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USD902165S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target
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Publication number
USD902165S1
USD902165S1US29/726,094US202029726094FUSD902165SUS D902165 S1USD902165 S1US D902165S1US 202029726094 FUS202029726094 FUS 202029726094FUS D902165 SUSD902165 SUS D902165S
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United States
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
Prior art date
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Application number
US29/726,094
Inventor
William R. Johanson
Kirankumar Neelasandra Savandaiah
Prashant Prabhakar Prabhu
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Applied Materials Inc
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Applied Materials Inc
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Assigned to APPLIED MATERIALS, INC.reassignmentAPPLIED MATERIALS, INC.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: PRABHU, PRASHANT PRABHAKAR, SAVANDAIAH, KIRANKUMAR, JOHANSON, WILLIAM
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FIG. 1 is a top perspective view of a target profile for a physical vapor deposition chamber target showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right elevation view thereof;
FIG. 6 is a left elevation view thereof;
FIG. 7 is a front elevation view thereof;
FIG. 8 is a back elevation view thereof; and,
FIG. 9 is an enlarged cross sectional view taken along line9-9 inFIG. 4.
The dashed lines inFIGS. 1-9 represent unclaimed environment and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/726,0942018-03-092020-02-28Target profile for a physical vapor deposition chamber targetActiveUSD902165S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/726,094USD902165S1 (en)2018-03-092020-02-28Target profile for a physical vapor deposition chamber target

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Application NumberPriority DateFiling DateTitle
US29/639,953USD877101S1 (en)2018-03-092018-03-09Target profile for a physical vapor deposition chamber target
US29/726,094USD902165S1 (en)2018-03-092020-02-28Target profile for a physical vapor deposition chamber target

Related Parent Applications (1)

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US29/639,953DivisionUSD877101S1 (en)2018-03-092018-03-09Target profile for a physical vapor deposition chamber target

Publications (1)

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USD902165S1true USD902165S1 (en)2020-11-17

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US29/639,953ActiveUSD877101S1 (en)2018-03-092018-03-09Target profile for a physical vapor deposition chamber target
US29/726,094ActiveUSD902165S1 (en)2018-03-092020-02-28Target profile for a physical vapor deposition chamber target

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JP (2)JP1651699S (en)
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD933725S1 (en)*2019-02-082021-10-19Applied Materials, Inc.Deposition ring for a substrate processing chamber
USD933726S1 (en)*2020-07-312021-10-19Applied Materials, Inc.Deposition ring for a semiconductor processing chamber
USD937329S1 (en)2020-03-232021-11-30Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD940765S1 (en)2020-12-022022-01-11Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD946638S1 (en)2017-12-112022-03-22Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
US11581166B2 (en)2020-07-312023-02-14Applied Materials, Inc.Low profile deposition ring for enhanced life
USD1007449S1 (en)2021-05-072023-12-12Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1012051S1 (en)*2019-06-172024-01-23Tokyo Electron LimitedElectrostatic chuck for semiconductor manufacturing device
USD1012873S1 (en)*2020-09-242024-01-30Asm Ip Holding B.V.Electrode for semiconductor processing apparatus
USD1053230S1 (en)2022-05-192024-12-03Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD1071103S1 (en)*2022-04-112025-04-15Applied Materials, Inc.Gas distribution plate
USD1072774S1 (en)*2021-02-062025-04-29Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1085029S1 (en)*2022-07-192025-07-22Applied Materials, Inc.Gas distribution plate

