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USD828358S1 - SSD storage device - Google Patents

SSD storage deviceDownload PDF

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Publication number
USD828358S1
USD828358S1US29/614,250US201729614250FUSD828358SUS D828358 S1USD828358 S1US D828358S1US 201729614250 FUS201729614250 FUS 201729614250FUS D828358 SUSD828358 SUS D828358S
Authority
US
United States
Prior art keywords
storage device
ssd storage
ssd
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/614,250
Inventor
G. M Lim
Eun-Jin Yun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electronics Co LtdfiledCriticalSamsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD.reassignmentSAMSUNG ELECTRONICS CO., LTD.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: YUN, EUN-JIN, LIM, G. M
Application grantedgrantedCritical
Publication of USD828358S1publicationCriticalpatent/USD828358S1/en
Activelegal-statusCriticalCurrent
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Description

FIG. 1 is a perspective view of an SSD storage device showing our new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Broken lines and unshaded portions contained within broken lines depict either features of the SSD storage device that form no part of the present design claim or exemplary elements that might be used in conjunction with the SSD storage device that are shown for illustrative purposes only and that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an SSD storage device, as shown and described.
US29/614,2502017-02-172017-08-17SSD storage deviceActiveUSD828358S1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
KR30-2017-00076602017-02-17
KR201700076602017-02-17

Publications (1)

Publication NumberPublication Date
USD828358S1true USD828358S1 (en)2018-09-11

Family

ID=61684890

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/614,250ActiveUSD828358S1 (en)2017-02-172017-08-17SSD storage device

Country Status (3)

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US (1)USD828358S1 (en)
JP (1)JP1600325S (en)
TW (1)TWD189069S (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD848432S1 (en)*2017-02-172019-05-14Samsung Electronics Co., Ltd.SSD storage device
USD862475S1 (en)*2017-02-172019-10-08Samsung Electronics Co., Ltd.SSD storage device
USD868796S1 (en)*2018-02-072019-12-03Samsung Electronics Co., Ltd.USB memory
USD869469S1 (en)*2018-04-092019-12-10Samsung Electronics Co., Ltd.SSD storage device
USD869470S1 (en)*2018-04-092019-12-10Samsung Electronics Co., Ltd.SSD storage device
USD888676S1 (en)*2018-08-292020-06-30Samsung Electronics Co., Ltd.Case for a circuit board
USD888675S1 (en)*2018-08-292020-06-30Samsung Electronics Co., Ltd.Case for a circuit board
USD988318S1 (en)*2020-09-102023-06-06Samsung Electronics Co., Ltd.Solid state drive memory device
USD996424S1 (en)*2020-06-092023-08-22Samsung Electronics Co., Ltd.Solid state drive memory device

Citations (80)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4872505A (en)*1988-08-161989-10-10Ncr CorporationHeat sink for an electronic device
US5224023A (en)*1992-02-101993-06-29Smith Gary WFoldable electronic assembly module
US5347428A (en)*1992-12-031994-09-13Irvine Sensors CorporationModule comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5754409A (en)*1996-11-061998-05-19Dynamem, Inc.Foldable electronic assembly module
US5995370A (en)*1997-09-011999-11-30Sharp Kabushiki KaishaHeat-sinking arrangement for circuit elements
US6002589A (en)*1997-07-211999-12-14Rambus Inc.Integrated circuit package for coupling to a printed circuit board
US6021048A (en)*1998-02-172000-02-01Smith; Gary W.High speed memory module
US6025992A (en)*1999-02-112000-02-15International Business Machines Corp.Integrated heat exchanger for memory module
US6088829A (en)*1995-10-262000-07-11Hitachi, Ltd.Synchronous data transfer system
USD432096S (en)*1999-11-242000-10-17Samsung Electronics Co., Ltd.Semiconductor module
US6381140B1 (en)*1999-08-302002-04-30Witek Enterprise Co., Ltd.Memory module
US6535387B2 (en)*2001-06-282003-03-18Intel CorporationHeat transfer apparatus
US6590282B1 (en)*2002-04-122003-07-08Industrial Technology Research InstituteStacked semiconductor package formed on a substrate and method for fabrication
US6614664B2 (en)*2000-10-242003-09-02Samsung Electronics Co., Ltd.Memory module having series-connected printed circuit boards
US6628538B2 (en)*2000-03-102003-09-30Hitachi, Ltd.Memory module including module data wirings available as a memory access data bus
US6757751B1 (en)*2000-08-112004-06-29Harrison GeneHigh-speed, multiple-bank, stacked, and PCB-mounted memory module
US6762942B1 (en)*2002-09-052004-07-13Gary W. SmithBreak away, high speed, folded, jumperless electronic assembly
US20040196682A1 (en)*2002-09-262004-10-07Elpida Memory, Inc.Semiconductor unit having two device terminals for every one input/output signal
US20050082663A1 (en)*2003-10-202005-04-21Renesas Technology Corp.Semiconductor device and semiconductor module
US6956284B2 (en)*2001-10-262005-10-18Staktek Group L.P.Integrated circuit stacking system and method
US20060049513A1 (en)*2004-09-032006-03-09Staktek Group L.P.Thin module system and method with thermal management
US20060049502A1 (en)*2004-09-032006-03-09Staktek Group, L.P.Module thermal management system and method
US20060049500A1 (en)*2004-09-032006-03-09Staktek Group L.P.Thin module system and method
US20060050488A1 (en)*2004-09-032006-03-09Staktel Group, L.P.High capacity thin module system and method
US20060050492A1 (en)*2004-09-032006-03-09Staktek Group, L.P.Thin module system and method
US20060050498A1 (en)*2004-09-032006-03-09Staktek Group L.P.Die module system and method
US20060050489A1 (en)*2004-09-032006-03-09Staktek Group L.P.Optimized mounting area circuit module system and method
US20060050592A1 (en)*2004-09-032006-03-09Staktek Group L.P.Compact module system and method
US20060129888A1 (en)*2004-09-032006-06-15Staktek Group L.P.Circuit module turbulence enhacement systems and methods
US20060171247A1 (en)*2005-02-032006-08-03Wolfgang HoppeSemiconductor memory module with bus architecture
US20060261449A1 (en)*2005-05-182006-11-23Staktek Group L.P.Memory module system and method
US20070011574A1 (en)*2005-06-142007-01-11Christian WeissMemory device
US20070033490A1 (en)*2005-07-192007-02-08Karl-Heinz MoosrainerSemiconductor memory module with error correction
US20070139897A1 (en)*2005-12-192007-06-21Siva RaghuramCircuit board arrangement including heat dissipater
US20070176286A1 (en)*2006-02-022007-08-02Staktek Group L.P.Composite core circuit module system and method
US7269025B2 (en)*2004-12-302007-09-11Intel CorporationBallout for buffer
US20070212906A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212919A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212920A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212902A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070223198A1 (en)*2006-03-252007-09-27Foxconn Technology Co., Ltd.Memory module assembly including a clamp for mounting heat sinks thereon
US7299313B2 (en)*2004-10-292007-11-20International Business Machines CorporationSystem, method and storage medium for a memory subsystem command interface
US20070294889A1 (en)*2001-12-062007-12-27Reinhold SchmittElectronic circuit module and method for its assembly
US20080094811A1 (en)*2006-10-232008-04-24International Business Machines CorporationHigh density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en)*2006-11-222008-05-22International Business Machines Corporation, Inc.Structures to enhance cooling of computer memory modules
US20080123303A1 (en)*2006-11-292008-05-29Elpida Memory, Inc.Memory module
US20080123300A1 (en)*2006-11-292008-05-29International Business Machines CorporationFolded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080137278A1 (en)*2006-12-112008-06-12Kreton CorporationMemory chip and insert card having the same thereon
US7516281B2 (en)*2004-05-252009-04-07Micron Technology, Inc.On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20090129026A1 (en)*2007-11-192009-05-21Samsung Electronics Co., Ltd.Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US7590899B2 (en)*2006-09-152009-09-15International Business Machines CorporationProcessor memory array having memory macros for relocatable store protect keys
US20090268390A1 (en)*2008-04-232009-10-29International Business Machines CorporationPrinted circuit assembly with determination of storage configuration based on installed paddle board
US7619893B1 (en)*2006-02-172009-11-17Netlist, Inc.Heat spreader for electronic modules
US7636274B2 (en)*2004-03-052009-12-22Netlist, Inc.Memory module with a circuit providing load isolation and memory domain translation
US20100073860A1 (en)*2008-09-242010-03-25Takakatsu MoriaiSsd apparatus
US7688592B2 (en)*2004-02-232010-03-30Infineon Technologies AgCooling system for devices having power semiconductors and method for cooling the device
US7811097B1 (en)*2005-08-292010-10-12Netlist, Inc.Circuit with flexible portion
US7839712B2 (en)*2007-08-032010-11-23Qimonda AgSemiconductor memory arrangement
US7861029B2 (en)*2007-04-232010-12-28Qimonda AgMemory module having buffer and memory ranks addressable by respective selection signal
USD637192S1 (en)2010-10-182011-05-03Apple Inc.Electronic device
USD637193S1 (en)2010-11-192011-05-03Apple Inc.Electronic device
US8018723B1 (en)*2008-04-302011-09-13Netlist, Inc.Heat dissipation for electronic modules
US8347057B2 (en)*2009-08-272013-01-01Elpida Memory, Inc.Memory module
USD673922S1 (en)*2011-04-212013-01-08Kabushiki Kaisha ToshibaPortion of a substrate for an electronic circuit
US8422263B2 (en)*2009-06-052013-04-16Elpida Memory, Inc.Load reduced memory module and memory system including the same
US8510629B2 (en)*2009-10-212013-08-13Elpida Memory, Inc.Memory module on which regular chips and error correction chips are mounted
US20130219235A1 (en)*2012-02-172013-08-22Kabushiki Kaisha ToshibaMemory system and test method thereof
US8705240B1 (en)*2007-12-182014-04-22Google Inc.Embossed heat spreader
US8796830B1 (en)*2006-09-012014-08-05Google Inc.Stackable low-profile lead frame package
USD716310S1 (en)*2012-06-092014-10-28Apple, Inc.Electronic device
US8885422B2 (en)*2009-06-122014-11-11Hewlett-Packard Development Company, L.P.Hierarchical on-chip memory
USD753073S1 (en)2014-12-302016-04-05Altia Systems, Inc.Printed circuit board
US20160172016A1 (en)*2014-12-122016-06-16Kabushiki Kaisha ToshibaSemiconductor device and electronic device
US20160334992A1 (en)*2015-05-122016-11-17Kabushiki Kaisha ToshibaSemiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en)*2015-07-092017-01-12Kabushiki Kaisha ToshibaSemiconductor device package having an oscillator and an apparatus having the same
USD787456S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD787457S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD794035S1 (en)*2016-06-202017-08-08V-Color Technology Inc.Solid state drive
USD793973S1 (en)*2015-01-142017-08-08Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD798251S1 (en)*2016-11-072017-09-26Transcend Information, Inc.Printed circuit board of solid-state memory

Patent Citations (83)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4872505A (en)*1988-08-161989-10-10Ncr CorporationHeat sink for an electronic device
US5224023A (en)*1992-02-101993-06-29Smith Gary WFoldable electronic assembly module
US5347428A (en)*1992-12-031994-09-13Irvine Sensors CorporationModule comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US6088829A (en)*1995-10-262000-07-11Hitachi, Ltd.Synchronous data transfer system
US5754409A (en)*1996-11-061998-05-19Dynamem, Inc.Foldable electronic assembly module
US6002589A (en)*1997-07-211999-12-14Rambus Inc.Integrated circuit package for coupling to a printed circuit board
US5995370A (en)*1997-09-011999-11-30Sharp Kabushiki KaishaHeat-sinking arrangement for circuit elements
US6021048A (en)*1998-02-172000-02-01Smith; Gary W.High speed memory module
US6025992A (en)*1999-02-112000-02-15International Business Machines Corp.Integrated heat exchanger for memory module
US6381140B1 (en)*1999-08-302002-04-30Witek Enterprise Co., Ltd.Memory module
USD432096S (en)*1999-11-242000-10-17Samsung Electronics Co., Ltd.Semiconductor module
US6628538B2 (en)*2000-03-102003-09-30Hitachi, Ltd.Memory module including module data wirings available as a memory access data bus
US6757751B1 (en)*2000-08-112004-06-29Harrison GeneHigh-speed, multiple-bank, stacked, and PCB-mounted memory module
US6614664B2 (en)*2000-10-242003-09-02Samsung Electronics Co., Ltd.Memory module having series-connected printed circuit boards
US6535387B2 (en)*2001-06-282003-03-18Intel CorporationHeat transfer apparatus
US6956284B2 (en)*2001-10-262005-10-18Staktek Group L.P.Integrated circuit stacking system and method
US20070294889A1 (en)*2001-12-062007-12-27Reinhold SchmittElectronic circuit module and method for its assembly
US6590282B1 (en)*2002-04-122003-07-08Industrial Technology Research InstituteStacked semiconductor package formed on a substrate and method for fabrication
US6762942B1 (en)*2002-09-052004-07-13Gary W. SmithBreak away, high speed, folded, jumperless electronic assembly
US20040196682A1 (en)*2002-09-262004-10-07Elpida Memory, Inc.Semiconductor unit having two device terminals for every one input/output signal
US20050082663A1 (en)*2003-10-202005-04-21Renesas Technology Corp.Semiconductor device and semiconductor module
US7688592B2 (en)*2004-02-232010-03-30Infineon Technologies AgCooling system for devices having power semiconductors and method for cooling the device
US7636274B2 (en)*2004-03-052009-12-22Netlist, Inc.Memory module with a circuit providing load isolation and memory domain translation
US7516281B2 (en)*2004-05-252009-04-07Micron Technology, Inc.On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20060049513A1 (en)*2004-09-032006-03-09Staktek Group L.P.Thin module system and method with thermal management
US20060050489A1 (en)*2004-09-032006-03-09Staktek Group L.P.Optimized mounting area circuit module system and method
US20060050592A1 (en)*2004-09-032006-03-09Staktek Group L.P.Compact module system and method
US20060129888A1 (en)*2004-09-032006-06-15Staktek Group L.P.Circuit module turbulence enhacement systems and methods
US20060050498A1 (en)*2004-09-032006-03-09Staktek Group L.P.Die module system and method
US20060049502A1 (en)*2004-09-032006-03-09Staktek Group, L.P.Module thermal management system and method
US20060049500A1 (en)*2004-09-032006-03-09Staktek Group L.P.Thin module system and method
US20060050488A1 (en)*2004-09-032006-03-09Staktel Group, L.P.High capacity thin module system and method
US20060050492A1 (en)*2004-09-032006-03-09Staktek Group, L.P.Thin module system and method
US7299313B2 (en)*2004-10-292007-11-20International Business Machines CorporationSystem, method and storage medium for a memory subsystem command interface
US7269025B2 (en)*2004-12-302007-09-11Intel CorporationBallout for buffer
US20060171247A1 (en)*2005-02-032006-08-03Wolfgang HoppeSemiconductor memory module with bus architecture
US20060261449A1 (en)*2005-05-182006-11-23Staktek Group L.P.Memory module system and method
US20070011574A1 (en)*2005-06-142007-01-11Christian WeissMemory device
US20070033490A1 (en)*2005-07-192007-02-08Karl-Heinz MoosrainerSemiconductor memory module with error correction
US7811097B1 (en)*2005-08-292010-10-12Netlist, Inc.Circuit with flexible portion
