USD877708S1 - Electrical terminal - Google Patents
Electrical terminalDownload PDFInfo
- Publication number
- USD877708S1 USD877708S1US29/669,185US201829669185FUSD877708SUS D877708 S1USD877708 S1US D877708S1US 201829669185 FUS201829669185 FUS 201829669185FUS D877708 SUSD877708 SUS D877708S
- Authority
- US
- United States
- Prior art keywords
- electrical terminal
- view
- elevation view
- design
- electric terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Broken lines formed by equal length dashes show unclaimed portions of the design. Broken lines formed of unequal length dashes (i.e., dash-dot) show boundaries between claimed and unclaimed portions of the design.
Claims (1)
- The ornamental design for an electric terminal, as shown and described.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/669,185USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
| US29/723,349USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/470,060USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
| US29/556,621USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/614,894USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
| US29/669,185USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/614,894ContinuationUSD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/723,349DivisionUSD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD877708S1true USD877708S1 (en) | 2020-03-10 |
Family
ID=55700350
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/470,060ActiveUSD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
| US29/556,618ActiveUSD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/556,621ActiveUSD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/556,619ActiveUSD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/614,894ActiveUSD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
| US29/669,185ActiveUSD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
| US29/723,349ActiveUSD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Family Applications Before (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/470,060ActiveUSD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
| US29/556,618ActiveUSD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/556,621ActiveUSD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/556,619ActiveUSD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
| US29/614,894ActiveUSD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/723,349ActiveUSD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Country Status (1)
| Country | Link |
|---|---|
| US (7) | USD754083S1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en)* | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD942406S1 (en)* | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD759022S1 (en)* | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
| US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
| USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
| USD742581S1 (en)* | 2013-12-09 | 2015-11-03 | Kenall Manufacturing Company | Driver housing |
| USD864968S1 (en)* | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
| USD814431S1 (en)* | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD846513S1 (en)* | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| JP1582228S (en)* | 2016-08-02 | 2017-07-24 | ||
| USD845906S1 (en)* | 2017-03-09 | 2019-04-16 | Sendyne Corporation | Electrical shunt |
| JP1664282S (en)* | 2019-07-24 | 2020-07-27 | ||
| USD956707S1 (en)* | 2019-09-26 | 2022-07-05 | Lapis Semiconductor Co., Ltd. | Circuit board |
| USD938925S1 (en)* | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD934820S1 (en) | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD947801S1 (en)* | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
| USD951212S1 (en)* | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951214S1 (en)* | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en)* | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951215S1 (en)* | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD986174S1 (en)* | 2020-07-10 | 2023-05-16 | Xinghui Peng | Power connector |
Citations (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3579046A (en) | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
| USD317300S (en) | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
| US5066999A (en) | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
| US5742005A (en) | 1994-09-14 | 1998-04-21 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
| US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
| US5994772A (en) | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
| US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
| US6348742B1 (en) | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
| US6391681B1 (en)* | 2001-03-16 | 2002-05-21 | Micron Technology, Inc. | Semiconductor component having selected terminal contacts with multiple electrical paths |
| US6476505B2 (en) | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
| US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
| USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
| US6494723B2 (en)* | 2000-03-31 | 2002-12-17 | Autonetworks Technologies, Ltd. | Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
| USD485536S1 (en) | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
| US6723924B2 (en)* | 2002-09-03 | 2004-04-20 | Sumitomo Wiring Systems, Ltd. | Electrical conductor assembly |
| US6753482B1 (en) | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
| US6905347B2 (en)* | 2002-11-08 | 2005-06-14 | Sumitomo Wiring Systems, Ltd. | Electrical junction box with connector and fuse modules |
| US20060097374A1 (en) | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
| USD540272S1 (en) | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD547371S1 (en) | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
| US20090004776A1 (en) | 2007-06-28 | 2009-01-01 | Ning Ye | Method of fabricating a memory card using sip/smt hybrid technology |
| USD601520S1 (en) | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
| USD612347S1 (en) | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
| US7709292B2 (en) | 2006-09-29 | 2010-05-04 | Sadwick Laurence P | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
| USD633054S1 (en) | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
| USD633450S1 (en) | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
| USD638809S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
| USD638810S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
| USD684547S1 (en) | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