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD851613S1 (en)*2017-10-052019-06-18Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
US10746511B2 (en)2017-11-062020-08-18JMA Outdoors, Inc.Apparatus for generating a vitals target
USD877101S1 (en)2018-03-092020-03-03Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD917003S1 (en)*2018-06-062021-04-20JMA Outdoors, Inc.Simulating target
JP1646505S (en)*2018-12-072019-11-25
US12125728B2 (en)2019-01-212024-10-22Applied Materials, Inc.Substrate carrier
USD904640S1 (en)*2019-01-212020-12-08Applied Materials, Inc.Substrate carrier
USD942516S1 (en)*2019-02-082022-02-01Applied Materials, Inc.Process shield for a substrate processing chamber
USD908645S1 (en)*2019-08-262021-01-26Applied Materials, Inc.Sputtering target for a physical vapor deposition chamber
USD941371S1 (en)*2020-03-202022-01-18Applied Materials, Inc.Process shield for a substrate processing chamber
USD941372S1 (en)*2020-03-202022-01-18Applied Materials, Inc.Process shield for a substrate processing chamber
JP1700776S (en)*2021-03-042021-11-29 Substrate placement plate for substrate processing apparatus
USD1037778S1 (en)2022-07-192024-08-06Applied Materials, Inc.Gas distribution plate

Citations (98)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5320728A (en)1990-03-301994-06-14Applied Materials, Inc.Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en)1993-05-191994-10-11Riteflite Pty. LimitedTarget for shooting
USD363464S (en)1992-08-271995-10-24Tokyo Electron Yamanashi LimitedElectrode for a semiconductor processing apparatus
USD376744S (en)*1994-08-031996-12-24Gerd Eisenblatter GmbhSupport plate
USD381030S (en)1995-11-211997-07-15Avi TepmanSputtering target
USD411516S (en)1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
USD423026S (en)1997-08-202000-04-18Tokyo Electron LimitedQuartz cover
US6086725A (en)1998-04-022000-07-11Applied Materials, Inc.Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6114216A (en)1996-11-132000-09-05Applied Materials, Inc.Methods for shallow trench isolation
USD446231S1 (en)2000-08-212001-08-07Komatsu Industries CorporationNozzle for a plasma arc torch
US6390905B1 (en)2000-03-312002-05-21Speedfam-Ipec CorporationWorkpiece carrier with adjustable pressure zones and barriers
USD487254S1 (en)2002-05-242004-03-02Nichia CorporationLight emitting diode
US20040149567A1 (en)2002-12-162004-08-05Alexander KosyachkovComposite sputter target and phosphor deposition method
USD496951S1 (en)2003-01-302004-10-05Thermal Dynamics CorporationMechanized cap for a plasma arc torch
US6815352B1 (en)1999-11-092004-11-09Shin-Etsu Chemical Co., Ltd.Silicon focus ring and method for producing the same
USD503729S1 (en)2003-10-312005-04-05Nordson CorporationNozzle for dispensing adhesives and sealants
US20050152089A1 (en)2003-12-262005-07-14Ngk Insulators, Ltd.Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en)2004-02-132005-09-08Goodman Matt G.Substrate support system for reduced autodoping and backside deposition
US20070076345A1 (en)2005-09-202007-04-05Bang Won BSubstrate placement determination using substrate backside pressure measurement
USD553104S1 (en)2004-04-212007-10-16Tokyo Electron LimitedAbsorption board for an electric chuck used in semiconductor manufacture
USD557226S1 (en)2005-08-252007-12-11Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD559066S1 (en)*2004-10-262008-01-08Jsr CorporationPolishing pad
USD559994S1 (en)2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD559993S1 (en)2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD562856S1 (en)2006-03-302008-02-26Dave HawleyPlasma gun anode
USD570310S1 (en)2006-08-012008-06-03Tokyo Electron LimitedAttracting plate of an electrostatic chuck for semiconductor manufacturing
USD571383S1 (en)2005-07-292008-06-17Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD571831S1 (en)2005-07-292008-06-24Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en)2005-07-292008-06-24Tokyo Electron LimitedTop panel for microwave introduction window of plasma processing apparatus
USD572733S1 (en)2005-07-292008-07-08Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
US7402098B2 (en)*2006-10-272008-07-22Novellus Systems, Inc.Carrier head for workpiece planarization/polishing
US20080173541A1 (en)2007-01-222008-07-24Eal LeeTarget designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
USD582949S1 (en)2006-12-152008-12-16Tokyo Electron LimitedCover for a heater stage of a plasma processing apparatus
US20080308416A1 (en)2007-06-182008-12-18Applied Materials, Inc.Sputtering target having increased life and sputtering uniformity
USD600660S1 (en)2008-03-282009-09-22Tokyo Electron LimitedHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20090260982A1 (en)2008-04-162009-10-22Applied Materials, Inc.Wafer processing deposition shielding components
US20100096261A1 (en)2008-10-172010-04-22Applied Materials, Inc.Physical vapor deposition reactor with circularly symmetric rf feed and dc feed to the sputter target
USD614593S1 (en)2008-07-212010-04-27Asm Genitech Korea LtdSubstrate support for a semiconductor deposition apparatus
US20100108500A1 (en)2008-10-312010-05-06Applied Materials, Inc.Encapsulated sputtering target
USD616390S1 (en)2009-03-062010-05-25Tokyo Electron LimitedQuartz cover for manufacturing semiconductor wafers
USD616389S1 (en)*2008-10-202010-05-25Ebara CorporationVacuum contact pad
US20100170786A1 (en)2009-01-072010-07-08Solar Applied Materials Technology Corp.Refurbished sputtering target and method for making the same
USD633452S1 (en)2009-08-272011-03-01Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en)2008-10-202011-11-22Ebara CorporationVacuum contact pad
US20120033340A1 (en)2010-08-062012-02-09Applied Materials, Inc.Electrostatic chuck and methods of use thereof
TWD146490S (en)2011-01-122012-04-21荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD669509S1 (en)2011-10-192012-10-23Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen RechtsNozzle for torch
US8371904B2 (en)*2008-08-082013-02-12Globalfoundries Singapore Pte. Ltd.Polishing with enhanced uniformity
US8398833B2 (en)2008-04-212013-03-19Honeywell International Inc.Use of DC magnetron sputtering systems
USD678745S1 (en)*2011-07-072013-03-26Phuong Van NguyenSpinning insert polishing pad
USD683806S1 (en)2012-01-122013-06-04Surefire, LlcFront plate for a firearm sound suppressor
USD687791S1 (en)2012-03-202013-08-13Veeco Instruments Inc.Multi-keyed wafer carrier
USD687790S1 (en)2012-03-202013-08-13Veeco Instruments Inc.Keyed wafer carrier
USD691974S1 (en)2011-12-222013-10-22Tokyo Electron LimitedHolding pad for transferring a wafer
US20130316628A1 (en)2012-05-232013-11-28Samsung Electronics Co., Ltd.Flexible membranes for a polishing head
USD694790S1 (en)2011-09-202013-12-03Tokyo Electron LimitedBaffle plate for manufacturing semiconductor
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
US20140261180A1 (en)2013-03-152014-09-18Applied Materials, Inc.Pvd target for self-centering process shield
USD716742S1 (en)2013-09-132014-11-04Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en)2013-09-132015-03-17Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD732145S1 (en)2014-02-042015-06-16Asm Ip Holding B.V.Shower plate
USD732094S1 (en)2012-07-202015-06-16Ivoclar Vivadent AgFiring plate for a dental furnace
US20150170888A1 (en)2013-12-182015-06-18Applied Materials, Inc.Physical vapor deposition (pvd) target having low friction pads
USD733843S1 (en)2014-02-042015-07-07ASM IP Holding, B.V.Shower plate
USD741921S1 (en)*2014-04-152015-10-27Q-Linea AbPositive mold for manufacturing a sample holding disc
USD741823S1 (en)2013-07-102015-10-27Hitachi Kokusai Electric Inc.Vaporizer for substrate processing apparatus
US20150357169A1 (en)2013-01-042015-12-10Tosoh Smd, Inc.Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160002776A1 (en)2013-02-212016-01-07Altatech SemiconductorChemical vapor deposition device
US20160002788A1 (en)2013-02-212016-01-07Altatech SemiconductorChemical vapour deposition device
US20160035547A1 (en)2014-07-292016-02-04Applied Materials, Inc.Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en)2014-12-022016-03-01John K. KremerLaser target
USD767234S1 (en)2015-03-022016-09-20Entegris, Inc.Wafer support ring
USD769200S1 (en)2013-05-152016-10-18Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
US9475996B2 (en)2012-10-172016-10-25Richard Max MandleCentrifugal fluid ring plasma reactor
USD770992S1 (en)2015-06-122016-11-08Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD789888S1 (en)*2016-01-082017-06-20Asm Ip Holding B.V.Electrode plate for semiconductor manufacturing apparatus
USD790041S1 (en)2016-01-082017-06-20Asm Ip Holding B.V.Gas dispersing plate for semiconductor manufacturing apparatus
USD793572S1 (en)2015-06-102017-08-01Tokyo Electron LimitedElectrode plate for plasma processing apparatus
USD795208S1 (en)2015-08-182017-08-22Tokyo Electron LimitedElectrostatic chuck for semiconductor manufacturing equipment
USD796458S1 (en)2016-01-082017-09-05Asm Ip Holding B.V.Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en)2015-04-212017-09-12Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD797691S1 (en)2016-04-142017-09-19Applied Materials, Inc.Composite edge ring
USD798248S1 (en)2015-06-182017-09-26Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
CN206573738U (en)2017-03-162017-10-20江苏亨通光导新材料有限公司Low loss fiber
USD801942S1 (en)2015-04-162017-11-07Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD808349S1 (en)2013-05-152018-01-23Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD810705S1 (en)2016-04-012018-02-20Veeco Instruments Inc.Self-centering wafer carrier for chemical vapor deposition
USD813181S1 (en)2016-07-262018-03-20Hitachi Kokusai Electric Inc.Cover of seal cap for reaction chamber of semiconductor
USD830435S1 (en)2015-12-282018-10-09Ntn CorporationInner ring for tapered roller bearing
USD830981S1 (en)2017-04-072018-10-16Asm Ip Holding B.V.Susceptor for semiconductor substrate processing apparatus
USD836572S1 (en)2016-09-302018-12-25Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD839224S1 (en)2016-12-122019-01-29Ebara CorporationElastic membrane for semiconductor wafer polishing
USD846514S1 (en)2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus
USD851613S1 (en)2017-10-052019-06-18Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD860747S1 (en)*2017-10-162019-09-24William P. RussoTapered segment diamond blade
US10442056B2 (en)*2012-06-292019-10-15Ebara CorporationSubstrate holding apparatus and polishing apparatus
USD868124S1 (en)2017-12-112019-11-26Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD877101S1 (en)2018-03-092020-03-03Applied Materials, Inc.Target profile for a physical vapor deposition chamber target

