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USD783550S1 - Power semiconductor device - Google Patents

Power semiconductor device
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Publication number
USD783550S1
USD783550S1US29/568,584US201629568584FUSD783550SUS D783550 S1USD783550 S1US D783550S1US 201629568584 FUS201629568584 FUS 201629568584FUS D783550 SUSD783550 SUS D783550S
Authority
US
United States
Prior art keywords
semiconductor device
power semiconductor
view
ornamental design
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/568,584
Inventor
Maki Hasegawa
Masahiro Kato
Shinya Nakagawa
Hisashi Kawafuji
Toru Iwagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to US29/568,584priorityCriticalpatent/USD783550S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATIONreassignmentMITSUBISHI ELECTRIC CORPORATIONASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: HASEGAWA, MAKI, IWAGAMI, TORU, KATO, MASAHIRO, KAWAFUJI, HISASHI, NAKAGAWA, SHINYA
Application grantedgrantedCritical
Publication of USD783550S1publicationCriticalpatent/USD783550S1/en
Activelegal-statusCriticalCurrent
Anticipated expirationlegal-statusCritical

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Description

FIG. 1 is a front, right side, bottom perspective view of a power semiconductor device, showing our new design;
FIG. 2 is another rear, left side, and top perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor device, as shown and described.
US29/568,5842014-04-022016-06-20Power semiconductor deviceActiveUSD783550S1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US29/568,584USD783550S1 (en)2014-04-022016-06-20Power semiconductor device

Applications Claiming Priority (6)

Application NumberPriority DateFiling DateTitle
JP20140072632014-04-02
JP20140072652014-04-02
JP20140072662014-04-02
JP20140072642014-04-02
US29/503,649USD772182S1 (en)2014-04-022014-09-29Power semiconductor device
US29/568,584USD783550S1 (en)2014-04-022016-06-20Power semiconductor device

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US29/503,649DivisionUSD772182S1 (en)2014-04-022014-09-29Power semiconductor device

Publications (1)

Publication NumberPublication Date
USD783550S1true USD783550S1 (en)2017-04-11

Family

ID=57210354

Family Applications (4)

Application NumberTitlePriority DateFiling Date
US29/503,649ActiveUSD772182S1 (en)2014-04-022014-09-29Power semiconductor device
US29/568,592ActiveUSD770994S1 (en)2014-04-022016-06-20Power semiconductor device
US29/568,598ActiveUSD777124S1 (en)2014-04-022016-06-20Power semiconductor device
US29/568,584ActiveUSD783550S1 (en)2014-04-022016-06-20Power semiconductor device

Family Applications Before (3)

Application NumberTitlePriority DateFiling Date
US29/503,649ActiveUSD772182S1 (en)2014-04-022014-09-29Power semiconductor device
US29/568,592ActiveUSD770994S1 (en)2014-04-022016-06-20Power semiconductor device
US29/568,598ActiveUSD777124S1 (en)2014-04-022016-06-20Power semiconductor device

Country Status (1)