US20070139897A1 (en)*2005-12-192007-06-21Siva RaghuramCircuit board arrangement including heat dissipater
US20070176286A1 (en)*2006-02-022007-08-02Staktek Group L.P.Composite core circuit module system and method
US7619893B1 (en)*2006-02-172009-11-17Netlist, Inc.Heat spreader for electronic modules
US20070212902A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212906A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212919A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070212920A1 (en)*2006-03-082007-09-13Clayton James EThin multichip flex-module
US20070223198A1 (en)*2006-03-252007-09-27Foxconn Technology Co., Ltd.Memory module assembly including a clamp for mounting heat sinks thereon
US8796830B1 (en)*2006-09-012014-08-05Google Inc.Stackable low-profile lead frame package
US7590899B2 (en)*2006-09-152009-09-15International Business Machines CorporationProcessor memory array having memory macros for relocatable store protect keys
US20080094811A1 (en)*2006-10-232008-04-24International Business Machines CorporationHigh density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en)*2006-11-222008-05-22International Business Machines Corporation, Inc.Structures to enhance cooling of computer memory modules
US20080123300A1 (en)*2006-11-292008-05-29International Business Machines CorporationFolded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080123303A1 (en)*2006-11-292008-05-29Elpida Memory, Inc.Memory module
US20080137278A1 (en)*2006-12-112008-06-12Kreton CorporationMemory chip and insert card having the same thereon
US7861029B2 (en)*2007-04-232010-12-28Qimonda AgMemory module having buffer and memory ranks addressable by respective selection signal
US7839712B2 (en)*2007-08-032010-11-23Qimonda AgSemiconductor memory arrangement
US20090129026A1 (en)*2007-11-192009-05-21Samsung Electronics Co., Ltd.Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US8705240B1 (en)*2007-12-182014-04-22Google Inc.Embossed heat spreader
US20090268390A1 (en)*2008-04-232009-10-29International Business Machines CorporationPrinted circuit assembly with determination of storage configuration based on installed paddle board
US8018723B1 (en)*2008-04-302011-09-13Netlist, Inc.Heat dissipation for electronic modules
US20100073860A1 (en)*2008-09-242010-03-25Takakatsu MoriaiSsd apparatus
US8422263B2 (en)*2009-06-052013-04-16Elpida Memory, Inc.Load reduced memory module and memory system including the same
US8885422B2 (en)*2009-06-122014-11-11Hewlett-Packard Development Company, L.P.Hierarchical on-chip memory
US8347057B2 (en)*2009-08-272013-01-01Elpida Memory, Inc.Memory module
US8510629B2 (en)*2009-10-212013-08-13Elpida Memory, Inc.Memory module on which regular chips and error correction chips are mounted
USD637192S1 (en)2010-10-182011-05-03Apple Inc.Electronic device
USD655296S1 (en)*2010-10-182012-03-06Apple Inc.Electronic device
USD686215S1 (en)*2010-11-192013-07-16Apple Inc.Electronic device
USD652041S1 (en)*2010-11-192012-01-10Apple Inc.Electronic device
USD637193S1 (en)2010-11-192011-05-03Apple Inc.Electronic device
USD673922S1 (en)*2011-04-212013-01-08Kabushiki Kaisha ToshibaPortion of a substrate for an electronic circuit
US20130219235A1 (en)*2012-02-172013-08-22Kabushiki Kaisha ToshibaMemory system and test method thereof
USD716310S1 (en)*2012-06-092014-10-28Apple, Inc.Electronic device
US20160172016A1 (en)*2014-12-122016-06-16Kabushiki Kaisha ToshibaSemiconductor device and electronic device
USD753073S1 (en)2014-12-302016-04-05Altia Systems, Inc.Printed circuit board
USD787456S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD787457S1 (en)*2015-01-142017-05-23Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
USD793973S1 (en)*2015-01-142017-08-08Kabushiki Kaisha ToshibaSubstrate for an electronic circuit
US20160334992A1 (en)*2015-05-122016-11-17Kabushiki Kaisha ToshibaSemiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en)*2015-07-092017-01-12Kabushiki Kaisha ToshibaSemiconductor device package having an oscillator and an apparatus having the same
USD794035S1 (en)*2016-06-202017-08-08V-Color Technology Inc.Solid state drive
USD798251S1 (en)*2016-11-072017-09-26Transcend Information, Inc.Printed circuit board of solid-state memory

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Communication dated Nov. 2, 2017, issued by the Taiwan Patent Office in counterpart Taiwan application No. 106304667.
Non-Patent Prior Art List;, 2 pgs total.

Cited By (12)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD848432S1 (en)*2017-02-172019-05-14Samsung Electronics Co., Ltd.SSD storage device
USD862475S1 (en)*2017-02-172019-10-08Samsung Electronics Co., Ltd.SSD storage device
USD868796S1 (en)*2018-02-072019-12-03Samsung Electronics Co., Ltd.USB memory
USD869469S1 (en)*2018-04-092019-12-10Samsung Electronics Co., Ltd.SSD storage device
USD869470S1 (en)*2018-04-092019-12-10Samsung Electronics Co., Ltd.SSD storage device
USD888676S1 (en)*2018-08-292020-06-30Samsung Electronics Co., Ltd.Case for a circuit board
USD888675S1 (en)*2018-08-292020-06-30Samsung Electronics Co., Ltd.Case for a circuit board
USD996424S1 (en)*2020-06-092023-08-22Samsung Electronics Co., Ltd.Solid state drive memory device
USD997939S1 (en)*2020-06-092023-09-05Samsung Electronics Co., Ltd.Solid state drive memory device
US11979996B2 (en)2020-06-092024-05-07Samsung Electronics Co., Ltd.Memory device and electronic device including the same
US12219721B2 (en)2020-06-092025-02-04Samsung Electronics Co., Ltd.Memory device and electronic device including the same
USD988318S1 (en)*2020-09-102023-06-06Samsung Electronics Co., Ltd.Solid state drive memory device

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Publication numberPublication date
JP1600325S (en)2018-03-26
TWD189069S (en)2018-03-11

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