Patent Citations (107)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5320728A (en)1990-03-301994-06-14Applied Materials, Inc.Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en)1992-08-271995-10-24Tokyo Electron Yamanashi LimitedElectrode for a semiconductor processing apparatus
USD351450S (en)1993-05-191994-10-11Riteflite Pty. LimitedTarget for shooting
USD376744S (en)*1994-08-031996-12-24Gerd Eisenblatter GmbhSupport plate
USD381030S (en)1995-11-211997-07-15Avi TepmanSputtering target
USD411516S (en)1996-03-151999-06-29Tokyo Electron LimitedGas diffusion plate for electrode of semiconductor wafer processing apparatus
US6114216A (en)1996-11-132000-09-05Applied Materials, Inc.Methods for shallow trench isolation
USD423026S (en)1997-08-202000-04-18Tokyo Electron LimitedQuartz cover
US6086725A (en)1998-04-022000-07-11Applied Materials, Inc.Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
US6815352B1 (en)1999-11-092004-11-09Shin-Etsu Chemical Co., Ltd.Silicon focus ring and method for producing the same
US6390905B1 (en)2000-03-312002-05-21Speedfam-Ipec CorporationWorkpiece carrier with adjustable pressure zones and barriers
US6659850B2 (en)2000-03-312003-12-09Speedfam-Ipec CorporationWork piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
USD446231S1 (en)2000-08-212001-08-07Komatsu Industries CorporationNozzle for a plasma arc torch
USD487254S1 (en)2002-05-242004-03-02Nichia CorporationLight emitting diode
US20040149567A1 (en)2002-12-162004-08-05Alexander KosyachkovComposite sputter target and phosphor deposition method
USD496951S1 (en)2003-01-302004-10-05Thermal Dynamics CorporationMechanized cap for a plasma arc torch
USD503729S1 (en)2003-10-312005-04-05Nordson CorporationNozzle for dispensing adhesives and sealants
US20050152089A1 (en)2003-12-262005-07-14Ngk Insulators, Ltd.Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en)2004-02-132005-09-08Goodman Matt G.Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en)2004-04-212007-10-16Tokyo Electron LimitedAbsorption board for an electric chuck used in semiconductor manufacture
USD584591S1 (en)*2004-10-262009-01-13Jsr CorporationPolishing pad
USD600989S1 (en)*2004-10-262009-09-29Jsr CorporationPolishing pad
USD559066S1 (en)*2004-10-262008-01-08Jsr CorporationPolishing pad
USD592029S1 (en)*2004-10-262009-05-12Jsr CorporationPolishing pad
USD592030S1 (en)*2004-10-262009-05-12Jsr CorporationPolishing pad
USD559994S1 (en)2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD559993S1 (en)2005-03-302008-01-15Tokyo Electron LimitedCover ring
USD572733S1 (en)2005-07-292008-07-08Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD571383S1 (en)2005-07-292008-06-17Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en)2005-07-292008-06-24Tokyo Electron LimitedTop panel for microwave introduction window of plasma processing apparatus
USD571831S1 (en)2005-07-292008-06-24Tokyo Electron LimitedTop panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en)2005-08-252007-12-11Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
US20070076345A1 (en)2005-09-202007-04-05Bang Won BSubstrate placement determination using substrate backside pressure measurement
USD562856S1 (en)2006-03-302008-02-26Dave HawleyPlasma gun anode
USD570310S1 (en)2006-08-012008-06-03Tokyo Electron LimitedAttracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en)*2006-10-272008-07-22Novellus Systems, Inc.Carrier head for workpiece planarization/polishing
USD582949S1 (en)2006-12-152008-12-16Tokyo Electron LimitedCover for a heater stage of a plasma processing apparatus
US20080173541A1 (en)2007-01-222008-07-24Eal LeeTarget designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US20080308416A1 (en)2007-06-182008-12-18Applied Materials, Inc.Sputtering target having increased life and sputtering uniformity
USD600660S1 (en)2008-03-282009-09-22Tokyo Electron LimitedHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20090260982A1 (en)2008-04-162009-10-22Applied Materials, Inc.Wafer processing deposition shielding components
US8398833B2 (en)2008-04-212013-03-19Honeywell International Inc.Use of DC magnetron sputtering systems
USD614593S1 (en)2008-07-212010-04-27Asm Genitech Korea LtdSubstrate support for a semiconductor deposition apparatus
US8371904B2 (en)*2008-08-082013-02-12Globalfoundries Singapore Pte. Ltd.Polishing with enhanced uniformity
US20100096261A1 (en)2008-10-172010-04-22Applied Materials, Inc.Physical vapor deposition reactor with circularly symmetric rf feed and dc feed to the sputter target
USD616389S1 (en)*2008-10-202010-05-25Ebara CorporationVacuum contact pad
USD649126S1 (en)2008-10-202011-11-22Ebara CorporationVacuum contact pad
US20100108500A1 (en)2008-10-312010-05-06Applied Materials, Inc.Encapsulated sputtering target
US20100170786A1 (en)2009-01-072010-07-08Solar Applied Materials Technology Corp.Refurbished sputtering target and method for making the same
USD616390S1 (en)2009-03-062010-05-25Tokyo Electron LimitedQuartz cover for manufacturing semiconductor wafers
USD633452S1 (en)2009-08-272011-03-01Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
US20120033340A1 (en)2010-08-062012-02-09Applied Materials, Inc.Electrostatic chuck and methods of use thereof
TWD146490S (en)2011-01-122012-04-21荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD678745S1 (en)*2011-07-072013-03-26Phuong Van NguyenSpinning insert polishing pad
USD694790S1 (en)2011-09-202013-12-03Tokyo Electron LimitedBaffle plate for manufacturing semiconductor
USD669509S1 (en)2011-10-192012-10-23Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen RechtsNozzle for torch
USD691974S1 (en)2011-12-222013-10-22Tokyo Electron LimitedHolding pad for transferring a wafer
USD683806S1 (en)2012-01-122013-06-04Surefire, LlcFront plate for a firearm sound suppressor
USD687791S1 (en)2012-03-202013-08-13Veeco Instruments Inc.Multi-keyed wafer carrier
USD687790S1 (en)2012-03-202013-08-13Veeco Instruments Inc.Keyed wafer carrier
US20130316628A1 (en)2012-05-232013-11-28Samsung Electronics Co., Ltd.Flexible membranes for a polishing head
US10442056B2 (en)*2012-06-292019-10-15Ebara CorporationSubstrate holding apparatus and polishing apparatus
USD732094S1 (en)2012-07-202015-06-16Ivoclar Vivadent AgFiring plate for a dental furnace
USD703162S1 (en)*2012-10-172014-04-22Sumitomo Electric Industries, Ltd.Wafer holder for stepper
US9475996B2 (en)2012-10-172016-10-25Richard Max MandleCentrifugal fluid ring plasma reactor
US20150357169A1 (en)2013-01-042015-12-10Tosoh Smd, Inc.Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160002788A1 (en)2013-02-212016-01-07Altatech SemiconductorChemical vapour deposition device
US20160002776A1 (en)2013-02-212016-01-07Altatech SemiconductorChemical vapor deposition device
US20140261180A1 (en)2013-03-152014-09-18Applied Materials, Inc.Pvd target for self-centering process shield
USD769200S1 (en)2013-05-152016-10-18Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en)2013-05-152018-01-23Ebara CorporationElastic membrane for semiconductor wafer polishing apparatus
USD741823S1 (en)2013-07-102015-10-27Hitachi Kokusai Electric Inc.Vaporizer for substrate processing apparatus
USD724553S1 (en)2013-09-132015-03-17Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en)2013-09-132014-11-04Asm Ip Holding B.V.Substrate supporter for semiconductor deposition apparatus
US20150170888A1 (en)2013-12-182015-06-18Applied Materials, Inc.Physical vapor deposition (pvd) target having low friction pads
USD733843S1 (en)2014-02-042015-07-07ASM IP Holding, B.V.Shower plate
USD732145S1 (en)2014-02-042015-06-16Asm Ip Holding B.V.Shower plate
USD741921S1 (en)*2014-04-152015-10-27Q-Linea AbPositive mold for manufacturing a sample holding disc
US20160035547A1 (en)2014-07-292016-02-04Applied Materials, Inc.Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en)2014-12-022016-03-01John K. KremerLaser target
USD767234S1 (en)2015-03-022016-09-20Entegris, Inc.Wafer support ring
USD801942S1 (en)2015-04-162017-11-07Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD837755S1 (en)2015-04-162019-01-08Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD825504S1 (en)2015-04-212018-08-14Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD797067S1 (en)2015-04-212017-09-12Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD793572S1 (en)2015-06-102017-08-01Tokyo Electron LimitedElectrode plate for plasma processing apparatus
USD770992S1 (en)2015-06-122016-11-08Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD825505S1 (en)2015-06-182018-08-14Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD798248S1 (en)2015-06-182017-09-26Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD795208S1 (en)2015-08-182017-08-22Tokyo Electron LimitedElectrostatic chuck for semiconductor manufacturing equipment
USD830435S1 (en)2015-12-282018-10-09Ntn CorporationInner ring for tapered roller bearing
USD796458S1 (en)2016-01-082017-09-05Asm Ip Holding B.V.Gas flow control plate for semiconductor manufacturing apparatus
USD790041S1 (en)2016-01-082017-06-20Asm Ip Holding B.V.Gas dispersing plate for semiconductor manufacturing apparatus
USD789888S1 (en)*2016-01-082017-06-20Asm Ip Holding B.V.Electrode plate for semiconductor manufacturing apparatus
USD810705S1 (en)2016-04-012018-02-20Veeco Instruments Inc.Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en)2016-04-142017-09-19Applied Materials, Inc.Composite edge ring
USD813181S1 (en)2016-07-262018-03-20Hitachi Kokusai Electric Inc.Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en)2016-09-302018-12-25Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD869409S1 (en)2016-09-302019-12-10Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD839224S1 (en)2016-12-122019-01-29Ebara CorporationElastic membrane for semiconductor wafer polishing
CN206573738U (en)2017-03-162017-10-20江苏亨通光导新材料有限公司Low loss fiber
USD830981S1 (en)2017-04-072018-10-16Asm Ip Holding B.V.Susceptor for semiconductor substrate processing apparatus
USD851613S1 (en)2017-10-052019-06-18Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD860747S1 (en)*2017-10-162019-09-24William P. RussoTapered segment diamond blade
USD868124S1 (en)2017-12-112019-11-26Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD877101S1 (en)2018-03-092020-03-03Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD846514S1 (en)2018-05-032019-04-23Kokusai Electric CorporationBoat of substrate processing apparatus

