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USD895075S1 - Seal member for semiconductor production apparatus - Google Patents

Seal member for semiconductor production apparatus
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Publication number
USD895075S1
USD895075S1US35/355,064US35506444FUSD895075SUS D895075 S1USD895075 S1US D895075S1US 35506444 FUS35506444 FUS 35506444FUS D895075 SUSD895075 SUS D895075S
Authority
US
United States
Prior art keywords
production apparatus
semiconductor production
seal member
reproduction
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,064
Other versions
USD895695S1 (en
USD886022S1 (en
USD896187S1 (en
USD882475S1 (en
USD879641S1 (en
USD887490S1 (en
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USD896883S1 (en
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USD925155S1 (en
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USD881237S1 (en
USD876604S1 (en
USD882211S1 (en
USD892873S1 (en
USD900816S1 (en
USD905274S1 (en
USD888899S1 (en
USD876598S1 (en
USD890253S1 (en
USD884362S1 (en
USD879624S1 (en
USD876605S1 (en
USD880462S1 (en
USD886468S1 (en
USD889213S1 (en
USD882373S1 (en
USD879149S1 (en
Inventor
Yong-Gu Kang
Sangho Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valqua Ltd
Original Assignee
Valqua Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valqua LtdfiledCriticalValqua Ltd
Assigned to VALQUA, LTD.reassignmentVALQUA, LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KIM, SANGHO, KANG, YONG-GU
Application grantedgrantedCritical
Publication of USD895075S1publicationCriticalpatent/USD895075S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

1.1: Perspective
1.2: Front
1.3: Back
1.4: Left
1.5: Right
1.6: Top
1.7: Bottom
1.8: Cross-sectional
1.9: Partial enlargement of cross-sectional view1.8
1.10: Reference
The present article is a seal member for semiconductor production apparatuses, such as chemical vapor deposition apparatuses and dry etching apparatuses; as illustrated in the reproduction1.10, the article is to be inserted into the groove of a semiconductor production apparatus; the semiconductor production apparatus itself forms no part of the claimed design; the reproduction1.8shows a transverse cross-sectional front view taken along the horizontal center of the reproduction1.6; and the reproduction1.9is an enlarged view showing a left end portion of the cross-sectional view1.8.
The broken lines shown in Reproduction1.10are for the purposes of illustrating environmental structure and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a seal member for semiconductor production apparatus, as shown and described.
US35/355,0642018-02-082018-08-03Seal member for semiconductor production apparatusActiveUSD895075S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JPD2018-2527FJP1612685S (en)2018-02-082018-02-08
JP2018-0025272018-02-08

Publications (1)

Publication NumberPublication Date
USD895075S1true USD895075S1 (en)2020-09-01

Family

ID=63369077

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US35/355,064ActiveUSD895075S1 (en)2018-02-082018-08-03Seal member for semiconductor production apparatus

Country Status (3)

CountryLink
US (1)USD895075S1 (en)
JP (1)JP1612685S (en)
TW (1)TWD197465S (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD933032S1 (en)*2018-10-122021-10-12Valqua, Ltd.Seal member for semiconductor production apparatus
USD933033S1 (en)*2018-10-122021-10-12Valqua, Ltd.Seal member for semiconductor production apparatus
USD962904S1 (en)*2019-09-182022-09-06Shenzhen Chuang Jin Heng Electronic Technology Co., LTDFlat antenna
USD986394S1 (en)*2021-05-122023-05-16S & B Technical Products, Inc.Pipe sealing gasket
USD1031951S1 (en)*2020-07-302024-06-18Valqua, Ltd.Composite seal
USD1042373S1 (en)2022-03-182024-09-17Applied Materials, Inc.Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en)2022-03-182024-09-17Applied Materials, Inc.Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en)*2022-03-182024-12-24Applied Materials, Inc.Support ring for an interlocking process kit for a substrate processing chamber
USD1071887S1 (en)*2023-01-312025-04-22Valqua, Ltd.Composite seal for semiconductor manufacturing device
US12293902B2 (en)2018-01-192025-05-06Applied Materials, Inc.Process kit for a substrate support
USD1074944S1 (en)*2022-02-022025-05-13Valqua, Ltd.Seal
USD1079661S1 (en)*2023-08-312025-06-17Kokusai Electric CorporationSusceptor of semiconductor manufacturing apparatus
USD1083043S1 (en)*2023-03-282025-07-08Mitsubishi Cable Industries, Ltd.Composite seal member for semiconductor production apparatus
US12387913B2 (en)2022-07-082025-08-12Tosoh Smd, Inc.Dynamic vacuum seal system for physical vapor deposition sputter applications