CountryLink
US (4)USD772182S1 (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD805485S1 (en)*2013-08-212017-12-19Mitsubishi Electric CorporationSemiconductor device
USD805680S1 (en)*2013-12-092017-12-19Kenall Manufacturing CompanyDriver housing
USD852765S1 (en)*2017-10-192019-07-02Rohm Co., Ltd.Semiconductor device
USD853343S1 (en)*2017-10-192019-07-09Rohm Co., Ltd.Semiconductor device
USD856947S1 (en)*2017-10-192019-08-20Rohm Co., Ltd.Semiconductor device
USD859334S1 (en)*2017-10-262019-09-10Mitsubishi Electric CorporationSemiconductor device
USD864882S1 (en)*2017-09-272019-10-29Hamamatsu Photonics K.K.Part for semiconductor device
USD864883S1 (en)*2017-09-272019-10-29Hamamatsu Photonics K.K.Part for semiconductor device
USD865690S1 (en)*2017-09-272019-11-05Hamamatsu Photonics K.K.Part for semiconductor device
USD888673S1 (en)*2018-06-262020-06-30Rohm Co., Ltd.Semiconductor module
USD893439S1 (en)*2018-05-072020-08-18Adura Led Solutions LlcCircuit board having arrangements of light-emitting diodes
USD900759S1 (en)*2018-11-072020-11-03Rohm Co., Ltd.Semiconductor device
USD902164S1 (en)*2019-01-242020-11-17Toshiba Memory CorporationIntegrated circuit card
USD906273S1 (en)*2018-11-072020-12-29Rohm Co., Ltd.Semiconductor device
USD913978S1 (en)2018-06-262021-03-23Rohm Co., Ltd.Semiconductor module
USD914621S1 (en)*2019-05-142021-03-30Rohm Co., Ltd.Packaged semiconductor module
USD920264S1 (en)*2019-11-272021-05-25The Noco CompanySemiconductor device
USD932452S1 (en)*2019-11-272021-10-05The Noco CompanySemiconductor device
USD933618S1 (en)*2018-10-312021-10-19Asahi Kasei Microdevices CorporationSemiconductor module
USD954666S1 (en)*2019-05-032022-06-14Lumileds Holding B.V.Flexible circuit board
USD971863S1 (en)*2020-01-282022-12-06Rohm Co., Ltd.Semiconductor module
USD972516S1 (en)*2020-01-282022-12-13Rohm Co., Ltd.Semiconductor module
USD973029S1 (en)*2020-12-152022-12-20Rohm Co., Ltd.Semiconductor device
USD981356S1 (en)*2020-01-282023-03-21Rohm Co., Ltd.Semiconductor module
USD999747S1 (en)*2020-07-312023-09-26Rohm Co., Ltd.Semiconductor device
USD1017533S1 (en)*2022-01-282024-03-12Mitsubishi Electric CorporationSemiconductor device
USD1021829S1 (en)*2021-03-162024-04-09Rohm Co., Ltd.Semiconductor module
USD1021830S1 (en)*2021-03-162024-04-09Rohm Co., Ltd.Semiconductor module
USD1022932S1 (en)*2021-03-162024-04-16Rohm Co., Ltd.Semiconductor module
USD1034494S1 (en)*2020-07-312024-07-09Rohm Co., Ltd.Semiconductor device
USD1046800S1 (en)*2022-01-282024-10-15Mitsubishi Electric CorporationSemiconductor device
USD1046801S1 (en)*2022-01-282024-10-15Mitsubishi Electric CorporationSemiconductor device
TWD234859S (en)2023-05-102024-11-21美商沃孚半導體有限公司 (美國)Power module

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD769832S1 (en)*2013-02-192016-10-25Sony CorporationSemiconductor device
USD772182S1 (en)*2014-04-022016-11-22Mitsubishi Electric CorporationPower semiconductor device
USD836073S1 (en)*2017-01-252018-12-18Shindengen Electric Manufacturing Co., Ltd.Solid state relay
TWD191875S (en)*2017-11-102018-07-21雙鴻科技股份有限公司A water cooling device
USD877102S1 (en)*2017-12-282020-03-03Shindengen Electric Manufacturing Co., Ltd.Semiconductor module
USD906271S1 (en)2018-04-132020-12-29Rohm Co., Ltd.Semiconductor module
JP1711706S (en)*2021-07-292022-04-04
JP1711705S (en)*2021-07-292022-04-04
USD1033355S1 (en)*2021-07-292024-07-02Rohm Co., Ltd.Semiconductor module

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USD770994S1 (en)*2014-04-022016-11-08Mitsubishi Electric CorporationPower semiconductor device
USD773412S1 (en)*2015-02-042016-12-06Mitsubishi Electric CorporationSemiconductor device
USD773413S1 (en)*2015-02-042016-12-06Mitsubishi Electric CorporationSemiconductor device

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USD606951S1 (en)*2008-11-142009-12-29Fuji Electric Device Technology Co, Ltd.Semiconductor device

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USD772182S1 (en)*2014-04-022016-11-22Mitsubishi Electric CorporationPower semiconductor device
USD773412S1 (en)*2015-02-042016-12-06Mitsubishi Electric CorporationSemiconductor device
USD773413S1 (en)*2015-02-042016-12-06Mitsubishi Electric CorporationSemiconductor device

