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USD966357S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target
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Publication number
USD966357S1
USD966357S1US29/821,669US202129821669FUSD966357SUS D966357 S1USD966357 S1US D966357S1US 202129821669 FUS202129821669 FUS 202129821669FUS D966357 SUSD966357 SUS D966357S
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United States
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
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US29/821,669
Inventor
David Gunther
Jiao Song
Kirankumar Neelasandra Savandaiah
Madan Kumar Shimoga Mylarappa
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Applied Materials Inc
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Applied Materials Inc
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Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.reassignmentAPPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SONG, Jiao
Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: GUNTHER, David, SAVANDAIAH, KIRANKUMAR NEELASANDRA, SHIMOGA MYLARAPPA, MADAN KUMAR
Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
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FIG. 1 is a top isometric view of a sputter target for a physical vapor deposition chamber, according to our novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a right side elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a front elevation thereof.
FIG. 7 is a back elevation view thereof; and,
FIG. 8 is an enlarged partial right side elevation view showing portions of the design in greater detail.
The broken lines in the drawings represent unclaimed environment and form no part of the claimed design.
The long dash short dash broken lines inFIGS. 4 and 8 represent the region of enlargement taken fromFIG. 4 as shown inFIG. 8 and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/821,6692020-12-022021-12-31Target profile for a physical vapor deposition chamber targetActiveUSD966357S1 (en)

Priority Applications (1)

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US29/821,669USD966357S1 (en)2020-12-022021-12-31Target profile for a physical vapor deposition chamber target

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US29/760,578USD940765S1 (en)2020-12-022020-12-02Target profile for a physical vapor deposition chamber target
US29/821,669USD966357S1 (en)2020-12-022021-12-31Target profile for a physical vapor deposition chamber target

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US29/760,578DivisionUSD940765S1 (en)2020-12-022020-12-02Target profile for a physical vapor deposition chamber target

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US29/821,669ActiveUSD966357S1 (en)2020-12-022021-12-31Target profile for a physical vapor deposition chamber target

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USD980813S1 (en)*2021-05-112023-03-14Asm Ip Holding B.V.Gas flow control plate for substrate processing apparatus
USD989012S1 (en)*2020-09-172023-06-13Ebara CorporationElastic membrane
USD990441S1 (en)*2021-09-072023-06-27Asm Ip Holding B.V.Gas flow control plate
USD1006768S1 (en)*2021-01-072023-12-05Solaero Technologies Corp.Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en)*2021-05-072023-12-12Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1012051S1 (en)*2019-06-172024-01-23Tokyo Electron LimitedElectrostatic chuck for semiconductor manufacturing device
USD1012873S1 (en)*2020-09-242024-01-30Asm Ip Holding B.V.Electrode for semiconductor processing apparatus
USD1053230S1 (en)2022-05-192024-12-03Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD1071103S1 (en)*2022-04-112025-04-15Applied Materials, Inc.Gas distribution plate
USD1071886S1 (en)*2022-01-202025-04-22Applied Materials, Inc.Substrate support for a substrate processing chamber
USD1072774S1 (en)*2021-02-062025-04-29Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1085029S1 (en)*2022-07-192025-07-22Applied Materials, Inc.Gas distribution plate
USD1086087S1 (en)*2023-03-302025-07-29Samsung Electronics Co., Ltd.CMP (chemical mechanical planarization) retaining ring
USD1090468S1 (en)2021-09-082025-08-26Lam Research CorporationDebubbler component

Families Citing this family (5)

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USD937329S1 (en)*2020-03-232021-11-30Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD973609S1 (en)*2020-04-222022-12-27Applied Materials, Inc.Upper shield with showerhead for a process chamber
US12080522B2 (en)2020-04-222024-09-03Applied Materials, Inc.Preclean chamber upper shield with showerhead
USD940765S1 (en)*2020-12-022022-01-11Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
JP1700776S (en)*2021-03-042021-11-29 Substrate placement plate for substrate processing apparatus

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