398427B1 (en)*2009-09-032013-02-22Applied Materials Inc PROCEDURE AND ALIGNMENT OF A SUBSTRATE
CN102001242B (en)*2010-10-142012-06-20吴江迈为技术有限公司Printing deviation measuring method, printing method and printing device for solar cell plate
CN102092179B (en)*2010-12-302012-07-04东莞市科隆威自动化设备有限公司Full-automatic solder paste printing machine
CN102706302B (en)*2011-07-042014-12-10东莞市卓安精机自动化设备有限公司Automatic detecting device for printing steel mesh
US9299118B1 (en)*2012-04-182016-03-29The Boeing CompanyMethod and apparatus for inspecting countersinks using composite images from different light sources
EP3735807B1 (en)*2018-01-022023-09-13Illinois Tool Works Inc.Edge lock assembly for a stencil printer and method and system therefor
US20200391530A1 (en)2019-06-132020-12-17Illinois Tool Works Inc.Multi-functional print head for a stencil printer
US11247286B2 (en)2019-06-132022-02-15Illinois Tool Works Inc.Paste dispensing transfer system and method for a stencil printer
US11318549B2 (en)2019-06-132022-05-03Illinois Tool Works Inc.Solder paste bead recovery system and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4608494A (en)*1983-11-111986-08-26Hitachi, Ltd.Component alignment apparatus
US4672437A (en)*1985-07-081987-06-09Honeywell Inc.Fiber optic inspection system
US4686565A (en)*1984-05-221987-08-11Fujitsu LimitedMethod and apparatus for visually examining an array of objects disposed in a narrow gap
US4737845A (en)*1985-10-111988-04-12Hitachi, Ltd.Method of loading surface mounted device and an apparatus therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4608494A (en)*1983-11-111986-08-26Hitachi, Ltd.Component alignment apparatus
US4686565A (en)*1984-05-221987-08-11Fujitsu LimitedMethod and apparatus for visually examining an array of objects disposed in a narrow gap
US4672437A (en)*1985-07-081987-06-09Honeywell Inc.Fiber optic inspection system
US4737845A (en)*1985-10-111988-04-12Hitachi, Ltd.Method of loading surface mounted device and an apparatus therefor

Cited By (66)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5794329A (en)*1995-02-271998-08-18Mpm CorporationSupport apparatus for circuit board
US5669970A (en)*1995-06-021997-09-23Mpm CorporationStencil apparatus for applying solder paste
US5943089A (en)1996-08-231999-08-24Speedline Technologies, Inc.Method and apparatus for viewing an object and for viewing a device that acts upon the object
US5883663A (en)*1996-12-021999-03-16Siwko; Robert P.Multiple image camera for measuring the alignment of objects in different planes
US6077022A (en)1997-02-182000-06-20Zevatech Trading AgPlacement machine and a method to control a placement machine
US6157870A (en)1997-02-182000-12-05Zevatech Trading AgApparatus supplying components to a placement machine with splice sensor
US6663712B2 (en)1997-02-212003-12-16Speedline Technologies, Inc.Dual track stenciling system with solder gathering head
US6129040A (en)1997-09-052000-10-10Esec SaSemi-conductor mounting apparatus for applying adhesive to a substrate
US6179938B1 (en)1997-10-302001-01-30Esec SaMethod and apparatus for aligning the bonding head of a bonder, in particular a die bonder
US6185815B1 (en)1997-12-072001-02-13Esec SaSemiconductor mounting apparatus with a chip gripper travelling back and forth
US6031242A (en)1998-01-232000-02-29Zevatech, Inc.Semiconductor die in-flight registration and orientation method and apparatus
US6135339A (en)1998-01-262000-10-24Esec SaUltrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
US20040175030A1 (en)*1999-05-042004-09-09Prince David P.Systems and methods for detecting defects in printed solder paste
US7310438B2 (en)1999-05-042007-12-18Speedline Technologies, Inc.Systems for detecting defects in printed solder paste
US7149344B2 (en)1999-05-042006-12-12Speedline Technologies, Inc.Systems and methods for detecting defects in printed solder paste
US20060245637A1 (en)*1999-05-042006-11-02Speedline Technologies, Inc.Systems for detecting defects in printed solder paste
US7072503B2 (en)1999-05-042006-07-04Speedline Technologies, Inc.Systems and methods for detecting defects in printed solder paste
US20050169514A1 (en)*1999-05-042005-08-04Speedline Technologies, Inc.Systems and methods for detecting defects in printed solder paste
US6891967B2 (en)1999-05-042005-05-10Speedline Technologies, Inc.Systems and methods for detecting defects in printed solder paste
US20040218808A1 (en)*1999-05-042004-11-04Prince David P.Systems and methods for detecting defects in printed solder paste
WO2001035703A1 (en)*1999-11-082001-05-17Speedline Technologies, Inc.Improvements in solder printers
US20030021886A1 (en)*2000-02-232003-01-30Baele Stephen JamesMethod of printing and printing machine
US6938227B2 (en)2002-08-082005-08-30Fry's Metals, Inc.System and method for modifying electronic design data
US20040089413A1 (en)*2002-08-082004-05-13Michael MurphySystem and method for modifying electronic design data
US20080043909A1 (en)*2002-08-132008-02-21International Business Machines CorporationX-Ray Alignment System For Fabricating Electronic Chips
US7270478B2 (en)2002-08-132007-09-18International Business Machines CorporationX-ray alignment system for fabricating electronic chips
US7213738B2 (en)2002-09-302007-05-08Speedline Technologies, Inc.Selective wave solder system
US20040060963A1 (en)*2002-09-302004-04-01Eric LudwigSelective wave solder system
US7293691B2 (en)2003-01-172007-11-13Speedline Technologies, Inc.Electronic substrate printing
WO2004087421A1 (en)2003-03-282004-10-14Speedline Technologies, Inc.Pressure control system for printing a viscous material
US20040187716A1 (en)*2003-03-282004-09-30Pham-Van-Diep Gerald C.Pressure control system for printing a viscous material
US6955120B2 (en)2003-03-282005-10-18Speedline Technologies, Inc.Pressure control system for printing a viscous material
US7171898B2 (en)2004-02-192007-02-06Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US7013802B2 (en)2004-02-192006-03-21Speedline Technologies, Inc.Method and apparatus for simultaneous inspection and cleaning of a stencil
US20070051253A1 (en)*2004-02-192007-03-08Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US7322288B2 (en)2004-02-192008-01-29Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US20060048655A1 (en)*2004-02-192006-03-09Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US20080066635A1 (en)*2004-02-192008-03-20Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US7469635B2 (en)2004-02-192008-12-30Speedline Technologies, Inc.Method and apparatus for performing operations within a stencil printer
US7121199B2 (en)2004-10-182006-10-17Speedline Technologies, Inc.Method and apparatus for supporting and clamping a substrate
US20060081138A1 (en)*2004-10-182006-04-20Perault Joseph AMethod and apparatus for supporting and clamping a substrate
US20070102477A1 (en)*2005-11-102007-05-10Speedline Technologies, Inc.Imaging system and method for a stencil printer
US20070102478A1 (en)*2005-11-102007-05-10Speedline Technologies, Inc.Optimal imaging system and method for a stencil printer
US7458318B2 (en)2006-02-012008-12-02Speedline Technologies, Inc.Off-axis illumination assembly and method
US7549371B2 (en)2006-07-102009-06-23Speedline Technologies, Inc.Method and apparatus for clamping a substrate
US20080006162A1 (en)*2006-07-102008-01-10Speedline Technologies, Inc.Method and apparatus for clamping a substrate
US20080197170A1 (en)*2007-02-162008-08-21Prince David PSingle and multi-spectral illumination system and method
US7710611B2 (en)2007-02-162010-05-04Illinois Tool Works, Inc.Single and multi-spectral illumination system and method
US20080250951A1 (en)*2007-04-132008-10-16Illinois Tool Works, Inc.Method and apparatus for adjusting a substrate support
US20110120325A1 (en)*2007-04-132011-05-26Illinois Tool Works, Inc.Method and apparatus for adjusting a substrate support
US7861650B2 (en)2007-04-132011-01-04Illinois Tool Works, Inc.Method and apparatus for adjusting a substrate support
US8230783B2 (en)2007-04-132012-07-31Illinois Tool Works Inc.Method and apparatus for adjusting a substrate support
US20080257179A1 (en)*2007-04-172008-10-23Patsy Anthony MatteroMultiplexed control of multi-axis machine with distributed control amplifier
US8253355B2 (en)2007-04-172012-08-28Illinois Tool Works Inc.Multiplexed control of multi-axis machine with distributed control amplifier
US7827909B2 (en)2007-04-172010-11-09Illinois Tool Works Inc.Stencil printer with multiplexed control of multi-axis machine having distributed control motor amplifier
US20110023735A1 (en)*2007-04-172011-02-03Illinois Tool Works Inc.Multiplexed control of multi-axis machine with distributed control amplifier
US20090169054A1 (en)*2007-12-262009-07-02Altek CorporationMethod of adjusting selected window size of image object
US8085983B2 (en)*2007-12-262011-12-27Altek CorporationMethod of adjusting selected window size of image object
US20090255426A1 (en)*2008-02-142009-10-15Illinois Tool Works Inc.Method and apparatus for placing substrate support components
US20110115899A1 (en)*2008-07-142011-05-19Panasonic CorporationComponent mount system
US9370925B1 (en)2015-03-252016-06-21Illinois Tool Works Inc.Stencil printer having stencil shuttle assembly
US9370924B1 (en)2015-03-252016-06-21Illinois Tool Works Inc.Dual action stencil wiper assembly for stencil printer
US9370923B1 (en)2015-04-072016-06-21Illinois Tool Works Inc.Lift tool assembly for stencil printer
US9868278B2 (en)2015-04-072018-01-16Illinois Tool Works Inc.Lift tool assembly for stencil printer
US10703089B2 (en)2015-04-072020-07-07Illinois Tool Works Inc.Edge lock assembly for a stencil printer
US10723117B2 (en)2015-04-072020-07-28Illinois Tool Works Inc.Lift tool assembly for stencil printer

Also Published As

Publication numberPublication date
US4924304A (en)1990-05-08
ES2058512T3 (en)1994-11-01
CA1320828C (en)1993-08-03
EP0394568B1 (en)1994-09-07
EP0394568A1 (en)1990-10-31

Similar Documents

PublicationPublication DateTitle
USRE34615E (en)Video probe aligning of object to be acted upon
US5471310A (en)System for placement and mounting of fine pitch integrated circuit devices
US5251266A (en)System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
EP0730528B1 (en)Alignment systems
JP4616514B2 (en) Electrical component mounting system and position error detection method therefor
US5627913A (en)Placement system using a split imaging system coaxially coupled to a component pickup means
US20080156207A1 (en)Stencil printers and the like, optical systems therefor, and methods of printing and inspection
US4821657A (en)Viewing apparatus for entering coordinate data in an automatic sewing machine
US4232335A (en)Numerical control tape preparation machine
CN211047019U (en)Multi-angle image acquisition system
JP2002264294A (en)Screen printing equipment and method of setting screen plate
CN220785181U (en)Calibrating device for elliptical printing machine
CN116697936A (en)Gantry type fishing rod straightness detection device and method based on machine vision
JPH02301438A (en)Device for adjusting object of video probe and method therefor
JPS58213496A (en) Component mounting equipment
KR0129784B1 (en)Apparatus for fire extinguishing utilizing spray wvisual inspection supporting system for printed circuit board ater
JPS6411404B2 (en)
JP3341855B2 (en) Work positioning stage device, method for correcting and updating control parameters in the same, and chip bonding device
JP3865459B2 (en) Semiconductor device mounting equipment
JPH08201430A (en) Prober alignment method and apparatus
CN216046545U (en)Multi-dimensional position adjusting device and optical detection equipment with same
CN113624209B (en)Module flat cable calibration equipment and calibration method
JP2020136424A (en)Component mounting machine
JP3173289B2 (en) Electronic component mounting apparatus and electronic component mounting method
US3376762A (en)Spotting projectorscope

Legal Events

DateCodeTitleDescription
FEPPFee payment procedure

Free format text:PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

REFURefund

Free format text:REFUND - PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: R284); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FEPPFee payment procedure

Free format text:PAT HLDR NO LONGER CLAIMS SMALL ENT STAT AS SMALL BUSINESS (ORIGINAL EVENT CODE: LSM2); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAYFee payment

Year of fee payment:8

ASAssignment

Owner name:SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MPM CORPORATION;REEL/FRAME:009719/0352

Effective date:19981231

FPAYFee payment

Year of fee payment:12

SULPSurcharge for late payment

Year of fee payment:11

ASAssignment

Owner name:SPEEDLINE HOLDINGS I, LLC, NEW YORK

Free format text:NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:014943/0593

Effective date:20040105

ASAssignment

Owner name:KPS SPECIAL SITUATIONS FUND II L.P., NEW YORK

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SPEEDLINE TECHNOLOGIES, INC.;REEL/FRAME:015460/0737

Effective date:20040521

ASAssignment

Owner name:SPEEDLINE TECHNOLOGIES, INC., MASSACHUSETTS

Free format text:RELEASE BY SECURED PARTY;ASSIGNOR:SPEEDLINE HOLDINGS I, LLC;REEL/FRAME:018480/0775

Effective date:20061106


[8]ページ先頭

©2009-2025 Movatter.jp