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP1612685S (en)2018-02-082018-09-03
JP1721756S (en)2021-12-232022-08-05 sealing material

Citations (31)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US2622905A (en)*1948-12-231952-12-23Auto Diesel Piston Ring CompanSealing ring
US3990711A (en)*1975-05-091976-11-09Hill Ralph WRestrained elastomeric seal ring means
US4421330A (en)*1982-02-081983-12-20Greene, Tweed & Co., Inc.Antifriction fluid seal assembly
US4466624A (en)*1977-06-271984-08-21Etablissement D'occidentSealing arrangement
US4582366A (en)*1984-11-021986-04-15Burfield Peter CLubricant seal for track linkage
USD289078S (en)*1984-10-261987-03-31Vassallo Research And Development CorporationGasket
US5261677A (en)*1991-07-301993-11-16Nitto Kohki Co., Ltd.Seal ring
USD379493S (en)*1994-12-191997-05-27Greene, Tweed Of Delaware, Inc.Gasket seal
USD498826S1 (en)*2003-02-132004-11-23Nichias Co., LtdMetal ring gasket
USD646764S1 (en)*2010-11-042011-10-11Faster S.P.A.Sealing gasket
TWD150427S (en)2009-08-102012-11-21日本華爾卡工業股份有限公司Hybrid seal member
USD696751S1 (en)*2011-10-272013-12-31Mueller International, LlcSlip-on gasket
TWD163769S (en)2012-08-072014-10-21Nihon Valqua Kogyo KkComposite sealing material
USD728182S1 (en)*2013-04-152015-04-28Robert Brian CookPaint can gasket
USD728757S1 (en)*2013-01-042015-05-05Michael GrahamGasket
US20150362075A1 (en)*2013-02-282015-12-17Kayaba Industry Co., Ltd.Seal member and front fork provided with seal member
TWD183446S (en)2015-12-242017-06-01Nihon Valqua Kogyo KkSeal material
USD796012S1 (en)*2015-02-262017-08-29Toyoda Gosei Co., Ltd.Gasket
JP1589474S (en)2017-03-162017-10-30
USD818089S1 (en)*2016-09-142018-05-15Nippon Valqua Industries, Ltd.Composite seal
USD821552S1 (en)*2016-11-292018-06-26Nippon Valqua Industries, Ltd.Composite seal
USD822181S1 (en)*2016-11-292018-07-03Nippon Valqua Industries, Ltd.Composite seal
JP1612685S (en)2018-02-082018-09-03
JP1612684S (en)2018-02-082018-09-03
USD846098S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD846096S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD846097S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD846095S1 (en)*2017-07-122019-04-16Mcwane, Inc.Restrained gasket
USD852335S1 (en)*2017-09-192019-06-25Mcwane, Inc.Restrained gasket
USD852935S1 (en)*2017-09-192019-07-02Mcwane, Inc.Restrained gasket
USD857859S1 (en)*2017-07-122019-08-27Mcwane, Inc.Restrained gasket

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US2622905A (en)*1948-12-231952-12-23Auto Diesel Piston Ring CompanSealing ring
US3990711A (en)*1975-05-091976-11-09Hill Ralph WRestrained elastomeric seal ring means
US4466624A (en)*1977-06-271984-08-21Etablissement D'occidentSealing arrangement
US4421330A (en)*1982-02-081983-12-20Greene, Tweed & Co., Inc.Antifriction fluid seal assembly
USD289078S (en)*1984-10-261987-03-31Vassallo Research And Development CorporationGasket
US4582366A (en)*1984-11-021986-04-15Burfield Peter CLubricant seal for track linkage
US5261677A (en)*1991-07-301993-11-16Nitto Kohki Co., Ltd.Seal ring
USD379493S (en)*1994-12-191997-05-27Greene, Tweed Of Delaware, Inc.Gasket seal
USD498826S1 (en)*2003-02-132004-11-23Nichias Co., LtdMetal ring gasket
TWD150427S (en)2009-08-102012-11-21日本華爾卡工業股份有限公司Hybrid seal member
USD646764S1 (en)*2010-11-042011-10-11Faster S.P.A.Sealing gasket
USD696751S1 (en)*2011-10-272013-12-31Mueller International, LlcSlip-on gasket
TWD163769S (en)2012-08-072014-10-21Nihon Valqua Kogyo KkComposite sealing material
USD728757S1 (en)*2013-01-042015-05-05Michael GrahamGasket
US20150362075A1 (en)*2013-02-282015-12-17Kayaba Industry Co., Ltd.Seal member and front fork provided with seal member
USD728182S1 (en)*2013-04-152015-04-28Robert Brian CookPaint can gasket
USD796012S1 (en)*2015-02-262017-08-29Toyoda Gosei Co., Ltd.Gasket
TWD183446S (en)2015-12-242017-06-01Nihon Valqua Kogyo KkSeal material
USD818089S1 (en)*2016-09-142018-05-15Nippon Valqua Industries, Ltd.Composite seal
USD821552S1 (en)*2016-11-292018-06-26Nippon Valqua Industries, Ltd.Composite seal
USD822181S1 (en)*2016-11-292018-07-03Nippon Valqua Industries, Ltd.Composite seal
JP1589474S (en)2017-03-162017-10-30
USD857859S1 (en)*2017-07-122019-08-27Mcwane, Inc.Restrained gasket
USD846095S1 (en)*2017-07-122019-04-16Mcwane, Inc.Restrained gasket
USD846097S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD846096S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD846098S1 (en)*2017-09-192019-04-16Mcwane, Inc.Restrained gasket
USD852335S1 (en)*2017-09-192019-06-25Mcwane, Inc.Restrained gasket
USD852935S1 (en)*2017-09-192019-07-02Mcwane, Inc.Restrained gasket
JP1612684S (en)2018-02-082018-09-03
JP1612685S (en)2018-02-082018-09-03

Cited By (16)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US12293902B2 (en)2018-01-192025-05-06Applied Materials, Inc.Process kit for a substrate support
USD933031S1 (en)*2018-10-122021-10-12Valqua, Ltd.Seal member for semiconductor production apparatus
USD933033S1 (en)*2018-10-122021-10-12Valqua, Ltd.Seal member for semiconductor production apparatus
USD933619S1 (en)*2018-10-122021-10-19Valqua, Ltd.Seal member for semiconductor production apparatus
USD933032S1 (en)*2018-10-122021-10-12Valqua, Ltd.Seal member for semiconductor production apparatus
USD962904S1 (en)*2019-09-182022-09-06Shenzhen Chuang Jin Heng Electronic Technology Co., LTDFlat antenna
USD1031951S1 (en)*2020-07-302024-06-18Valqua, Ltd.Composite seal
USD986394S1 (en)*2021-05-122023-05-16S & B Technical Products, Inc.Pipe sealing gasket
USD1074944S1 (en)*2022-02-022025-05-13Valqua, Ltd.Seal
USD1055006S1 (en)*2022-03-182024-12-24Applied Materials, Inc.Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en)2022-03-182024-09-17Applied Materials, Inc.Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en)2022-03-182024-09-17Applied Materials, Inc.Sliding ring for an interlocking process kit for a substrate processing chamber
US12387913B2 (en)2022-07-082025-08-12Tosoh Smd, Inc.Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1071887S1 (en)*2023-01-312025-04-22Valqua, Ltd.Composite seal for semiconductor manufacturing device
USD1083043S1 (en)*2023-03-282025-07-08Mitsubishi Cable Industries, Ltd.Composite seal member for semiconductor production apparatus
USD1079661S1 (en)*2023-08-312025-06-17Kokusai Electric CorporationSusceptor of semiconductor manufacturing apparatus

Also Published As

Publication numberPublication date
TWD197465S (en)2019-05-11
JP1612685S (en)2018-09-03

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