| USD690277S1 (en) | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
| USD690672S1 (en) | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD694200S1 (en) | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
| USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| US20140070381A1 (en) | 2012-09-12 | 2014-03-13 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
| US20140099805A1 (en) | 2012-10-10 | 2014-04-10 | Motorola Mobility Llc | Electronic connector capable of accepting a single subscriber identity mopdule or a memory card |
| US20140106621A1 (en) | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
| USD708595S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
| USD708594S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
| USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD736213S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
| USD736216S1 (en) | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
| USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD363920S (en)* | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
| US9402319B2 (en)* | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
| US8966747B2 (en)* | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
| US9936580B1 (en)* | 2015-01-14 | 2018-04-03 | Vlt, Inc. | Method of forming an electrical connection to an electronic module |
| US10785871B1 (en)* | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
- 2013
- 2013-10-17USUS29/470,060patent/USD754083S1/enactiveActive
- 2016
- 2016-03-02USUS29/556,618patent/USD775092S1/enactiveActive
- 2016-03-02USUS29/556,621patent/USD798249S1/enactiveActive
- 2016-03-02USUS29/556,619patent/USD775093S1/enactiveActive
- 2017
- 2017-08-24USUS29/614,894patent/USD834548S1/enactiveActive
- 2018
- 2018-11-06USUS29/669,185patent/USD877708S1/enactiveActive
- 2020
- 2020-02-06USUS29/723,349patent/USD942406S1/enactiveActive
Patent Citations (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3579046A (en) | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
| USD317300S (en) | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
| US5066999A (en) | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
| US5742005A (en) | 1994-09-14 | 1998-04-21 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
| US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
| US5994772A (en) | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
| US6348742B1 (en) | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
| US6476505B2 (en) | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
| US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
| US6494723B2 (en)* | 2000-03-31 | 2002-12-17 | Autonetworks Technologies, Ltd. | Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
| US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
| US6391681B1 (en)* | 2001-03-16 | 2002-05-21 | Micron Technology, Inc. | Semiconductor component having selected terminal contacts with multiple electrical paths |
| US6537850B1 (en) | 2001-03-16 | 2003-03-25 | Micron Technology, Inc. | Method for fabricating semiconductor components with terminal contacts having alternate electrical paths |
| USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
| USD471167S1 (en) | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
| US6753482B1 (en) | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
| US6723924B2 (en)* | 2002-09-03 | 2004-04-20 | Sumitomo Wiring Systems, Ltd. | Electrical conductor assembly |
| US6905347B2 (en)* | 2002-11-08 | 2005-06-14 | Sumitomo Wiring Systems, Ltd. | Electrical junction box with connector and fuse modules |
| USD485536S1 (en) | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
| US20060097374A1 (en) | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
| USD601520S1 (en) | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
| USD612347S1 (en) | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
| USD540272S1 (en) | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD547371S1 (en) | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
| US7709292B2 (en) | 2006-09-29 | 2010-05-04 | Sadwick Laurence P | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
| US20090004776A1 (en) | 2007-06-28 | 2009-01-01 | Ning Ye | Method of fabricating a memory card using sip/smt hybrid technology |
| USD633054S1 (en) | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
| USD633450S1 (en) | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
| USD638809S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
| USD638810S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
| USD684547S1 (en) | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
| USD690277S1 (en) | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
| USD694200S1 (en) | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
| USD690672S1 (en) | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| US20140070381A1 (en) | 2012-09-12 | 2014-03-13 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
| USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| US20140099805A1 (en) | 2012-10-10 | 2014-04-10 | Motorola Mobility Llc | Electronic connector capable of accepting a single subscriber identity mopdule or a memory card |
| US20140106621A1 (en) | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
| USD708595S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
| USD708594S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
| USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD775093S1 (en)* | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD775092S1 (en)* | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD798249S1 (en)* | 2013-10-17 | 2017-09-26 | Vlt, Inc. | Electric terminal |
| USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD736213S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
| USD736216S1 (en) | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
Non-Patent Citations (2)
| Title |
|---|
| Mitsubishi Electric Corporation, Release No. 2647, Mitsubishi Electric Launches 1200V/50A Large-Type Dual In-Line Package Intelligent Power Module, Jan. 26, 2012, 2 pages. |
| Protek Devices, Package Outline, 16 Pin Drip Package, 2000, 2 pages. |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD942406S1 (en)* | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en)* | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| USD754083S1 (en) | 2016-04-19 |
| USD798249S1 (en) | 2017-09-26 |
| USD942406S1 (en) | 2022-02-01 |
| USD834548S1 (en) | 2018-11-27 |
| USD775092S1 (en) | 2016-12-27 |
| USD775093S1 (en) | 2016-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure | Free format text:ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |