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USD785578S1 - Substrate supporting arm for semiconductor manufacturing apparatus - Google Patents

Substrate supporting arm for semiconductor manufacturing apparatus
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Publication number
USD785578S1
USD785578S1US29/558,827US201629558827FUSD785578SUS D785578 S1USD785578 S1US D785578S1US 201629558827 FUS201629558827 FUS 201629558827FUS D785578 SUSD785578 SUS D785578S
Authority
US
United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
supporting arm
substrate supporting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/558,827
Inventor
Woo Chan Kim
Jeong Ho Lee
Hyun Soo JANG
Jong Su Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM IP Holding BV
Original Assignee
ASM IP Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM IP Holding BVfiledCriticalASM IP Holding BV
Priority to US29/558,827priorityCriticalpatent/USD785578S1/en
Assigned to ASM IP HOLDING B.V.reassignmentASM IP HOLDING B.V.ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: KIM, JONG SU, JANG, HYUN SOO, KIM, WOO CHAN, LEE, JEONG HO
Application grantedgrantedCritical
Publication of USD785578S1publicationCriticalpatent/USD785578S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a perspective view of a substrate supporting arm for a semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate supporting arm for a semiconductor manufacturing apparatus, as shown and described.
US29/558,8272016-03-222016-03-22Substrate supporting arm for semiconductor manufacturing apparatusActiveUSD785578S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/558,827USD785578S1 (en)2016-03-222016-03-22Substrate supporting arm for semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US29/558,827USD785578S1 (en)2016-03-222016-03-22Substrate supporting arm for semiconductor manufacturing apparatus

Publications (1)

Publication NumberPublication Date
USD785578S1true USD785578S1 (en)2017-05-02

Family

ID=58629001

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US29/558,827ActiveUSD785578S1 (en)2016-03-222016-03-22Substrate supporting arm for semiconductor manufacturing apparatus

Country Status (1)

CountryLink
US (1)USD785578S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD825498S1 (en)*2017-07-172018-08-14Oculus Vr, LlcHeat sink assembly
USD831086S1 (en)*2016-12-092018-10-16Hitachi High-Technologies CorporationSubstrate processing unit
USD831085S1 (en)*2016-12-092018-10-16Hitachi High-Technologies CorporationSubstrate processing unit
USD847237S1 (en)*2016-12-092019-04-30Hitachi High-Technologies CorporationSubstrate processing unit
US10379583B2 (en)2017-04-192019-08-13Facebook Technologies, LlcSystem for discharging heat out of head-mounted display based on hybrid fan and heat pipe
USD938373S1 (en)*2019-10-252021-12-14Applied Materials, Inc.Substrate transfer structure
USD997892S1 (en)*2019-11-282023-09-05Kokusai Electric CorporationEnd effector for handling wafers

Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6132160A (en)*1997-06-272000-10-17Tokyo Electron LimitedSubstrate transferring apparatus
US6183183B1 (en)*1997-01-162001-02-06Asm America, Inc.Dual arm linear hand-off wafer transfer assembly
US6234738B1 (en)*1998-04-242001-05-22Mecs CorporationThin substrate transferring apparatus
US6293749B1 (en)*1997-11-212001-09-25Asm America, Inc.Substrate transfer system for semiconductor processing equipment
US6614201B2 (en)*2000-02-072003-09-02Tazmo Co., Ltd.Substrate transfer system
US6893507B2 (en)*1997-11-032005-05-17Asm America, Inc.Self-centering wafer support system
US6991419B2 (en)*2001-04-162006-01-31Samsung Electronics Co., Ltd.Method and apparatus for transferring a wafer
US7186297B2 (en)*2000-12-152007-03-06Kabushiki Kaisha Yaskawa DenkiWafer holding apparatus
USD559805S1 (en)*2005-08-122008-01-15Tokyo Electron LimitedStage arm for a semiconductor wafer delivery apparatus
US7578649B2 (en)*2002-05-292009-08-25Brooks Automation, Inc.Dual arm substrate transport apparatus
USD614152S1 (en)*2008-07-212010-04-20Asm Genitech Korea, Ltd.Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en)*2010-12-142012-08-21Tokyo Electron LimitedSubstrate transfer holder
USD666979S1 (en)*2010-12-142012-09-11Tokyo Electron LimitedSubstrate holder
USD695240S1 (en)*2011-10-202013-12-10Tokyo Electron LimitedArm for wafer transportation for manufacturing semiconductor
USD701498S1 (en)*2011-10-202014-03-25Tokyo Electron LimitedArm for wafer transportation for manufacturing semiconductor

