USD839224S1 - Elastic membrane for semiconductor wafer polishing - Google Patents

Description

FIG. 1 is a bottom perspective view of an elastic membrane for semiconductor wafer polishing showing our new design;

FIG. 2 is a top perspective view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a front view thereof, a rear view being identical thereto;

FIG. 6 is a right-side view thereof, a left-side view being identical thereto;

FIG. 7 is a cross-sectional view taken along line7-7 ofFIG. 4; and,

FIG. 8 is an enlarged portion view labeledFIG. 8 inFIG. 7.

The dash-dot lines inFIG. 7 represent the boundary line of the enlarged portion view shown inFIG. 8.

Claims (1)

CLAIM
1. The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.

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