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USD927456S1 - Microphone boom for a communications headset - Google Patents

Microphone boom for a communications headset
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Publication number
USD927456S1
USD927456S1US29/730,828US202029730828FUSD927456SUS D927456 S1USD927456 S1US D927456S1US 202029730828 FUS202029730828 FUS 202029730828FUS D927456 SUSD927456 SUS D927456S
Authority
US
United States
Prior art keywords
microphone boom
communications headset
communications
headset
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/730,828
Inventor
Nicholas W Paterson
John A Kelley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Plantronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plantronics IncfiledCriticalPlantronics Inc
Priority to US29/730,828priorityCriticalpatent/USD927456S1/en
Assigned to WELLS FARGO BANK, NATIONAL ASSOCIATIONreassignmentWELLS FARGO BANK, NATIONAL ASSOCIATIONSUPPLEMENTAL SECURITY AGREEMENTAssignors: PLANTRONICS, INC., POLYCOM, INC.
Assigned to PLANTRONICS, INC.reassignmentPLANTRONICS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KELLEY, JOHN A., PATERSON, NICHOLAS W.
Application grantedgrantedCritical
Publication of USD927456S1publicationCriticalpatent/USD927456S1/en
Assigned to PLANTRONICS, INC., POLYCOM, INC.reassignmentPLANTRONICS, INC.RELEASE OF PATENT SECURITY INTERESTSAssignors: WELLS FARGO BANK, NATIONAL ASSOCIATION
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.reassignmentHEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).Assignors: PLANTRONICS, INC.
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a top-right perspective view of a microphone boom for a communications headset showing my new design;
FIG. 2 is a bottom-left perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a back view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines depicting a temple pad, headband and earcup are to show environment and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a microphone boom for a communications headset, as shown and described.
US29/730,8282018-03-212020-04-08Microphone boom for a communications headsetActiveUSD927456S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/730,828USD927456S1 (en)2018-03-212020-04-08Microphone boom for a communications headset

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US29/641,325USD882544S1 (en)2018-03-212018-03-21Communications headset
US29/730,828USD927456S1 (en)2018-03-212020-04-08Microphone boom for a communications headset

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US29/641,325DivisionUSD882544S1 (en)2018-03-212018-03-21Communications headset

Publications (1)

Publication NumberPublication Date
USD927456S1true USD927456S1 (en)2021-08-10

Family

ID=70329262

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US29/641,325ActiveUSD882544S1 (en)2018-03-212018-03-21Communications headset
US29/730,828ActiveUSD927456S1 (en)2018-03-212020-04-08Microphone boom for a communications headset

Family Applications Before (1)

Application NumberTitlePriority DateFiling Date
US29/641,325ActiveUSD882544S1 (en)2018-03-212018-03-21Communications headset

Country Status (1)

CountryLink
US (2)USD882544S1 (en)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD937808S1 (en)*2020-04-102021-12-07Ming LiuHeadset
USD945394S1 (en)*2020-12-182022-03-08Shenzhen Qianhai Patuoxun Network And Technology Co., LtdHeadphone
USD956014S1 (en)*2020-08-132022-06-28Gn Audio A/SHeadset
USD968367S1 (en)*2020-05-012022-11-01Rtx A/SHeadset
USD969104S1 (en)*2021-02-052022-11-08Plantronics, Inc.Communications headset
USD982552S1 (en)*2021-05-262023-04-04Anker Innovations Technology Co., Ltd.Headphone
USD986216S1 (en)*2021-03-222023-05-16Plantronics, Inc.Communications headset
USD1000417S1 (en)*2021-08-132023-10-03Plantronics, Inc.Communications headset
USD1003273S1 (en)*2021-07-162023-10-31Primer Studios, CorporationHeadphone set
USD1003272S1 (en)*2021-07-162023-10-31Primer Studios, CorporationBoom microphone
USD1006788S1 (en)*2021-10-222023-12-05Shenzhen Shokz Co., Ltd.Headphones
USD1006787S1 (en)*2021-10-222023-12-05Shenzhen Shokz Co., Ltd.Headphones
USD1008216S1 (en)*2021-12-012023-12-19Dongguan YouSound Electronics Co., Ltd.Headset
USD1012889S1 (en)2021-10-222024-01-30Shenzhen Shokz Co., Ltd.Headphones
USD1016036S1 (en)*2021-12-202024-02-27Tao PengHeadphone
USD1016037S1 (en)*2021-12-202024-02-27Tao PengHeadphone
USD1020691S1 (en)*2022-03-312024-04-02Shenzhen Zhonghantong Technology Co., Ltd.Wireless headset
USD1021872S1 (en)*2022-07-252024-04-09Audio-Technica CorporationMicrophone
USD1022948S1 (en)*2022-07-252024-04-16Audio-Technica CorporationHeadset
USD1025950S1 (en)*2022-09-082024-05-07Shenzhen Fushike Electronic Co., LtdWireless earphone
USD1029792S1 (en)*2021-07-152024-06-04Kaetel Systems GmbhHeadphone part
USD1030702S1 (en)*2022-10-202024-06-11Freedman Electronics Pty LtdHeadphone boom arm
USD1034518S1 (en)*2022-03-172024-07-09ACCO Brands CorporationHeadset
USD1034519S1 (en)*2022-03-172024-07-09ACCO Brands CorporationHeadset
USD1034520S1 (en)*2023-03-032024-07-09Xiamen Mairdi Electronic Technology Co., Ltd.Bone conduction headphones
USD1034516S1 (en)*2023-03-032024-07-09Xiamen Mairdi Electronic Technology Co., Ltd.Bone conduction headphones
USD1043612S1 (en)*2022-06-172024-09-24Epos Group A/SHeadset
USD1044770S1 (en)*2022-09-162024-10-01Microsoft CorporationHeadset microphone with transparent portion
USD1071899S1 (en)*2023-03-092025-04-22Lijun XIEHeadset
USD1076872S1 (en)*2024-12-042025-05-27Yueying XieHeadphone
USD1080580S1 (en)2021-10-222025-06-24Shenzhen Shokz Co., Ltd.Speaker covers of headphones

Families Citing this family (8)

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Publication numberPriority datePublication dateAssigneeTitle
USD736174S1 (en)*2014-02-102015-08-11New Audio LLCHeadphone device
USD882544S1 (en)*2018-03-212020-04-28Plantronics, Inc.Communications headset
USD958773S1 (en)*2021-01-122022-07-26Shenzhen Fushike Electronic Co., LtdWireless earphone
US11700474B2 (en)2021-06-242023-07-11New Audio LLCMulti-microphone headset
USD1000416S1 (en)2021-06-242023-10-03New Audio LLCWireless headphones
USD1013662S1 (en)*2021-08-132024-02-06Shenzhen Fushike Electronic Co., LtdWireless earphone
TWI818471B (en)*2022-03-172023-10-11寶德科技股份有限公司Over-ear headphone
USD1093338S1 (en)*2023-11-092025-09-16Binglan TangEarphone

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