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USD922329S1 - Press-fit pin case - Google Patents

Press-fit pin caseDownload PDF

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Publication number
USD922329S1
USD922329S1US29/697,995US201929697995FUSD922329SUS D922329 S1USD922329 S1US D922329S1US 201929697995 FUS201929697995 FUS 201929697995FUS D922329 SUSD922329 SUS D922329S
Authority
US
United States
Prior art keywords
press
fit pin
pin case
case
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/697,995
Inventor
Jihwan Kim
Yushuang YAO
Bosung WON
Atapol Prajuckamol
Olaf Zschieschang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Industries LLCfiledCriticalSemiconductor Components Industries LLC
Priority to US29/697,995priorityCriticalpatent/USD922329S1/en
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCreassignmentSEMICONDUCTOR COMPONENTS INDUSTRIES, LLCASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: ZSCHIESCHANG, OLAF, PRAJUCKAMOL, ATAPOL, YAO, YUSHUANG, KIM, JIHWAN, WON, BOSUNG
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTreassignmentDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTSECURITY INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTreassignmentDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTCORRECTIVE ASSIGNMENT TO CORRECT THE EXCLUSION OF FAIRCHILD SEMICONDUCTOR CORPORATION OF CONVEYING PARTY PREVIOUSLY RECORDED ON REEL 051145 FRAME 0062. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST.Assignors: FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Application grantedgrantedCritical
Publication of USD922329S1publicationCriticalpatent/USD922329S1/en
Assigned to FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCreassignmentFAIRCHILD SEMICONDUCTOR CORPORATIONRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 051145, FRAME 0062Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a top perspective view of a press-fit pin case showing our new design;
FIG. 2 is a top plan view of the press-fit pin case;
FIG. 3 is a bottom plan view of the press-fit pin case;
FIG. 4 is a first side elevation view of the press-fit pin case;
FIG. 5 is a second side elevation view of the press-fit pin case;
FIG. 6 is a first end elevation view of the press-fit pin case; and,
FIG. 7 is a second end elevation view of the press-fit pin case.
Any broken lines in the drawings are for purposes of depicting portions and form no part of the claimed design. All evenly spaced broken lines are directed to the environment. The dot-dash lines depict the bounds of the claimed design, and form no part of the claimed design. In addition, the unshaded surfaces that directly adjoin the claimed solid line edge form no part of the claimed design.

Claims (1)

    CLAIM
  1. What is claimed is an ornamental design for a press-fit pin case, as shown and described herein.
US29/697,9952019-05-102019-07-12Press-fit pin caseActiveUSD922329S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/697,995USD922329S1 (en)2019-05-102019-07-12Press-fit pin case

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US201962846209P2019-05-102019-05-10
US16/510,385US11081828B2 (en)2019-05-102019-07-12Power module housing
US29/697,995USD922329S1 (en)2019-05-102019-07-12Press-fit pin case

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US16/510,385ContinuationUS11081828B2 (en)2019-05-102019-07-12Power module housing

Publications (1)

Publication NumberPublication Date
USD922329S1true USD922329S1 (en)2021-06-15

Family

ID=73047338

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US16/510,385ActiveUS11081828B2 (en)2019-05-102019-07-12Power module housing
US29/697,995ActiveUSD922329S1 (en)2019-05-102019-07-12Press-fit pin case

Family Applications Before (1)

Application NumberTitlePriority DateFiling Date
US16/510,385ActiveUS11081828B2 (en)2019-05-102019-07-12Power module housing

Country Status (1)

CountryLink
US (2)US11081828B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN114446893A (en)*2022-02-142022-05-06苏州华太电子技术有限公司Power semiconductor module and application thereof
EP4231792B1 (en)*2022-02-162024-08-07Schneider Toshiba Inverter Europe SASApparatus for adapting a power module to the printed circuit board of a motor controller
CN115394732B (en)*2022-05-302023-09-05安世半导体科技(上海)有限公司 Power semiconductor module and assembly method thereof
CN119008566A (en)*2024-07-252024-11-22瑞能微恩半导体(上海)有限公司Power module

Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4723919A (en)*1986-07-111988-02-09Gte Products CorporationTelephone interface connection device
US6024584A (en)*1996-10-102000-02-15Berg Technology, Inc.High density connector
US6093035A (en)*1996-06-282000-07-25Berg Technology, Inc.Contact for use in an electrical connector
US6325644B1 (en)*1996-10-102001-12-04Berg Technology, Inc.High density connector and method of manufacture
USD550628S1 (en)*2006-04-262007-09-11Tyco Electronics CorporationElectrical connector receptacle
US7950962B2 (en)*2008-01-292011-05-31Sumitomo Wiring Systems, Ltd.Connector with tapered ribs for improving resin flow
CN303415221S (en)*2015-10-21
USD741813S1 (en)*2014-07-252015-10-27Ipex Technologies Inc.Electrical junction box lid
USD745852S1 (en)*2013-01-252015-12-22Fci Americas Technology LlcElectrical connector
USD768086S1 (en)*2015-06-112016-10-04Ipex Technologies Inc.Hinged electrical junction box
USD770984S1 (en)*2015-06-112016-11-08Ipex Technologies Inc.Hinged electrical junction box
EP2940718B1 (en)2014-04-302018-04-18Vincotech GmbHAssembly for cooling a power module
WO2018159230A1 (en)*2017-02-282018-09-07パナソニックＩｐマネジメント株式会社Method for manufacturing capacitor
US10396481B2 (en)*2014-10-232019-08-27Fci Usa LlcMezzanine electrical connector
USD887366S1 (en)*2017-07-202020-06-16Appleton Grp LlcPower supply housing

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN303415221S (en)*2015-10-21
US4723919A (en)*1986-07-111988-02-09Gte Products CorporationTelephone interface connection device
US6093035A (en)*1996-06-282000-07-25Berg Technology, Inc.Contact for use in an electrical connector
US6325644B1 (en)*1996-10-102001-12-04Berg Technology, Inc.High density connector and method of manufacture
US6024584A (en)*1996-10-102000-02-15Berg Technology, Inc.High density connector
USD550628S1 (en)*2006-04-262007-09-11Tyco Electronics CorporationElectrical connector receptacle
US7950962B2 (en)*2008-01-292011-05-31Sumitomo Wiring Systems, Ltd.Connector with tapered ribs for improving resin flow
USD745852S1 (en)*2013-01-252015-12-22Fci Americas Technology LlcElectrical connector
EP2940718B1 (en)2014-04-302018-04-18Vincotech GmbHAssembly for cooling a power module
USD741813S1 (en)*2014-07-252015-10-27Ipex Technologies Inc.Electrical junction box lid
US10396481B2 (en)*2014-10-232019-08-27Fci Usa LlcMezzanine electrical connector
USD768086S1 (en)*2015-06-112016-10-04Ipex Technologies Inc.Hinged electrical junction box
USD770984S1 (en)*2015-06-112016-11-08Ipex Technologies Inc.Hinged electrical junction box
WO2018159230A1 (en)*2017-02-282018-09-07パナソニックＩｐマネジメント株式会社Method for manufacturing capacitor
USD887366S1 (en)*2017-07-202020-06-16Appleton Grp LlcPower supply housing

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Infineon. Link: https://www.infineon.com/dgdl/Infineon-AN2009-01_Mounting_Instructions_Easy_PressFIT-ApplicationNotes-v02_04-EN.pdf?fileId=db3a30431ed1d7b2011ef425e7c75c5c. Jun. 17, 2019. Assembly Instructions for the Easy-PressFIT Modules. (Year: 2019).*
Vincotech, "10-Ex12PMA0335C-L188A48x_FD," datasheet, rev. 2, May 11, 2018.
Vincotech, "Vincotech Adds flor E1/E2 Product Family," Aug. 2018 Product News, Oct. 21, 2018.

Also Published As

Publication numberPublication date
US11081828B2 (en)2021-08-03
US20200358221A1 (en)2020-11-12

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