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.
Search Report for Taiwan Design Application No. 1077303086 dated Jul. 6, 2018.
Sputtering Targets for LSis, posted at JX Nippon Mining & Metals, posting date Mar. 22, 2016. Site visited Apr. 1, 2019. URL: <https://web .archive .org/web/20 160322055046/http :1/www.nmm.jx-group.co.jp/english/products/04_supa/target_adv.html> (Year: 2016).
Sputtering Targets, posted at Angstrom Sciences, posting date May 5, 2016. Site visited Apr. 1, 2019. URL: <https://web.archive.org/web/20160505015447/https://www.angstromsciences.com/sputtering-targets> (Year: 2016).
U.S. Appl. No. 29/690,617, filed May 9, 2019.

Cited By (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD946638S1 (en)2017-12-112022-03-22Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD933725S1 (en)*2019-02-082021-10-19Applied Materials, Inc.Deposition ring for a substrate processing chamber
USD1012051S1 (en)*2019-06-172024-01-23Tokyo Electron LimitedElectrostatic chuck for semiconductor manufacturing device
USD970566S1 (en)*2020-03-232022-11-22Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD937329S1 (en)2020-03-232021-11-30Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
US11581166B2 (en)2020-07-312023-02-14Applied Materials, Inc.Low profile deposition ring for enhanced life
USD933726S1 (en)*2020-07-312021-10-19Applied Materials, Inc.Deposition ring for a semiconductor processing chamber
USD1012873S1 (en)*2020-09-242024-01-30Asm Ip Holding B.V.Electrode for semiconductor processing apparatus
USD940765S1 (en)2020-12-022022-01-11Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD966357S1 (en)*2020-12-022022-10-11Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1072774S1 (en)*2021-02-062025-04-29Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1007449S1 (en)2021-05-072023-12-12Applied Materials, Inc.Target profile for a physical vapor deposition chamber target
USD1071103S1 (en)*2022-04-112025-04-15Applied Materials, Inc.Gas distribution plate
USD1053230S1 (en)2022-05-192024-12-03Applied Materials, Inc.Sputter target for a physical vapor deposition chamber
USD1085029S1 (en)*2022-07-192025-07-22Applied Materials, Inc.Gas distribution plate

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