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6183183B1 (en)*1997-01-162001-02-06Asm America, Inc.Dual arm linear hand-off wafer transfer assembly
US6132160A (en)*1997-06-272000-10-17Tokyo Electron LimitedSubstrate transferring apparatus
US6893507B2 (en)*1997-11-032005-05-17Asm America, Inc.Self-centering wafer support system
US6293749B1 (en)*1997-11-212001-09-25Asm America, Inc.Substrate transfer system for semiconductor processing equipment
US6234738B1 (en)*1998-04-242001-05-22Mecs CorporationThin substrate transferring apparatus
US6614201B2 (en)*2000-02-072003-09-02Tazmo Co., Ltd.Substrate transfer system
US7186297B2 (en)*2000-12-152007-03-06Kabushiki Kaisha Yaskawa DenkiWafer holding apparatus
US6991419B2 (en)*2001-04-162006-01-31Samsung Electronics Co., Ltd.Method and apparatus for transferring a wafer
US7578649B2 (en)*2002-05-292009-08-25Brooks Automation, Inc.Dual arm substrate transport apparatus
USD559805S1 (en)*2005-08-122008-01-15Tokyo Electron LimitedStage arm for a semiconductor wafer delivery apparatus
USD614152S1 (en)*2008-07-212010-04-20Asm Genitech Korea, Ltd.Substrate transfer device for semiconductor deposition apparatus
USD665759S1 (en)*2010-12-142012-08-21Tokyo Electron LimitedSubstrate transfer holder
USD666979S1 (en)*2010-12-142012-09-11Tokyo Electron LimitedSubstrate holder
USD695240S1 (en)*2011-10-202013-12-10Tokyo Electron LimitedArm for wafer transportation for manufacturing semiconductor
USD701498S1 (en)*2011-10-202014-03-25Tokyo Electron LimitedArm for wafer transportation for manufacturing semiconductor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action dated Jul. 5, 2016 in Korean Design application No. 30-2016-0000963.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD831086S1 (en)*2016-12-092018-10-16Hitachi High-Technologies CorporationSubstrate processing unit
USD831085S1 (en)*2016-12-092018-10-16Hitachi High-Technologies CorporationSubstrate processing unit
USD847237S1 (en)*2016-12-092019-04-30Hitachi High-Technologies CorporationSubstrate processing unit
US10379583B2 (en)2017-04-192019-08-13Facebook Technologies, LlcSystem for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US10656690B2 (en)2017-04-192020-05-19Facebook Technologies, LlcSystem for discharging heat out of head-mounted display based on hybrid fan and heat pipe
US11029730B2 (en)2017-04-192021-06-08Facebook Technologies, LlcSystem for discharging heat out of head-mounted display based on hybrid fan
US11435784B2 (en)2017-04-192022-09-06Meta Platforms Technologies, LlcSystem for discharging heat out of head-mounted display
USD825498S1 (en)*2017-07-172018-08-14Oculus Vr, LlcHeat sink assembly
USD938373S1 (en)*2019-10-252021-12-14Applied Materials, Inc.Substrate transfer structure
USD997892S1 (en)*2019-11-282023-09-05Kokusai Electric CorporationEnd effector for handling wafers

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