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USD981969S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents

Elastic membrane for semiconductor wafer polishing apparatus
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Publication number
USD981969S1
USD981969S1US29/794,758US202129794758FUSD981969SUS D981969 S1USD981969 S1US D981969S1US 202129794758 FUS202129794758 FUS 202129794758FUS D981969 SUSD981969 SUS D981969S
Authority
US
United States
Prior art keywords
semiconductor wafer
polishing apparatus
elastic membrane
wafer polishing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/794,758
Inventor
Kenichi AKAZAWA
Tomoko OWADA
Osamu Nabeya
Makoto Fukushima
Yuichi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara CorpfiledCriticalEbara Corp
Assigned to EBARA CORPORATIONreassignmentEBARA CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: FUKUSHIMA, MAKOTO, AKAZAWA, KENICHI, KATO, YUICHI, NABEYA, OSAMU, OWADA, TOMOKO
Application grantedgrantedCritical
Publication of USD981969S1publicationCriticalpatent/USD981969S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG.1 is a top perspective view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;
FIG.2 is a bottom perspective view thereof;
FIG.3 is a top view thereof;
FIG.4 is a bottom view thereof;
FIG.5 is a front view thereof, the rear view being identical;
FIG.6 is a right-side view thereof, the left-side view being identical;
FIG.7 is an enlarged cross-sectional end view taken along line7-7 inFIG.3 thereof; and,
FIG.8 is an enlarged detail view ofsection8 inFIG.7 thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
US29/794,7582020-12-182021-06-15Elastic membrane for semiconductor wafer polishing apparatusActiveUSD981969S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2020-027290D2020-12-18
JPD2020-27290FJP1692349S (en)2020-12-182020-12-18

Publications (1)

Publication NumberPublication Date
USD981969S1true USD981969S1 (en)2023-03-28

Family

ID=77173029

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/794,758ActiveUSD981969S1 (en)2020-12-182021-06-15Elastic membrane for semiconductor wafer polishing apparatus

Country Status (2)

CountryLink
US (1)USD981969S1 (en)
JP (1)JP1692349S (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD364384S (en)*1994-05-231995-11-21Fuji Electric Co., Ltd.Semi-conductor element with terminal casing
US6659850B2 (en)*2000-03-312003-12-09Speedfam-Ipec CorporationWork piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD633452S1 (en)*2009-08-272011-03-01Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
TWD167111S (en)2013-05-152015-04-11荏原製作所股份有限公司Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en)*2013-05-152016-10-18Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en)*2013-05-152016-11-08Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD790041S1 (en)*2016-01-082017-06-20Asm Ip Holding B.V.Gas dispersing plate for semiconductor manufacturing apparatus
USD808349S1 (en)*2013-05-152018-01-23Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD839224S1 (en)*2016-12-122019-01-29Ebara CorporationElastic membrane for semiconductor wafer polishing
TWD197827S (en)2017-12-192019-06-01Ebara Corp Elastic film for semiconductor wafer polishing
USD859332S1 (en)2017-06-292019-09-10Ebara CorporationElastic membrane for semiconductor wafer polishing
US10537975B2 (en)2015-08-182020-01-21Ebara CorporationSubstrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
USD918161S1 (en)*2017-12-192021-05-04Ebara CorporationElastic membrane
TWD215079S (en)2020-09-172021-11-01日商荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD364384S (en)*1994-05-231995-11-21Fuji Electric Co., Ltd.Semi-conductor element with terminal casing
US6659850B2 (en)*2000-03-312003-12-09Speedfam-Ipec CorporationWork piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD633452S1 (en)*2009-08-272011-03-01Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en)*2013-05-152018-03-20Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en)*2013-05-152016-10-18Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en)*2013-05-152016-11-08Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en)*2013-05-152018-01-23Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
TWD167111S (en)2013-05-152015-04-11荏原製作所股份有限公司Elastic membrane for semiconductor wafer polishing apparatus
US10537975B2 (en)2015-08-182020-01-21Ebara CorporationSubstrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
USD790041S1 (en)*2016-01-082017-06-20Asm Ip Holding B.V.Gas dispersing plate for semiconductor manufacturing apparatus
USD839224S1 (en)*2016-12-122019-01-29Ebara CorporationElastic membrane for semiconductor wafer polishing
USD913977S1 (en)*2016-12-122021-03-23Ebara CorporationElastic membrane for semiconductor wafer polishing
USD859332S1 (en)2017-06-292019-09-10Ebara CorporationElastic membrane for semiconductor wafer polishing
TWD197827S (en)2017-12-192019-06-01Ebara Corp Elastic film for semiconductor wafer polishing
USD918161S1 (en)*2017-12-192021-05-04Ebara CorporationElastic membrane
TWD215079S (en)2020-09-172021-11-01日商荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing

Also Published As

Publication numberPublication date
JP1692349S (en)2021-08-10

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