Cited By (37)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
USD805485S1 (en)*2013-08-212017-12-19Mitsubishi Electric CorporationSemiconductor device
USD805680S1 (en)*2013-12-092017-12-19Kenall Manufacturing CompanyDriver housing
USD844216S1 (en)*2013-12-092019-03-26Kenall Manufacturing CompanyDriver housing
USD864882S1 (en)*2017-09-272019-10-29Hamamatsu Photonics K.K.Part for semiconductor device
USD865690S1 (en)*2017-09-272019-11-05Hamamatsu Photonics K.K.Part for semiconductor device
USD864883S1 (en)*2017-09-272019-10-29Hamamatsu Photonics K.K.Part for semiconductor device
USD856947S1 (en)*2017-10-192019-08-20Rohm Co., Ltd.Semiconductor device
USD853343S1 (en)*2017-10-192019-07-09Rohm Co., Ltd.Semiconductor device
USD852765S1 (en)*2017-10-192019-07-02Rohm Co., Ltd.Semiconductor device
USD859334S1 (en)*2017-10-262019-09-10Mitsubishi Electric CorporationSemiconductor device
USD864135S1 (en)2017-10-262019-10-22Mitsubishi Electric CorporationSemiconductor device
USD893439S1 (en)*2018-05-072020-08-18Adura Led Solutions LlcCircuit board having arrangements of light-emitting diodes
USD913978S1 (en)2018-06-262021-03-23Rohm Co., Ltd.Semiconductor module
USD888673S1 (en)*2018-06-262020-06-30Rohm Co., Ltd.Semiconductor module
USD903613S1 (en)2018-06-262020-12-01Rohm Co., Ltd.Semiconductor module
USD933618S1 (en)*2018-10-312021-10-19Asahi Kasei Microdevices CorporationSemiconductor module
USD1046799S1 (en)2018-10-312024-10-15Asahi Kasei Microdevices CorporationSemiconductor module
USD900759S1 (en)*2018-11-072020-11-03Rohm Co., Ltd.Semiconductor device
USD906273S1 (en)*2018-11-072020-12-29Rohm Co., Ltd.Semiconductor device
USD902164S1 (en)*2019-01-242020-11-17Toshiba Memory CorporationIntegrated circuit card
USD954666S1 (en)*2019-05-032022-06-14Lumileds Holding B.V.Flexible circuit board
USD914621S1 (en)*2019-05-142021-03-30Rohm Co., Ltd.Packaged semiconductor module
USD932452S1 (en)*2019-11-272021-10-05The Noco CompanySemiconductor device
USD920264S1 (en)*2019-11-272021-05-25The Noco CompanySemiconductor device
USD971863S1 (en)*2020-01-282022-12-06Rohm Co., Ltd.Semiconductor module
USD972516S1 (en)*2020-01-282022-12-13Rohm Co., Ltd.Semiconductor module
USD981356S1 (en)*2020-01-282023-03-21Rohm Co., Ltd.Semiconductor module
USD999747S1 (en)*2020-07-312023-09-26Rohm Co., Ltd.Semiconductor device
USD1034494S1 (en)*2020-07-312024-07-09Rohm Co., Ltd.Semiconductor device
USD973029S1 (en)*2020-12-152022-12-20Rohm Co., Ltd.Semiconductor device
USD1022932S1 (en)*2021-03-162024-04-16Rohm Co., Ltd.Semiconductor module
USD1021830S1 (en)*2021-03-162024-04-09Rohm Co., Ltd.Semiconductor module
USD1021829S1 (en)*2021-03-162024-04-09Rohm Co., Ltd.Semiconductor module
USD1017533S1 (en)*2022-01-282024-03-12Mitsubishi Electric CorporationSemiconductor device
USD1046800S1 (en)*2022-01-282024-10-15Mitsubishi Electric CorporationSemiconductor device
USD1046801S1 (en)*2022-01-282024-10-15Mitsubishi Electric CorporationSemiconductor device
TWD234859S (en)2023-05-102024-11-21美商沃孚半導體有限公司 (美國)Power module

Also Published As

Publication numberPublication date
USD777124S1 (en)2017-01-24
USD772182S1 (en)2016-11-22
USD770994S1 (en)2016-11-08

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